CN107160044A - A kind of large-breadth plates laser etching machine - Google Patents
A kind of large-breadth plates laser etching machine Download PDFInfo
- Publication number
- CN107160044A CN107160044A CN201710606868.XA CN201710606868A CN107160044A CN 107160044 A CN107160044 A CN 107160044A CN 201710606868 A CN201710606868 A CN 201710606868A CN 107160044 A CN107160044 A CN 107160044A
- Authority
- CN
- China
- Prior art keywords
- workbench
- laser
- etching machine
- driving
- breadth plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
Abstract
The invention discloses a kind of large-breadth plates laser etching machine, including：Frame, the frame includes base, the crossbeam by upright supports above the base；The workbench being slidably disposed on the base and the first driving means for driving the workbench to slide；The laser socket being slidably disposed on the crossbeam and the second drive device for driving the laser socket to slide；Optical Maser System on the laser socket is arranged on by lifting drive；The glide direction of the workbench is vertical with x-axis, and the glide direction and y-axis of the laser socket are perpendicular, and the driving direction of the lifting drive is parallel with z-axis.It is arranged such, a kind of large-breadth plates laser etching machine that the present invention is provided, it can effectively solve the problem that the problem of sheet material that laser etching machine of the prior art is caused when etching large-breadth plates is damaged and etching efficiency is relatively low.
Description
Technical field
It is to be related to a kind of large-breadth plates laser etching machine in particular the invention belongs to laser etching technology field.
Background technology
It is more and more extensive with the technology application of laser-induced thermal etching, breadth size is processed to laser-induced thermal etching and process velocity is wanted
Also more and more higher is sought, higher requirement is also accordingly proposed to the automaticity that laser-induced thermal etching is processed.
When large-breadth plates are etched, because the size of large-breadth plates is larger, bearing capacity is not enough easily defeated
Fracture damage during sending, and etching efficiency is relatively low.Therefore, laser etching machine of the prior art how is solved in etching
During large-breadth plates, the problem of easily causing sheet material damage and relatively low etching efficiency to be solved as those skilled in the art
Important technological problems certainly.
The content of the invention
A kind of large-breadth plates laser etching machine that the present invention is provided, it can effectively solve the problem that laser erosion of the prior art
Quarter, machine sheet material for causing when etching large-breadth plates damaged and the problem of etching efficiency is relatively low.
A kind of large-breadth plates laser etching machine that the present invention is provided, including：
Frame, the frame includes base, the crossbeam by upright supports above the base；
The workbench being slidably disposed on the base and first for driving the workbench slip
Drive device；
The laser socket being slidably disposed on the crossbeam and second for driving the laser socket slip
Drive device；
Optical Maser System on the laser socket is arranged on by lifting drive；
The glide direction of the workbench is vertical with x-axis, and the glide direction and y-axis of the laser socket are perpendicular, institute
The driving direction for stating lifting drive is parallel with z-axis, and the glide direction of the workbench and the laser socket
Glide direction is all located in x/y plane.
Preferably, the first driving means include linear electric motors and the sliding platform driven by linear electric motors, the work
It is arranged on as platform on the sliding platform.
Preferably, multiple through holes for being used to adsorb workpiece to be added, the through hole and vacuum are distributed with the workbench
Source is connected.
Preferably, second drive device includes linear electric motors.
Preferably, in addition to be arranged on the Optical Maser System lower end dust excluding hood.
Preferably, in addition to：
Grating Detecting System for detecting the Optical Maser System and the work-table position；
Control system for controlling the first driving means, the second drive device and the lifting drive, institute
Control system is stated with the Grating Detecting System to be communicably connected.
Preferably, the length of the workbench is 2 meters, and width is 1.5 meters.
Preferably, the bottom of the frame is provided with heavily loaded pin cup.
