CN108990283A - A method of improving soft or hard combination pcb board difference of height drilling - Google Patents
A method of improving soft or hard combination pcb board difference of height drilling Download PDFInfo
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- CN108990283A CN108990283A CN201810875722.XA CN201810875722A CN108990283A CN 108990283 A CN108990283 A CN 108990283A CN 201810875722 A CN201810875722 A CN 201810875722A CN 108990283 A CN108990283 A CN 108990283A
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- pcb board
- soft
- hard combination
- ink
- combination pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finishing Walls (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention discloses a kind of method for improving soft or hard combination pcb board difference of height drilling, wherein the method includes the steps: it is filled and solidifies using recessed area of the ink to soft or hard combination pcb board bore region to be drilled；To the filling and solidify after the soft or hard combination pcb board for having ink drills, then the ink of soft or hard combination pcb board face filling is carried out moving back film process, the soft or hard combination pcb board to be drilled.The present invention coats compared to entire plate face by using the recessed area of the selective soft or hard combination pcb board bore region to be drilled of filling of ink, can preferably control cost；And it fills and the soft or hard combination pcb board after cured printing ink is after fitting cover board and backing plate, since ink is without dead angle filling and high coating hardness, the burr that soft or hard combination pcb board drilling processing generates can be effectively suppressed, to be effectively improved PCB difference of height drilling processing problem.
Description
Technical field
The present invention relates to the drilling field PCB more particularly to a kind of methods for improving soft or hard combination pcb board difference of height drilling.
Background technique
Rigid Flex is flexible circuit board and rigid circuit board by processes such as pressings, is existed by related process requirement combination
The wiring board with FPC characteristic and PCB characteristic being formed together.The Rigid Flex can be used for some productions for having particular/special requirement
In product, both there is certain flexure region, also there is certain rigid region, to interiors of products space is saved, reduced finished product body
Product, enhances product performance and is very helpful.
Rigid Flex has greatly enriched the design pattern of wiring board, it has also become one of the mainstream of PCB development.However, by
In the combination that Rigid Flex is flexible circuit board and rigid circuit board, there will necessarily be thickness differentiation in composite structure,
To cause its surface structure difference of height, easily cause some drilling processing problems, such as generate a large amount of burrs etc..At present usually
Cover board or backing plate are done using phenolic board, cover board or backing plate are applied pressure to by the pressure foot of drilling machine, are close to it with pcb board, centainly
Solve the difference of height drilling problems of soft or hard combination version in degree.But with PCB design diversification, precise treatment, functionalization hair
Exhibition, the difference of height of soft or hard combination version can be bigger, at the same drilling processing is required it is higher, phenolic board be difficult to meet bigger difference of height and
The requirement of more precision drilling processing.
Certainly, the prior art, which also has through setting gasket, fills the high low gap of plate face to reach and improve asking for drilling burr
Topic is easy to produce new difference of height but since the height of gasket is difficult to get hold of, at the same gasket there is also contraposition with connect,
Seamless filled problem, is still difficult to meet demand.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, improve soft or hard combination pcb board height the purpose of the present invention is to provide a kind of
The method of difference drilling, it is intended to solve the prior art and be also easy to produce hair when drilling to the soft or hard combination pcb board with difference of height
The problem of thorn.
Technical scheme is as follows:
A method of improving soft or hard combination pcb board difference of height drilling, wherein comprising steps of
It is filled and solidifies using recessed area of the ink to soft or hard combination pcb board bore region to be drilled；
To the filling and solidify after the soft or hard combination pcb board for having ink drills, then the soft or hard combination pcb board face is filled out
The ink filled carries out moving back film process, the soft or hard combination pcb board to be drilled.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein described to use ink to soft or hard combination
The recessed area of pcb board bore region to be drilled is filled and specifically includes the step of solidification:
Ink is filled into the recessed area of soft or hard combination pcb board bore region to be drilled by the way of silk-screen printing；
Curing process is carried out to the ink filled on soft or hard combination pcb board by the way of UV photocuring, makes soft or hard combination pcb board
Recessed area and cover board, backing plate or another soft or hard combination pcb board filled with ink after upper cured printing ink is seamless applying.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the ink wraps by weight percentage
Include the resin of 40-45%, the activated monomer of 10-15%, the initiator of 5-10%, the filler of 30-40%, 3.5-4.5% auxiliary agent and
The toner of 0.01-0.1%.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the activated monomer is acrylic acid.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the resin is polyurethane acroleic acid
Ester, aliphatic acrylate, polyether acrylate and modification acrylate it is one or more.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the pencil hardness after the ink solidification
Greater than 3B.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the metal attachment after the ink solidification
Power is greater than 2B.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the soft or hard combination pcb board face is filled out
The ink filled carries out the step of moving back film process and specifically includes:
It is taken off using high temperature washing, liquid medicine and the ink of soft or hard combination pcb board face filling is carried out by the way of removing or directly removing
Film process is moved back, the soft or hard combination pcb board to be drilled.
