CN101784163A - Printed circuit board and processing method of printed circuit board - Google Patents
Printed circuit board and processing method of printed circuit board Download PDFInfo
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- CN101784163A CN101784163A CN201010135781A CN201010135781A CN101784163A CN 101784163 A CN101784163 A CN 101784163A CN 201010135781 A CN201010135781 A CN 201010135781A CN 201010135781 A CN201010135781 A CN 201010135781A CN 101784163 A CN101784163 A CN 101784163A
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- blind hole
- adhesive linkage
- protective layer
- daughter board
- pcb
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Abstract
The embodiment of the invention discloses a printed circuit board and a processing method of the printed circuit board, which are used for improving the reliability of the PCB. The method of the embodiment of the invention comprises the following steps: drilling blind holes on a first sub plate; paving an adhesive layer on the opening surface of the blind holes, wherein the positions of the adhesive layer positioned at each blind hole are provided with windows corresponding to the blind holes; and pressing a protective layer on the adhesive layer. The embodiment of the invention also provides the printed circuit board. The embodiment of the invention can effectively improve the reliability of the PCB.
Description
Technical field
The present invention relates to field of machining, relate in particular to the processing method of a kind of printed circuit board (PCB) (PCB, Printed CircuitBoard) and printed circuit board (PCB).
Background technology
In the prior art, PCB is last may to be drilled with multiple hole, comprising through hole, and buried via hole and blind hole, through hole is meant the hole of running through the PCB top and bottom, and buried via hole is meant the hole that is embedded in PCB inside, and blind hole is meant an end on the PCB surface, and the other end is in the hole of PCB inside.
In the wet course of processing of PCB, can use various PCB liquid medicine, these PCB liquid medicine may flow into the blind hole of having bored, because the radius-thickness ratio of blind hole is general bigger, so are difficult to clean after flowing into PCB liquid medicine, thereby bring security risk.
A kind of PCB processing method is in the prior art: after PCB gets out blind hole, with conductive paste or resin blind hole is clogged fully, in the wet course of processing, can avoid liquid medicine to flow into like this, after finishing wet processing, with the control deep drilling blind hole is holed again again, remove conductive paste or resin.
But, in this technical scheme, need carry out twice boring, because the problems such as positioning accuracy of drilling instrument itself are easy to make that difference appears in the blind hole after twice boring, can influence the reliability of PCB equally.
Summary of the invention
The embodiment of the invention provides the processing method of a kind of printed circuit board (PCB) and printed circuit board (PCB), can improve the reliability of PCB.
The printed circuit board (PCB) that the embodiment of the invention provides comprises: first daughter board, adhesive linkage and protective layer; Offer blind hole on described first daughter board, the opening surface of described blind hole is provided with adhesive linkage, is coated with protective layer on the described adhesive linkage; Described adhesive linkage offers the window corresponding with described blind hole in the position that is positioned at each blind hole.
The processing method of the printed circuit board (PCB) that the embodiment of the invention provides comprises: get out blind hole on first daughter board; Opening surface in described blind hole is laid adhesive linkage, and described adhesive linkage offers the window corresponding with described blind hole in the position that is positioned at each blind hole; Pressing protective layer above described adhesive linkage.
As can be seen from the above technical solutions, the embodiment of the invention has the following advantages:
In the embodiment of the invention; PCB is by first daughter board, and adhesive linkage and protective layer are formed, and protective layer is connected with daughter board by adhesive linkage; because protective layer can cover blind hole fully; therefore when PCB wet processing, PCB liquid medicine can not flow in the blind hole, simultaneously; because adhesive linkage offers the window corresponding with blind hole in the position that is positioned at each blind hole; therefore when protective layer and adhesive linkage pressing, the cohesive material of adhesive linkage can not flow in the blind hole, thereby can improve the reliability of PCB.
Description of drawings
Fig. 1 is embodiment schematic diagram of printed circuit board (PCB) in the embodiment of the invention;
Fig. 2 is an adhesive linkage vertical view in the embodiment of the invention;
Fig. 3 is another embodiment schematic diagram of printed circuit board (PCB) in the embodiment of the invention;
Fig. 4 is a printed circuit board (PCB) processing method flow chart in the embodiment of the invention;
Fig. 5 is a kind of copper mode schematic diagram that subtracts in the embodiment of the invention;
Fig. 6 subtracts copper mode schematic diagram for another kind in the embodiment of the invention.
