CN1277917A - Mat under printed circuit board, and its processing art - Google Patents
Mat under printed circuit board, and its processing art Download PDFInfo
- Publication number
- CN1277917A CN1277917A CN 00108481 CN00108481A CN1277917A CN 1277917 A CN1277917 A CN 1277917A CN 00108481 CN00108481 CN 00108481 CN 00108481 A CN00108481 A CN 00108481A CN 1277917 A CN1277917 A CN 1277917A
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- pressurization
- lower bolster
- pressure
- central layer
- technology
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The present invention relates to an improvement of the structural design and mfg. technology of printed circuit board backing plate, its structure adopts medium or high density core plate and adhered with metal foil on both surfaces. A new technology of coating glue on both surfaces and pressurized at a certain temperature for curing simplifies the process and meets the technical requirement of printed circuit board.
Description
The invention belongs to the improvement of special-purpose attaching material in the processing electronic circuit, and the supporting technology that adds.
The develop rapidly of electronic technology make electronic circuit become in the industrial control process and various automated productions in most important components.So the printed substrate of electronic circuit more and more comes into one's own with regard to becoming the most basic electronic product material.The particularly microminiaturization of electronic devices and components, the integrated electronic circuit that makes develop towards the meticulous direction of height day by day, make the processing of printed substrate in the electronic circuit more and more accurate and difficult.The jack of superminiature electronic component is meticulous to the micron number magnitude.Be the meticulous then strictness and difficult further of the processing of finishing drilling operating.Lower bolster promptly is pad plays protection precision metallic paillon foil and drill bit below circuit board effect; be disposable consumption articles for use; it is again the necessity of electronics industry; it needs the smooth of strictness; firm binding force and uniformity or the like special technique index; need cheap practical economic performance again, thereby preset many difficulty to producer's processing.Domestic required large-tonnage product is external import at present, and its two-sided tape technology of taking has determined structural characteristics, promptly clips one deck two-sided tape paper between tinsel and central layer.Though the physical structure of this lower bolster is reasonable, complex process, one-time investment is too high and cause the low profit or the loss of product during production, thereby awaits further improvement.
The purpose of this invention is to provide a kind of new underlay structural design and accessory processing technology, make it require to meet under the printed substrate processing specification prerequisite to simplify technology significantly, reduce cost, to adapt to the needs of growing electronics industry in basic fundamental.
Key Design of the present invention has been to simplify the structure of lower bolster, during new design is taked or highdensity fiber board as central layer, the paillon foil that directly adheres to aluminium or copper then by seccotine on two sides of central layer is for making paillon foil evenly securely on the fiber board face attached to middle and higher density.The present invention is supporting to have designed special technology, to guarantee guaranteeing the absolute evenness of lower bolster in this structural design, the specification requirement when all even firmness of tinsel adhesive force all meets printed wire boring.
Below in conjunction with accompanying drawing further specify structure of the present invention, technology is how to realize the object of the invention:
Fig. 1 is a structural representation of the present invention.
Fig. 2 adds the technology schematic diagram for static pressure.
Fig. 3 is a roll-in processing technology schematic diagram.
Wherein in 1 representative or the central layer made of high density fiberboard, 2 represents copper or aluminium foil, the glue-line after 3 signals are solidified, and 4 represents the static state platen that pressurizes, and 5 represent glue spreader, and 6 represent backer roll.
Taked direct bonding simplified structure among the present invention; tinsel directly is bonded on the high-density fiber central layer in this structure; then on technology, has higher requirement; mainly be guarantee to be coated with adhesive all even pressure evenly; guarantee not exist between whole paillon foils and the central layer any small steam bubble or space, to guarantee quality and the real protection drill bit in the processing printed plate process.For the designed lower bolster structure specialized designs of the present invention the supporting technology that adds, this technology comprises following operation:
(1) size is joined sanction: by the requirement of standard or process conditions with core and the supporting corresponding cutting of the corresponding physical dimension of tinsel.
