CN102361538A - Method for processing printed circuit two-level blind hole - Google Patents
Method for processing printed circuit two-level blind hole Download PDFInfo
- Publication number
- CN102361538A CN102361538A CN2011103109981A CN201110310998A CN102361538A CN 102361538 A CN102361538 A CN 102361538A CN 2011103109981 A CN2011103109981 A CN 2011103109981A CN 201110310998 A CN201110310998 A CN 201110310998A CN 102361538 A CN102361538 A CN 102361538A
- Authority
- CN
- China
- Prior art keywords
- hole
- blind holes
- printed circuit
- order blind
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a method for processing a printed circuit two-level blind hole, belonging to the technical field of printed circuit manufacture. The method comprises the following steps of: firstly, drilling a through hole 1 at the position in the need of manufacturing the two-level blind hole on a single-layer double-faced PCB (Printed Circuit Board); then, drilling a through hole 2 at the position in the need of manufacturing the two-level blind hole on a single-layer medium board; and finally, thermally pressing the perforated single-layer double-faced PCB, the perforated single-layer medium board and a copper foil together, and obtaining the printed circuit two-level blind hole. According to the method disclosed by the invention, the limitation on materials and equipment in the traditional blind hole manufacturing method is reduced; the blind hole alignment difficulty is reduced; therefore, the failure rate of two-level and multi-level blind holes resulted from alignment is greatly reduced; the method has the characteristics of being rapid, simple, economical and practical; and the method is applied to being used by most of PCB manufactures, in particular PCB manufactures without special blind hole equipment, in the event of processing the two-level blind holes (comprising the multi-level blind holes).
Description
Technical field
The invention belongs to printed circuit manufacturing technology field.Specially refer to the process technology of printed circuit (PCB) second-order blind holes.
Technical background
Electronic Design is also making great efforts to dwindle its size when improving constantly the complete machine performance.In portable type electronic product, " little " is constant pursuit forever.High density interconnect (HDI) technology can make end product design miniaturization more, satisfies the higher standard of Electronic Performance and efficient simultaneously.HDI generally adopts lamination method (Build-up) manufacturing, adopts advanced PCB technology such as folded hole, plating filling perforation, laser directly punch simultaneously, is mainly used in 3G mobile, senior DV, IC support plate etc.The HDI circuit board typically refers to and utilizes Microvia collocation fine rule and close distance can carry more multicomponent or the more multi circuit board of laying in the unit are to reach, so the making of Microvia is one of technology of HDI circuit board technology most critical.Blind hole is meant and connects the top layer does not connect whole plate with internal layer via that common HDI plate is to adopt the single order blind hole basically, high-order HDI employing second order or above blind hole.So-called second-order blind holes is meant by identical or different hole, two apertures piles up the pore structure that forms.Yet along with the increase of the circuit board number of plies, and depth-to-width ratio heals under the high situation, make contraposition accurately second-order blind holes become the technological difficulties of HDI circuit board.
Common second-order blind holes processing method mainly contains:
(1) CO
2Laser drill
CO
2Laser drill is mainly utilized is that photo-thermal is ablated, and promptly processed absorbed ripple increases in extremely short time self-energy greater than the high-octane infrared light of 760nm, and temperature raises, and when reaching organic fusing point, melts and evaporates and the hole that forms.CO commonly used at present
2The method of processing blind hole by laser is direct processing method, is about to blind hole surface copper thickness and erodes to below the 12 μ m, carries out brown or melanism again, uses CO at last
2Laser directly processes Copper Foil and dielectric layer forms blind hole.CO
2The laser processing second-order blind holes is to adopt the mode of lamination to realize, promptly processes the single order blind hole earlier, and then through lamination, processes second-order blind holes after the contraposition.CO
2Laser is the main method of present processing blind hole; Characteristics such as it is fast to have speed, and efficient height and cost are low, but the brill dirt is many; Main suitable aperture is 100um and above blind hole; Procedure of processing is complicated, in the processing second-order blind holes, needs the processing one by one of single order single order, and the aligning accuracy of blind hole is reduced.
