CN207615894U - A kind of sapphire multistation perforating device - Google Patents
A kind of sapphire multistation perforating device Download PDFInfo
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- CN207615894U CN207615894U CN201721140338.2U CN201721140338U CN207615894U CN 207615894 U CN207615894 U CN 207615894U CN 201721140338 U CN201721140338 U CN 201721140338U CN 207615894 U CN207615894 U CN 207615894U
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- sapphire
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- jig
- galvanometer
- perforating device
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Abstract
The utility model discloses a kind of sapphire multistation perforating device, including laser assembly, laser assembly includes picosecond laser, and the light beam that picosecond laser is sent out is refracted at least two galvanometers arranged side by side by optical path component, and is transmitted away by galvanometer；Positioning table below laser module is equipped with sapphire jig identical with galvanometer quantity, and sapphire jig is located at the underface of galvanometer, and the position of sapphire jig and galvanometer corresponds；It is equipped with close to the position of positioning table and carries module, it includes sliding rail to carry module, and can be along the sapphire raw material grasping mechanism and sapphire finished product grasping mechanism that sliding rail moves, and sapphire feeding module and sapphire discharging module is respectively set in sliding rail both ends.The utility model provides a kind of sapphire multistation perforating device, can accurately be positioned to supplied materials, using the light path control of laser to the quantity of punching, realizes efficiently punching.
Description
Technical field
The utility model belongs to automatic industrial manufacture field, and in particular to a kind of sapphire multistation perforating device.
Background technology
Sapphire is commonly called as corundum, it has excellent optical property, mechanical performance and chemical stability, intensity height, hardness
Greatly, it can work under the mal-condition close to 2000 DEG C of high temperature, thus be widely used in infrared military installation, satellite spatial
The window material of technology, high intensity laser beam.Sapphire is also gradually applied to mobile phone industry at present, such as is applied to hand as protecgulum
Machine, characteristic that is wear-resisting using its, resisting protect mobile phone.However, sapphire hardness is very high, processing difficulties, even if using advanced
Nano laser cut, also due to hot melt problem cut surface generate microcrack, need to be ground again after dicing
Grinding and polishing light processing causes processing procedure very long, inefficiency.With the continuous improvement of cost of labor, people are to sapphire punch device
More stringent requirements are proposed.
Invention content：
In order to overcome the defect of above-mentioned background technology, the utility model to provide a kind of sapphire multistation perforating device, energy
It is enough that supplied materials is accurately positioned, the quantity of punching, position, size are quickly set using the light path control of laser
It sets, realizes efficiently punching.
In order to solve the above-mentioned technical problem the used technical solution of the utility model is：
A kind of sapphire multistation perforating device, including laser assembly, laser assembly include picosecond laser, picosecond
The light beam that laser is sent out is refracted at least two galvanometers arranged side by side by optical path component, and is transmitted away by galvanometer；Swash
Positioning table below optical assembly is equipped with sapphire jig identical with galvanometer quantity, and sapphire jig is being located at galvanometer just
Lower section, and the position of sapphire jig and galvanometer corresponds；It is equipped with close to the position of positioning table and carries module, carry mould
Group includes sliding rail, and can be along the sapphire raw material grasping mechanism and sapphire finished product grasping mechanism that sliding rail moves, sapphire raw material
The quantity of grasping mechanism and sapphire finished product grasping mechanism is identical as the quantity of sapphire jig, and blue treasured is respectively set in sliding rail both ends
Stone feeding module and sapphire discharging module.
Preferably, laser assembly, carrying module, sapphire feeding module, sapphire discharging module and positioning table
It is arranged on the mounting platform of rack.
Preferably, the sliding rail for carrying module is arranged on mounting platform, sliding rail is equipped with the support platform being slidably connected, branch
It supports platform and is equipped with holder, sapphire raw material grasping mechanism and sapphire finished product grasping mechanism are symmetricly set on the both sides of holder.
Preferably, being additionally provided at least two cleaning mechanisms on holder, two cleaning mechanisms are separately positioned on close to sapphire
The position of raw material grasping mechanism and sapphire finished product grasping mechanism；Cleaning mechanism includes hairbrush.
Preferably, sapphire feeding module and sapphire discharging module include slide unit rebound, slide unit rebound passes through peace
It fills seat to be arranged on mounting platform, slide unit rebound is equipped with several material baskets.
Preferably, positioning table includes for clamping sapphire sapphire jig, sapphire jig is arranged in jig
On pedestal, jig base is arranged by cushion block on positioning support seat, and the setting of positioning support seat adjusts platform on adjusting platform
Equipped with the linear motor regulating mechanism for adjusting positioning support seat X axis and Y-axis position；At least one jig base and cushion block
Between be equipped with manual fine-tuning platform.
