CN103537810B - Ferrite substrate laser boring method - Google Patents

Ferrite substrate laser boring method Download PDF

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Publication number
CN103537810B
CN103537810B CN201210246721.1A CN201210246721A CN103537810B CN 103537810 B CN103537810 B CN 103537810B CN 201210246721 A CN201210246721 A CN 201210246721A CN 103537810 B CN103537810 B CN 103537810B
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China
Prior art keywords
laser
ferrite
laser boring
ferrite substrate
hole
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Application number
CN201210246721.1A
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Chinese (zh)
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CN103537810A (en
Inventor
周俊
倪经
张为国
李扬兴
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CETC 9 Research Institute
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CETC 9 Research Institute
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Priority to CN201210246721.1A priority Critical patent/CN103537810B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to the laser boring method of a kind of ferrite substrate.At present, the grounding technology of bringing onto load ferrite device the most seriously restricts its large-scale production, and prior art has distinct disadvantage, it is impossible to meet future development demand.Laser boring earthing method has clear superiority, but the hard crisp characteristic due to Ferrite Material, use conventional laser punching micro-crack easily occurs or ruptures suddenly, and the Main Trends of The Development of following ferrite device be miniaturization, chip type, in high precision, high stable, high reliability.Therefore, significant by improving the grounding technology of laser boring solution bringing onto load ferrite device.It addition, the important indicator evaluating quality of laser drilling is the tapering in hole, the present invention all can improve the tapering of through hole at ferrite substrate surface spin coating one layer photoetching glue or one layer of copper of plating.

Description

Ferrite substrate laser boring method
Technical field
This Invention relates to the laser boring method of a kind of special material, is the laser boring method of a kind of ferrite substrate exactly.
Background technology
The development of wireless technology requires that the operating frequency of ferrite device is higher, more powerful, operating temperature is higher and smaller, therefore, low cost, miniaturization, chip type, in high precision, high stable, high reliability be the Main Trends of The Development of ferrite device.At present, the grounding technology of bringing onto load ferrite device the most seriously restricts its large-scale production, and prior art has distinct disadvantage, it is impossible to meet future development demand.Laser boring grounding technology has clear superiority, but due to the hard crisp characteristic of Ferrite Material, uses conventional laser punching micro-crack easily occur or rupture suddenly, and the manufacturing cost height of actual application, poor stability, reliability are low.Therefore, significant by improving the grounding technology of laser boring solution bringing onto load ferrite device.
Summary of the invention
1, originally Invention is on the basis of experimental study, by two minor tick laser boring methods, it is possible to quickly get through hole on ferrite substrate, and effectively prevent substrate from rupturing.
2, the important indicator evaluating quality of laser drilling is the tapering in hole, this Invent the tapering that all can improve through hole at ferrite substrate surface spin coating one layer photoetching glue or one layer of copper of plating.
Accompanying drawing explanation
Fig. 1 is that ferrite substrate crack fracture occurs；
Fig. 2 is laser boring positive and negative of ferrite substrate；
Fig. 3 is ferrite substrate two minor tick laser boring positive and negative；
Fig. 4 is the ferrite substrate two minor tick laser boring positive and negative of spin coating photoresist；
Fig. 5 is the ferrite substrate two minor tick laser boring positive and negative of copper plate；
Detailed description of the invention
Below by embodiment to this The method of invention is described further.
Embodiment 1
Conventional laser drilling method is for once to get through hole, and in actual mechanical process, due to ferritic hard crisp characteristic, laser beam energy is too big, easily makes substrate crack fracture (see Fig. 1) occur.If laser beam energy is smaller, although can through hole (see Fig. 2), but its through hole taper ratio is compared with big and efficiency comparison is low, it is impossible to meet large-scale production demand.
This Invention uses precise laser processing machine, carries out secondary interval laser boring on the ferrite substrate that 0.400mm is thick.The thru-hole quality that employing table 1 parameter is got is good (see Fig. 3), and its entrance hole diameter is 0.300mm, and outlet aperture is 0.254mm, and tapering is 0.057rad, and trepanning velocity is 12～14 seconds/.
Table 1 ferrite substrate laser boring parameter
Laser sets current value (A) 15.0～25.0
Laser pulse repetition frequency (KHz) 20～30
Laser pulse width (%) 50～70
The progressive amount of focal length (mm) 0.400
The progressive speed of focal length 25～35
Puncturing patterns Helical
Machining object rotary speed (mm/s) 4～12
Auxiliary gas Compressed air
Punching number of times (secondary) 2
Embodiment 2
On the ferrite substrate that 0.400mm is thick, the photoresist of one layer of 2 μ m-thick of spin coating, carries out two minor tick laser borings to it, and set parameter is as shown in table 2.The thru-hole quality that employing table 2 parameter is got is good (see Fig. 4), and its entrance hole diameter is 0.300mm, and outlet aperture is 0.262mm, and tapering is 0.047rad, and trepanning velocity is 12～14 seconds/.
The ferrite substrate laser boring parameter of table 2 spin coating photoresist
Laser sets current value (A) 15.0～25.0
Laser pulse repetition frequency (KHz) 20～30
Laser pulse width (%) 50～70
The progressive amount of focal length (mm) 0.402
The progressive speed of focal length 25～35
Puncturing patterns Helical
Machining object rotary speed (mm/s) 4～12
Auxiliary gas Compressed air
Punching number of times (secondary) 2
Embodiment 3
Plating the metallic copper of one layer of 14 μ m-thick on the ferrite substrate that 0.400mm is thick, copper-plated ferrite substrate carries out two minor tick laser borings, set parameter is as shown in table 3.The thru-hole quality that employing table 3 parameter is got is good (see Fig. 5), and its entrance hole diameter is 0.300mm, and outlet aperture is 0.279mm, and tapering is 0.024rad, and trepanning velocity is 14～16 seconds/.
Table 3 copper-plated ferrite substrate laser boring parameter
Laser sets current value (A) 15.0～25.0
Laser pulse repetition frequency (KHz) 20～30
Laser pulse width (%) 50～70
The progressive amount of focal length (mm) 0.428
The progressive speed of focal length 30～45
Puncturing patterns Helical
Machining object rotary speed (mm/s) 4～12
Auxiliary gas Compressed air
Punching number of times (secondary) 2