The method of the soft or hard combination pcb board difference of height drilling of the improvement, wherein the intensity of the UV photocuring is 600-
1200mj/cm2。
The utility model has the advantages that the method provided by the invention for improving soft or hard combination pcb board difference of height drilling, has by using ink
The recessed area of bore region to be drilled on the soft or hard combination pcb board of selective filling, coats compared to entire plate face, can preferably control cost；
And fill and the soft or hard combination pcb board after cured printing ink be after fitting cover board and backing plate, due to ink without dead angle fill with
And high coating hardness, the burr that soft or hard combination pcb board drilling processing generates can be effectively suppressed, to be effectively improved PCB difference of height
Drilling processing problem.
Detailed description of the invention
Fig. 1 is a kind of flow chart for the method preferred embodiment for improving soft or hard combination pcb board difference of height drilling of the present invention.
Specific embodiment
The present invention provides a kind of methods for improving soft or hard combination pcb board difference of height drilling, to make the purpose of the present invention, skill
Art scheme and effect are clearer, clear, and the present invention is described in more detail below.It should be appreciated that tool described herein
Body embodiment only to explain the present invention, is not intended to limit the present invention.
Soft or hard combination pcb board is flexible circuit board and rigid circuit board by processes such as pressings, by related process requirement group
It is combined the wiring board with FPC characteristic and PCB characteristic to be formed.The soft or hard combination pcb board is in combined production process
There will necessarily be thickness differentiation, to cause pcb board surface structure difference of height, this easily causes some more serious drillings
Processing problems, such as be also easy to produce burr etc..
Based on the above issues, the present invention provides a kind of method for improving soft or hard combination pcb board difference of height drilling, wherein such as
Shown in Fig. 1, comprising steps of
S100, it is filled and solidifies using recessed area of the ink to soft or hard combination pcb board bore region to be drilled；
S200, to the filling and solidify after the soft or hard combination pcb board for having ink drills, then to the soft or hard combination PCB
The ink of plate face filling carries out moving back film process, the soft or hard combination pcb board to be drilled.
Specifically, ink is filled soft or hard combination pcb board face recessed area and solidified by the present invention, makes itself and soft or hard combination PCB
The other regions of plate face flush, and reach seamless applying with lid/backing plate, fill conducive to ink and inhibit drilling processing burr, to solve
It has determined PCB difference of height drilling processing problem, ink is taken off again after hole machined to be drilled and is removed.
Further, ink is filled into soft or hard combination pcb board bore region to be drilled by the way of silk-screen printing by the present invention
Recessed area, coated compared to entire plate face, the present invention is selectively filled with soft or hard combination pcb board surface recessed area energy using ink
Preferably control cost；And by the way of screen printing ink, mainly consider that there is screen printing apparatus in each PCB factory, and
Silk-screen printing thickness range is big, precision is high, the thickness uniformity is good.
Specifically, it when the soft or hard combination pcb board upper and lower surface bore region to be drilled has recessed area, then needs simultaneously
Ink filling is carried out to the recessed area of soft or hard combination pcb board upper and lower surface bore region to be drilled, at this time then preferably in the soft or hard combination
Pcb board upper and lower surface is bonded cover board and backing plate respectively, make the soft or hard combination pcb board upper and lower surface filled with ink recessed area with
The cover board and backing plate are realized seamless applying.When the soft or hard combination pcb board bore region to be drilled only has lower surface, there are recessed areas
When, then it only needs to carry out ink filling to the lower surface recessed area of soft or hard combination pcb board bore region to be drilled, enables filled recessed area
Enough five points are realized with backing plate to be bonded.