Embodiment
The embodiment of the invention provides the processing method of a kind of printed circuit board (PCB) and printed circuit board (PCB), can improve the reliability of PCB.
See also Fig. 1, the PCB that provides in the embodiment of the invention comprises:
Offer blind hole 102 on first daughter board 101, the opening surface of blind hole 102 is provided with adhesive linkage 103, is coated with protective layer 104 on the adhesive linkage 103;
In the present embodiment, the position of the blind hole 102 on first daughter board 101, quantity, qualification is not all done in the degree of depth and aperture, is that example describes with two blind holes only herein.
Be provided with adhesive linkage 103 on the blind hole 102 on first daughter board 101, the size of this adhesive linkage 103 can be similar to the area of first daughter board 101, and the thickness of adhesive linkage 103 is not done qualification herein.
Offer plurality of windows on this adhesive linkage 103; the quantity of concrete window; the position is all corresponding with the blind hole 102 on first daughter board 101 with size; after being laid on first daughter board 101, this adhesive linkage 103 to make blind hole 102 hollow outs on the daughter board 101 of winning; other positions are capped; because the window on the adhesive linkage 103 is corresponding with the blind hole 102 on first daughter board 101, therefore when protective layer 104 and adhesive linkage 103 pressings, the cohesive material of adhesive linkage 103 can not flow in the blind hole 102.
Need to prove, this adhesive linkage 103 is the materials with viscosity, can (for example can be the low gummosis polypropylene that adds copper for example for the low gummosis adhesives that adds copper, or add the low gummosis polyimides of copper), or central layer, concrete adhesive linkage 103 is gone back the stickum of other types, does not specifically do qualification herein.
Be coated with protective layer 104 on adhesive linkage 103, the size of this protective layer 104 also can be similar to the area of first daughter board 101, and protective layer 104 is bonded on first daughter board 101 by adhesive linkage 103.
This protective layer 104 can be Copper Foil in actual applications, and the thickness of this Copper Foil preferably can be 1 ounce more than or equal to the H ounce.
Gap (clearance) 105 can be set on protective layer 104, and this gap 105 removes overcoat 104 easily in order to finish chemical processing procedure at PCB after.
In the present embodiment; PCB is by first daughter board 101; adhesive linkage 103 and protective layer 104 are formed; protective layer 104 is connected with first daughter board 101 by adhesive linkage 103; because protective layer 104 can cover blind hole 102 fully; therefore when PCB wets processing; PCB liquid medicine can not flow in the blind hole 102; simultaneously; because adhesive linkage 103 offers the window corresponding with blind hole 102 in the position that is positioned at each blind hole 102; therefore at protective layer 104 during with adhesive linkage 103 pressings, the cohesive material of adhesive linkage 103 can not flow in the blind hole 102, thus can improve PCB reliability.
What describe in the foregoing description is the situation of single face PCB, and in actual applications, the number of devices that plugs in order to increase on the PCB can also be used two-sided PCB, specifically sees also Fig. 3, and another embodiment of PCB comprises in the embodiment of the invention:
First daughter board, 301, the second daughter boards 302, separator 303;
Offer blind hole 304 on first daughter board 301, the opening surface of blind hole 304 is provided with adhesive linkage 305, is coated with protective layer 306 on the adhesive linkage 305;
Offer blind hole 307 on second daughter board 302, the opening surface of blind hole 307 is provided with adhesive linkage 308, is coated with protective layer 309 on the adhesive linkage 308;
Need to prove; blind hole 304 on first daughter board 301; blind hole 307 on the relation between adhesive linkage 305 and the protective layer 306 and second daughter board 302, the relation between adhesive linkage 308 and the protective layer 309 are all identical with the relation described among the aforementioned embodiment shown in Figure 1, repeat no more herein.
