CN118102598A - Leveling compensation method for PCB drilling - Google Patents
Leveling compensation method for PCB drilling Download PDFInfo
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- CN118102598A CN118102598A CN202410465986.3A CN202410465986A CN118102598A CN 118102598 A CN118102598 A CN 118102598A CN 202410465986 A CN202410465986 A CN 202410465986A CN 118102598 A CN118102598 A CN 118102598A
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- 238000005553 drilling Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims abstract description 37
- 238000007650 screen-printing Methods 0.000 claims abstract description 27
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims abstract description 20
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000007639 printing Methods 0.000 claims abstract description 19
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 17
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- 239000005711 Benzoic acid Substances 0.000 claims abstract description 9
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- 239000008399 tap water Substances 0.000 claims description 8
- 235000020679 tap water Nutrition 0.000 claims description 8
- 238000002791 soaking Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical group OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 claims description 3
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
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Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention relates to the technical field of PCB manufacturing, in particular to a leveling compensation method for PCB drilling. The method comprises the following steps: step one, performing silk-screen printing operation on a PCB surface; printing a UV ink coating on the drilling surface of the drilling tool of the PCB, and standing to enable the UV ink to supplement the appearance of the PCB; step three, UV is adopted to irradiate the UV ink coating, so that the UV ink coating is solidified; step four, placing a backing plate on the UV ink coating for drilling; step five, performing film stripping treatment on the UV ink coating to finish PCB drilling; wherein, the UV ink coating comprises the following raw materials in percentage by weight: 80-90% of benzoic acid unsaturated low molecular resin, 5-15% of epoxy silicone monomer, 0.1-1% of benzoin dimethyl ether, 1-3% of hydroquinone, 1-2% of polyurethane leveling agent, 0.5-2% of defoaming agent, 0.5-2% of dispersing agent and 0.5-2% of wax.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a leveling compensation method for PCB drilling.
Background
Along with the high-speed development of the PCB technology, the complex PCB appearance structure has height difference and board warpage, so that the drilling knife face cannot be tightly attached to the backing plate, and a large number of drilling burrs are generated. However, the existing pad is a flat board, and the pad cannot better compensate the height difference of the appearance of the PCB. At present, 8 people are evenly arranged for burr and burr repair every day in order to prevent the customer from kneeling on the upper part of the drill; therefore, certain repair is scrapped, the labor cost and the material cost are lost, and meanwhile, the delivery is delayed.
Disclosure of Invention
The invention aims to avoid the defects in the prior art and provide a leveling compensation method for PCB drilling.
In order to achieve the above purpose, the present invention provides the following technical solutions:
The leveling compensation method for the PCB drilling comprises the following steps:
step one, performing silk-screen printing operation on a PCB surface;
printing a UV ink coating on the drilling surface of the drilling tool of the PCB, and standing to enable the UV ink to supplement the appearance of the PCB;
Step three, irradiating the UV ink coating by adopting UV to cure the UV ink coating;
Fourthly, placing a backing plate on the UV ink coating for drilling;
Step five, removing the backing plate, and performing film stripping treatment on the UV ink coating to finish PCB drilling;
Wherein, the UV ink coating comprises the following raw materials in percentage by weight:
80-90% of benzoic acid unsaturated low molecular resin
5% -15% Of epoxy silicone monomer
Benzoin dimethyl ether 0.1-1%
Hydroquinone 1% -3%
1% -2% Of polyurethane leveling agent
0.5 To 2 percent of defoaming agent
0.5 To 2 percent of dispersing agent
Wax 0.5% -2%.
In some embodiments, the defoamer is a silicone defoamer (dimethicone, ethylene glycol silicone, fatty alcohol polyethoxy silicone condensate), a polyether defoamer, a mineral oil defoamer, or a complex defoamer.
In some embodiments, the dispersant is vinyl alcohol, polyethylenimine, or sodium polyacrylate.