(2) UV laser drill
The UV laser drill is to use photochemistry to split the erosion principle, and the wavelength that utilizes the ultra-violet (UV) band to have surpasses the high-energy photons of 400nm material is processed.This high-octane ultraviolet photon can destroy organic strand, and the littler particulate of formation such as metallic bond and inorganic matter utilizes and is removed under the effect of external force and forms blind hole.UV laser processing second-order blind holes is to adopt disposable processing mode, promptly disposable Copper Foil and dielectric layer is removed the formation second-order blind holes.UV laser is the main flow trend of following blind hole processing, has the precision height, bores dirty fewly, and energy is big, can the multistage blind hole of disposable processing, be fit to characteristics such as capillary processing, but long processing time, and cost is high, difficult control, and cause the ablation of bottom Copper Foil easily.
(3) plasma etching
The plasma etching blind hole is warp exposure in copper-clad plate, and development and etching method etch away the Copper Foil on blind hole surface, exposes dielectric layer, and then puts it in the plasma apparatus, and feed plasma gas (N
2, O
2And CF
4Deng) plasma gas and medium react and medium removed and form blind hole under certain parameter condition.Plasma etching second-order blind holes and CO
2Laser is the same, adopts the mode of lamination to realize, promptly etch the single order blind hole earlier, and then through lamination, contraposition etches second-order blind holes.Plasma etching blind hole good uniformity, characteristics such as easy to operate, but material installation is required high, cost is big, and causes lateral erosion easily, and plasma not suitable for making second order and above blind hole.
(4) chemical etching
It is with etching method the Copper Foil on blind hole surface to be removed to form naked window that chemical method for etching is made blind hole, exposes the dielectric layer material, and then is ejected on the naked window with the certain density concentrated sulfuric acid, erodes to dielectric material and forms blind hole.Chemical method for etching is made second-order blind holes and CO
2Laser, plasma etching equally are the forms that adopts lamination.This method can be avoided the erosion of crossing of bottom Copper Foil, and can be with the disposable removal of dielectric layer, but does not fit into the dielectric material that contains fiber, and causes lateral erosion easily, and suitablely carries out the making of second-order blind holes.
Above-mentioned is several kinds of second-order blind holes manufacture methods commonly used, wherein CO
2Laser method, plasma etching method and chemical method for etching are owing to exist bit errors all not to be suitable for the processing of second order and multistage blind hole.Though UV laser can be realized the processing of disposable second-order blind holes, the UV laser machine cost that is exclusively used in blind hole processing is high, all can't bear for most manufacturers.
Summary of the invention
In order to make more producer realize the low-cost processing of blind hole down, the present invention proposes a kind of new process with the laminating processing blind hole.This method is with double sided board, and dielectric layer material and pure copper foil are raw material, utilizes the method for lamination to produce second-order blind holes, has characteristics such as fail safe is good, simple to operate, cost is low, is suitable for the making of (comprising multistage blind hole) of various printed circuit second-order blind holes.In addition, this processing medium layer aperture is bigger than double sided board aperture, can effectively avoid the problems such as blind hole inefficacy that cause owing to contraposition, and is suitable for the making of various apertures second-order blind holes.
Technical scheme of the present invention is:
A kind of processing method of printed circuit second-order blind holes, as shown in Figure 2, may further comprise the steps:
Step 1: get the two-sided pcb board of individual layer, on the two-sided pcb board of individual layer, need the position of processing and fabricating second-order blind holes to drill through hole 1;
Step 2: get and the big or small single-layer medium plate of the two-sided pcb board equal area of individual layer described in the step 1, need the position of processing and fabricating second-order blind holes to drill through hole 2 at said single-layer medium plate;
Step 3: get Copper Foil with step 1, the two-sided pcb board of individual layer described in 2 or said single-layer medium plate equal area size; With the single-layer medium plate after the two-sided pcb board of the individual layer after the said boring, the said boring and said Copper Foil or pcb board according to pcb board last, dielectric-slab middle, Copper Foil under the position relation back that overlaps adopt heat pressing process to be pressed into one, obtain the printed circuit second-order blind holes.