In the technical scheme that the present invention is provided, workpiece to be added is fixed on workbench, field lens focal length is mixed up, by laser
The a certain region of system to machined part is etched processing, after the completion of the region processing, by controlling first driving means
With the second drive device, driving workbench is slided, while driving Optical Maser System to slide, equals Optical Maser System alignment work
Another region of platform, so repeatedly, the technical scheme that the present invention is provided can be etched processing to large-breadth plates, it is to avoid
Frequent transport large-breadth plates and the sheet material that causes is easily damaged and the problem of relatively low operating efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is the schematic front view of large-breadth plates laser etching machine in the embodiment of the present invention；
Fig. 2 is the left view schematic diagram of large-breadth plates laser etching machine in the embodiment of the present invention；
Fig. 3 is the schematic top plan view of large-breadth plates laser etching machine in the embodiment of the present invention.
In Fig. 1-Fig. 3：
11-base, 12-crossbeam, 13-workbench, 14-first driving means, the 15-the second drive device, 16-
Lifting drive, 17-laser socket, 18-Optical Maser System, 19-sliding platform, 20-dust excluding hood, 21-heavy duty pin
Cup.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
As shown in Figure 1 to Figure 3, a kind of large-breadth plates laser etching machine that the present embodiment is provided, including frame, work are put down
Platform 13, first driving means 14, laser socket 17, the second drive device 15, lifting drive 16 and Optical Maser System 18.
Wherein, frame includes base 11 and by upright supports square crossbeam 12 on the pedestal 11, in the present embodiment, column
Gantry marble column and gantry marble crossbeam 12 are preferably used with crossbeam 12, so, column and crossbeam 12 have preferably
Intensity, can prevent it from deforming.Furthermore it is possible to heavily loaded pin cup 21 is provided with the bottom of frame, to reduce in process
Vibration.
Workbench 13 is slidably disposed on base 11, and first driving means 14 are used to drive workbench 13 to slide
's.Workbench 13 is used to carry workpiece to be added, and first driving means 14 make workpiece to be added not by driving workbench 13
With the above-mentioned Optical Maser System 18 of regional alignment.
Laser socket 17 is slidably disposed on crossbeam 12, and the second drive device 15 is used to drive laser socket 17 to slide
It is dynamic.Optical Maser System 18 is arranged on laser socket 17 by lifting drive 16, and lifting drive 16 is used to drive laser
Device system 18 is lifted.
It should be noted that the glide direction of workbench 13 is vertical with x-axis, the glide direction and y-axis of laser socket 17
Perpendicular, the driving direction of lifting drive 16 is parallel with z-axis, and the glide direction and the cunning of laser socket of workbench
Dynamic direction is all located in x/y plane.Above-mentioned " x-axis " " y-axis " " z-axis " refers respectively to three reference axis of three-dimensional system of coordinate.
In the technical scheme that the present embodiment is provided, workpiece to be added is fixed on workbench 13, field lens focal length is mixed up, by swashing
The a certain region of light device system 18 to machined part is etched processing, after the completion of the region processing, is driven by control first
The dynamic drive device 15 of device 14 and second, driving workbench 13 is slided, while driving Optical Maser System 18 to slide, makes laser
Another region of the alignment work platform 13 of system 18, is etched processing, so repeatedly, the technical scheme that the present embodiment is provided,
Large-breadth plates can be etched with processing, it is to avoid frequent transport large-breadth plates and the sheet material that causes is easily damaged and work
The problem of making less efficient.
Above-mentioned first driving means 14 can include linear electric motors and the sliding platform 19 driven by linear electric motors, and work is flat
Platform 13 is arranged on sliding platform 19.Guide rail can be provided between sliding platform 19 and base 11, enables the edge of sliding platform 19
Guide rail direction is slided, and the bearing of trend of guide rail is parallel with above-mentioned x-axis.Workbench 13 is arranged on sliding platform 19, and the two is consolidated
Fixed connection, and then by sliding platform 19 workbench 13 can be driven to translate.
