CN105722340A

CN105722340A - Blind hole processing method of PCB

Info

Publication number: CN105722340A
Application number: CN201511003212.6A
Authority: CN
Inventors: 卢华勇; 李小王; 刘德林
Original assignee: HUIZHOU CEE ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: HUIZHOU CEE ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2015-12-25
Filing date: 2015-12-25
Publication date: 2016-06-29

Abstract

The invention provides a blind hole processing method of a PCB. According to a visual scope of a scanning electron microscope, the PCB is divided into multiple areas, at the same time, an optical path travelling path is set, first-shot laser light is given in the first area of an scanning electron microscope region, then the first-shot laser light is given to a next area, and until light is given to all the areas, the laser light moves back to the first area for a second shot or the second shot and a third shot in a roll, and until the light is given to all the areas, the laser light then moves back to the first area for the third shot. The blind hole processing method of the PCB, provided by the invention, effectively solves the phenomena of drum type holes or layering and foaming which are easily caused by use of a conventional mode in deep blind hole processing, and improves the hole type quality and the reliability of deep blind hole processing.

Description

A kind of method for processing blind hole of pcb board

Technical field

The present invention relates to PCB manufacturing technology field, be specifically related to the method for processing blind hole of a kind of pcb board.

Background technology

Along with the electronic products such as mobile equipment develop to light, thin, short, little direction, built-in printed circuit board also must develop to direction lightweight, that volume is little, line density is high accordingly.Occur in that highly dense interconnection printed circuit board (HDI), the introducing with small buried blind via that becomes more meticulous of HDI plate, decrease the high-layer problem in multi-layer sheet, but also save the layout area in plate face to a great extent.Blind hole therein is processed as its key technology, has multiple processing method at present as first opened the processing of copper window and directly radium-shine beating Copper fabrication etc..But no matter which kind of mode carries out radium-shine resin medium after removing copper window adds man-hour, especially thick resin (more than 50um) small blind hole (below 4mil) adds the phenomenon easily occurring cydariform hole man-hour or dividing, bubble, and causes that yield is relatively low.Main cause is, conventional processing mode is the Continuous maching adopting 2 steps or 3 steps, due to CO₂Energy is too high, and Recession rate quickly, if adopted when once (3 step) just completes ablation micro hole, then often on internal copper layers of foil surface, owing to temperature is too high, causes Organic substance, carbide (to have little time and O in air₂Burning or spilling), or cause drum type hole, even causing internal Copper Foil temperature too high (conducting heat), thus causing internal copper layers of foil and inner dielectric layer disengaging (layering or foaming) phenomenon, needing further perfect.

Summary of the invention

The present invention is directed to above-mentioned the deficiencies in the prior art and provide one can reduce PCB cost of manufacture, the method for processing blind hole of the pcb board of production efficiency can be improved again simultaneously.

The present invention solves that the technical scheme that the problems referred to above adopt is:

A kind of method for processing blind hole of pcb board, PCB is divided into multiple region by the visual range according to electron scanning Electronic Speculum, laser light cycle period is set according to electron scanning Electronic Speculum burst length length, concurrently set light path walking path, the first rifle laser light is first made a call in 1 region in scanning electron microscope region, but move to subsequent region and make a call to the first rifle laser light, move back to 1 region until described laser light after having beaten Zone Full and make the second rifle, until the second rifle moves back to 1 region after all having beaten again makes the 3rd rifle to completing.

Further, PCB is divided into multiple region by the visual range according to electron scanning mirror, laser light cycle period is set according to electron scanning Electronic Speculum burst length length, concurrently set light path walking path, 1 rifle laser light is first made a call in 1 region in scanning electron microscope region, it is subsequently moved to subsequent region and makes a call to the first rifle laser light, move back to 1 region until described laser light after having beaten Zone Full and make the 2nd rifle and the 3rd rifle continuously, be subsequently moved to subsequent region and make a call to the 2nd rifle and the 3rd rifle laser light continuously until having beaten Zone Full.

Further, described electron scanning Electronic Speculum visual range is: 50mm*50mm.

Further, described second rifle laser light energy is the 50% of described first rifle laser light energy, and described 3rd rifle laser light energy is the 50% of described second rifle laser light energy,

The beneficial effects of the present invention is:

The method for processing blind hole of a kind of pcb board provided by the present invention is beaten to adopt in laser light process and is completed processing for three times, each energy is than last little energy 50%, the interval (heat radiation) added, thus being not result in significantly high temperature, so both can remove or reduce carbonization residue phenomenon, end copper and medium separation problem can be avoided again, the method effectively solve deep blind hole processing in adopt traditional approach easily cause cydariform hole or point, bubble as, promote deep blind hole processing pass quality and reliability.

