CN103081579A - Laser processing method - Google Patents
Laser processing method Download PDFInfo
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- CN103081579A CN103081579A CN2010800688242A CN201080068824A CN103081579A CN 103081579 A CN103081579 A CN 103081579A CN 2010800688242 A CN2010800688242 A CN 2010800688242A CN 201080068824 A CN201080068824 A CN 201080068824A CN 103081579 A CN103081579 A CN 103081579A
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- hole
- copper foil
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- pulse laser
- laser
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Provided is a laser processing method for drilling holes with a pulsed laser beam into a workpiece in which an insulating layer is sandwiched between a first conductor layer and a second conductor layer. The laser processing method includes: a first step of irradiating the same portion of the first conductor layer multiple times with the pulsed laser beam to form a first hole penetrating through the first conductor layer; and a second step of irradiating the portion of the insulating layer exposed by the first hole multiple times with the pulsed laser beam to form a second hole corresponding to the first hole and penetrating through the insulating layer. In the first step, the abovementioned same portion is irradiated multiple times with the pulsed laser beam generated at an oscillation frequency of 3 kHz to 15 kHz.
Description
Technical field
The present invention relates to a kind of laser processing.
Background technology
Known a kind of technology of carrying out blind hole processing, it is for having this at least 3 printed wiring board of the folded structure that forms layer by layer of Copper Foil, resin bed, Copper Foil, by irradiation UV laser, after thereby the Copper Foil of effects on surface (the 1st conductor layer) is processed, the resin bed (insulating barrier) that is positioned at this Copper Foil below is proceeded processing, until expose till the Copper Foil (the 2nd conductor layer) of this resin bed below.
In patent documentation 1, record following technology, namely, conductor layer is arranged, contain the substrate that is doped with glass (printed wiring board) that insulating barrier, the conductor layer of glass fibre form for stacked above one another, make UV laser carry out circumference action and after the conductor layer on surface processes window, via this window, utilize CO
2Laser carries out perforate processing at insulating barrier, utilizes the remaining film at the bottom of the UV laser ablation hole.Thus, according to patent documentation 1, can not need for removal remain in the film at the bottom of the hole chemical desmear (chemical desmear) operation (by adjust, wash, boil, the operation such as cooling, washing, expansion, washing, oxidation de-smear, washing, neutralization, washing, drying consists of).
Patent documentation 1: TOHKEMY 2002-118344 communique
Summary of the invention
In patent documentation 1, in that being carried out perforate, printed wiring board adds man-hour, and be to utilize the conductor layer of circumference processing (trepanning processing) effects on surface to process as prerequisite.
On the other hand, in patent documentation 1, not with in the relevant record of the processing (punching processing of the conductor layer on surface) of the same position irradiation multiple pulses laser of the conductor layer on surface.And, in patent documentation 1, not do not carry out perforate with the punching processing of conductor layer by the surface at printed wiring board (machined object) and add man-hour, how to carry out the record that stable perforate processing is correlated with.
The present invention is exactly In view of the foregoing and proposes, and its purpose is to obtain a kind of laser processing, and it can add man-hour machined object being carried out perforate, carries out stable perforate processing.
In order to solve above-mentioned problem, realize purpose, a laser processing that mode is related of the present invention, it utilizes pulse laser to have the machined object of insulating barrier to carry out perforate processing to clamping between the 1st conductor layer and the 2nd conductor layer, and this laser processing is characterised in that to have following operation, that is: the 1st operation, in this operation, to the same position irradiation multiple pulses laser of described the 1st conductor layer, and form the 1st hole of running through described the 1st conductor layer; And the 2nd operation, in this operation, in described insulating barrier, pass through the position that expose in described the 1st hole, irradiation multiple pulses laser, corresponding with described the 1st hole and form the 2nd hole run through described insulating barrier, in described the 1st operation, the pulse laser that will produce with the frequency of oscillation that is less than or equal to 15kHz more than or equal to 3kHz to described same position irradiation repeatedly.
The effect of invention
According to the present invention, in the 1st operation, owing to can stably be used to form the punching processing in the 1st hole of running through the 1st conductor layer, therefore, in the 2nd operation, and formation corresponding with the 1st hole runs through the 2nd hole of insulating barrier and also becomes easy.That is, can add and carry out stable perforate processing man-hour machined object being carried out perforate.
Description of drawings
Fig. 1 is the figure of the related laser processing of expression execution mode 1.
Fig. 2 is the figure of the machined object in the expression execution mode 1.
Fig. 3 is that the expression Copper Foil is removed processing conditions in the processing and the figure of the relation between the machinability.
Fig. 4 is that the expression resin is removed processing conditions in the processing and the figure of the relation between the machinability.