Claims (4)

1. the method carrying out laser boring on ferrite substrate, it is characterized in that: the method laser sets current value as 15.0～25.0A, laser pulse repetition frequency is 20～30KHz, laser pulse width is 50～70%, entrance hole diameter is 0.300mm, by two minor tick laser borings, it is achieved rapid processing through hole on the ferrite substrate that thickness is 0.400mm, and effectively prevent rupturing of substrate.
Laser boring method the most according to claim 1, it is characterised in that: described ferrite substrate surface spin coating one layer photoetching glue or one layer of copper of plating all can improve the tapering of through hole.
Laser boring method the most according to claim 2, it is characterised in that: described photoresist thickness is 2 μm.
Laser boring method the most according to claim 2, it is characterised in that: described copper layer thickness is 14 μm.
CN201210246721.1A 2012-07-16 2012-07-16 Ferrite substrate laser boring method Active CN103537810B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210246721.1A CN103537810B (en) 2012-07-16 2012-07-16 Ferrite substrate laser boring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210246721.1A CN103537810B (en) 2012-07-16 2012-07-16 Ferrite substrate laser boring method

Publications (2)

Publication Number Publication Date
CN103537810A CN103537810A (en) 2014-01-29
CN103537810B true CN103537810B (en) 2016-08-17

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115647618A (en) * 2022-11-04 2023-01-31 西南科技大学 Method for processing micropores on monocrystal yttrium iron garnet ferrite thick film composite substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1785577A (en) * 2005-12-21 2006-06-14 北京工业大学 Laser perforating method and its perforating device
CN2860713Y (en) * 2005-12-21 2007-01-24 北京工业大学 Laser boring device
CN201543969U (en) * 2009-08-25 2010-08-11 北京寰宇纳磁科技发展有限公司 Laser perforating system
TW201208801A (en) * 2010-08-31 2012-03-01 Mitsubishi Electric Corp Laser process method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1785577A (en) * 2005-12-21 2006-06-14 北京工业大学 Laser perforating method and its perforating device
CN2860713Y (en) * 2005-12-21 2007-01-24 北京工业大学 Laser boring device
CN201543969U (en) * 2009-08-25 2010-08-11 北京寰宇纳磁科技发展有限公司 Laser perforating system
TW201208801A (en) * 2010-08-31 2012-03-01 Mitsubishi Electric Corp Laser process method

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