CN110099515A - A method of improving PCB drilling - Google Patents
A method of improving PCB drilling Download PDFInfo
- Publication number
- CN110099515A CN110099515A CN201910428398.1A CN201910428398A CN110099515A CN 110099515 A CN110099515 A CN 110099515A CN 201910428398 A CN201910428398 A CN 201910428398A CN 110099515 A CN110099515 A CN 110099515A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- resin material
- composite resin
- layer
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
A kind of method that the present invention discloses improvement pcb board drilling, wherein, the method includes the steps: by directly coating composite resin material in at least one side of pcb board, and curing process is carried out to the pcb board, the composite resin material being coated on pcb board is made to form compound resin layer；Drilling processing is carried out to the pcb board coated with compound resin layer later；Pcb board by drilling processing is carried out to move back film process, removal is coated in the compound resin layer on the pcb board.The present invention coats composite resin material and the pcb board after solidify can be placed directly on the machine table top that drills and process, it need not combine and tape, simplify operation, improve efficiency, and thickness is less than existing cover board after the composite resin material solidification of its coating, reduces the long occupancy of the effective sword of drill point, is conducive to chip removal or increases lamination, also it is conducive to drill point to enter to bore positioning, improves machining accuracy.
Description
Technical field
The present invention relates to the drilling field PCB more particularly to a kind of methods for improving PCB drilling.
Background technique
Drilling operating is the important procedure that printed circuit board (abbreviation PCB) is manufactured, and drilling processing quality is straight
The superiority and inferiority for influencing PCB performance and quality is connect, or even influences the global reliability of the electronic device containing PCB.Cover board and backing plate
It is the key that PCB drilling processing auxiliary material, when drilling processing is normally placed at the upper and lower surfaces of pcb board to be drilled, is placed in drilling
On machine table top, and surrounding is attached with adhesive tape, and cover board and backing plate have protection pcb board face, table top, improve drilling processing performance and product
The effects of matter.Common cover board has aluminium flake, overlay film aluminium flake, cold punching plate etc., and common backing plate has wooden fine plate, compound sheeting caps, UV
Plate, melamine plate, phenolic board, lubrication backing plate etc..
Existing pcb board needs first to merge lid, backing plate with pcb board group to tape in drilling, complicated for operation, low efficiency；
Existing cover sheet thickness is most of in 0.1-0.5mm range, and backing plate can all be accounted for there are certain thickness tolerance (± 0.05-0.15mm)
The effective sword of the drill point of certain length is long to influence drilling chip removal or stack-design.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of methods of improvement PCB drilling, it is intended to
Solve the problems, such as that the prior art needs to rely on backing plate or cover board when drilling to pcb board.
Technical scheme is as follows:
A method of improving pcb board drilling, wherein comprising steps of
Composite resin material is coated in at least one side of pcb board in advance, curing process is carried out to the pcb board, makes to be coated in PCB
Composite resin material on plate forms compound resin layer；
Drilling processing is carried out to the pcb board coated with compound resin layer；
Pcb board by drilling processing is carried out to move back film process, removal is coated in the compound resin layer on the pcb board.
The method for improving pcb board drilling, wherein the composite resin material includes matrix resin, photoinitiator, fills out
Material, modified acroleic acid and addition auxiliary agent.
The method for improving pcb board drilling, wherein the composite resin material includes 30-50 parts by weight
Matrix resin, 3-7 parts of photoinitiator, 20-40 parts of filler, 10-20 parts of modified acroleic acid and 0.5-3 parts of addition helps
Agent.
The method for improving pcb board drilling, wherein the matrix resin is selected from unsaturated polyester (UP), epoxy resin, three officials
One of energy aliphatic urethane acrylate, polyester resin, polyimide resin and phenolic resin are a variety of.
The method for improving pcb board drilling, wherein the composite resin material further includes organic amine.
It is described improve pcb board drilling method, wherein the compound resin layer with a thickness of 10-200um.
The method for improving pcb board drilling, wherein under conditions of 50-90 DEG C, use concentration for the alkaline medicine of 3-5%
Water carries out moving back film process to the pcb board by drilling processing, and removal is coated in the compound resin layer on the pcb board.