Accompanying drawing explanation

Fig. 1 is the processing method schematic diagram of traditional handicraft blind hole；

Fig. 2 is electron scanning Electronic Speculum light path walking path of the present invention and directional diagram；

Fig. 3 is the processing method schematic diagram of blind hole in embodiment 1；

Fig. 4 is the processing method schematic diagram of blind hole in embodiment 2；

Detailed description of the invention

Specifically illustrate embodiments of the present invention below in conjunction with accompanying drawing, accompanying drawing is only for reference and illustrates to use, and does not constitute the restriction to scope of patent protection of the present invention.

Embodiment 1

As it is shown in figure 1, the Continuous maching of routine: in scanning mirror region, beating 2-3 rifle laser light forms complete blind hole continuously, moves again to subsequent region and repeats above action, to beat interval short so described problem before generation because of continuous；Advantage efficiency high-quality is poor, is suitable for big-diameter blind hole and thin-medium；

As shown in Figures 2 and 3, the method for processing blind hole of a kind of pcb board provided by the invention, PCB is divided into multiple region by the visual range according to electron scanning Electronic Speculum, laser light cycle period is set according to electron scanning Electronic Speculum burst length length, concurrently set light path walking path, the first rifle laser light is first made a call in 1 region in scanning electron microscope region, but move to subsequent region and make a call to the first rifle laser light, move back to 1 region until described laser light after having beaten Zone Full and make the second rifle, until the second rifle moves back to 1 region after all having beaten again makes the 3rd rifle to completing.

In the present embodiment, described electron scanning Electronic Speculum visual range is: 50mm*50mm.

In the present embodiment, described second rifle laser light energy is the 50% of described first rifle laser light energy, and described 3rd rifle laser light energy is the 50% of described second rifle laser light energy,

Embodiment 2

As shown in Figure 4, further, PCB is divided into multiple region by the visual range according to electron scanning mirror, laser light cycle period is set according to electron scanning Electronic Speculum burst length length, concurrently set light path walking path, 1 rifle laser light is first made a call in 1 region in scanning electron microscope region, it is subsequently moved to subsequent region and makes a call to the first rifle laser light, move back to 1 region until described laser light after having beaten Zone Full and make the 2nd rifle and the 3rd rifle continuously, be subsequently moved to subsequent region and make a call to the 2nd rifle and the 3rd rifle laser light continuously until having beaten Zone Full.

The beneficial effects of the present invention is:

Above-described embodiment is the present invention preferably embodiment; but embodiments of the present invention are also not restricted to the described embodiments; the change made under other any spirit without departing from the present invention and principle, modification, replacement, combination, simplification; all should be the substitute mode of equivalence, be included within protection scope of the present invention.

Claims

1. the method for processing blind hole of a pcb board, it is characterized in that: according to the visual range of electron scanning Electronic Speculum, PCB is divided into multiple region, laser light cycle period is set according to electron scanning Electronic Speculum burst length length, concurrently set light path walking path, the first rifle laser light is first made a call in 1 region in scanning electron microscope region, but move to subsequent region and make a call to the first rifle laser light, move back to 1 region until described laser light after having beaten Zone Full and make the second rifle, until the second rifle moves back to 1 region after all having beaten again makes the 3rd rifle to completing.

2. the method for processing blind hole of a kind of pcb board according to claim 1, it is characterized in that: according to the visual range of electron scanning mirror, PCB is divided into multiple region, laser light cycle period is set according to electron scanning Electronic Speculum burst length length, concurrently set light path walking path, 1 rifle laser light is first made a call in 1 region in scanning electron microscope region, it is subsequently moved to subsequent region and makes a call to the first rifle laser light, move back to 1 region until described laser light after having beaten Zone Full and make the 2nd rifle and the 3rd rifle continuously, it is subsequently moved to subsequent region and makes a call to the 2nd rifle and the 3rd rifle laser light continuously until having beaten Zone Full.

3. the method for processing blind hole of a kind of pcb board according to claim 1 and 2, it is characterised in that: described electron scanning Electronic Speculum visual range is: 50mm*50mm.

4. the method for processing blind hole of a kind of pcb board according to claim 1 and 2, it is characterised in that: described second rifle laser light energy is the 50% of described first rifle laser light energy, and described 3rd rifle laser light energy is the 50% of described second rifle laser light energy.