In order to which workpiece to be added is fixed on workbench 13, it is to avoid the two misplaces, the present embodiment it is preferred
In scheme, multiple through holes for being used to adsorb workpiece to be added are distributed with workbench 13, through hole is connected with vacuum source.Above-mentioned vacuum
Source is used to provide negative-pressure gas, and negative-pressure gas is lived the absorption of workpieces being placed on workbench 13 by through hole, to be processed complete
Bi Hou, vacuum source carries out release, so as to which workpiece is removed from workbench 13.
Above-mentioned second drive device 15, which may also comprise, can be provided with guide rail, the edge of laser socket 17 on linear electric motors, crossbeam 12
Guide rail is slided, and linear electric motors are used to drive laser socket 17 along guide rail shift reciprocately.
In addition, in order to avoid the dust produced in etching process is polluted to external world, the lower end of Optical Maser System 18 can
So that provided with dust excluding hood 20, during processing, dust excluding hood 20 is covered on workpiece, the dust that etching process is produced is in the presence of dust excluding hood 20
Do not diffuse into surrounding environment.Further, dust excluding hood 20 is connected with dust collecting system, and dust is housed in dust excluding hood 20,
And collection is siphoned away by dust collecting system.Dust collecting system is similar to dust catcher principle of the prior art, no longer carries out herein
Illustrate.
In order to improve automation, the large-breadth plates laser etching machine that the present embodiment is provided, in addition to Grating Detecting System
And control system, wherein, Grating Detecting System is used for the position of detection laser system 18 and workbench 13, and control system is used
In control first driving means 14, the second drive device 15 and lifting drive 16.Moreover, control system and Grating examinations system
System is communicably connected.
Optical Maser System 18 and the positional information of workbench 13 that control system is gathered by Grating Detecting System, control
First driving means 14, the second drive device 15 and lifting drive 16, to realize Optical Maser System 18 and workbench
13 be automatically positioned is automatically controlled with Optical Maser System 18.
In the present embodiment, the size of above-mentioned workbench 13 can be specially that length is 2000 millimeters, and width is 1500 millis
Rice.The scanning range of the scanning galvanometer of laser system can be 170 millimeters * 170 millimeters, when scanning galvanometer is in 2000 millimeters of *
Scanned on 1500 millimeters of absorption workbench behind a region, the driving workbench 13 or second of first driving means 14 drives
The driving Optical Maser System 18 of device 15 is moved to another region processing, and scanning galvanometer is scanned again, is moved again after the completion of scanning
Another region is moved, so repeatedly motion scan, until 2000 millimeters * 1500 millimeters of workbench 13 is machined.
The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other
Between the difference of embodiment, each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (8)
1. a kind of large-breadth plates laser etching machine, it is characterised in that including：
Frame, the frame includes base, the crossbeam by upright supports above the base；
The workbench being slidably disposed on the base and the first driving for driving the workbench to slide
Device；
The laser socket being slidably disposed on the crossbeam and the second driving for driving the laser socket to slide
Device；
Optical Maser System on the laser socket is arranged on by lifting drive；
The glide direction of the workbench is vertical with x-axis, and the glide direction and y-axis of the laser socket are perpendicular, the liter
The driving direction for dropping drive device is parallel with z-axis, and the slip of the glide direction of the workbench and the laser socket
Direction is all located in x/y plane.
2. large-breadth plates laser etching machine as claimed in claim 1, it is characterised in that the first driving means include straight
Line motor and the sliding platform driven by linear electric motors, the workbench are arranged on the sliding platform.
3. large-breadth plates laser etching machine as claimed in claim 2, it is characterised in that be distributed with the workbench many
The individual through hole for being used to adsorb workpiece to be added, the through hole is connected with vacuum source.
4. large-breadth plates laser etching machine as claimed in claim 1, it is characterised in that second drive device includes straight
Line motor.
5. large-breadth plates laser etching machine as claimed in claim 1, it is characterised in that also including being arranged on the laser
The dust excluding hood of the lower end of system.
6. the large-breadth plates laser etching machine as described in claim any one of 1-5, it is characterised in that also include：
Grating Detecting System for detecting the Optical Maser System and the work-table position；
Control system for controlling the first driving means, the second drive device and the lifting drive, the control
System processed is communicably connected with the Grating Detecting System.