Above-mentioned PCB in the embodiment of the invention is illustrated, introduces the PCB processing method in the embodiment of the invention below, see also Fig. 4, concrete manufacturing procedure can comprise:
401, on first daughter board, get out blind hole;
Specifically get out in the process embodiment of the invention of blind hole and do not do qualification.
402, lay adhesive linkage at the opening surface of blind hole;
Get out after the blind hole, can lay adhesive linkage at the opening surface of blind hole, this adhesive linkage offers the window corresponding with blind hole in the position that is positioned at each blind hole.
In the present embodiment, offer plurality of windows on this adhesive linkage, the quantity of concrete window, the position is all corresponding with the blind hole on first daughter board with size, will make the blind hole hollow out on the daughter board of winning after this adhesive linkage is laid on first daughter board, other positions are capped.
Need to prove, this adhesive linkage is the material with viscosity, can (for example can be the low gummosis polypropylene that adds copper for example for the low gummosis adhesives that adds copper, or add the low gummosis polyimides of copper), or central layer, concrete adhesive linkage is the stickum of other types also, does not specifically do qualification herein.
403, pressing protective layer above adhesive linkage.
After laying adhesive linkage, can on adhesive linkage, be coated with protective layer, the size of this protective layer also can be similar to the area of first daughter board, and protective layer is bonded on first daughter board by adhesive linkage.
This protective layer can be Copper Foil in actual applications, and the thickness of this Copper Foil preferably can be 1 ounce more than or equal to the H ounce.
What describe in the foregoing description is the situation of single face PCB; in actual applications two-sided PCB can also be arranged; then can also carry out pressing to first daughter board and second daughter board by separator is connected; the structure of this second daughter board can be identical with first daughter board; promptly the opening surface of the blind hole of second daughter board is laid adhesive linkage; adhesive linkage offers the window corresponding with blind hole in the position that is positioned at each blind hole, pressing protective layer above adhesive linkage.
In the present embodiment; after PCB finishes chemical processing procedure; can remove protective layer; specifically can be when pressing protective layer and adhesive linkage; a gap of etching (clearance) on the protective layer of blind hole zone outer rim; gap 105 that specifically can be as shown in Figure 1 when needs are removed protective layer, is directly held gap (clearance) and is torn protective layer and get final product.
Need to prove; the situation that the gummosis deficiency appears between blind hole and the blind hole or other positions may appear in the process of actual pressing protective layer; the situation that gummosis enters the hole perhaps appears in the blind hole; for overcoming these problems; can subtract copper in the present embodiment and handle, specifically can adopt following dual mode:
One, reduce the Copper Foil area:
See also Fig. 5, in the present embodiment, in the process of daughter board processing, by increasing the mode of layer, only on the orifice ring of the blind hole of first daughter board and/or second daughter board Copper Foil (i.e. part shown among Fig. 5 501) is set, other zone is no Copper Foils all.
Need to prove; in Fig. 5; the outer porose disc at 501 places adopts full porose disc circuit (Pad Only) mode; 502 place's original copy layer through hole porose discs are embedded in time skin; wherein, 2N is the daughter board original copy design number of plies, and 2N+2 is for respectively increasing one deck PAD ONLY layer up and down in the original copy design number of plies; 2N+4 respectively increases layer protective layer up and down again for after having increased PAD ONLY layer.
Two, reduce copper thickness:
See also Fig. 6, in the present embodiment, after daughter board processing (after being adhesive linkage and protective layer pressing), can handle by attenuate copper, so that copper thickness reduces, concrete processing mode is those skilled in the art's a common practise, does not do qualification herein.
After having carried out subtracting the copper processing, make that the copper layer on the PCB is less, when pressing protective layer and adhesive linkage, can not produce too big pressure like this, thereby can avoid the stickum of adhesive linkage to enter blind hole adhesive linkage;
Secondly, after the attenuation of copper layer, make that protective layer and adhesive linkage pressing pressure ratio everywhere is average, thereby can avoid between blind hole and the blind hole or the situation of gummosis deficiency appears in other positions.