Preferably, the ink of soft or hard combination pcb board bore region recessed area to be drilled filling is carried out by the way of UV photocuring
Curing process, soft or hard combination pcb board upper surface and lower surface after hardening are bonded cover board and backing plate respectively.The present invention is preferred
The curing mode of UV photocuring mainly considers that it is environmentally friendly, efficient, easy to operate.
Further, during using UV light-curable ink, the intensity of the UV photocuring is preferably 600-
1200mj/cm2。
Preferably, in the present invention, the ink includes the activity of the resin of 40-45%, 10-15% by weight percentage
Monomer, the initiator of 5-10%, the filler of 30-40%, the auxiliary agent of 3.5-4.5% and 0.01-0.1% toner.
Wherein, the resin is urethane acrylate, aliphatic acrylate, polyether acrylate and modified acroleic acid
Ester it is one or more, but not limited to this.
The activated monomer is preferably acrylic acid.
The initiator is 2,4,6- trimethylbenzoy-dipheny phosphine oxide (photoinitiator TPO) or 1- hydroxyl ring
Hexyl phenyl ketone (photoinitiator 184), the photoinitiator TPO are a kind of efficient curing agent, it can be used for causing
The basic photopolymer of unsaturated-resin；The photoinitiator 184 has very high space charge force, excellent thermal stability
And xanthochromia is not generated, it is one of domestic most common photoinitiator, maximum absorption wavelength 333nm is mainly used for causing propylene
The rapid curing of the systems such as acid esters and methacrylate.
The filler is preferably talcum powder or gas silicon, wherein and the talcum powder is magnesium silicate mineral talc talc,
Main component is hydrous magnesium silicate, and after crushed, with HCl treatment, washing, drying is formed；The gas silicon is gas phase titanium dioxide
Silicon is applied to polymer, polymer composites and engineering plastics mainly as auxiliary agent, provides rheology control, thixotropic effects,
Resist blocking and that, anti-settling, the filler as powdery polymer and resin.
The auxiliary agent is preferably organosilicon, for example, polysiloxanes.
The toner is a kind of coloured powdered rubber, after being mixed with plastic pigment, it is heated injection molding be made it is various not
With the plastic cement products of color, it is widely used in plastic cement coloring process, generally there is blue, orange, green, black, yellow, red
The multiple colors such as color, purple and pearly-lustre color.The preferably blue toner of the present invention.
As a wherein embodiment, by weight percentage by ink, by 42% resin, 13% activated monomer, 6%
Initiator, 35% filler, 3.95% auxiliary agent and 0.05% toner carry out mixing dispersion stirring 2h, be tuned into 12000 ±
The glue viscosity of 3000CPS fills recessed area and UV light is solid using the pcb board face of the screen painting difference difference of height of different meshes
Change, lid/backing plate of then arranging in pairs or groups carries out drilling processing test, detects burr, finally moves back film process.
Preferably, in the present invention, the pencil hardness after the ink solidification is greater than 3B, because if ink hardness is too low
(being lower than 3B), then ink is difficult to achieve the effect that inhibit drilling processing burr.
Preferably, the metal adhesion after the ink solidification is greater than 2B, because if metal adhesion is too weak (being lower than 2B),
It then will affect drilling processing burr inhibitory effect and cause plate when processing mobile to influence installation effect.
Further, in the step S200, after drilling to the soft or hard combination pcb board of the filling ink, then
The ink of soft or hard combination pcb board face filling is carried out moving back film process, the soft or hard combination pcb board to be drilled, wherein this hair
Bright taken off using high temperature washing, liquid medicine moves back the ink of soft or hard combination pcb board face filling by the way of removing or directly removing
Film process, the soft or hard combination pcb board to be drilled.
Present invention preferably employs 50 DEG C of concentration be 3% NaOH solution move back wash processing 30-200s, make filling ink
It is removed efficiently.
Below by the specific embodiment method for improving the drilling of soft or hard combination pcb board difference of height a kind of to the present invention do into
Illustrate to one step:
Embodiment 1
By urethane acrylate, acrylic monomers, photoinitiator TPO, talcum powder, polysiloxanes and blue toner according to weight
Percentage is that the ratio of 42:13:6:35:3.95:0.05 carries out mixing 2h, is tuned into the gelatin viscosity of 12000CPS, uses
The pcb board face of the screen painting difference difference of height of different meshes, filling pcb board face recessed area and UV photocuring, the UV photocuring
Intensity be 900mj/cm2, lid of then arranging in pairs or groups/backing plate progress drilling processing test, the results are shown in Table 1 for detection burr, finally
Move back film process.
1 embodiment of table, 1 burr testing result:
It can see from above-mentioned experimental result, the prepared UV light-curable ink of embodiment 1, suitable screen painting selected to fill
Pcb board face difference of height has excellent drilling processing performance after solidification, can effectively inhibit machined burrs, and processing retreats film speed
Fastly and without residue glue.
Embodiment 2
By aliphatic acrylate, acrylic monomers, photoinitiator 184, gas silicon, polysiloxanes and blue toner according to weight hundred
Divide than being that the ratio of 40:15:10:31:3.9:0.1 carries out mixing 2h, is tuned into the gelatin viscosity of 14000CPS, uses difference
The pcb board face of the screen painting difference difference of height of mesh number, filling pcb board face recessed area and UV photocuring, the UV photocuring it is strong
Degree is 800mj/cm2, lid of then arranging in pairs or groups/backing plate progress drilling processing test, the results are shown in Table 2 for detection burr, finally moves back
Film process.
2 embodiment of table, 2 burr testing result:
It can see from above-mentioned experimental result, the prepared UV light-curable ink of embodiment 2, suitable screen painting selected to fill
Pcb board face difference of height has excellent drilling processing performance after solidification, can effectively inhibit machined burrs, and processing retreats film speed
Fastly and without residue glue.
Embodiment 3
By polyether acrylate, acrylic monomers, photoinitiator TPO, talcum powder, polysiloxanes and blue toner according to weight hundred
Divide than being that the ratio of 45:10:5:35.5:4.45:0.05 carries out mixing 2h, is tuned into the gelatin viscosity of 10000CPS, uses
The pcb board face of the screen painting difference difference of height of different meshes, filling pcb board face recessed area and UV photocuring, the UV photocuring
Intensity be 1000mj/cm2, lid of then arranging in pairs or groups/backing plate progress drilling processing test, the results are shown in Table 2 for detection burr, finally
Move back film process.
3 embodiment of table, 3 burr testing result:
It can see from above-mentioned experimental result, the prepared UV light-curable ink of embodiment 2, suitable screen painting selected to fill
Pcb board face difference of height has excellent drilling processing performance after solidification, can effectively inhibit machined burrs, and processing retreats film speed
Fastly and without residue glue.
In conclusion the method provided by the invention for improving soft or hard combination pcb board difference of height drilling, has by using ink
The recessed area of the soft or hard combination pcb board bore region to be drilled of selective filling coats compared to entire plate face, can preferably control cost；And
And the soft or hard combination pcb board after filling and cured printing ink is after fitting cover board and backing plate, due to ink without dead angle filling and
The burr that soft or hard combination pcb board drilling processing generates can be effectively suppressed in high coating hardness, to be effectively improved PCB difference of height brill
Hole machined problem.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (9)
1. a kind of method for improving soft or hard combination pcb board difference of height drilling, which is characterized in that comprising steps of
It is filled and solidifies using recessed area of the ink to soft or hard combination pcb board bore region to be drilled；
To the filling and solidify after the soft or hard combination pcb board for having ink drills, then the soft or hard combination pcb board face is filled out
The ink filled carries out moving back film process, the soft or hard combination pcb board to be drilled.
2. the method according to claim 1 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that described to adopt
The step of being filled and solidified with recessed area of the ink to soft or hard combination pcb board bore region to be drilled specifically includes:
Ink is filled into the recessed area of soft or hard combination pcb board bore region to be drilled by the way of silk-screen printing；
Curing process is carried out to the ink filled on soft or hard combination pcb board by the way of UV photocuring, makes soft or hard combination pcb board
Recessed area and cover board, backing plate or another soft or hard combination pcb board filled with ink after upper cured printing ink is seamless applying.
3. the method according to claim 1 or 2 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that described
Ink includes that the resin of 40-45%, the activated monomer of 10-15%, the initiator of 5-10%, 30-40% are filled out by weight percentage
The toner of material, the auxiliary agent of 3.5-4.5% and 0.01-0.1%.
4. the method according to claim 3 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that the work
Property monomer be acrylic acid.
5. the method according to claim 3 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that the tree
Rouge is the one or more of urethane acrylate, aliphatic acrylate, polyether acrylate and modification acrylate.
6. the method according to claim 3 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that the oil
Pencil hardness after ink solidifies is greater than 3B.
7. the method according to claim 3 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that the oil
Metal adhesion after ink solidifies is greater than 2B.
8. the method according to claim 1 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that described
The ink of soft or hard combination pcb board face filling specifically include the step of moving back film process:
It is taken off using high temperature washing, liquid medicine and the ink of soft or hard combination pcb board face filling is carried out by the way of removing or directly removing
Film process is moved back, the soft or hard combination pcb board to be drilled.
9. the method according to claim 2 for improving soft or hard combination pcb board difference of height drilling, which is characterized in that the UV
The intensity of photocuring is 600-1200mj/cm2。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810875722.XA CN108990283A (en) | 2018-08-03 | 2018-08-03 | A method of improving soft or hard combination pcb board difference of height drilling |
| PCT/CN2019/098376 WO2020024937A1 (en) | 2018-08-03 | 2019-07-30 | Method for improving height-differential drilling of rigid-flex pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810875722.XA CN108990283A (en) | 2018-08-03 | 2018-08-03 | A method of improving soft or hard combination pcb board difference of height drilling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108990283A true CN108990283A (en) | 2018-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810875722.XA Pending CN108990283A (en) | 2018-08-03 | 2018-08-03 | A method of improving soft or hard combination pcb board difference of height drilling |
Country Status (2)
| Country | Link |
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| CN (1) | CN108990283A (en) |
| WO (1) | WO2020024937A1 (en) |
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| CN109760133A (en) * | 2019-01-29 | 2019-05-17 | 深圳市柳鑫实业股份有限公司 | A kind of cover board and the preparation method and application thereof |
| WO2020024937A1 (en) * | 2018-08-03 | 2020-02-06 | 深圳市柳鑫实业股份有限公司 | Method for improving height-differential drilling of rigid-flex pcb |
| TWI711518B (en) * | 2019-05-22 | 2020-12-01 | 大陸商深圳市柳鑫實業股份有限公司 | A method to improve PCB drilling |
| CN112074084A (en) * | 2020-08-06 | 2020-12-11 | 恒赫鼎富(苏州)电子有限公司 | Method for avoiding drilling abnormity of rigid-flex board |
| CN112752407A (en) * | 2020-11-30 | 2021-05-04 | 黄石西普电子科技有限公司 | Drilling process and production method of high-low difference rigid-flex board |
| CN113939088A (en) * | 2021-09-30 | 2022-01-14 | 福莱盈电子股份有限公司 | Method for improving burr of back knife face of soft and hard combined plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020024937A1 (en) * | 2018-08-03 | 2020-02-06 | 深圳市柳鑫实业股份有限公司 | Method for improving height-differential drilling of rigid-flex pcb |
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| CN112074084A (en) * | 2020-08-06 | 2020-12-11 | 恒赫鼎富(苏州)电子有限公司 | Method for avoiding drilling abnormity of rigid-flex board |
| CN112752407A (en) * | 2020-11-30 | 2021-05-04 | 黄石西普电子科技有限公司 | Drilling process and production method of high-low difference rigid-flex board |
| CN113939088A (en) * | 2021-09-30 | 2022-01-14 | 福莱盈电子股份有限公司 | Method for improving burr of back knife face of soft and hard combined plate |
| CN113939088B (en) * | 2021-09-30 | 2023-01-03 | 福莱盈电子股份有限公司 | Method for improving burr of back knife face of soft and hard combined plate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020024937A1 (en) | 2020-02-06 |
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Application publication date: 20181211 |