The method for improving pcb board drilling, wherein the composite resin material includes 40 parts by weight
A6700,0.06 part of SA2290,0.04 part of FL2520,9 parts of FL4350,2.5 parts of I940,4.4 parts of I7510,10 parts
M280,11.5 parts of FL-OW, 18 parts of FL2630,0.5 part of SA312,2 parts of SA24 and 2 part of organic amine.
The method for improving pcb board drilling, wherein described to coat compound resin material in at least one side of pcb board in advance
Material, the step of carrying out curing process to the pcb board, the composite resin material being coated on pcb board is made to form compound resin layer
It specifically includes:
First layer composite resin material is coated in at least one side of pcb board in advance, the first layer composite resin material is carried out
First time curing process；
Second layer composite resin material is coated on the first layer composite resin material surface by first time curing process, and
Second of curing process is carried out to the second layer composite resin material.
The method for improving pcb board drilling, wherein described compound in the first layer by first time curing process
Resin material surface coats second layer composite resin material, and carries out at second of solidification to the second layer composite resin material
After the step of reason further include:
It circuits sequentially, coats (n+1)th layer of compound tree on the n-th layer composite resin material surface by n-th curing process
Rouge material, and (n+1)th curing process is carried out to (n+1)th layer of composite resin material, the compound resin layer is made, n is
Integer more than or equal to 2.
The utility model has the advantages that the method provided by the invention for improving pcb board drilling, by directly being applied in at least one side of pcb board
Composite resin material is covered, and curing process is carried out to the pcb board, forms the composite resin material being coated on pcb board multiple
Resin layer；Drilling processing is carried out to the pcb board；Pcb board by drilling processing is carried out moving back film process, removal is coated in
Compound resin layer on the pcb board.The present invention, which coats the pcb board after composite resin material solidifies, can be placed directly in drilling board
It is processed on face, simplifies the combination operation of lid, backing plate and pcb board, improve efficiency, be conducive to realize automatic operation, and it is applied
Thickness is less than existing cover board after the composite resin material solidification covered, and reduces the long occupancy of the effective sword of drill point, is conducive to chip removal or increasing
Add lamination, is also conducive to drill point and enters to bore positioning, improve machining accuracy.
Detailed description of the invention
Fig. 1 is a kind of flow chart for the method preferred embodiment for improving pcb board drilling of the present invention.
Specific embodiment
The present invention provides a kind of methods of improvement pcb board drilling, to make the purpose of the present invention, technical solution and effect more
Add clear, clear, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein only to
It explains the present invention, is not intended to limit the present invention.
Embodiment of the present invention provides a kind of method of improvement PCB drilling, as shown in Figure 1, comprising steps of
S100, in advance pcb board at least one side coat composite resin material, to the pcb board carry out curing process, make to coat
Composite resin material on pcb board forms compound resin layer；
S200, drilling processing is carried out to the pcb board coated with compound resin layer；
S300, the pcb board by drilling processing is carried out to move back film process, removal is coated in the compound resin layer on the pcb board.
In the present embodiment, the face that can be used in coating composite resin material in the pcb board refers to the upper surface of pcb board
And lower surface, two faces when the upper and lower surfaces of the pcb board refer to pcb board drilling with drill point perpendicular contact.
In some embodiments, composite resin material is coated in the upper surface of pcb board, the pcb board is solidified
Processing makes the composite resin material coated in pcb board upper surface form compound resin layer；By the compound of the pcb board upper surface
Resin layer is laid with backing plate towards drill point, and in the pcb board lower surface, carries out drilling processing to the pcb board；Finally to process
The pcb board of drilling processing carries out moving back film process, and removal is coated in the compound resin layer of the pcb board upper surface.
In the present embodiment, the alternative cover board in the prior art of the compound resin layer coated in pcb board upper surface,
Existing pcb board needs that cover board is first merged joint adhesive band, complicated for operation, low efficiency, and existing lid with pcb board group in drilling
Plate thickness is most of in 100-500um range, and the effective sword of drill point that this can occupy condition of equivalent thickness is long, thus influence to drill chip removal or
Stack-design；And the pcb board that upper surface is coated with compound resin layer in the present embodiment can be placed directly on drilling machine table top and carry out
Drilling which simplify operation, improves efficiency without additional cover board, and compound resin layer of its coating solidify after thickness
Less than existing cover board, reduce the long occupancy of the effective sword of drill point, is conducive to chip removal or increases lamination, while the compound resin layer
Hardness is lower than the hardness of aluminium flake, is also conducive to drill point and enters to bore positioning, improves machining accuracy.