In the present embodiment, PCB is by first daughter board, and adhesive linkage and protective layer are formed, and protective layer is connected with daughter board by adhesive linkage, because protective layer can cover blind hole fully, therefore when PCB wet processing, PCB liquid medicine can not flow in the blind hole, simultaneously, because adhesive linkage offers the window corresponding with blind hole in the position that is positioned at each blind hole, therefore when protective layer and adhesive linkage pressing, the cohesive material of adhesive linkage can not flow in the blind hole, thereby can improve the reliability of PCB;
Secondly, can use two-sided PCB in the present embodiment, thereby improve the utilance of PCB;
Once more, can subtract copper to daughter board in the present embodiment and handle, so can avoid occurring between blind hole and the blind hole problem that gummosis deficiency or gummosis enter the hole;
Further, in the present embodiment, can be on the protective layer of blind hole zone outer rim a gap of etching (clearance), the protective layer by therefore can holding easily when needing to remove protective layer tears and gets final product;
Further again, in the present embodiment, need not to use precision instruments such as control deep drilling, therefore can reduce production costs, simultaneously, in the prior art, owing to need in blind hole, insert conductive paste or resin, so after blind hole being holed again with the control deep drilling, also need to use chemical agent that blind hole is cleaned repeatedly with removal conductive paste or resin, and in the present embodiment, owing to do not use conductive paste or resin to fill blind hole, therefore need not again blind hole to be cleaned repeatedly, thereby can shorten the production cycle.
One of ordinary skill in the art will appreciate that all or part of step that realizes in the foregoing description method is to instruct relevant hardware to finish by program, described program can be stored in a kind of computer-readable recording medium, the above-mentioned storage medium of mentioning can be a read-only memory, disk or CD etc.
More than the processing method of a kind of printed circuit board (PCB) provided by the present invention and printed circuit board (PCB) is described in detail, for one of ordinary skill in the art, thought according to the embodiment of the invention, part in specific embodiments and applications all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (13)
1. a printed circuit board (PCB) is characterized in that, comprising:
First daughter board, adhesive linkage and protective layer;
Offer blind hole on described first daughter board, the opening surface of described blind hole is provided with adhesive linkage, is coated with protective layer on the described adhesive linkage;
Described adhesive linkage offers the window corresponding with described blind hole in the position that is positioned at each blind hole.
2. printed circuit board (PCB) according to claim 1 is characterized in that, described printed circuit board (PCB) also comprises:
Second daughter board and separator;
Described separator is between first daughter board and second daughter board, and described first daughter board is connected with the second daughter board pressing;
Offer blind hole on described second daughter board, the opening surface of described blind hole is provided with adhesive linkage, is coated with protective layer on the described adhesive linkage;
Described adhesive linkage offers the window corresponding with described blind hole in the position that is positioned at each blind hole.
3. printed circuit board (PCB) according to claim 1 and 2 is characterized in that, described protective layer is a Copper Foil, and the thickness of described Copper Foil is more than or equal to the H ounce.
4. printed circuit board (PCB) according to claim 1 and 2 is characterized in that, described adhesive linkage is the low gummosis adhesives that adds copper, or central layer.
5. printed circuit board (PCB) according to claim 1 and 2 is characterized in that described protective layer is provided with the gap that is used to remove described protective layer.
6. the processing method of a printed circuit board (PCB) is characterized in that, comprising:
On first daughter board, get out blind hole;
Opening surface in described blind hole is laid adhesive linkage, and described adhesive linkage offers the window corresponding with described blind hole in the position that is positioned at each blind hole;
Pressing protective layer above described adhesive linkage.
7. method according to claim 6 is characterized in that, described method also comprises:
By separator described first daughter board and second daughter board being carried out pressing is connected;
Opening surface in the blind hole of second daughter board is laid adhesive linkage, and described adhesive linkage offers the window corresponding with described blind hole in the position that is positioned at each blind hole;
Pressing protective layer above described adhesive linkage.
8. method according to claim 7 is characterized in that, described protective layer is a Copper Foil, and the thickness of described Copper Foil is more than or equal to the H ounce.
9. method according to claim 8 is characterized in that, is describedly also comprising before the pressing protective layer above the adhesive linkage:
Described first daughter board and/or second daughter board are subtracted the copper processing.
10. method according to claim 9 is characterized in that, describedly first daughter board and/or second daughter board are subtracted copper handles and comprises:
Only on the orifice ring of the blind hole of described first daughter board and/or second daughter board, Copper Foil is set.
11. method according to claim 8 is characterized in that, describedly also comprises after the pressing protective layer above adhesive linkage:
Described first daughter board and/or second daughter board are subtracted the copper processing.
12. according to each described method in the claim 6 to 11, it is characterized in that, describedly above described adhesive linkage, comprise after the pressing protective layer:
After described printed circuit board (PCB) is finished chemical processing procedure, remove described protective layer.
13. method according to claim 12 is characterized in that, described method also comprises: the gap is set on protective layer;
Described removal protective layer comprises:
Remove described protective layer by described gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010135781A CN101784163A (en) | 2010-03-26 | 2010-03-26 | Printed circuit board and processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010135781A CN101784163A (en) | 2010-03-26 | 2010-03-26 | Printed circuit board and processing method of printed circuit board |
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| Publication Number | Publication Date |
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| CN101784163A true CN101784163A (en) | 2010-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010135781A Pending CN101784163A (en) | 2010-03-26 | 2010-03-26 | Printed circuit board and processing method of printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361538A (en) * | 2011-10-14 | 2012-02-22 | 电子科技大学 | Method for processing printed circuit two-level blind hole |
| CN103225094A (en) * | 2013-05-20 | 2013-07-31 | 深圳市博敏电子有限公司 | Single-sided current protection method for blind hole plate electroplating |
| CN104640345A (en) * | 2015-02-26 | 2015-05-20 | 华为技术有限公司 | Printed circuit board and manufacturing method of printed circuit board |
| CN104661427A (en) * | 2015-02-15 | 2015-05-27 | 华为技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN105682350A (en) * | 2016-04-05 | 2016-06-15 | 苏州市惠利源科技有限公司 | Half-annular ring circuit board |
| CN106163102A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| TWI626872B (en) * | 2017-01-13 | 2018-06-11 | 元鼎音訊股份有限公司 | Printed circuit board manufacturing method and printed circuit board thereof |
| CN108495486A (en) * | 2018-04-10 | 2018-09-04 | 生益电子股份有限公司 | A kind of production method and High speed rear panel of High speed rear panel |
-
2010
- 2010-03-26 CN CN201010135781A patent/CN101784163A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361538A (en) * | 2011-10-14 | 2012-02-22 | 电子科技大学 | Method for processing printed circuit two-level blind hole |
| CN103225094A (en) * | 2013-05-20 | 2013-07-31 | 深圳市博敏电子有限公司 | Single-sided current protection method for blind hole plate electroplating |
| CN103225094B (en) * | 2013-05-20 | 2015-09-09 | 深圳市博敏电子有限公司 | The guard method of a kind of blind hole plate plating single-sided current |
| CN104661427A (en) * | 2015-02-15 | 2015-05-27 | 华为技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN104661427B (en) * | 2015-02-15 | 2018-09-21 | 华为技术有限公司 | Printed circuit board and board, printed circuit board manufacturing method |
| CN104640345A (en) * | 2015-02-26 | 2015-05-20 | 华为技术有限公司 | Printed circuit board and manufacturing method of printed circuit board |
| CN104640345B (en) * | 2015-02-26 | 2018-03-06 | 华为技术有限公司 | Printed circuit board (PCB) and board, printed circuit board manufacturing method |
| CN106163102A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN106163102B (en) * | 2015-04-02 | 2018-11-23 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN105682350A (en) * | 2016-04-05 | 2016-06-15 | 苏州市惠利源科技有限公司 | Half-annular ring circuit board |
| TWI626872B (en) * | 2017-01-13 | 2018-06-11 | 元鼎音訊股份有限公司 | Printed circuit board manufacturing method and printed circuit board thereof |
| CN108495486A (en) * | 2018-04-10 | 2018-09-04 | 生益电子股份有限公司 | A kind of production method and High speed rear panel of High speed rear panel |
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Open date: 20100721 |