In some embodiments, the silk screening operation comprises the steps of:
Judging the thickness of the PCB, when the thickness of the PCB is not less than 4mm, checking whether the surface of the PCB is oxidized or has sundries, if so, performing microetching treatment, and then performing first silk screen printing;
and (3) checking the PCB surface after the first silk screen printing, standing for treatment if bubbles exist, and then carrying out UV irradiation on the PCB surface.
In some embodiments, the screen used in the first silk screen printing is 18T, and the stamp-pad ink thickness is 160-200 μm.
In some embodiments, the step of printing the UV ink coating comprises:
Regulating ink: uniformly mixing a formula amount of benzoic acid unsaturated low molecular resin, an epoxy silicone monomer, benzoin dimethyl ether, hydroquinone, a polyurethane leveling agent, a defoaming agent, a dispersing agent and wax to obtain UV (ultraviolet) ink;
Printing: and printing the UV ink on the PCB surface after the first silk screen printing in a second silk screen printing mode, checking the PCB surface, if bubbles exist, carrying out standing treatment, and then carrying out UV irradiation to finish printing of the UV ink coating, thereby obtaining the UV ink film.
In some embodiments, the UV ink has a thickness of 180 μm to 200 μm.
In some embodiments, the UV has a power of 1000W or more and a UV speed of 2.5m/min or less.
In some embodiments, the step of stripping comprises: and soaking the PCB by using tap water, wherein the water temperature of the tap water is 40-50 ℃ and the soaking time is 20-30 min.
In some embodiments, the resting time is 20-30 min.
The leveling compensation method for the PCB drilling has the beneficial effects that:
According to the leveling compensation method for the PCB drilling, before the PCB is drilled, the UV ink is covered on the silk-screened plate surface of the PCB, the whole PCB is filled with the UV ink by utilizing the flowability of the UV ink, so that the PCB surface is leveled, then the UV ink is cured under UV irradiation to generate a cured film, the whole PCB is tightly attached and connected with the backing plate by means of the cured film, the problem of burrs generated when a drilling tool is used for cutting out is avoided, and the production quality of the PCB is effectively improved.
According to the leveling compensation method for the PCB drilling, UV ink is used for manufacturing a coating, raw materials in the UV ink comprise benzoic acid unsaturated low-molecular resin, epoxy silicone monomer, benzoin dimethyl ether, hydroquinone, polyurethane leveling agent, defoamer, dispersing agent and wax, the benzoic acid unsaturated low-molecular resin is used as a prepolymer, the epoxy silicone monomer is used as an active diluent, benzoin dimethyl ether is used as a photoinitiator, hydroquinone is used as a stabilizer, and the polyurethane leveling agent is used as a leveling agent, so that the UV ink has the flow property to compensate the appearance and the warping of the PCB, the whole surface is flat, the UV ink can be cured to form a stable cured film, the bonding problem with a base plate can not occur, and meanwhile, the cured film can avoid burr. In addition, the UV ink is irradiated and cured by UV, the UV irradiation does not damage the front silk-screen pattern, and the UV ink can be effectively promoted to be cured. In addition, the UV ink raw material can be used for film stripping, and cannot remain on the PCB, so that the quality of the PCB is prevented from being influenced.
Drawings
Fig. 1 is a flow chart of a leveling compensation method for PCB drilling according to an embodiment of the present invention.
FIG. 2 is a diagram of the flash problem of the comparative example.
Fig. 3 is a diagram of test data of a test example of HE20Y 89082.
FIG. 4 is a graph of test data for a test example bore diameter 0.25mm for material MT20N20RABA 2D.
FIG. 5 is a graph of test data for a test example bore with a 0.35mm diameter for MT20N20RABA 2D.
FIG. 6 is a graph of test data for a test example bore diameter 0.4mm for material number MT20N20RABA 2D.