(2) double spread: with two sides of central layer, and the even coated with adhesive in bonding side of tinsel correspondence, adhesive of the present invention is epoxide-resin glue.
(3) pressurization, constant temperature solidify, and under setting pressure and the temperature tinsel are located pressurization on central layer then, keep the corresponding time under corresponding temperature, realize the curing of glue face.
(4) lower bolster that is cured is pruned by specification and treating selvedge formation product.
During central layer adopts in above technology or high density fiberboard, thickness can be selected 0.75-2.2mm, and adopting the thickness of aluminium foil is 0.01-0.025mm.The evenness that adopts under the suitable temperature pressurization operation can guarantee to solidify quality and tinsel, and can prevent because of steam bubble, take the quality that defective that sky causes influences lower bolster.In the constant temperature pressing technology, can take following different treatment step:
(1) in constant temperature pressurization operation, adopts static vertical method of pressurizeing, glue-coated central layer and paillon foil are arranged between two blocks of platens 4 of forcing press, load 80～160 kilograms/m
2Pressure, and make platen temperature rise to 80 ℃～160 ℃, continue can unload after 2～5 minutes.
If platen temperature is located at below 40 ℃ in the above conditions, then must intensified pressure to 100-180 kilogram/m
2, persistent pressure just can unload more than 10 hours.
(2) in constant temperature pressurization operation, also can adopt two roller rolling pressing mode to realize the solidifying and setting process.When adopting such craft method, use manyly to seaming roll composition production line, make glue-coated central layer and paillon foil pass through backer roll continuously.When taking so two rollers to pressurize, roller is 30～100 kilograms/m to the pressure at right angle of product
2, the linear velocity that processed semi-finished product pass through from two rollers is 20～25 meters/minute, by finishing pressurization constant temperature curing process behind No. 10 pressure rollers, the temperature of backer roll should keep between 60 ℃～200 ℃ in this operation continuously.
If the room temperature below 40 ℃ is adopted in the not special intensification of backer roll, pressure is enlarged to 50～120 kg/m when then taking above operation
2, half-finished linear velocity is 15～20 meters/minute, the number of times by pressure roller is more than 10 times.
It is good to adopt above technology to make the quality of the directly sticking type lower bolster of two-sided aluminium foil, and cost is low, can satisfy the requirement of present printed wire board machining process.
Claims (8)
1, a kind of printed substrate lower bolster, by central layer and adhere to its surperficial tinsel and form, it is characterized in that this lower bolster by in or the central layer made of high density fiberboard and two-sided direct the gummed aluminium foil or the Copper Foil that adhere to form.
2, according to the said lower bolster of claim 1; The thickness that it is characterized in that central layer is 0.75～2.2mm, and aluminum foil thickness is 0.01～0.025mm.
3,, it is characterized in that this technology finished by following operation according to the said lower bolster processing technology of claim 1:
(1) size is joined sanction: with core and the supporting corresponding cutting of choosing of the corresponding physical dimension of metal forming,
(2) double spread: with central layer two sides and the even coated with adhesive of metal forming corresponding side surface,
(3) pressurization, constant temperature solidify: with the location pressurization of the corresponding central layer of metal forming, viscose glue solidifies under proper temperature,
(4) become finished product by standard shearing, deburring.
4, according to the said lower bolster processing technology of claim 3, it is characterized in that in pressurization, heating cure operation, taking the method for vertical static pressurization, the central layer and the tinsel of double spread are placed under the static pressure of pressurization up and down, and pressure is 80～160 kilograms/m
2, it is 80 °～160 ° that the pressurization platen is heated up, 2～5 minutes persistent pressure time.
5, according to the said lower bolster processing technology of claim 3, it is characterized in that in pressurization heating cure operation, taking static vertical pressurization operation, when temperature being set being below 40 ℃, static pressure is 100-180 kilogram/m
2, pressing time was greater than 10 hours.