Fig. 5 is the figure that the processing example of execution mode 1 has been used in expression.
Fig. 6 is the figure that another processing example of execution mode 1 has been used in expression.
Fig. 7 is the figure of the related laser processing of expression execution mode 2.
Fig. 8 is the figure of the related laser processing of expression Comparative Examples.
Embodiment
Below, based on accompanying drawing, the execution mode of laser processing involved in the present invention is at length described.In addition, the present invention is not limited to present embodiment.
Execution mode 1
Use Fig. 1 that execution mode 1 related laser processing is described.Fig. 1 (a) to (d) is the process profile of the related laser processing of expression execution mode 1.
In the operation shown in Fig. 1 (a), prepare machined object 10.Machined object 10 is to have the printed wiring board that between Copper Foil (the 1st conductor layer) 11 and Copper Foil (the 2nd conductor layer) 12 clamping has 3 layers of structure of resin bed (insulating barrier) 13 for example shown in Fig. 2 (a).Resin bed 13 is for example take epoxy resin or polyimide based resin as main component.
In the operation shown in Fig. 1 (b), the same position 11e on Copper Foil 11 shines repeatedly UV pulse laser (that is, carrying out punching processing).Specifically, utilize oscillator (not shown) to produce the UV pulse laser.
At this, frequency of oscillation being made as F ［ kHz ］, energy density is made as E ［ J/mm
2The time, to satisfy F-E plane (with reference to Fig. 3)
3＜=F＜=15 formulas 1
0.05＜=E＜=0.30 formula 2
Mode, utilize oscillator (not shown) to produce the UV pulse laser.The zone of satisfying formula 1 and formula 2 is regional PR1 by the chain-dotted line encirclement shown in Figure 3.
In the zone (0＜F＜3) in regional PR1 left side shown in Figure 3, because long during each interpulse heat release of UV pulse laser, therefore, the shortage of heat to Copper Foil 11 processing is difficult to Copper Foil 11 is processed.In the zone on regional PR1 right side shown in Figure 3 (in 15＜F), owing to there is following trend, namely, (N: the Copper Foil spatters (spatter) that the UV pulse laser integer more than or equal to 2) is splashed by the UV pulsed laser irradiation of (N-1) individual pulse absorbs or scattering in N pulse, thereby can't be efficiently to Copper Foil 11 irradiations, therefore, be difficult to Copper Foil 11 is processed.In the zone (E＜0.05) of regional PR1 downside shown in Figure 3, there is the trend of the energy (for example heat energy) that the energy in each pulse of UV pulse laser needs less than the machining of Copper Foil 11, be difficult to Copper Foil 11 is processed.In the zone of regional PR1 upside shown in Figure 3 (in 0.30＜E), owing to there is following trend, namely, the resin bed 13 that is positioned at Copper Foil 11 belows causes excessive evaporating pressure because of superheated, produce peeling off of Copper Foil 11 or Copper Foil 12, the quality of the printed wiring board (machined object) after therefore might causing processing worsens.
In addition, (in 0.30＜E), the energy density of UV pulse laser is excessive energy density for resin, might produce the depression (excessively removing) of resin bed 13 in the zone of regional PR1 upside shown in Figure 3.In the case, might processing dimension compare with design size deviation large and so that processing quality worsen.And, be difficult to by the control of number of pulses selectively Copper Foil 11 be processed, accompany with resin bed 13 depressions, the Copper Foil 12 of its below also is removed, and might can't process blind hole.In order to process selectively Copper Foil 11, and reliably blind hole is carried out stable processing, the thickness fluctuation of Copper Foil 11 is taken into account, need to make energy density or number of pulses have surplus.From the preferred E of this point＜=0.30.
With the pulse frequency corresponding with the frequency of oscillation that satisfies formula 1 (F), penetrate the UV pulse laser from oscillator.That is, frequency of oscillation is less, and the pulse frequency of the UV pulse laser that penetrates from oscillator is also less.The UV pulse laser that penetrates from oscillator is to the same position 11e irradiation of Copper Foil 11 repeatedly (for example 5 times).That is, the UV pulse laser L1～L5 of 5 pulses penetrating from oscillator, order is to the same position 11e irradiation of Copper Foil 11.Thus, formed hole (the 1st hole) 11a(with reference to Fig. 1 (d)).Hole 11a is the hole that forms after the above-mentioned position 11e in the Copper Foil 11 is removed, and Copper Foil 11i is run through in this hole.
In the operation shown in Fig. 1 (c), position (same position) 13e that hole 11a exposes that passes through in the resin bed 13 shines repeatedly UV pulse laser (that is, carrying out punching processing).Specifically, utilize oscillator (not shown) to produce the UV pulse laser.