In some embodiments, the thickness of the compound resin layer can be arranged to difference according to different types of pcb board
Size.
In some specific embodiments, the compound resin layer with a thickness of 10-200um.Answering in the present embodiment
Resin thickness degree is usually less than the thickness of existing cover board, the long occupancy of effective sword so as to reduce drill point.
In some embodiments, composite resin material is coated in the lower surface of pcb board, the pcb board is solidified
Processing makes the composite resin material coated in pcb board lower surface form compound resin layer；By the compound of the pcb board lower surface
Resin layer is laid with additional cover board in the upper surface of the pcb board backwards to drill point, carries out drilling processing to the pcb board；Most
The pcb board by drilling processing is carried out afterwards to move back film process, removal is coated in the compound resin layer of the pcb board lower surface.
In the present embodiment, the alternative backing plate in the prior art of the compound resin layer coated in pcb board lower surface,
Existing pcb board also needs that backing plate is first merged joint adhesive band with pcb board group in drilling, complicated for operation, low efficiency, and by
It is usually rigid structure in existing backing plate, and its profile pattern is stronger, this is easy the pcb board of deformation or surface irregularity
Gap is generated between backing plate, increase so as to cause drilling processing burr, poor processability the problems such as, and existing backing plate is all
There are certain thickness deviations, and usually in ± 0.05-0.15mm, the thickness deviation of backing plate will increase drill pad twist drill depth under drill point
Depth design is typically designed in 0.4~1.0mm, and it is long to occupy the effective sword of longer drill point, influences chip removal and stack-design.And this
Embodiment is coated in the alternative backing plate of compound resin layer of pcb board lower surface, since compound resin layer is to be applied directly to pcb board
Surface, the compactness on the compound resin layer and pcb board surface is high, between the two gapless, thus can be effectively improved deformation
Or the drilling processing burr of the pcb board of surface irregularity, processing performance etc., also reduce what plate thickness tolerance designed brill deeply
It influences, reduces the dependence to backing plate.In the present embodiment, by pcb board lower surface coat compound resin layer after, it is described
Pcb board can not use additional backing plate in drilling, perhaps be changed without backing plate or the high-end backing plate of substitution etc., this is not only mentioned
The high application flexibility of backing plate, also reduces backing plate cost.
In some embodiments, it is coated with composite resin material in the upper and lower surfaces of pcb board, the pcb board is carried out
Curing process makes the composite resin material coated in pcb board upper and lower surfaces form compound resin layer；To the pcb board directly into
Row drilling processing；Pcb board by drilling processing is carried out to move back film process, removal is coated in answering for the pcb board upper and lower surfaces
Resin layer.
In the present embodiment, the pcb board upper and lower surfaces are prepared for compound resin layer, thus to the pcb board into
When row drilling, it may not be necessary to additional cover board and backing plate, the pcb board can be placed directly on drilling machine table top and drill,
Which simplify operations, improve drilling efficiency；Its operation that need not stick combined cap, backing plate is additionally favorable for realizing automatic operation.
In some embodiments, the composite resin material includes matrix resin, photoinitiator, filler, modified propylene
Acid and addition auxiliary agent.In the present embodiment, the modified acroleic acid can enhance the adhesive force of composite resin material and reinforce it
Levelability；By adjusting the ratio of ingredient each in composite resin material, different hardness, different adhesive force can be made and easily move back film
Compound resin layer.
In some embodiments, the composite resin material includes 30-50 parts of matrix resin, 3-7 by weight
The photoinitiator, 20-40 parts of filler, 10-20 parts of modified acroleic acid and 0.5-3 parts of addition auxiliary agent of part.In this implementation
In example, the lid such as the alternative existing common aluminium flake of compound resin layer, overlay film aluminium flake, cold punching plate that the composite resin material is formed
Plate, also backing plates such as the fine plate of alternative existing common wood, compound sheeting caps, UV plate, melamine plate, phenolic board.