What need special instruction is:
1, because dielectric material can cause lateral expansion in hot pressing; Cause the contraction in aperture; So the pore size of step 1, through hole described in 21, through hole 2 should make that the pore size of through hole 1, through hole 2 is consistent with the aperture of required second-order blind holes after step 3 hot pressing greater than the aperture of required second-order blind holes in the technique scheme.During the concrete pore size of confirming said through hole 1, through hole 2; Contrived experiment is confirmed in advance: promptly at first go out the through hole of serial aperture greater than required second-order blind holes aperture at two-sided pcb board of individual layer that step 1 adopts or single-layer medium twist drill that step 2 adopted; After adopting the hot pressing of heat pressing process described in the step 3 then; Measure the pore size of serial through hole; Find out and immediate that through hole in required second-order blind holes aperture, the pore size before the pairing hot pressing of this through hole is exactly a step 1, the pore size of through hole described in 21, through hole 2.
2, after step 3 obtained the printed circuit second-order blind holes, the metalized that usually also need carry out copper electroplating layer or fill out copper second-order blind holes was striden layer interconnection with what realize multilayer printed circuit board.
3, the two-sided pcb board of individual layer described in the step 1 can be two-sided pcb board of flexible single-layer or the two-sided pcb board of rigidity individual layer.
4, the plate of single-layer medium described in the step 2 should have good hot pressing performance; To guarantee hot pressing or can combine that optional material is dielectric materials such as phenolic resins, epoxy resin, polyester, polyimides, polytetrafluoroethylene, glass cloth, impregnated paper with the levels material.
Can adopt UV laser machine drill hole when 5, step 1 drills through hole 1 on the two-sided pcb board of individual layer, if machine drilling also can be adopted greater than 200 μ m in the aperture.
Can adopt UV laser or CO when 6, step 2 drills through hole 2 on the single-layer medium plate
2Laser drill is if machine drilling also can be adopted greater than 200 μ m in the aperture.
7, Copper Foil described in the step 3 can adopt pcb board to replace.
8, technique scheme also is applicable to and makes the multistage blind hole of printed circuit.
The invention has the beneficial effects as follows:
The various double sided boards that employed double sided board uses for the printed circuit industry among the present invention greatly reduce the restriction of traditional fabrication blind hole method to material.The aperture of medium layer material of the present invention is bigger than double sided board aperture, greatly reduces the difficulty of blind hole contraposition, makes the second order and the multistage blind hole failure rate that cause owing to contraposition reduce greatly.The present invention need not special-purpose blind hole equipment, also can be suitable for for the manufacturer that does not have blind hole equipment.The present invention is not only applicable to the making of second-order blind holes, also is applicable to the making of multistage blind hole more than the second order.Generally speaking, the present invention has quick, simple, economic and practical characteristics, is fit to most of PCB manufacturer, does not especially have the PCB manufacturer of special-purpose blind hole equipment to use.
Description of drawings
Fig. 1 is a printed circuit second-order blind holes structural representation.
Fig. 2 is a schematic flow sheet of the present invention.
Embodiment
Below in conjunction with an embodiment the present invention is done further detailed description.