At this, frequency of oscillation being made as F ［ kHz ］, energy density is made as E ［ J/mm
2The time, to satisfy in the F-E plane (with reference to Fig. 3)
15＜F formula 3
E＜0.05 formula 4
Mode, utilize oscillator (not shown) to produce the UV pulse laser.The zone of satisfying formula 3 and formula 4 is Fig. 3 and the regional PR3 by dotted line shown in Figure 4.As regional PR3, corresponding with the processing conditions that can not remove Copper Foil 12 as shown in Figure 3, as shown in Figure 4, corresponding with the processing conditions that can remove resin bed 13.That is, can not remove the processing conditions of Copper Foil 12 with removing selectively resin bed 13 corresponding for regional PR3.
With the pulse frequency corresponding with the frequency of oscillation that satisfies formula 3, penetrate the UV pulse laser from oscillator.That is, frequency of oscillation is larger, and the pulse frequency of the UV pulse laser that penetrates from oscillator is also larger.The UV pulse laser that penetrates from oscillator passes through position 13e irradiation that hole 11a exposes repeatedly (for example 5 times) to the resin bed 13.That is, the UV pulse laser L11～L15 of 5 pulses penetrating from oscillator passes through the position 13e irradiation that hole 11a exposes in the resin bed 13 in turn.Thus, shown in Fig. 1 (d), formed hole (the 2nd hole) 13a, and after should expose by the position 12e that hole 13a exposes in Copper Foil 12, this position 12e is residual and be not removed.Hole 13a is with the rear hole that forms of position 13e removal that hole 11a exposes of passing through in the resin bed 13, has the shape corresponding with hole 11a and size.In addition, hole 13a runs through resin bed 13i.
As mentioned above, shown in Fig. 1 (d), formed consisted of by hole 11a and hole 13a, at the bottom of the hole by the blind hole BH1 of Copper Foil 12 obturations.
Next, use Fig. 5, the processing example of using the related laser processing of execution mode 1 is described.
In the operation shown in Fig. 5 (a), as the machined object 110 that needs processing blind hole BH100, prepared by Copper Foil 111 stacked above one another of the resin bed 113 of the Copper Foil 112 of thickness t 5 μ m, thickness t 10 μ m, thickness t 5 μ m and the printed wiring board that forms.
In the operation shown in Fig. 5 (b), the same position 111e in Copper Foil 111 shines 5 (5 pulses) UV pulse lasers.Specifically, utilize oscillator (not shown) to produce UV pulse laser L101～L105 with following processing conditions, thereby process.
Energy density: 0.07J/mm
2
Frequency of oscillation: 15kHz
Irradiated area: Ф 50 μ m=1962 μ m
2
Number of pulses: 5
This processing conditions satisfies above-mentioned formula 1 and formula 2, can stably process Copper Foil 111.Thus, form the hole 111a of diameter R100=50 μ m.Hole 111a runs through Copper Foil 111i.
In the operation shown in Fig. 5 (c), pass through 10 (10 pulses) UV pulse lasers of position 113e irradiation that hole 111a exposes in the resin bed 113.Specifically, utilize oscillator (not shown) to produce UV pulse laser L111～L120 with following processing conditions, thereby process.
Energy density: 0.02J/mm
2
Frequency of oscillation: 45kHz
Irradiated area: Ф 50 μ m=1962 μ m
2
Number of pulses: 10
This processing conditions satisfies above-mentioned formula 3 and formula 4, can not remove Copper Foil 112 and stably resin bed 113 is processed.Thus, form the hole 113a of diameter R100=50 μ m.Hole 113a runs through resin bed 113i.
As mentioned above, shown in Fig. 5 (d), form consisted of by hole 111a and hole 113a, at the bottom of the hole by the blind hole BH100 of Copper Foil 112 obturations.In addition, similarly, behind 100 position processing blind holes in printed wiring board (machined object 110), its result can stably process the blind hole identical with hole BH100 at all 100 positions.
Next, use Fig. 6, another processing example of using the related laser processing of execution mode 1 is described.
In the operation shown in Fig. 6 (a), as the machined object 210 that needs processing blind hole BH200, prepared by Copper Foil 211 stacked above one another of the resin bed 213 of the Copper Foil 212 of thickness t 5 μ m, thickness t 20 μ m, thickness t 5 μ m and the printed wiring board that forms.
In the operation shown in Fig. 6 (b), the same position 211e in Copper Foil 211 shines 5 (5 pulses) UV pulse lasers.Specifically, utilize oscillator (not shown) to produce UV pulse laser L201～L205 with following processing conditions, thereby process.