In some embodiments, the matrix resin is selected from unsaturated polyester (UP), epoxy resin, trifunctional aliphatic poly ammonia
One of ester acrylate, polyester resin, polyimide resin and phenolic resin are a variety of, but not limited to this.
In a kind of specific embodiment, the matrix resin selects trifunctional aliphatic urethane acrylate, institute
State trifunctional aliphatic urethane acrylate is fast with curing rate, film forming than more flexible, wear-resisting, adhesive force is excellent, hardness is good,
The advantages that good weatherability.Further, since the trifunctional aliphatic urethane acrylate is special trifunctional reunion ammonia
Ester has been grafted a large amount of alkali solubility polar group on side chain, therefore the trifunctional aliphatic urethane acrylate has been made
Based on resin formed compound resin layer be easier to move back film in lye, can effectively improve and move back membrane efficiency.
In some embodiments, the composite resin material further includes organic amine.Preferably, the composite resin material
By weight further include 1-5 parts of organic amine, is penetrated into compound resin layer since organic amine can effectively facilitate lye, and
And organic amine can also play with trifunctional aliphatic urethane acrylate and cooperate with the alkali effect of moving back, therefore, by compound tree
Addition organic amine can further promote compound resin layer and move back film properties in alkaline medicinal liquid in rouge material.
In some specific embodiments, the organic amine is selected from ethamine, propylamine, butylamine etc., but not without being limited thereto.
In some embodiments, the photoinitiator be one or both of I940 and I7510, but not limited to this.
Two kinds of photoinitiators provided in this embodiment, which can arrange in pairs or groups mutually, provides suitable photocuring wave-length coverage.
In some embodiments, the filler is one of 3000 mesh talcum powder, 1500 mesh talcum powder and silicon powder
Or it is a variety of, but not limited to this.
In some embodiments, the modified acroleic acid be selected from single official's acrylic acid, the hydroxyl modified acroleic acid of double officials and
One of three official's propoxyl group modified acroleic acids are a variety of.In the present embodiment, the modified acroleic acid is mainly used for enhancing compound
The adhesive force of resin material, and reinforce its levelability.
In some embodiments, the addition auxiliary agent is selected from silicon levelling agent, phosphoric acid ester, active amine, toner, dispersion
One of agent is a variety of, but not limited to this.
In a kind of specific embodiment, the composite resin material includes 40 parts of tri- official of A6700(by weight
Energy aliphatic urethane acrylate), 0.06 part of SA2290(macromolcular dispersant), 0.04 part of FL2520(toner) and, 9 parts
FL4350(silicon powder), 2.5 parts of I940(photoinitiator), 4.4 parts of I7510(photoinitiator), the mono- official of 10 parts of M280(
Acrylic acid), 11.5 parts of FL-OW(3000 mesh talcum powder), 18 parts of FL2630(1500 mesh talcum powder) and, 0.5 part of SA312
(silicon levelling agent), 2 parts of SA24(phosphoric acid ester) and 2 parts of organic amine.
In some embodiments, described to coat composite resin material in at least one side of pcb board in advance, to the PCB
The step of plate carries out curing process, and the composite resin material being coated on pcb board is made to form compound resin layer specifically includes:
First layer composite resin material is coated in at least one side of pcb board in advance, the first layer composite resin material is carried out
First time curing process；
Second layer composite resin material is coated on the first layer composite resin material surface by first time curing process, and
Second of curing process is carried out to the second layer composite resin material.
Due to being directed to different types of pcb board, need to prepare different-thickness on pcb board when meeting its drilling demand
Compound resin layer, for example, when preparing thickness and being greater than the compound resin layer of 100um, it usually needs coating is twice or more than twice
Composite resin material；The present embodiment on pcb board for coating composite resin material twice, in order to guarantee second of coating
Composite resin material can stable bond on the composite resin material of first time coating, needed before second coats pair
The composite resin material of coating carries out curing process for the first time.
In some embodiments, in order to guarantee second coating composite resin material can stable bond the
On the composite resin material of primary coating, and simultaneously in order to improve the membrane efficiency of moving back of compound resin layer, at second of solidification
The energy demand of reason is greater than the energy of first time curing process.