6,, it is characterized in that in level pressure heating cure technology when taking the continuous double-roller pressurization, the backer roll temperature is 60～200 ℃, 30～100 kilograms/m of pressure at right angle according to the said lower bolster processing technology of claim 3
2, the processing flitch is 20～25 meters/minute by linear velocity, number of pass times is more than 10 times continuously.
7, according to the said lower bolster processing technology of claim 3, be lower than 40 ℃ as setting temperature when it is characterized in that taking pressurization, heating cure operation, pressure should be 50～120 kg/m when then roll extrusion was handled
2, processing flitch linear velocity is 5～20 meters/minute, is more than 10 times by the pressure roller number of times.
8,, it is characterized in that adopting adhesive in coating technique is epoxide-resin glue according to the said lower bolster processing technology of claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB00108481XA CN1167547C (en) | 2000-06-09 | 2000-06-09 | Mat under printed circuit board, and its processing art |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB00108481XA CN1167547C (en) | 2000-06-09 | 2000-06-09 | Mat under printed circuit board, and its processing art |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1277917A true CN1277917A (en) | 2000-12-27 |
| CN1167547C CN1167547C (en) | 2004-09-22 |
Family
ID=4579221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB00108481XA Expired - Fee Related CN1167547C (en) | 2000-06-09 | 2000-06-09 | Mat under printed circuit board, and its processing art |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1167547C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101973145A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | Method for preparing embedded material and embedded material prepared thereby |
| CN103448317A (en) * | 2009-12-22 | 2013-12-18 | Jx日矿日石金属株式会社 | Method for producing laminate, and laminate |
| CN104191457A (en) * | 2014-08-22 | 2014-12-10 | 深圳市柳鑫实业有限公司 | Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board |
| CN104385354A (en) * | 2014-09-25 | 2015-03-04 | 深圳市柳鑫实业有限公司 | Base plate for drilling printed circuit board and manufacturing method for base plate |
| CN104476902A (en) * | 2014-12-30 | 2015-04-01 | 烟台柳鑫新材料科技有限公司 | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof |
| CN108189516A (en) * | 2017-12-06 | 2018-06-22 | 常州市宝平不绣钢制品有限公司 | A kind of preparation method of copper-clad plate |
| CN116984898A (en) * | 2023-07-19 | 2023-11-03 | 广东合正科技有限公司 | Full-automatic production system for processing circuit board backing plate |
-
2000
- 2000-06-09 CN CNB00108481XA patent/CN1167547C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103448317A (en) * | 2009-12-22 | 2013-12-18 | Jx日矿日石金属株式会社 | Method for producing laminate, and laminate |
| CN103448317B (en) * | 2009-12-22 | 2016-12-28 | Jx日矿日石金属株式会社 | The manufacture method of laminate and laminate |
| CN101973145A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | Method for preparing embedded material and embedded material prepared thereby |
| CN104191457A (en) * | 2014-08-22 | 2014-12-10 | 深圳市柳鑫实业有限公司 | Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board |
| CN104191457B (en) * | 2014-08-22 | 2017-01-18 | 深圳市柳鑫实业股份有限公司 | Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board |
| CN104385354A (en) * | 2014-09-25 | 2015-03-04 | 深圳市柳鑫实业有限公司 | Base plate for drilling printed circuit board and manufacturing method for base plate |
| CN104385354B (en) * | 2014-09-25 | 2016-07-06 | 深圳市柳鑫实业股份有限公司 | A kind of boring backing plate of printed circuit board and preparation method thereof |
| CN104476902A (en) * | 2014-12-30 | 2015-04-01 | 烟台柳鑫新材料科技有限公司 | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof |
| CN108189516A (en) * | 2017-12-06 | 2018-06-22 | 常州市宝平不绣钢制品有限公司 | A kind of preparation method of copper-clad plate |
| CN116984898A (en) * | 2023-07-19 | 2023-11-03 | 广东合正科技有限公司 | Full-automatic production system for processing circuit board backing plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1167547C (en) | 2004-09-22 |
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