Energy density: 0.10J/mm
2
Frequency of oscillation: 15kHz
Irradiated area: Ф 50 μ m=1962 μ m
2
Number of pulses: 5
This processing conditions satisfies above-mentioned formula 1 and formula 2, can stably process Copper Foil 211.Thus, form the hole 211a of diameter R200=50 μ m.Hole 211a runs through Copper Foil 211i.
In the operation shown in Fig. 6 (c), pass through 15 (15 pulses) UV pulse lasers of position 213e irradiation that hole 211a exposes in the resin bed 213.Specifically, utilize oscillator (not shown) to produce UV pulse laser L211～L225 with following processing conditions, thereby process.
Energy density: 0.03J/mm
2
Frequency of oscillation: 30kHz
Irradiated area: Ф 50 μ m=1962 μ m
2
Number of pulses: 15
This processing conditions satisfies above-mentioned formula 3 and formula 4, can not remove Copper Foil 212 and stably resin bed 213 is processed.Thus, form the hole 213a of diameter R200=50 μ m.Hole 213a runs through resin bed 213i.
As mentioned above, shown in Fig. 6 (d), form consisted of by hole 211a and hole 213a, at the bottom of the hole by the blind hole BH200 of Copper Foil 212 obturations.In addition, similarly, behind 100 position processing blind holes in printed wiring board (machined object 210), its result can stably process the blind hole identical with hole BH200 at all 100 positions.
Next, use Fig. 8, the processing example of using the related laser processing of Comparative Examples is described.
In the operation shown in Fig. 8 (a), as the machined object 910 that needs processing blind hole, prepared by Copper Foil 911 stacked above one another of the resin bed 913 of the Copper Foil 912 of thickness t 5 μ m, thickness t 10 μ m, thickness t 5 μ m and the printed wiring board that forms.
In the operation shown in Fig. 8 (b), the same position 911e in Copper Foil 911 shines 5 (5 pulses) UV pulse lasers.Specifically, utilize oscillator (not shown) to produce UV pulse laser L901～L905 with following processing conditions, thereby process.
Energy density: 0.04J/mm
2
Frequency of oscillation: 25kHz
Irradiated area: Ф 50 μ m=1962 μ m
2
Number of pulses: 5
This processing conditions does not satisfy above-mentioned formula 1 and formula 2, forms the more shallow hole 911a of the degree of depth that does not run through Copper Foil 911i.
In the operation shown in Fig. 8 (c), to 10 (10 pulses) UV pulse lasers of hole 911a irradiation.Specifically, utilize oscillator (not shown) to produce UV pulse laser L911～L920 with following processing conditions, thereby process.
Energy density: 0.02J/mm
2
Frequency of oscillation: 45kHz
Irradiated area: Ф 50 μ m=1962 μ m
2
Number of pulses: 10
This processing conditions satisfies above-mentioned formula 3 and formula 4, but does not satisfy formula 1 and formula 2, and that left behind is the more shallow hole 911a of the degree of depth that does not run through Copper Foil 911i.
As mentioned above, shown in Fig. 8 (d), form the more shallow hole 911a of the degree of depth that does not run through Copper Foil 911i, can't form the hole of running through Copper Foil 911i.
Next, by execution mode 1 produce an effect, use the result after Fig. 3 and Fig. 4 explanation is tested for clearly.Fig. 3 is that the expression Copper Foil is removed the energy density E ［ J/mm in the processing
2And frequency of oscillation F ［ kHz ］ and machinability between the figure of relation.Fig. 4 is that the expression resin is removed the energy density E ［ J/mm in the processing
2And frequency of oscillation F ［ kHz ］ and machinability between the figure of relation.
As shown in Figure 3, the inventor attempts having carried out following processing: with actual service conditions, be E=0.02,0.03,0.04,0.05,0.06,0.07,0.08,0.10 and F=2.0,3.0,4.0,5.0,10.0,15.0,20.0,25.0,30.0,35.0,40.0, all combinations of 45.0, respectively with 100 the positions irradiations in the Copper Foil of printed wiring board of the UV pulse laser of 5 pulses.
Its result, in Fig. 3, as long as being arranged, 1 position can't remove Copper Foil (namely, can't form the hole of running through Copper Foil), then this information slip is shown *, can remove Copper Foils (that is, can form the hole of running through Copper Foil) at all 100 positions but the fluctuation of the diameter in hole is shown △ more than or equal to the information slip of setting, the fluctuation that can remove at all 100 positions the diameter in Copper Foils and hole is shown zero less than the information slip of setting.