In the present embodiment, the coating method includes but is not limited to roller coating, spraying, showering, curtain coating painting, silk-screen etc..
In some specific embodiments, the energy of the first time curing process is 500mj, second of curing process
Energy be 800mj.In some embodiments, the curing mode includes but is not limited to heat cure, photocuring etc..
In some embodiments, the first layer composite resin material surface described by first time curing process
Second layer composite resin material is coated, and after the step of carrying out second of curing process to the second layer composite resin material
Further include:
It circuits sequentially, coats (n+1)th layer of compound tree on the n-th layer composite resin material surface by n-th curing process
Rouge material, and (n+1)th curing process is carried out to (n+1)th layer of composite resin material, the compound resin layer is made, n is
Integer more than or equal to 2.
Be broadly divided into two kinds of situations for carrying out repeatedly coating on pcb board: it is insufficient that one is disposable coating thickness, needs
Repeatedly coating is to guarantee thickness；Another kind is the resin for successively coating different function layer, for example is first coating one close to pcb board face
Metal adhesion is good and the resin of hardness height for layer, the big resin of inter-coat good film-forming property, intensity, surface coating good water solubility
Resin layer, the more optimized multilayer functional resin design of Lai Shixian performance.For multiple coating procedure, in order to ensure coating interlayer
Adhesive force and repeatedly cured brittle risk, the inner layer resin layer generally coated need to control suitable curing degree, generally
Slightly stick the back of the hand sense to be preferred, curing degree is too low, and resin layer is in a liquid state or biggish adhesion, is unfavorable for rear coating operation；
Curing degree is excessively high, will cause ply adhesion deficiency, or even repeatedly cured embrittlement issue.
In some specific embodiments, when needing to reach needed for compound resin layer by 2 times or more coatings
When thickness, then it is required to carry out one-step solidification processing, last time curing process to composite resin material after each coating
Energy should be using the energy that is very fully cured, to realize to form stable compound resin layer.
In some embodiments, the compound resin layer move back film can be selected according to formula and appointed condition it is suitable
Stripping mode, the present embodiment preferably under conditions of 50-90 DEG C, use concentration to pass through drilling to described for the alkaline medicinal liquid of 3-5%
The pcb board of processing carries out moving back film process, and removal is coated in the compound resin layer on the pcb board.
Specifically, the compound resin layer thickness of coating is thicker, takes off except condition is harsher, takes off except the time is longer.For taking off
Except the parameter settings such as the chemical concentration of resin layer, temperature, time have a strict requirements, chemical concentration is too high or temperature is too high or when
Between it is too long, be all easy to cause pcb board face copper foil different degrees of microetch or oxidation etc. abnormal, or even after influencing drilling processing
Rear process hole in quality, while also the heatproof of equipment or corrosion resistance are put forward higher requirements, need to be according to compound resin layer
The formula etc. for taking off film properties, film thickness, liquid medicine come reasonable set process flow and relevant parameter index.It is relatively thin for film thickness such as
90um hereinafter, it is controllable to move back the film time shorter, such as within 200s, successional level can be proposed with take off and wash line and taken off
Film also can use PCB producer existing production line such as dry film and take off wash water horizontal line and takes off film；For film thickness compared with thickness rate such as 120um or more,
It then can control that move back the film time longer, such as 300s or more, intermittent recessed pendent can be proposed with and take off film.
In conclusion the method provided by the invention for improving pcb board drilling, by directly being applied in at least one side of pcb board
Composite resin material is covered, and curing process is carried out to the pcb board, forms the composite resin material being coated on pcb board multiple
Resin layer；Later by the compound resin layer of the pcb board towards drill point, drilling processing is carried out to the pcb board；To by boring
The pcb board of hole processing carries out moving back film process, and removal is coated in the compound resin layer on the pcb board.The present invention coats compound tree
Pcb board after rouge material solidification can be placed directly on drilling machine table top and process, and without combining and taping, simplify operation, mention
High efficiency, and thickness is less than existing cover board after composite resin material solidification of its coating, reduces that the effective sword of drill point is long to be accounted for
With, conducive to chip removal or increase lamination, is also conducive to drill point and enters to bore positioning, raising machining accuracy.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of method for improving pcb board drilling, which is characterized in that comprising steps of
Composite resin material is coated in at least one side of pcb board in advance, curing process is carried out to the pcb board, makes to be coated in PCB
Composite resin material on plate forms compound resin layer；
Drilling processing is carried out to the pcb board coated with compound resin layer；
Pcb board by drilling processing is carried out to move back film process, removal is coated in the compound resin layer on the pcb board.