Present embodiment provides a kind of method with laminating making second-order blind holes, and its practical implementation step is following:
(1) getting double surface soft board (dielectric layer is PI, and thickness is 25 μ m) uses UV laser to get out the through hole that the aperture is 100 μ m (the second-order blind holes aperture is 100 μ m in the present embodiment) in the above.In order to prevent that boring the dirty influence that follow-up blind hole is made in the hole should remove the dirt of the brill in the through hole clean.Adopt plasma technology that micropore is cleaned in this example, concrete steps are: boring → high-pressure washing → drying-plate → plasma cleans.High-pressure washing is for clean hole wall is provided; Reduce the load that follow-up plasma cleans; Drying-plate is that down baking half an hour cleans with plasma at last and not only can remove in the hole and the adhesive force of the brill dirt of hole wall hole wall also can improve copper facing the time to remove moisture in the plate at 120 ℃
(2) get epoxy jelly membrane dielectric-slab (thickness is 25 μ m), using UV laser to get out the aperture in the above is 200 μ m, 250 μ m, 300 μ m, 350 μ m, 400 μ m, the through hole of 450 μ m.
(3) get Copper Foil, its thickness is 18 μ m, incites somebody to action hole-drilled double sided board, and epoxy jelly membrane and pure copper foil are according to double sided board, and the order of epoxy jelly membrane and pure copper foil is carried out contraposition and fixing.
(4) plate that fixes is put into baking oven and toasted 15-20 minute down at 120 ℃, purpose is to make epoxy jelly membrane solidify flowability when reducing its lamination, carries out lamination then.The concrete parameter of lamination is as shown in the table:
(5) plate behind the lamination is put into plasma cleaner and clean, with the cull in the flush away ostium, then with the blind hole hole metallization.Concrete plasma cleaning parameters is following:
(6) cook microsection and observe epoxy jelly membrane lamination back aperture and change size, and find out the epoxy jelly membrane aperture identical behind the lamination with the double sided board aperture.Epoxy jelly membrane aperture lamination front and rear gaps directly changes as shown in the table:
The epoxy jelly membrane aperture is the trend that diminishes behind the lamination, and along with its rate of change of increase in aperture is more and more littler.Because the blind hole aperture is 100 μ m, and the aperture in two range upon range of holes is identical in the present embodiment, so the aperture of epoxy jelly membrane should be 230 μ m before the lamination.
(7) on epoxy jelly membrane, drill through through hole according to selected aperture, carry out the making of laminating second-order blind holes then according to above-mentioned steps, obtain the second-order blind holes that the aperture is 100 μ m.
Claims (8)
1. the processing method of a printed circuit second-order blind holes may further comprise the steps:
Step 1: get the two-sided pcb board of individual layer, on the two-sided pcb board of individual layer, need the position of processing and fabricating second-order blind holes to drill through hole 1;
Step 2: get and the big or small single-layer medium plate of the two-sided pcb board equal area of individual layer described in the step 1, need the position of processing and fabricating second-order blind holes to drill through hole 2 at said single-layer medium plate;
Step 3: get Copper Foil with step 1, the two-sided pcb board of individual layer described in 2 or said single-layer medium plate equal area size; With the single-layer medium plate after the two-sided pcb board of the individual layer after the said boring, the said boring and said Copper Foil according to pcb board last, dielectric-slab middle, Copper Foil under the position relation back that overlaps adopt heat pressing process to be pressed into one, obtain the printed circuit second-order blind holes.
2. the processing method of printed circuit second-order blind holes according to claim 1 is characterized in that, after step 3 obtains the printed circuit second-order blind holes, and the metalized that second-order blind holes is carried out copper electroplating layer or filled out copper.
3. the processing method of printed circuit second-order blind holes according to claim 1 and 2; It is characterized in that; The pore size of step 1, through hole described in 21, through hole 2 should make that the pore size of through hole 1, through hole 2 is consistent with the aperture of required second-order blind holes after step 3 hot pressing greater than the aperture of required second-order blind holes.
4. the processing method of printed circuit second-order blind holes according to claim 3; It is characterized in that; During the concrete pore size of confirming said through hole 1, through hole 2; Confirm through prior contrived experiment: promptly at first go out the through hole of serial aperture greater than required second-order blind holes aperture at two-sided pcb board of individual layer that step 1 adopts or single-layer medium twist drill that step 2 adopted, adopt the hot pressing of heat pressing process described in the step 3 then after, measure the pore size of serial through hole; Find out and immediate that through hole in required second-order blind holes aperture, the pore size before the pairing hot pressing of this through hole is exactly a step 1, the pore size of through hole described in 21, through hole 2.