7. large-breadth plates laser etching machine as claimed in claim 1, it is characterised in that the length of the workbench is 2
Rice, width is 1.5 meters.
8. large-breadth plates laser etching machine as claimed in claim 1, it is characterised in that the bottom of the frame is provided with heavy duty
Pin cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606868.XA CN107160044A (en) | 2017-07-24 | 2017-07-24 | A kind of large-breadth plates laser etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606868.XA CN107160044A (en) | 2017-07-24 | 2017-07-24 | A kind of large-breadth plates laser etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107160044A true CN107160044A (en) | 2017-09-15 |
Family
ID=59817370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710606868.XA Pending CN107160044A (en) | 2017-07-24 | 2017-07-24 | A kind of large-breadth plates laser etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107160044A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598590A (en) * | 2018-05-29 | 2018-09-28 | 黄山科太环保科技有限公司 | A kind of amorphous silicon membrane lithium battery etching device |
| CN110977175A (en) * | 2019-12-18 | 2020-04-10 | 沈阳新松机器人自动化股份有限公司 | Steel plate coating removing equipment and method |
| CN111730215A (en) * | 2020-07-24 | 2020-10-02 | 苏州天准科技股份有限公司 | Laser direct imaging apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100228398B1 (en) * | 1996-12-18 | 1999-11-01 | 정선종 | Micro dry etching device using laser ablation |
| CN203471145U (en) * | 2013-07-18 | 2014-03-12 | 深圳市大族激光科技股份有限公司 | Laser processing device |
| CN104635626A (en) * | 2013-11-12 | 2015-05-20 | 西安中科麦特电子技术设备有限公司 | Laser micro-processing control system |
| CN105290619A (en) * | 2015-12-10 | 2016-02-03 | 深圳锦帛方激光科技有限公司 | Laser engraving machine |
| CN205147593U (en) * | 2015-08-27 | 2016-04-13 | 深圳市荣兴精密激光技术有限公司 | A etching machine for light guide plate |
| CN206153765U (en) * | 2016-09-30 | 2017-05-10 | 广东正业科技股份有限公司 | Decide longmen duplex position laser cutting equipment |
| CN206230258U (en) * | 2016-12-07 | 2017-06-09 | 河北程杰汽车转向机制造有限公司 | Steering machine valve body circle end face clamp for machining |
-
2017
- 2017-07-24 CN CN201710606868.XA patent/CN107160044A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100228398B1 (en) * | 1996-12-18 | 1999-11-01 | 정선종 | Micro dry etching device using laser ablation |
| CN203471145U (en) * | 2013-07-18 | 2014-03-12 | 深圳市大族激光科技股份有限公司 | Laser processing device |
| CN104635626A (en) * | 2013-11-12 | 2015-05-20 | 西安中科麦特电子技术设备有限公司 | Laser micro-processing control system |
| CN205147593U (en) * | 2015-08-27 | 2016-04-13 | 深圳市荣兴精密激光技术有限公司 | A etching machine for light guide plate |
| CN105290619A (en) * | 2015-12-10 | 2016-02-03 | 深圳锦帛方激光科技有限公司 | Laser engraving machine |
| CN206153765U (en) * | 2016-09-30 | 2017-05-10 | 广东正业科技股份有限公司 | Decide longmen duplex position laser cutting equipment |
| CN206230258U (en) * | 2016-12-07 | 2017-06-09 | 河北程杰汽车转向机制造有限公司 | Steering machine valve body circle end face clamp for machining |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598590A (en) * | 2018-05-29 | 2018-09-28 | 黄山科太环保科技有限公司 | A kind of amorphous silicon membrane lithium battery etching device |
| CN110977175A (en) * | 2019-12-18 | 2020-04-10 | 沈阳新松机器人自动化股份有限公司 | Steel plate coating removing equipment and method |
| CN111730215A (en) * | 2020-07-24 | 2020-10-02 | 苏州天准科技股份有限公司 | Laser direct imaging apparatus |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170915 |