2. improving the method for pcb board drilling according to claim 1, which is characterized in that the composite resin material includes master
Body resin, photoinitiator, filler, modified acroleic acid and addition auxiliary agent.
3. improving the method for pcb board drilling according to claim 2, which is characterized in that the composite resin material is by weight
Part meter include 30-50 parts of matrix resin, 3-7 parts of photoinitiator, 20-40 parts of filler, 10-20 parts of modified acroleic acid with
And 0.5-3 parts of addition auxiliary agent.
4. according to any method for improving pcb board drilling of claim 2-3, which is characterized in that the matrix resin is selected from
Unsaturated polyester (UP), epoxy resin, trifunctional aliphatic urethane acrylate, polyester resin, polyimide resin and phenolic aldehyde tree
One of rouge is a variety of.
5. according to any method for improving pcb board drilling of claim 2-3, which is characterized in that the composite resin material
It further include organic amine.
6. -3 any method for improving pcb board drilling according to claim 1, which is characterized in that the compound resin layer
With a thickness of 10-200um.
7. improving the method for pcb board drilling according to claim 1, which is characterized in that under conditions of 50-90 DEG C, use
The alkaline medicinal liquid that concentration is 3-5% carries out moving back film process to the pcb board by drilling processing, and removal is coated in the pcb board
On compound resin layer.
8. improving the method for pcb board drilling according to claim 1, which is characterized in that the composite resin material is by weight
Part meter includes 40 parts of A6700,0.06 part of SA2290,0.04 part of FL2520,9 parts of FL4350,2.5 parts of I940,4.4
The I7510,10 parts of M280,11.5 parts of FL-OW, 18 parts of FL2630,0.5 part of SA312 of part, SA24 and 2 part of 2 parts
Organic amine.
9. improving the method for pcb board drilling according to claim 1, which is characterized in that described in advance at least the one of pcb board
Face coats composite resin material, carries out curing process to the pcb board, forms the composite resin material being coated on pcb board
The step of compound resin layer, specifically includes:
First layer composite resin material is coated in at least one side of pcb board in advance, the first layer composite resin material is carried out
First time curing process；
Second layer composite resin material is coated on the first layer composite resin material surface by first time curing process, and
Second of curing process is carried out to the second layer composite resin material.
10. improving the method for pcb board drilling according to claim 9, which is characterized in that described solid by first time described
The first layer composite resin material surface for changing processing coats second layer composite resin material, and to the second layer compound resin material
Material carried out after the step of second of curing process further include:
It circuits sequentially, coats (n+1)th layer of compound tree on the n-th layer composite resin material surface by n-th curing process
Rouge material, and (n+1)th curing process is carried out to (n+1)th layer of composite resin material, the compound resin layer is made, n is
Integer more than or equal to 2.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910428398.1A CN110099515B (en) | 2019-05-22 | 2019-05-22 | Method for improving PCB drilling |
| TW108131948A TWI711518B (en) | 2019-05-22 | 2019-09-04 | A method to improve PCB drilling |
| KR1020190111305A KR102183776B1 (en) | 2019-05-22 | 2019-09-09 | A improving method of PCB drilling |
| JP2019177489A JP6787608B1 (en) | 2019-05-22 | 2019-09-27 | How to improve drilling holes in PCB panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910428398.1A CN110099515B (en) | 2019-05-22 | 2019-05-22 | Method for improving PCB drilling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110099515A true CN110099515A (en) | 2019-08-06 |