For example, in Fig. 3, processing conditions (F, E)=(15,0.07) of using in processing example application implementation mode 1, Fig. 5 is illustrated with zero.Processing conditions (F, E)=(15,0.10) of using in processing example application implementation mode 1, Fig. 6 is illustrated with zero.Processing conditions (F, E)=(25,0.04) of using in the processing example of Fig. 8 that Comparative Examples is related on the other hand, with * illustrate.
According to the above results, it is the zone corresponding with preferred processing conditions in the Copper Foil removal processing that the inventor derives the regional PR1 that is surrounded by chain-dotted line shown in Figure 3.
In addition, as shown in Figure 4, the inventor attempts having carried out following processing: with actual service conditions, be E=0.02,0.03,0.04,0.05,0.06,0.07,0.08,0.10 and F=3.0,4.0,5.0,10.0,15.0,20.0,25.0,30.0,35.0,40.0, all combinations of 45.0, respectively with 100 the positions irradiations in the resin bed that exposes that has passed through the printed wiring board after the processing shown in Figure 3 of the UV pulse laser of 5 pulses.
Its result is in Fig. 3, as long as there is 1 position can't remove resin bed (namely, can't form the hole of running through resin bed), then this information slip is shown *, the information slip that can remove at all 100 positions resin bed (that is, can form the hole of running through resin bed) is shown zero.
For example, in Fig. 4, processing conditions (F, E)=(45,0.02) of using in processing example application implementation mode 1, Fig. 5 is illustrated with zero.Processing conditions (F, E)=(30,0.03) of using in processing example application implementation mode 1, Fig. 6 is illustrated with zero.The processing conditions that uses in the processing example of Fig. 8 that Comparative Examples is related (F, E)=(45,0.02) also illustrates with zero.
According to the above results, the inventor has confirmed following situation, that is, as shown in Figure 4, no matter under any actual service conditions, can carry out resin and remove processing.
At this, consider following situation, that is, suppose in the operation shown in Fig. 1 (b), will be with the UV pulse laser that produces less than the frequency of oscillation of the 3kHz same position 11e irradiation situation repeatedly in the Copper Foil 11.In the case, there is following trend, namely, (N: the UV pulse laser integer more than or equal to 2) can't utilize (this is because pulse frequency is lower, and heat occurs to scatter and disappear) to the impact of the savings heat in the Copper Foil 11 that is produced by the irradiation of the UV pulse laser of (N-1) individual pulse for N pulse.Therefore, because the UV pulse laser of N pulse can't utilize the impact of savings heat, need to utilize the heating that the irradiation of the UV pulse laser of N pulse produces and remove Copper Foil 11, therefore, the energy that needs are a large amount of.That is, because long during the heat release between each pulse of UV pulse laser, therefore, the heat energy that the machining of Copper Foil 11 needs is not enough, is difficult to process Copper Foil 11.
Perhaps, consider following situation, that is, suppose in the operation shown in Fig. 1 (b), will be with the UV pulse laser that produces greater than the frequency of oscillation of the 15kHz same position 11e irradiation situation repeatedly in the Copper Foil 11.In the case, there is following trend, that is, (N: the Copper Foil spatters that the UV pulse laser integer more than or equal to 2) is splashed by the UV pulsed laser irradiation of (N-1) individual pulse absorbs or scattering, thereby can't be efficiently to Copper Foil 11 irradiations in N pulse.
For example as shown in Figure 8, at least a portion of the UV pulse laser L902 of the 2nd pulse is absorbed or scattering by the Copper Foil spatters SP1 that is splashed by the UV pulse laser L901 irradiation of the 1st pulse～SP7.At least a portion of the UV pulse laser L903 of the 3rd pulse is absorbed or scattering by the Copper Foil spatters SP11 that is splashed by the UV pulse laser L902 irradiation of the 2nd pulse～SP15.Its result is difficult to carry out running through Copper Foil 911(Copper Foil 11) the processing in hole.
Relative with it, in execution mode 1, in the operation shown in Fig. 1 (b), the UV pulse laser that will produce with the frequency of oscillation that is less than or equal to 15kHz more than or equal to 3kHz shines repeatedly to the same position 11e in the Copper Foil 11.Thus, can stably be used to form the punching processing (with reference to Fig. 3) of the hole 11a that runs through Copper Foil 11, therefore, in the operation shown in Fig. 1 (c), and stably formation corresponding with hole 11a runs through the hole 13a of resin bed 13 and also becomes easy.That is, when machined object 10 carries out perforate processing (namely carrying out the processing of the blind hole BH1 that is made of hole 11a and hole 13a), can carry out stable perforate processing.
Perhaps, consider following situation, that is, suppose in the operation shown in Fig. 1 (b), will be with less than 0.05J/mm
2 Same position 11e irradiation repeatedly the situation of the pulse laser that produces of energy density in the Copper Foil 11.In the case, the little trend of energy (for example heat energy) that exists the machining of the energy Ratios Copper Foil 11 in each pulse of UV pulse laser to need is difficult to processing Copper Foil 11.
Relative with it, in execution mode 1, in the operation shown in Fig. 1 (b), will be with more than or equal to 0.05J/mm
2The same position 11e irradiation of the pulse laser that produces of energy density in the Copper Foil 11 repeatedly.Thus, because the energy in each pulse of UV pulse laser easily surpasses the energy (for example heat energy) that the machining of Copper Foil 11 needs, therefore, processing Copper Foil 11 becomes easy.
Perhaps, consider following situation, that is, suppose in the operation shown in Fig. 1 (c), same position 11e irradiation repeatedly the situation of the UV pulse laser that will produce with the frequency of oscillation that is less than or equal to 15kHz in the Copper Foil 11.In the case, if for example processing conditions belongs to regional PR1, then with behind the passing through position 13e that hole 11a exposes and remove of resin bed 13, also might continue should remove by the position 12e that hole 13a exposes in the Copper Foil 12.Thus, be difficult to form by the blind hole at the bottom of the Copper Foil 12 inaccessible holes.
Relative with it, in execution mode 1, in the operation shown in Fig. 1 (c), the UV pulse laser that will produce with the frequency of oscillation greater than 15kHz shines repeatedly to the same position 11e in the Copper Foil 11.Thus, can be so that the residual mode of position 12e that should expose by hole 13a of Copper Foil 12, corresponding with hole 11a and stably form the hole 13a that runs through resin bed 13.That is, be easy to form at the bottom of the hole blind hole BH1 by Copper Foil 12 obturations.
Perhaps, consider following situation, that is, suppose in the operation shown in Fig. 1 (c), will be with more than or equal to 0.05J/mm
2 Same position 11e irradiation repeatedly the situation of the UV pulse laser that produces of energy density in the Copper Foil 11.In the case, if for example processing conditions belongs to regional PR1, then with behind the passing through position 13e that hole 11a exposes and remove of resin bed 13, also might continue should remove by the position 12e that hole 13a exposes in the Copper Foil 12.Thus, be difficult to form by the blind hole at the bottom of the Copper Foil 12 inaccessible holes.
Relative with it, in execution mode 1, in the operation shown in Fig. 1 (c), will be with less than 0.05J/mm
2The same position 11e irradiation of the UV pulse laser that produces of energy density in the Copper Foil 11 repeatedly.Thus, can be so that the residual mode of position 12e that should expose by hole 13a of Copper Foil 12, corresponding with hole 11a and stably form the hole 13a that runs through resin bed 13.That is, be easy to form at the bottom of the hole blind hole BH1 by Copper Foil 12 obturations.
In addition, in the operation shown in Fig. 1 (b), can be to satisfy in the F-E plane (with reference to Fig. 3)
4＜=F＜=15 formulas 5
Mode, utilize oscillator (not shown) to produce the UV pulse laser.The zone of satisfying formula 5 and formula 2 is regional PR2 by the double dot dash line encirclement shown in Figure 3.As shown in Figure 3, regional PR2 comprises with the processing conditions shown in zero, and does not comprise with * the processing conditions that illustrates and with the processing conditions shown in the triangle.Thus, because the diameter fluctuation in the hole that processes in the Copper Foil is dropped in the scope less than setting, therefore, can further improve the processing quality of perforate processing.
In addition, also can substitute machined object 10 and the machined object 20 shown in Fig. 2 (b) is processed.Machined object 20 is the printed wiring boards that have Copper Foil and the alternately laminated multi-ply construction repeatedly of resin bed, and for example stacked above one another has Copper Foil 27, resin bed 26, Copper Foil 25, resin bed 24, Copper Foil (the 2nd conductor layer) 12, resin bed (insulating barrier) 13, Copper Foil (the 1st conductor layer) 11.
Next, use Fig. 7 that execution mode 2 related laser processings are described.Fig. 7 (a) to (d) is the process profile of the related laser processing of expression execution mode 2.Below, by with the difference of execution mode 1 centered by describe.
In the operation shown in the operation shown in Fig. 7 (a) and Fig. 7 (b), carry out respectively the processing identical with the operation shown in the operation shown in Fig. 1 (a) and Fig. 1 (b).
In the operation shown in Fig. 7 (c), do not use the processing conditions that satisfies formula 3 and formula 4, and use the processing conditions that satisfies formula 1 and formula 2.That is, to satisfy formula 1 in the F-E plane (with reference to Fig. 3) and the mode of formula 2, utilize oscillator (not shown) to produce the UV pulse laser.The zone of satisfying formula 1 and formula 2 is Fig. 3 and the regional PR1 by the chain-dotted line encirclement shown in Figure 4.For regional PR1, corresponding, corresponding with the processing conditions that can remove resin bed 13 as shown in Figure 4 with the processing conditions of removing Copper Foil 12 as shown in Figure 3.That is, regional PR1 with can remove resin bed 13 and can also remove the processing conditions of Copper Foil 12 corresponding.
The UV pulse laser that penetrates from oscillator passes through position 13e irradiation that hole 11a exposes repeatedly (for example 5 times) to the resin bed 13.That is, the UV pulse laser L311～L315 of 5 pulses penetrating from oscillator passes through the position 13e irradiation that hole 11a exposes in the resin bed 13 in turn.Thus, shown in Fig. 7 (d), formed hole (the 2nd hole) 13a, and, should remove by the position 12e that hole 13a exposes in the Copper Foil 12 formed hole 12a.Hole 13a is corresponding with hole 11a and run through the hole of resin bed 13i.Hole 12a is corresponding with hole 11a and hole 13a and run through the hole of Copper Foil 12i.
As mentioned above, shown in Fig. 7 (d), form consisted of by hole 11a, hole 13a and hole 12a, run through machined object 10(printed wiring board) through hole TH300.
As mentioned above, in execution mode 2, in the operation shown in Fig. 7 (b), the UV pulse laser that will produce with the frequency of oscillation that is less than or equal to 15kHz more than or equal to 3kHz shines repeatedly to the same position 11e in the Copper Foil 11.Thus, owing to can stably be used to form the punching processing (with reference to Fig. 3) of the hole 11a that runs through Copper Foil 11, therefore, in the operation shown in Fig. 7 (c), be easy to stably to form corresponding with hole 11a and run through the hole 13a of resin bed 13 and corresponding and run through the hole 12a of Copper Foil 12 with hole 13a.That is, when machined object 10 carries out perforate processing (namely carrying out the processing of the through hole TH300 that is made of hole 11a, hole 13a and hole 12a), can carry out stable perforate processing.
Industrial applicibility
As mentioned above, laser processing involved in the present invention is applicable to the punching processing of conductor layer on the surface of printed wiring board.
The explanation of label
10 machined objects
11,11i Copper Foil
The 11a hole
12,12i Copper Foil
13,13i resin bed
The 13a hole
20 machined objects
24 resin beds
25 Copper Foils
26 resin beds
27 Copper Foils
110 machined objects
111,111i Copper Foil
The 111a hole
112 Copper Foils
113,113i resin bed
The 113a hole
210 machined objects
211,211i Copper Foil
The 211a hole
212 Copper Foils
213,213i resin bed
The 213a hole
910 machined objects
911,911i Copper Foil
The 911a hole
912 Copper Foils
913 resin beds
The BH1 blind hole
The BH100 blind hole
The BH200 blind hole
L1～L15UV pulse laser
L101～L120UV pulse laser
L201～L225UV pulse laser
L311～L315UV pulse laser
L901～L915UV pulse laser
The PR1 zone
The PR2 zone
The PR3 zone
The TH300 through hole
Claims (5)
1. laser processing, it utilizes pulse laser to have the machined object of insulating barrier to carry out perforate processing to clamping between the 1st conductor layer and the 2nd conductor layer,
This laser processing is characterised in that to have following operation, that is:
The 1st operation in this operation, to the same position irradiation multiple pulses laser of described the 1st conductor layer, and forms the 1st hole of running through described the 1st conductor layer; And
The 2nd operation in this operation, being passed through the position that expose in described the 1st hole in described insulating barrier, irradiation multiple pulses laser is corresponding with described the 1st hole and form the 2nd hole of running through described insulating barrier,
In described the 1st operation, the pulse laser that will produce with the frequency of oscillation that is less than or equal to 15kHz more than or equal to 3kHz to described same position irradiation repeatedly.
2. laser processing according to claim 1 is characterized in that,
In described the 1st operation, the pulse laser that will produce with the frequency of oscillation that is less than or equal to 15kHz more than or equal to 4kHz to described same position irradiation repeatedly.
3. laser processing according to claim 1 is characterized in that,
In described the 1st operation, will be with more than or equal to 0.05J/mm
2The pulse laser that produces of energy density to described same position irradiation repeatedly.
4. laser processing according to claim 1 is characterized in that,
In described the 2nd operation, so that the residual mode in position that should expose by described the 2nd hole in described the 2nd conductor layer, the pulse laser that will produce with the frequency of oscillation greater than 15kHz to the position irradiation of exposing by described the 1st hole repeatedly.