5. the processing method of printed circuit second-order blind holes according to claim 1 and 2 is characterized in that, the two-sided pcb board of individual layer described in the step 1 is two-sided pcb board of flexible single-layer or the two-sided pcb board of rigidity individual layer.
6. the processing method of printed circuit second-order blind holes according to claim 1 and 2 is characterized in that, the panel material of single-layer medium described in the step 2 is phenolic resins, epoxy resin, polyester, polyimides, polytetrafluoroethylene, glass cloth or impregnated paper.
7. the processing method of printed circuit second-order blind holes according to claim 1 and 2 is characterized in that, adopts UV laser machine drill hole when step 1 drills through hole 1 on the two-sided pcb board of individual layer, if machine drilling also can be adopted greater than 200 μ m in the aperture.
8. the processing method of printed circuit second-order blind holes according to claim 1 and 2 is characterized in that, adopts UV laser or CO when step 2 drills through hole 2 on the single-layer medium plate
2Laser drill is if machine drilling also can be adopted greater than 200 μ m in the aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103109981A CN102361538A (en) | 2011-10-14 | 2011-10-14 | Method for processing printed circuit two-level blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103109981A CN102361538A (en) | 2011-10-14 | 2011-10-14 | Method for processing printed circuit two-level blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102361538A true CN102361538A (en) | 2012-02-22 |
Family
ID=45586789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103109981A Pending CN102361538A (en) | 2011-10-14 | 2011-10-14 | Method for processing printed circuit two-level blind hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102361538A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458616A (en) * | 2012-05-29 | 2013-12-18 | 深南电路有限公司 | Printed circuit board processing method |
| CN104661436A (en) * | 2015-02-06 | 2015-05-27 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| CN105072805A (en) * | 2015-08-06 | 2015-11-18 | 高德（无锡）电子有限公司 | Printed circuit board with blind holes and processing method of printed circuit board |
| CN105101629A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Printed circuit board with blind holes and processing method of printed circuit board |
| CN106132118A (en) * | 2016-07-13 | 2016-11-16 | 南京宏睿普林微波技术股份有限公司 | A kind of complex media method of manufacturing circuit board of multilayer dielectricity circuit |
| CN106484161A (en) * | 2015-08-28 | 2017-03-08 | 深圳欧菲光科技股份有限公司 | A kind of face glass and the terminal with this face glass |
| CN108024450A (en) * | 2016-10-31 | 2018-05-11 | 北大方正集团有限公司 | Two-sided blind hole circuit board processing method |
| CN108260302A (en) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN108684160A (en) * | 2018-06-04 | 2018-10-19 | 珠海崇达电路技术有限公司 | A kind of multistage blind hole HDI board manufacturing methods |
| CN112739011A (en) * | 2020-11-30 | 2021-04-30 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of three-layer blind hole printed board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| CN101626663A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Method for preparing second-order laser blind hole by UV, acid etching and CO2 |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
| CN101695224A (en) * | 2009-11-06 | 2010-04-14 | 深南电路有限公司 | Method for processing multilayer printed circuit board |
| CN101784163A (en) * | 2010-03-26 | 2010-07-21 | 华为技术有限公司 | Printed circuit board and processing method of printed circuit board |
-
2011
- 2011-10-14 CN CN2011103109981A patent/CN102361538A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| CN101626663A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Method for preparing second-order laser blind hole by UV, acid etching and CO2 |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
| CN101695224A (en) * | 2009-11-06 | 2010-04-14 | 深南电路有限公司 | Method for processing multilayer printed circuit board |
| CN101784163A (en) * | 2010-03-26 | 2010-07-21 | 华为技术有限公司 | Printed circuit board and processing method of printed circuit board |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458616A (en) * | 2012-05-29 | 2013-12-18 | 深南电路有限公司 | Printed circuit board processing method |
| CN103458616B (en) * | 2012-05-29 | 2016-12-14 | 深南电路有限公司 | The processing method of printed circuit board (PCB) |
| CN104661436A (en) * | 2015-02-06 | 2015-05-27 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| CN104661436B (en) * | 2015-02-06 | 2019-04-30 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| CN105072805A (en) * | 2015-08-06 | 2015-11-18 | 高德（无锡）电子有限公司 | Printed circuit board with blind holes and processing method of printed circuit board |
| CN105101629A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Printed circuit board with blind holes and processing method of printed circuit board |
| CN106484161A (en) * | 2015-08-28 | 2017-03-08 | 深圳欧菲光科技股份有限公司 | A kind of face glass and the terminal with this face glass |
| CN106132118A (en) * | 2016-07-13 | 2016-11-16 | 南京宏睿普林微波技术股份有限公司 | A kind of complex media method of manufacturing circuit board of multilayer dielectricity circuit |
| CN108024450A (en) * | 2016-10-31 | 2018-05-11 | 北大方正集团有限公司 | Two-sided blind hole circuit board processing method |
| CN108024450B (en) * | 2016-10-31 | 2020-06-16 | 北大方正集团有限公司 | Method for processing double-sided blind hole circuit board |
| CN108260302A (en) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN108684160A (en) * | 2018-06-04 | 2018-10-19 | 珠海崇达电路技术有限公司 | A kind of multistage blind hole HDI board manufacturing methods |
| CN108684160B (en) * | 2018-06-04 | 2020-10-16 | 珠海崇达电路技术有限公司 | Manufacturing method of multi-step blind hole HDI plate |
| CN112739011A (en) * | 2020-11-30 | 2021-04-30 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of three-layer blind hole printed board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102361538A (en) | Method for processing printed circuit two-level blind hole | |
| US10015889B2 (en) | Method for constructing an external circuit structure | |
| US20040112637A1 (en) | Built-up printed circuit board with stacked via-holes and method for manufacturing the same | |
| KR20190120295A (en) | Method of manufacturing recessed HDI substrate | |
| CN103456643A (en) | Ic carrier plate and manufacturing method thereof | |
| CN104701189A (en) | Manufacturing method of three-layered packaging substrates and three-layered packaging substrates | |
| CN103037640B (en) | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate | |
| CN103079350A (en) | Method for processing patterns in blind slot of printed circuit board | |
| CN106332475A (en) | Manufacturing method for depth-control stepped metalized blind groove PCB | |
| CN101511151B (en) | Method for processing blind hole of PCB | |
| KR100861619B1 (en) | Radiant heat printed circuit board and fabricating method of the same | |
| WO2012065376A1 (en) | Substrate of printed circuit board and manufacturing method thereof | |
| JP2004253761A (en) | Method for manufacturing double-sided flexible printed circuit board | |
| CN101351083B (en) | Line board and technique | |
| US7909977B2 (en) | Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby | |
| CN104185363A (en) | Composite type ultra-thin non-core substrate and manufacturing method thereof | |
| JP2007180211A (en) | Core substrate for manufacturing wiring board and manufacturing method of wiring board | |
| JP4128649B2 (en) | Method for manufacturing thin film multilayer circuit board | |
| CN104023484A (en) | Manufacturing method of printed circuit board overlaid through hole structure | |
| CN109104829B (en) | Deep micropore manufacturing method and PCB | |
| KR100754061B1 (en) | Method of fabricating printed circuit board | |
| US8191244B2 (en) | Fabricating method of circuit board | |
| CN104284530B (en) | The method that no core plate technique makes printed circuit board | |
| CN105682379A (en) | Process for rapidly fabricating multi-layer circuit board | |
| JP2011171353A (en) | Method of manufacturing printed board, and printed board using this |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120222 |