| CN110099515B CN110099515B (en) | 2021-09-14 |
Family
ID=67448857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910428398.1A Active CN110099515B (en) | 2019-05-22 | 2019-05-22 | Method for improving PCB drilling |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6787608B1 (en) |
| KR (1) | KR102183776B1 (en) |
| CN (1) | CN110099515B (en) |
| TW (1) | TWI711518B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111644892A (en) * | 2020-07-08 | 2020-09-11 | 昆山广谦电子有限公司 | Method for improving metal plate processing burr |
| CN113025114A (en) * | 2020-02-18 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Drilling ink and application thereof |
| CN113402953A (en) * | 2021-07-30 | 2021-09-17 | 深圳市宏宇辉科技有限公司 | Cover plate for PCB drilling and preparation method and application thereof |
| CN113784508A (en) * | 2020-06-10 | 2021-12-10 | 南通深南电路有限公司 | Drill point selection method and PCB drilling method |
| CN114888895A (en) * | 2022-06-23 | 2022-08-12 | 中国电子科技集团公司第十四研究所 | High-quality drilling method for thermoplastic bonding sheet polytetrafluoroethylene multi-layer plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010540260A (en) * | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク． | Improved system and method for drilling holes in a printed circuit board |
| CN105505135A (en) * | 2015-12-24 | 2016-04-20 | 深圳市柳鑫实业股份有限公司 | Backing plate for drilling of PCB (printed circuit board) and preparation method of backing plate |
| CN105729557A (en) * | 2016-03-14 | 2016-07-06 | 深圳市柳鑫实业股份有限公司 | Method for improving PCB drilling burrs |
| CN106922083A (en) * | 2017-02-15 | 2017-07-04 | 深圳市柳鑫实业股份有限公司 | A kind of method of improvement PCB drillings burr |
| CN107623997A (en) * | 2017-10-18 | 2018-01-23 | 梅州市志浩电子科技有限公司 | A kind of no burr PCB processing method and PCB |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK8689A (en) * | 1988-01-11 | 1989-07-12 | Thiokol Morton Inc | PROCEDURE AND APPARATUS FOR PLACING POLYMER MATERIALS ON PRINTED CIRCUIT CARDS |
| JPH01210206A (en) * | 1988-02-16 | 1989-08-23 | San Alum Kogyo Kk | Patch for boring printed board |
| JPH05347467A (en) * | 1992-06-15 | 1993-12-27 | Showa Alum Corp | Manufacture of aluminum board for semiconductor |
| JP2828129B2 (en) * | 1993-06-07 | 1998-11-25 | 三菱瓦斯化学株式会社 | Drilling method for printed wiring boards |
| JP2003152308A (en) * | 2001-11-09 | 2003-05-23 | Nippon Synthetic Chem Ind Co Ltd:The | Method of boring printed wiring board |
| JP4644414B2 (en) * | 2003-01-28 | 2011-03-02 | 三菱瓦斯化学株式会社 | Colored drilling lubricant sheet |
| US20090258187A1 (en) * | 2008-04-10 | 2009-10-15 | Michael Donavon Brady | Protective coating for glass manufacturing and processing into articles |
| JP5347467B2 (en) | 2008-12-09 | 2013-11-20 | 住友電気工業株式会社 | Mobile communication device and communication control method |
| DE102008064166A1 (en) * | 2008-12-22 | 2010-06-24 | Schmoll Maschinen Gmbh | Automated machine tool and method for introducing reference holes in printed circuit boards |
| JP2016023204A (en) * | 2014-07-17 | 2016-02-08 | ジーティーエー エレクトロニクス カンパニー リミテッド | Photosensitive coating resin for guide sheet for boring and applications thereof |
| JP6940823B2 (en) * | 2016-05-31 | 2021-09-29 | 三菱瓦斯化学株式会社 | Entry sheet for drilling and drilling method using it |
| CN108990283A (en) * | 2018-08-03 | 2018-12-11 | 深圳市柳鑫实业股份有限公司 | A method of improving soft or hard combination pcb board difference of height drilling |
-
2019
- 2019-05-22 CN CN201910428398.1A patent/CN110099515B/en active Active
- 2019-09-04 TW TW108131948A patent/TWI711518B/en active
- 2019-09-09 KR KR1020190111305A patent/KR102183776B1/en active IP Right Grant
- 2019-09-27 JP JP2019177489A patent/JP6787608B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010540260A (en) * | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク． | Improved system and method for drilling holes in a printed circuit board |
| CN105505135A (en) * | 2015-12-24 | 2016-04-20 | 深圳市柳鑫实业股份有限公司 | Backing plate for drilling of PCB (printed circuit board) and preparation method of backing plate |