5. laser processing according to claim 4 is characterized in that,
In described the 2nd operation, so that the residual mode in position that should expose by described the 2nd hole in described the 2nd conductor layer, will be with less than 0.05J/mm
2The pulse laser that produces of energy density to the position irradiation of exposing by described the 1st hole repeatedly.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2010/064802 WO2012029123A1 (en) | 2010-08-31 | 2010-08-31 | Laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103081579A true CN103081579A (en) | 2013-05-01 |
| CN103081579B CN103081579B (en) | 2016-02-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080068824.2A Expired - Fee Related CN103081579B (en) | 2010-08-31 | 2010-08-31 | Laser processing |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5442130B2 (en) |
| KR (1) | KR101438342B1 (en) |
| CN (1) | CN103081579B (en) |
| TW (1) | TWI423858B (en) |
| WO (1) | WO2012029123A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722340A (en) * | 2015-12-25 | 2016-06-29 | 惠州中京电子科技有限公司 | Blind hole processing method of PCB |
| CN111438447A (en) * | 2018-12-29 | 2020-07-24 | 东泰高科装备科技有限公司 | Film opening method, solar cell packaging film and opening method |
| WO2022222411A1 (en) * | 2021-04-22 | 2022-10-27 | 广东工业大学 | Pcb short-wavelength pulse laser drilling method and related apparatus |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103537810B (en) * | 2012-07-16 | 2016-08-17 | 中国电子科技集团公司第九研究所 | Ferrite substrate laser boring method |
| KR102199211B1 (en) * | 2013-10-11 | 2021-01-07 | 삼성디스플레이 주식회사 | Laser processing apparatus and processing method using the same |
| JP6671145B2 (en) | 2015-10-30 | 2020-03-25 | 株式会社レーザーシステム | Method for manufacturing processed resin substrate and laser processing apparatus |
| KR102477657B1 (en) * | 2021-03-18 | 2022-12-14 | 주식회사 이오테크닉스 | Laser drilling method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005074479A (en) * | 2003-09-01 | 2005-03-24 | Sumitomo Heavy Ind Ltd | Laser beam machining device and laser beam machining method |
| CN100345348C (en) * | 2002-04-02 | 2007-10-24 | 三菱电机株式会社 | Laser processing system and laser processing method |
| CN100525983C (en) * | 2004-01-16 | 2009-08-12 | 日立比亚机械股份有限公司 | Laser machining method and laser machining apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5593606A (en) * | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
| JP2000031649A (en) * | 1998-07-14 | 2000-01-28 | Ngk Spark Plug Co Ltd | Manufacture of multilayer printed circuit board |
| DE10125397B4 (en) * | 2001-05-23 | 2005-03-03 | Siemens Ag | Method for drilling microholes with a laser beam |
-
2010
- 2010-08-31 WO PCT/JP2010/064802 patent/WO2012029123A1/en active Application Filing
- 2010-08-31 JP JP2012539536A patent/JP5442130B2/en not_active Expired - Fee Related
- 2010-08-31 CN CN201080068824.2A patent/CN103081579B/en not_active Expired - Fee Related
- 2010-08-31 KR KR1020137004792A patent/KR101438342B1/en active IP Right Grant
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2011
- 2011-01-18 TW TW100101727A patent/TWI423858B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100345348C (en) * | 2002-04-02 | 2007-10-24 | 三菱电机株式会社 | Laser processing system and laser processing method |
| JP2005074479A (en) * | 2003-09-01 | 2005-03-24 | Sumitomo Heavy Ind Ltd | Laser beam machining device and laser beam machining method |
| CN100525983C (en) * | 2004-01-16 | 2009-08-12 | 日立比亚机械股份有限公司 | Laser machining method and laser machining apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722340A (en) * | 2015-12-25 | 2016-06-29 | 惠州中京电子科技有限公司 | Blind hole processing method of PCB |
| CN111438447A (en) * | 2018-12-29 | 2020-07-24 | 东泰高科装备科技有限公司 | Film opening method, solar cell packaging film and opening method |
| WO2022222411A1 (en) * | 2021-04-22 | 2022-10-27 | 广东工业大学 | Pcb short-wavelength pulse laser drilling method and related apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130063528A (en) | 2013-06-14 |
| JPWO2012029123A1 (en) | 2013-10-28 |
| TWI423858B (en) | 2014-01-21 |
| TW201208801A (en) | 2012-03-01 |
| WO2012029123A1 (en) | 2012-03-08 |
| KR101438342B1 (en) | 2014-09-16 |
| JP5442130B2 (en) | 2014-03-12 |
| CN103081579B (en) | 2016-02-10 |
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