Preferably, mounting platform is equipped with air blower, the vacuum cleaning mouth of air blower passes through on bellows and jig base
Pumping dirt pipe docking.
Preferably, the light beam that picosecond laser is sent out is refracted to speculum by outer optical path component, speculum is anti-by optical fiber
It is mapped to galvanometer, light path seal sleeve is additionally provided between speculum and galvanometer.
The beneficial effects of the utility model are：A kind of sapphire multistation perforating device is provided, for solving sapphire
Difficult problem is punched, it can effectively change, and traditional equipment sapphire perforating efficiency is low, and precision is low, the big present situation of difficulty.This reality
Use picosecond laser, the laser beam which sends out that there is ultrashort pulsewidth with novel, its energy is high, and diversity is small.Pass through
Spectroscopical light beam is uniformly divided into two bundles light, which realizes light path Orientation differences by galvanometer, realizes product not with this
With the processing of position.This device uses double-station automatic loading/unloading, positioning table to walk automatically, double-station rapid processing, energy
It is quickly accurate to realize sapphire punching, and the size, quantity, position of punching can be quickly arranged, blue treasured greatly improved
The efficiency of stone punching.Using unified mounting platform benchmark, the precision of processing and the stability of equipment processing can guarantee；It carries
Each performs its own functions for module or so station, and left station is finished product grabbing device, and right working position is raw material grabbing device, when right working position feeding
When, left station can on expect positioning table, when expecting positioning table on right working position, left station can put finished product
To blanking material basket, the efficiency of processing is substantially increased in this way.
Description of the drawings
Fig. 1 is the general structure schematic diagram of the utility model embodiment,
Fig. 2 is the carrying modular structure schematic diagram of the utility model embodiment,
Fig. 3 is the input and output material modular structure schematic diagram of the utility model embodiment,
Fig. 4 is the positioning table structural schematic diagram of the utility model embodiment,
Fig. 5 is the laser module structural schematic diagram of the utility model embodiment.
In figure：1- laser assemblies, 1.1- picosecond lasers, 1.2- optical path components, 1.3- galvanometers, 1.4- speculums,
1.5- light path seal sleeves, 2- positioning tables, 2.1- sapphire fixtures, 2.2- manual fine-tuning platforms, 2.3- positioning supports
Seat, 2.4- adjusting platforms, 2.5- sapphire jigs, 2.6- jig bases, 2.7- cushion blocks, 3- carrying modules, 3.1- sliding rails,
3.2- sapphire raw material grasping mechanisms, 3.3- sapphire finished product grasping mechanisms, 3.4- support platforms, 3.5- holders, 3.6- cleanings
Mechanism, 4- sapphire feeding modules, 5- sapphire discharging modules, 6- slide unit rebounds, 7- material baskets, 8- mounting bases, 9- filter cylinders,
10- racks, 11- mounting platforms, 12 air blowers.
Specific implementation mode
The utility model is described further with reference to the accompanying drawings and examples.
A kind of sapphire multistation perforating device, including laser assembly 1, laser assembly 1 include picosecond laser
1.1, the light beam that picosecond laser 1.1 is sent out is refracted at least two galvanometers 1.3 arranged side by side by optical path component 1.2, and
It is transmitted away by galvanometer 1.3；Positioning table 2 below laser module is controlled equipped with sapphire identical with 1.3 quantity of galvanometer
Tool 2.5, sapphire jig 2.5 is located at the underface of galvanometer 1.3, and sapphire jig 2.5 and the position one of galvanometer 1.3 are a pair of
It answers；It is equipped with close to the position of positioning table 2 and carries module 3, it includes sliding rail 3.1 to carry module 3, and can be moved along sliding rail 3.1
Sapphire raw material grasping mechanism 3.2 and sapphire finished product grasping mechanism 3.3, sapphire raw material grasping mechanism 3.2 and sapphire
The quantity of finished product grasping mechanism 3.3 is identical as the quantity of sapphire jig 2.5, and sapphire feeding is respectively set in 3.1 both ends of sliding rail
Module 4 and sapphire discharging module 5.
Laser assembly 1 carries module 3, sapphire feeding module 4, sapphire discharging module 5 and positioning table 2
It is arranged on the mounting platform 11 of rack 10.