| CN105729557A (en) * | 2016-03-14 | 2016-07-06 | 深圳市柳鑫实业股份有限公司 | Method for improving PCB drilling burrs |
| CN106922083A (en) * | 2017-02-15 | 2017-07-04 | 深圳市柳鑫实业股份有限公司 | A kind of method of improvement PCB drillings burr |
| CN107623997A (en) * | 2017-10-18 | 2018-01-23 | 梅州市志浩电子科技有限公司 | A kind of no burr PCB processing method and PCB |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113025114A (en) * | 2020-02-18 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Drilling ink and application thereof |
| CN113784508A (en) * | 2020-06-10 | 2021-12-10 | 南通深南电路有限公司 | Drill point selection method and PCB drilling method |
| CN113784508B (en) * | 2020-06-10 | 2024-03-29 | 南通深南电路有限公司 | Drill point selection method and PCB drilling method |
| CN111644892A (en) * | 2020-07-08 | 2020-09-11 | 昆山广谦电子有限公司 | Method for improving metal plate processing burr |
| CN113402953A (en) * | 2021-07-30 | 2021-09-17 | 深圳市宏宇辉科技有限公司 | Cover plate for PCB drilling and preparation method and application thereof |
| CN114888895A (en) * | 2022-06-23 | 2022-08-12 | 中国电子科技集团公司第十四研究所 | High-quality drilling method for thermoplastic bonding sheet polytetrafluoroethylene multi-layer plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI711518B (en) | 2020-12-01 |
| TW202042995A (en) | 2020-12-01 |
| JP2020189394A (en) | 2020-11-26 |
| CN110099515B (en) | 2021-09-14 |
| KR102183776B1 (en) | 2020-11-27 |
| JP6787608B1 (en) | 2020-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110099515A (en) | A method of improving PCB drilling | |
| CN106455310B (en) | The manufacturing method of Copper foil with carrier, laminate, the manufacturing method of printing distributing board and e-machine | |
| CN102803576B (en) | Roughening treatment Copper Foil and manufacture method, copper clad laminate and printed circuit board (PCB) | |
| CN104125711B (en) | High-frequency circuit copper foil, copper-clad plate, printed wiring board, the copper foil with carrier, the manufacture method of electronic equipment and printed wiring board | |
| TWI287414B (en) | Printed wiring board and manufacturing method of printed wiring board | |
| CN101820728B (en) | Technological method for processing printed circuit board (PCB) with stepped groove | |
| CN100387103C (en) | Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device | |
| CN202310279U (en) | Graphical printed board at bottom of dual-step ladder groove | |
| CN101848602A (en) | Multi-layer printed board | |
| CN110281308A (en) | A kind of boring gluing aluminum-based cover plate of PCB and preparation method thereof | |
| CN102555333B (en) | Composite metallic material, its manufacture method and printed wiring board | |
| CN1984527A (en) | Ultrathin copper foil with carrier and printed circuit board | |
| CN100551211C (en) | The manufacture method of multilayer printed-wiring board and this multilayer printed-wiring board | |
| CN106358386A (en) | Manufacturing method of blind hole of backboard plugin | |
| CN103037640B (en) | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate | |
| CN103935079A (en) | Coated aluminum substrate for drilling PCB (Printed Circuit Board) and preparation method of coated aluminum substrate | |
| CN104476902A (en) | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof | |
| CN105075411A (en) | Method for manufacturing multilayer wiring substrate | |
| CN105729557B (en) | A method of improving PCB drilling burrs | |
| CN103950247A (en) | Laminated paper base plate used in drilling of PCB (Printed Circuit Board) and manufacturing method of laminated paper base plate | |
| CN102427673B (en) | Machining method of blind hole PCB (Printed Circuit Board) | |
| JP3735485B2 (en) | Copper foil with resin film, and copper foil with resin using the same | |
| CN101037780B (en) | Pre-infusion for copper plating pf steel iron member and preparation method thereof | |
| CN115339177A (en) | Base plate, cover plate and lubricating heat-dissipation adhesive | |
| CN207460601U (en) | The special overlay film aluminium flake of printed circuit board drilling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |