CN104476902A - PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof - Google Patents
PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof Download PDFInfo
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- CN104476902A CN104476902A CN201410839756.5A CN201410839756A CN104476902A CN 104476902 A CN104476902 A CN 104476902A CN 201410839756 A CN201410839756 A CN 201410839756A CN 104476902 A CN104476902 A CN 104476902A
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- cover plate
- aluminium foil
- phenolic
- back drill
- aluminum foil
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a PCB (printed circuit board) back-drilled cover plate and a manufacturing method thereof. The manufacturing method comprises the following steps: phenolic resin is impregnated on paper and then is baked into a prepreg; the single manufactured prepreg or multiple attached prepregs are attached to an aluminum foil in a pressed mode to obtain a phenolic-aldehyde cover plate with a single surface coated with the aluminum foil. The phenolic resin, the paper and the aluminum foil are compounded to form the phenolic-aldehyde cover plate with the single surface coated with the aluminum foil, a phenolic resin insulation dielectric layer formed by the phenolic resin and the paper replaces an epoxy resin glass-fiber compound insulation dielectric layer high in cost, the cost is greatly reduced, and meanwhile, the cover plate has the functions of easiness in drilling, good positioning effect and reduction of abrasion of a drill point. Besides, the aluminum foil replaces a copper foil high in cost, the cost can be further reduced substantially, and meanwhile, the cover plate has the advantages that a metal conducting layer is thin, thickness tolerance is small, the cover plate can be attached to a PCB well, and the depth control precision of drilling is good.
Description
Technical field
The present invention relates to printed circuit board field, particularly relate to a kind of cover plate and manufacture method thereof of PCB back drill.
Background technology
PCB back drill technology be by heavy copper after via in non-transmitting Conductive layer portions adopt machine drilling processing mode to remove, to ensure the part signal transmission stability retained, be conducive to high speed transmission of signals.PCB back drill technology adopts high-frequency electronic principle of induction rig to carry out the processing of boring back drill usually, utilizes high-frequency electronic conducting loop by drill point tip contacts cover plate (conductor) or pcb board, calculate the lower degree of depth of boring of design.The cover plate that current back drill adopts usually has aluminium flake, single-side coated copper plate etc., aluminium flake is adopted to carry out back drill Drilling operation, its cost is low, but due to aluminium flake smooth surface, easily enter to bore and skid and locating effect is poor, position, hole precision is low, product partially thin (0.14-0.20mm), there is degree of being adjacent to the not foot phenomenon with pcb board, borehole accuracy can be affected control, simultaneously aluminium flake conductive layer thicker (0.14-0.20mm) and thickness deviation is larger, cause back drill to hole and control dark low precision, be in just progressively by market at present; Adopt single-side coated copper plate, then upper epidermis is insulation resin dielectric layer, easy drill point enters to bore, and good positioning effect, position, hole precision are high, and Copper Foil metal conducting layer thin (≤35 μm) thickness deviation is little, product and pcb board degree of being adjacent to good, the dark precision of boring control is good, but high cost, be many times of prices of aluminium flake, to be difficult to accept by user, the glass simultaneously in epoxy resin glass compound inslation dielectric layer is unfavorable for that drill point weares and teares.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of cover plate and manufacture method thereof of PCB back drill, be intended to solve that prior art cover plate locating effect is poor, borehole accuracy is low, with PCB degree of being adjacent to difference, hole and control dark low precision and the high problem of cost.
Technical scheme of the present invention is as follows:
A manufacture method for the cover plate of PCB back drill, wherein, comprises the following steps:
A, by resin impregnating on paper after baking make prepreg;
B, prepregs of individual or multiple made laminating and aluminium foil are fitted and suppresses, obtain one side cladded aluminum foil phenolic cover plate.
The manufacture method of the cover plate of described PCB back drill, wherein, described step B specifically comprises:
B1, prepregs of individual or multiple made laminating and aluminium foil to be fitted;
B2, again prepreg and aluminium foil to be suppressed at high temperature under high pressure, obtain one side cladded aluminum foil phenolic cover plate.
The manufacture method of the cover plate of described PCB back drill, wherein, described step B specifically comprises:
B1 ', prepregs of individual or multiple made laminating to be suppressed at high temperature under high pressure, obtain phenolic resins insulating medium layer;
B2 ', then laminated for described phenolic resins dielectric or aluminium foil one side is applied certain thickness adhesive, then phenolic resins insulating medium layer and aluminium foil are fitted suppress, obtain one side cladded aluminum foil phenolic cover plate.
The manufacture method of the cover plate of described PCB back drill, wherein, described aluminium foil is the aluminium foil through one side process, and the one side treated side of described prepreg and aluminium foil is fitted.
The manufacture method of the cover plate of described PCB back drill, wherein, described aluminium foil is the aluminium foil through one side process, and described phenolic resins dielectric treated side that is laminated or aluminium foil applies certain thickness adhesive.
The manufacture method of the cover plate of described PCB back drill, wherein, in described step B, described aluminium foil is 6-60 μm of thick aluminium foil.
The manufacture method of the cover plate of described PCB back drill, wherein, in described step B, the gross thickness of the prepregs of described individual or multiple laminating controls at 0.1-1.0mm.
The manufacture method of the cover plate of described PCB back drill, wherein, in described step B2 ', described adhesive is one or more in epoxy adhesive, adhesive for polyurethane, unsaturated polyester (UP) adhesive.
The manufacture method of the cover plate of described PCB back drill, wherein, in described step B2 ', the condition of described laminating compacting comprises HTHP compacting, normal temperature laminating compacting or roll-in laminating compacting.
A cover plate for PCB back drill, wherein, adopts as above arbitrary described preparation method to make.
Beneficial effect: the present invention is by making one side cladded aluminum foil phenolic cover plate by phenolic resins, paper and aluminium foil compound, the phenolic resins insulating medium layer that described phenolic resins and paper are formed replaces the epoxy resin glass compound inslation dielectric layer of high cost, cost reduces greatly, has the effect easily entering brill, good positioning effect, the wearing and tearing of reduction drill point simultaneously; In addition, aluminium foil replaces the Copper Foil of high cost, also can significantly reduce costs further, possesses that metal conducting layer is thin and thickness deviation is little simultaneously, and product is good with pcb board degree of being adjacent to, and the good advantage of dark precision is controlled in boring.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method preferred embodiment of the cover plate of a kind of PCB back drill of the present invention.
Fig. 2 is the particular flow sheet of step S200 in method shown in Fig. 1.
Fig. 3 is another particular flow sheet of step S200 in method shown in Fig. 1.
Fig. 4 is the structural representation of the preferred embodiment of the cover plate of a kind of PCB back drill of the present invention.
Fig. 5 is the structural representation of another preferred embodiment of the cover plate of a kind of PCB back drill of the present invention.
Detailed description of the invention
The invention provides a kind of cover plate and manufacture method thereof of PCB back drill, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the flow chart of the manufacture method preferred embodiment of the cover plate of a kind of PCB back drill of the present invention, and as shown in Figure 1, it comprises the following steps:
S100, by resin impregnating on paper after baking make prepreg;
S200, prepregs of individual or multiple made laminating and aluminium foil are fitted and suppresses, obtain one side cladded aluminum foil phenolic cover plate.
The present invention is by making one side cladded aluminum foil phenolic cover plate by phenolic resins, paper and aluminium foil compound, one side cladded aluminum foil phenolic cover plate of the present invention, not only cost reduces greatly, and effectively reduces the wearing and tearing of drill point, also has the effect easily entering brill, good positioning effect simultaneously; In addition, possess that metal conducting layer is thin and thickness deviation is little, product and pcb board degree of being adjacent to good, the advantage that the dark precision of boring control is good.
Specifically, as shown in Figure 2, described step S200 can be refined as following steps:
S201, prepregs of individual or multiple made laminating and aluminium foil to be fitted;
S202, again prepreg and aluminium foil to be suppressed at high temperature under high pressure, obtain one side cladded aluminum foil phenolic cover plate.
In described step S201, the prepregs of individual or multiple made laminating and an aluminium foil are fitted.Such as, 1 or 2-6 can be selected to put up the prepreg of conjunction and an aluminium foil is fitted, to form cost, thickness, hardness are moderate, the phenolic resins insulating medium layer easily entering to bore.
In described step S202, the prepreg of fitting together and aluminium foil are suppressed 30-120min under 140-170 DEG C of high temperature 10-30MPa high pressure, obtains one side cladded aluminum foil phenolic cover plate of the present invention.Wherein, the upper epidermis of described one side cladded aluminum foil phenolic cover plate is phenolic resins insulating medium layer, and described phenolic resins insulating medium layer has makes drill point easily enter to bore location, improve position, hole precision, reduce the advantages such as drill point wearing and tearing; The layer of described one side cladded aluminum foil phenolic cover plate is aluminium foil, and described aluminium foil can form high-frequency electronic conducting loop with drill point, has the advantage such as low cost, the dark control accuracy of high brill.
Specifically, as shown in Figure 3, described step S200 also can be refined as following steps:
S201 ', prepregs of individual or multiple made laminating to be suppressed at high temperature under high pressure, obtain phenolic resins insulating medium layer;
S202 ', then laminated for described phenolic resins dielectric or aluminium foil one side is applied certain thickness adhesive, then phenolic resins insulating medium layer and aluminium foil are fitted suppress, obtain one side cladded aluminum foil phenolic cover plate.
In described step S201 ', such as, the prepreg that 1 or 2-6 can be selected to put up conjunction is suppressed, to form thickness, hardness phenolic resins insulating medium layer that is moderate, that easily enter to bore.And described prepreg suppresses 30-120min under 140-170 DEG C of high temperature 10-30MPa high pressure, obtain phenolic resins insulating medium layer of the present invention.Preferably, described prepreg suppresses 50-70min under 140-160 DEG C of high temperature 20-25MPa high pressure, the drill point of described phenolic resins insulating medium layer obtained under condition of the present invention enter to bore location and position, hole precision higher, and drill point weares and teares less.
In described step S202 ', apply certain thickness adhesive in the one side of described phenolic resins insulating medium layer, then the coated side of phenolic resins insulating medium layer and aluminium foil are fitted suppress, obtain one side cladded aluminum foil phenolic cover plate.In addition, also can apply certain thickness adhesive in described aluminium foil one side, then the coated side of aluminium foil and phenolic resins insulating medium layer are fitted suppress, obtain one side cladded aluminum foil phenolic cover plate.The upper epidermis of the described one side cladded aluminum foil phenolic cover plate obtained is phenolic resins insulating medium layer, and described phenolic resins insulating medium layer has makes drill point easily enter to bore location, improve position, hole precision, reduce the advantages such as drill point wearing and tearing; The layer of described one side cladded aluminum foil phenolic cover plate is aluminium foil, and described aluminium foil can form high-frequency electronic conducting loop with drill point, has the advantage such as low cost, the dark control accuracy of high brill.
Further, aluminium foil described in the present invention is the aluminium foil through one side process, and described aluminium foil forms one deck one side processing layer after one side process, and the one side treated side of described prepreg and aluminium foil is fitted.
Further, in described step S202 ', described aluminium foil is the aluminium foil through one side process, and the one side treated side of described aluminium foil applies certain thickness adhesive, then the coated side of aluminium foil and phenolic resins insulating medium layer are fitted and suppress, obtained one side cladded aluminum foil phenolic cover plate.Certain the present invention also can apply certain thickness adhesive in the one side of phenolic resins insulating medium layer, is then fitted by the one side treated side of the coated side of phenolic resins insulating medium layer and aluminium foil and suppresses, obtained one side cladded aluminum foil phenolic cover plate.Wherein, described adhesive includes but not limited to one or more in epoxy adhesive, adhesive for polyurethane, unsaturated polyester (UP) adhesive.Described adhesive has the large advantage of adhesion strength, the phenolic resins insulating medium layer bonding by described adhesive and aluminium foil are fitted closely, space is not had between phenolic resins insulating medium layer and aluminium foil, effectively prevent the problem that phenolic resins insulating medium layer takes away by drill bit when holing, thus be beneficial to raising drilling effect.
In the present invention, carry out one side process to described aluminium foil, object is to improve drilling effect.The method of the one side process of described aluminium foil includes but not limited to the processing methods such as alligatoring, activation, oxidation, application of resin.Preferably, adopt alligatoring or application of resin method to carry out one side process to aluminium foil, adopt the aluminium foil after roughening treatment, the roughness of aluminium foil can be increased, thus the skidding of drill point when effectively preventing from holing, be beneficial to the raising of position, hole accuracy; And after aluminium foil surface coated with resins, in the process that top layer resin falls at drill point, guide effect can be played, thus prevent syringe needle from offseting, improve position, hole precision, improve drill point efficiency.
Further, in described step S202 ', the condition of described compacting includes but not limited to HTHP compacting, normal temperature laminating compacting or roll-in laminating compacting.The high temperature range of described HTHP is 140-170 DEG C, and high pressure range is 10-30Mpa; Described roll-in is taked to fit at the temperature of 50-60 DEG C, then phenolic resins insulating medium layer and aluminium foil is suppressed, and obtains one side cladded aluminum foil phenolic cover plate.
Further, aluminium foil described in the present invention is 6-60 μm of thick aluminium foil, and aluminium foil of the present invention also can be alloy aluminium foil.The effect of thickness on boring of aluminium foil has larger impact, and when aluminium foil is too thick, the bits produced during its boring are more, easily get lodged in the groove of drill point, affect chip removal function, and thickness deviation great Yi affects the dark precision of boring control; And when aluminium foil is too thin, space becomes and easily forms burr greatly between aluminium foil and pcb board, and easily lose during aluminium foil processing and affect processing quality.Thickness is adopted to be the performance that the aluminium foil of 6-60 μm can ensure one side cladded aluminum foil phenolic cover plate.Preferably, thickness is adopted to be that the aluminium foil of 15-45 μm and prepreg are fitted, to improve the performance of one side cladded aluminum foil phenolic cover plate further.
Further, the phenolic resins that described phenolic resins is is synthesis main body and the phenolic resins that synthesizes and modification thereof with phenol or phenol derivative monomer, formaldehyde or formaldehyde-derived monomer, adopt the moderate phenolic resins of hardness for the preparation of one side cladded aluminum foil phenolic cover plate, be conducive to drill point to enter to bore location, improve position, hole precision.
Further, described paper is conventional fibre paper, includes but not limited to bleached wood pulp paper, balance paper, brown paper, recycled writing paper etc.
Based on above-mentioned preparation method, the present invention also provides a kind of cover plate of PCB back drill, and the cover plate of described PCB back drill adopts preparation method as above to make.
Fig. 4 is the structural representation of the preferred embodiment of the cover plate of a kind of PCB back drill of the present invention, as shown in Figure 4, the cover plate 100 of described PCB back drill, it comprises phenolic resins insulating medium layer 200 and the aluminium foil 300 suppressed in phenolic resins insulating medium layer 200 lower surface of fitting.
Fig. 5 is the structural representation of another preferred embodiment of the cover plate of a kind of PCB back drill of the present invention, as shown in Figure 5, the cover plate 1 of described PCB back drill comprises phenolic resins insulating medium layer 2 and comprises the aluminium foil 4 of an one side processing layer 3, and one side processing layer 3 and described phenolic resins insulating medium layer 2 lower surface of described aluminium foil 4 are fitted.
Below in conjunction with embodiment, the present invention is described in detail.
Embodiment 1
Get three phenolic aldehyde prepregs and a undressed aluminium foil laminating, then the prepreg posted and aluminium foil are suppressed 60min at 160 DEG C of high temperature, 20MPa pressure, obtained one side cladded aluminum foil phenolic cover plate.Wherein, the upper epidermis of described one side cladded aluminum foil phenolic cover plate is phenolic resins insulating medium layer, and described phenolic resins dielectric layer thickness is 0.486mm; The layer of described one side cladded aluminum foil phenolic cover plate is aluminium foil, and described aluminum foil thickness is 10 μm, and cover plate gross thickness is 0.496mm.
Embodiment 2: get two phenolic aldehyde prepregs and a laminating of the aluminium foil through one side activation process, then the prepreg posted and aluminium foil are suppressed 60min at 160 DEG C of high temperature, 25MPa pressure, obtained one side cladded aluminum foil phenolic cover plate.Wherein, the upper epidermis of described one side cladded aluminum foil phenolic cover plate is phenolic resins insulating medium layer, and described phenolic resins dielectric layer thickness is 0.296mm; The layer of described one side cladded aluminum foil phenolic cover plate is aluminium foil, and described aluminum foil thickness is 15 μm, and cover plate gross thickness is 0.311mm.
Embodiment 3: get six phenolic aldehyde prepregs and a laminating of the aluminium foil through one side roughening treatment, through 160 DEG C of high temperature, 30MPa pressure compacting 30min, obtained one side cladded aluminum foil phenolic cover plate.Wherein, the upper epidermis of described one side cladded aluminum foil phenolic cover plate is phenolic resins insulating medium layer, and described phenolic resins dielectric layer thickness is 0.785mm; The layer of described one side cladded aluminum foil phenolic cover plate is aluminium foil, and described aluminum foil thickness is 15 μm, and cover plate gross thickness is 0.800mm.
Embodiment 4: get three phenolic aldehyde prepregs and a laminating of the aluminium foil through one side oxidation processes, through 170 DEG C of high temperature, 25MPa pressure compacting 80min, obtained one side cladded aluminum foil phenolic cover plate.Wherein, the upper epidermis of described one side cladded aluminum foil phenolic cover plate is phenolic resins insulating medium layer, and described phenolic resins dielectric layer thickness is 0.486mm; The layer of described one side cladded aluminum foil phenolic cover plate is aluminium foil, and described aluminum foil thickness is 40 μm, and cover plate gross thickness is 0.526mm.
Embodiment 5: get the aluminium foil that a thickness is 15 μm, through chemical medicinal liquid one side activation process, then comma squeegee apparatus or roller coating device or spray equipment coating thickness on the one side treated side of aluminium foil is adopted to be the epoxy adhesive layer of 10 μm-15 μm, and through being baked into semi-solid preparation goods, then by its coated side with to have suppressed, thickness is that the phenolic resins insulating barrier of about 0.50mm is fitted and suppressed 30min through 140 DEG C of high temperature, 20MPa pressure, obtained one side cladded aluminum foil phenolic cover plate, thickness is 0.520mm.
Embodiment 6: get the aluminium foil that a thickness is 15 μm, through resin coating process, then adopt comma squeegee apparatus or roller coating device or spray equipment on aluminium foil one side treated side, apply the unsaturated polyester (UP) adhesive layer that a layer thickness is 10 μm-15 μm, then by its coated side with to have suppressed, thickness is that the phenolic resins insulating barrier of about 0.50mm is fitted through 60 DEG C of roll-formings, obtained one side cladded aluminum foil phenolic cover plate, thickness is 0.523mm.
Get the made one side cladded aluminum foil phenolic cover plate of above experiment and aluminium flake, single-side coated copper plate carry out the contrast of back drill borehole test, following table 1 between result.CPK in table 1 represents the dark precision of back drill control.
Table 1
From above contrast test result, the dark precision of back drill control of one side cladded aluminum foil phenolic cover plate is suitable with single-side coated copper plate, is better than aluminium flake.
In sum, the present invention is by making one side cladded aluminum foil phenolic cover plate by phenolic resins, paper and aluminium foil compound, the phenolic resins insulating medium layer that described phenolic resins and paper are formed replaces the epoxy resin glass compound inslation dielectric layer of high cost, cost reduces greatly, has the effect easily entering brill, good positioning effect, the wearing and tearing of reduction drill point simultaneously; In addition, aluminium foil replaces the Copper Foil of high cost, also can significantly reduce costs further, possesses that metal conducting layer is thin and thickness deviation is little simultaneously, and product is good with pcb board degree of being adjacent to, and the good advantage of dark precision is controlled in boring.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (10)
1. a manufacture method for the cover plate of PCB back drill, is characterized in that, comprises the following steps:
A, by resin impregnating on paper after baking make prepreg;
B, prepregs of individual or multiple made laminating and aluminium foil are fitted and suppresses, obtain one side cladded aluminum foil phenolic cover plate.
2. the manufacture method of the cover plate of PCB back drill according to claim 1, it is characterized in that, described step B specifically comprises:
B1, prepregs of individual or multiple made laminating and aluminium foil to be fitted;
B2, again prepreg and aluminium foil to be suppressed at high temperature under high pressure, obtain one side cladded aluminum foil phenolic cover plate.
3. the manufacture method of the cover plate of PCB back drill according to claim 1, it is characterized in that, described step B specifically comprises:
B1 ', prepregs of individual or multiple made laminating to be suppressed at high temperature under high pressure, obtain phenolic resins insulating medium layer;
B2 ', then laminated for described phenolic resins dielectric or aluminium foil one side is applied certain thickness adhesive, then phenolic resins insulating medium layer and aluminium foil are fitted suppress, obtain one side cladded aluminum foil phenolic cover plate.
4. the manufacture method of the cover plate of PCB back drill according to claim 1 or 2, it is characterized in that, described aluminium foil is the aluminium foil through one side process, and the one side treated side of described prepreg and aluminium foil is fitted.
5. the manufacture method of the cover plate of PCB back drill according to claim 3, it is characterized in that, described aluminium foil is the aluminium foil through one side process, and described phenolic resins dielectric treated side that is laminated or aluminium foil applies certain thickness adhesive.
6. the manufacture method of the cover plate of PCB back drill according to claim 1, it is characterized in that, in described step B, described aluminium foil is 6-60 μm of thick aluminium foil.
7. the manufacture method of the cover plate of PCB back drill according to claim 1, is characterized in that, in described step B, the gross thickness of the prepregs of described individual or multiple laminatings controls at 0.1-1.0mm.
8. the manufacture method of the cover plate of PCB back drill according to claim 3, is characterized in that, in described step B2 ', described adhesive is one or more in epoxy adhesive, adhesive for polyurethane, unsaturated polyester (UP) adhesive.
9. the manufacture method of the cover plate of PCB back drill according to claim 3, is characterized in that, in described step B2 ', the condition of described laminating compacting comprises HTHP compacting, normal temperature laminating compacting or roll-in laminating compacting.
10. a cover plate for PCB back drill, is characterized in that, adopt as arbitrary in claim 1 to 9 as described in preparation method make.
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| CN201410839756.5A CN104476902A (en) | 2014-12-30 | 2014-12-30 | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof |
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| CN201410839756.5A CN104476902A (en) | 2014-12-30 | 2014-12-30 | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof |
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Cited By (7)
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| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
| CN105599426A (en) * | 2015-12-17 | 2016-05-25 | 深圳市柳鑫实业股份有限公司 | Drilling cover plate and preparation method thereof |
| CN106001696A (en) * | 2016-05-26 | 2016-10-12 | 深圳市柳鑫实业股份有限公司 | PCB mechanically-drilled cover plate and preparation method thereof |
| CN107718840A (en) * | 2017-09-14 | 2018-02-23 | 烟台柳鑫新材料科技有限公司 | A kind of PCB back drills cover plate and preparation method thereof |
| CN111251366A (en) * | 2020-01-17 | 2020-06-09 | 珠海纵航科技有限公司 | PCB drilling cover plate |
| CN112277422A (en) * | 2020-10-28 | 2021-01-29 | 烟台柳鑫新材料科技有限公司 | Cover plate and preparation method thereof |
| CN113276213A (en) * | 2020-07-31 | 2021-08-20 | 生益电子股份有限公司 | Composite drill |
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