The sliding rail 3.1 for carrying module 3 is arranged on mounting platform 11, and sliding rail 3.1 is equipped with the support platform being slidably connected
3.4, support platform 3.4 is equipped with holder 3.5, and sapphire raw material grasping mechanism 3.2 and sapphire finished product grasping mechanism 3.3 are symmetrical
It is arranged in the both sides of holder 3.5.
At least two cleaning mechanisms 3.6 are additionally provided on holder 3.5, two cleaning mechanisms 3.6 are separately positioned on close to blue precious
The position of stone raw material grasping mechanism 3.2 and sapphire finished product grasping mechanism 3.3；Cleaning mechanism 3.6 includes hairbrush.
Sapphire feeding module 4 and sapphire discharging module 5 include slide unit rebound 6, and slide unit rebound 6 passes through mounting base
8 are arranged on mounting platform 11, and slide unit rebound 6 is equipped with several material baskets 7.
Positioning table 2 includes for clamping sapphire sapphire jig 2.5, and sapphire jig 2.5 is arranged in jig
On pedestal 2.6, jig base 2.6 is arranged by cushion block 2.7 on positioning support seat 2.3, and the setting of positioning support seat 2.3 is being adjusted
On platform 2.4, adjusts the linear motor that platform 2.4 is equipped with for adjusting positioning support seat 2.3X axis and Y-axis position and adjust machine
Structure；Manual fine-tuning platform 2.2 is equipped between at least one jig base 2.6 and cushion block 2.7.Sapphire jig 2.5 includes blue precious
Stone fixture 2.1.
Mounting platform 11 is equipped with air blower 12, and the vacuum cleaning mouth of air blower 12 passes through bellows and jig base 2.6
On pumping dirt pipe docking.
The light beam that picosecond laser 1.1 is sent out is refracted to speculum 1.4 by outer optical path component 1.2, and speculum 1.4 will
Fiber reflection is additionally provided with light path seal sleeve 1.5 to galvanometer 1.3 between speculum 1.4 and galvanometer 1.3.
Above-mentioned mounting platform 11 is marble platform, punching size, the optical path component of 1 outgoing laser beam of laser assembly
1.2 path, the position of sapphire feeding module 4 and sapphire discharging module 5, positioning table 2 and carrying component are by work
Control machine controls.
Optical path component 1.2 includes picosecond light path box, speculum 1.4, firm banking, beam expanding lens, slide, spectroscope, dust-proof
Cover, z axis module, galvanometer 1.3, are supported on by marble support platform 3.4 on mounting platform 11.
2 component of positioning table includes vacuum absorption device, positioning fixture, product jig, XY linear motors, wherein XY
Linear motor is by linear motor driver and included control card control.
Material basket 7 on sapphire feeding module 4 and sapphire discharging module 5 is by Serve Motor Control, along slide unit rebound 6
Mobile, action is controlled by PLC and its hardware circuit；
The action that the support platform 3.4 of module 3 is slided along sliding rail 3.1 is carried, sapphire raw material grasping mechanism 3.2 (is carried
3 right working position of module) and sapphire finished product grasping mechanism 3.3 (carry module 3 left station) grasping movement, cleaning mechanism 3.6
Cleaning action is controlled by motor, motor PLC controls.
PLC connection man-machine interfaces.It includes that dirt pipe is taken out on top to be additionally provided on mounting platform 11 and take out dirt component, takes out dirt fixed plate,
Dirt bellows is taken out, Y types take out dirt pipe, air blower 12, filter cylinder 9 etc..
A kind of sapphire multistation perforating device is present embodiments provided, for solving the problems, such as that sapphire punching is difficult,
It can effectively change that traditional equipment sapphire perforating efficiency is low, and precision is low, the big present situation of difficulty.The utility model use picosecond swashs
Light device 1.1, the laser beam which sends out have ultrashort pulsewidth, its energy is high, and diversity is small.Pass through spectroscopical light beam quilt
It uniformly is divided into two bundles light, which realizes light path Orientation differences by galvanometer 1.3, and adding for product different location is realized with this
Work.This device uses double-station automatic loading/unloading, positioning table 2 to walk automatically, double-station rapid processing, can be quickly accurate real
Existing sapphire punching, and the size, quantity, position of punching can be quickly arranged, the effect of sapphire punching greatly improved
Rate.Using unified 11 benchmark of mounting platform, the precision of processing and the stability of equipment processing can guarantee；It is taken at punching non-
Contact is processed, and scale error is punched caused by avoiding the abrasion such as cutter；The waste residue generated is punched, it is automatic by air blower 12
Cleaning.Also it can realize automatic collection by filter cylinder 9.Carrying 3 or so station of module, Each performs its own functions, and left station is finished product crawl dress
Set, right working position be raw material grabbing device, when right working position feeding, left station can on expect positioning table 2, work as right working position
On when expecting positioning table 2, left station can put finished product to blanking material basket 7, substantially increase the efficiency of processing in this way.
First two groups of sapphire raw materials to be processed are respectively charged into two raw material material baskets 7 of sapphire feeding module 4, are placed on
On 4 slide unit rebound 6 of sapphire feeding module, it is controlled by PLC and its hardware circuit and moves to feeding station；
Carry the feeding sucker movement of two sapphire raw material grasping mechanisms 3.2 (carrying 3 right working position of module) of module 3
To after feeding position (namely position of 4 material basket 7 of sapphire feeding module)：Tilt cylinder swings (sucker is vertically against product), feeding gas
Cylinder declines, 4 fine motion (raw material is made to be contacted with sucker) of sapphire feeding module, feeding sucker air-breathing, and feeding cylinder rises, tilt cylinder
Rotation (keeps sucker horizontal), and feeding sucker is moved to discharge position (while positioning table 2 is moved to discharge position up and down) up and down,
Feeding cylinder declines (product is put on positioning table 2), and the positioning fixture vacuum opening of positioning table 2 (sucks production
Product), feeding cylinder rises, and positioning table 2 is moved to machining position, carries module 3 and returns to feeding position and (while carrying 3 He of module
Feeding module repeats above-mentioned action).
The positioning fixture vacuum of positioning table 2 disconnects, 2 clamp of positioning table, the locating clip of positioning table 2
Tool unclamps, and 2 vacuum of positioning table is opened, the laser beam laser perforation processing that picosecond laser 1.1 is sent out, and positions work
Make platform 2 and is moved to feeding position.
It carries the sapphire finished product grasping mechanism 3.3 (carry module 3 left station) on module 3 and reaches feeding position, under cylinder
Drop is carried 3 sucker vacuum of module and is opened, and the positioning fixture vacuum of positioning table 2 disconnects, and carries 3 cylinder of module and rises, carries
Module 3 is moved to lower material position (cleaning mechanism 3.6 while cleaning positioning table 2), and sapphire discharging module 5 moves to blanking
3 tilt cylinder of module rotation (sucker is vertical) is carried in position, carries 3 cylinder of module and declines (product is put into feeding basket 7), carries mould
3 sucker vacuum of group disconnect, and carry 3 right cylinder of module and rise, and carry 3 tilt cylinder of module rotation (sucker is horizontal), carry 3 feeding of module
Standby position (carries out next flake products processing).
The present apparatus uses double-station loading and unloading, double-station to process simultaneously, substantially increases the efficiency of sapphire perforation processing.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Claims (8)
1. a kind of sapphire multistation perforating device, including laser assembly (1), it is characterised in that：Laser assembly (1) includes
Picosecond laser (1.1), the light beam that the picosecond laser (1.1) sends out are refracted at least two by optical path component (1.2)
Galvanometer (1.3) arranged side by side, and transmitted away by the galvanometer (1.3)；Positioning work below the laser assembly (1)
Platform (2) is equipped with sapphire jig (2.5) identical with the galvanometer (1.3) quantity, and the sapphire jig (2.5) is located at institute
The underface of galvanometer (1.3) is stated, and the sapphire jig (2.5) and the position of the galvanometer (1.3) correspond；Close to institute
The position for stating positioning table (2) is equipped with carrying module (3), and the carrying module (3) includes sliding rail (3.1), and can be along described
The mobile sapphire raw material grasping mechanism (3.2) of sliding rail (3.1) and sapphire finished product grasping mechanism (3.3), the sapphire are former
Expect the quantity of the quantity and the sapphire jig (2.5) of grasping mechanism (3.2) and the sapphire finished product grasping mechanism (3.3)
Identical, sapphire feeding module (4) and sapphire discharging module (5) is respectively set in sliding rail (3.1) both ends.
2. a kind of sapphire multistation perforating device according to claim 1, it is characterised in that：The laser assembly
(1), the carrying module (3), the sapphire feeding module (4), the sapphire discharging module (5) and the positioning work
Platform (2) is arranged on the mounting platform (11) of rack (10).
3. a kind of sapphire multistation perforating device according to claim 2, it is characterised in that：The carrying module (3)
The sliding rail (3.1) be arranged on the mounting platform (11), the sliding rail (3.1) is equipped with the support platform that is slidably connected
(3.4), the support platform (3.4) is equipped with holder (3.5), the sapphire raw material grasping mechanism (3.2) and the blue treasured
Stone finished product grasping mechanism (3.3) is symmetricly set on the both sides of the holder (3.5).
4. a kind of sapphire multistation perforating device according to claim 3, it is characterised in that：On the holder (3.5)
At least two cleaning mechanisms (3.6) are additionally provided with, two cleaning mechanisms (3.6) are separately positioned on close to the sapphire raw material
The position of grasping mechanism (3.2) and the sapphire finished product grasping mechanism (3.3)；The cleaning mechanism (3.6) includes hairbrush.
5. a kind of sapphire multistation perforating device according to claim 2, it is characterised in that：The sapphire feeding mould
Group (4) and sapphire discharging module (5) include slide unit rebound (6), and the slide unit rebound (6) is arranged by mounting base (8)
On the mounting platform (11), the slide unit rebound (6) is equipped with several material baskets (7).
6. a kind of sapphire multistation perforating device according to claim 2, it is characterised in that：The positioning table
(2) include for clamping sapphire sapphire jig (2.5), the sapphire jig (2.5) is arranged in jig base (2.6)
On, the jig base (2.6) is arranged by cushion block (2.7) on positioning support seat (2.3), the positioning support seat (2.3)
On adjusting platform (2.4), the adjusting platform (2.4) is equipped with for adjusting positioning support seat (2.3) X-axis and Y for setting
The linear motor regulating mechanism of shaft position；It is equipped between at least one jig base (2.6) and the cushion block (2.7) manual
Fine adjustment stage (2.2).
7. a kind of sapphire multistation perforating device according to claim 6, it is characterised in that：The mounting platform (11)
It is equipped with air blower (9), the vacuum cleaning mouth of the air blower (9) passes through the pumping on bellows and the jig base (2.6)
Dirt pipe docks.
8. according to a kind of sapphire multistation perforating device of claim 1-7 any one of them, it is characterised in that：Described picosecond
The light beam that laser (1.1) is sent out is refracted to speculum (1.4) by outer optical path component (1.2), and the speculum (1.4) is by light
Fibre is reflected into galvanometer (1.3), and light path seal sleeve (1.5) is additionally provided between the speculum (1.4) and the galvanometer (1.3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721140338.2U CN207615894U (en) | 2017-09-07 | 2017-09-07 | A kind of sapphire multistation perforating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721140338.2U CN207615894U (en) | 2017-09-07 | 2017-09-07 | A kind of sapphire multistation perforating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207615894U true CN207615894U (en) | 2018-07-17 |
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ID=62818934
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| CN201721140338.2U Active CN207615894U (en) | 2017-09-07 | 2017-09-07 | A kind of sapphire multistation perforating device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110682002A (en) * | 2019-09-11 | 2020-01-14 | 武汉船舶通信研究所（中国船舶重工集团公司第七二二研究所） | Automatic change radium carving equipment |
| CN110757574A (en) * | 2018-07-28 | 2020-02-07 | 深圳市东德宇科技有限公司 | Jewelry precision punching plastic hexagonal hole site template |
| CN111702352A (en) * | 2020-07-16 | 2020-09-25 | 厦门柔性电子研究院有限公司 | Laser punching and sorting equipment |
| CN115245993A (en) * | 2021-04-25 | 2022-10-28 | 昆山玛冀电子有限公司 | Coil lead cutting machine and cutting method |
| CN117259346A (en) * | 2023-11-16 | 2023-12-22 | 珠海市申科谱工业科技有限公司 | Sapphire glass surface printing ink laser removing equipment |
-
2017
- 2017-09-07 CN CN201721140338.2U patent/CN207615894U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110757574A (en) * | 2018-07-28 | 2020-02-07 | 深圳市东德宇科技有限公司 | Jewelry precision punching plastic hexagonal hole site template |
| CN110682002A (en) * | 2019-09-11 | 2020-01-14 | 武汉船舶通信研究所（中国船舶重工集团公司第七二二研究所） | Automatic change radium carving equipment |
| CN110682002B (en) * | 2019-09-11 | 2021-06-29 | 武汉船舶通信研究所（中国船舶重工集团公司第七二二研究所） | Automatic change radium carving equipment |
| CN111702352A (en) * | 2020-07-16 | 2020-09-25 | 厦门柔性电子研究院有限公司 | Laser punching and sorting equipment |
| CN115245993A (en) * | 2021-04-25 | 2022-10-28 | 昆山玛冀电子有限公司 | Coil lead cutting machine and cutting method |
| CN117259346A (en) * | 2023-11-16 | 2023-12-22 | 珠海市申科谱工业科技有限公司 | Sapphire glass surface printing ink laser removing equipment |
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