Detailed Description
Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The embodiment discloses a leveling compensation method for PCB drilling, as shown in FIG. 1, comprising the following steps:
step one, performing silk-screen printing operation on a PCB surface;
The step is a normal silk screen operation, which comprises the following steps:
judging the thickness of the PCB, checking whether the PCB surface is oxidized or has sundries when the thickness of the PCB is not less than 4mm or the PCB is in a burr blacklist material number, if so, carrying out microetching treatment, and then carrying out first silk screen printing;
when the PCB board thickness is great or when burr blacklist material number, produce easily and bear pollutant or other unnecessary impurity, influence the quality of follow-up PCB board, consequently need ensure that PCB board thickness is not less than 4mm, simultaneously, need clean PCB board face, get rid of oxidation material and impurity with the mode of microetching.
And (3) checking the PCB surface after the first silk screen printing, standing for treatment if bubbles exist, and then carrying out UV irradiation on the PCB surface.
The PCB surface after silk screen printing has silk screen printing ink, so that the PCB is firstly subjected to standing treatment, partial printing ink is removed, and the silk screen printing ink is cured in a UV irradiation mode.
In this embodiment, the screen used for the first screen printing is 18T, and the ink thickness is 160 μm to 200 μm, preferably 180 μm.
Printing a UV ink coating on the drilling surface of the drilling tool of the PCB, and standing to enable the UV ink to supplement the appearance of the PCB;
firstly, silk screen printing is carried out, then a UV ink coating is printed on the PCB surface, and the UV ink can flow through standing time, so that the UV ink supplements the PCB surface.
Step three, irradiating the UV ink coating by adopting UV to cure the UV ink coating;
Through the UV irradiation mode, the UV ink layer is solidified, and the smooth ink surface can be solidified stably.
Fourthly, placing a backing plate on the UV ink coating for drilling;
Step five, removing the backing plate, and performing film stripping treatment on the UV ink coating to finish PCB drilling;
After drilling, the backing plate can be removed, the UV ink coating is subjected to film stripping treatment, and the influence of the UV ink on the performance of the PCB is avoided.
Wherein, the UV ink coating comprises the following raw materials in percentage by weight:
80% -90%, preferably 85%, 10% of epoxy silicone monomer, preferably 10%, 0.5% of benzoin dimethyl ether, preferably 0.5%, 2% of hydroquinone, preferably 2%, 1.5% of polyurethane leveling agent, preferably 1.5%, 1% of defoamer, preferably 1%, 1% of dispersant, preferably 1%, 1% of wax, preferably 1%
The film removing step comprises the following steps: and (3) soaking the PCB by using tap water, wherein the water temperature of the tap water is 40-50 ℃, preferably 45 ℃, and the soaking time is 20-30 min, preferably 25min.
Because the UV ink coating adopts the raw materials, when the film is removed, the actinically cured film layer can be dissolved and removed only by using low-temperature tap water, so that the film is convenient to remove, the performance of a PCB (printed circuit board) is not affected, the operation is convenient, and the film is suitable for mass production and application.
In this embodiment, the defoaming agent is a silicone defoaming agent, for example: dimethicone, ethylene glycol silicone, fatty alcohol polyethoxy silicone condensate; polyether defoamers, for example: GP-type defoamer, polypropylene glycol, GPE-type polyoxyethylene; mineral oil defoamers and complex defoamers. In practical applications, other defoamers are also possible.
In this embodiment, the dispersing agent is vinyl alcohol, polyethylenimine, or sodium polyacrylate. In practical applications, other dispersants are also possible.
In this embodiment, the step of printing the UV ink coating includes:
Regulating ink: uniformly mixing a formula amount of benzoic acid unsaturated low molecular resin, an epoxy silicone monomer, benzoin dimethyl ether, hydroquinone, a polyurethane leveling agent, a defoaming agent, a dispersing agent and wax to obtain UV (ultraviolet) ink;
specifically, the benzoic acid unsaturated low molecular resin, the epoxy silicone monomer, the benzoin dimethyl ether, the hydroquinone, the polyurethane leveling agent, the defoamer, the dispersant and the wax are put into a mixer to be mixed until no particles appear.
Printing: and printing the UV ink on the PCB surface after the first silk screen printing in a second silk screen printing mode, checking the PCB surface, if bubbles exist, carrying out standing treatment, and then carrying out UV irradiation to finish printing of the UV ink coating, thereby obtaining the UV ink film.
Specifically, when printing the UV ink layer, print the UV ink layer with the mode of silk screen printing equally, it is more convenient like this, can involve the action of scraper blade with the silk screen printing in-process, the uneven face of PCB board can be complemented to the UV ink of being convenient for.
In this embodiment, the thickness of the UV ink is 180 μm to 200 μm, preferably 190 μm.
In this embodiment, the UV power is equal to or greater than 1000W and the UV speed is equal to or less than 2.5m/min, preferably, the UV power is 1200W and the UV speed is 2 m/min.
In this embodiment, the standing time is 20 to 30min, preferably 25min.
Test effect
To further illustrate the effects of the leveling compensation method for PCB drilling of the present invention, the following test and comparative examples were conducted,
Test example:
The drilling operation is carried out according to the embodiment by selecting the material numbers HE20Y89082 and MT20N20RABA2D, the specific test conditions are shown in the table 1, the flow is shown in the table 2, the detection items are shown in the table 3, the detection structure is shown in the table 4, and the specific material steps comprise:
The method comprises the steps of first silk-screen printing-printing a UV ink coating, UV curing, drilling, slice detection, film removing, plate surface inspection, deburring, hole inspection, photoresist removing, electroplating, hole inspection and slice detection
Note that: operation requirements of each key post
A. Screen printing requires: the thickness of the screen 18T stamp-pad ink is 160-200 mu m
B. UV requirements: the power is more than or equal to 1000W, and the speed is less than or equal to 2.5m/min
C. drilling requirements: the used backing plate is used to suspend the cutter outlet surface
D. UV ink coating thickness requirement: 160 μm thickness
E. film stripping requirements are as follows: tap water, water temperature 50 ℃, soaking for 25min
F. deburring requirements: and (3) avoiding abrasive belt grinding, wherein the rest sections are operated according to SOP, after film stripping, the deburring line grinding is required to cancel abrasive belt grinding, and only nylon brushes are used for grinding according to SOP parameters, so that new burrs are prevented from being generated by abrasive belt extrusion.
TABLE 1
TABLE 2
TABLE 3 Table 3
TABLE 4 Table 4
Pore size contrast data:
TABLE 5
Comparative example:
The materials HE20Y89082 and MT20N20RABA2D were selected to carry out conventional drilling without using a UV ink layer, the test conditions are shown in Table 1, the obtained flash problem is shown in FIG. 2, and the drilling flow is as follows: the method comprises the steps of first silk screen printing, drilling, slicing and detecting burrs, film removing, plate surface inspection, deburring, hole checking, photoresist removing, electroplating, hole checking and slicing and detecting.
As can be seen from comparison of the comparative example and the test example, the quality of each test is qualified when the PCB is drilled by coating UV ink on the knife-out surface of the PCB due to defects in design (serious sinking of the hole site of the board caused by copper drawing in the inner layer) and uneven board surface of the thick board.
A. The length of the burr is less than or equal to 12 mu m (a common backing plate is used, the length of the burr is more than 33 mu m), and the length of the burr is reduced by 64%;
b. The drilled backing plate is used, the cutter surface is free of hole deformation, hole explosion and hole blocking;
7.1.2, detection after electroplating:
a. 100% of holes are inspected and burrs are screened after electroplating, the yield is 100%, and no burrs exist;
b. The pore diameters of all the pressing parts are measured completely, the yield is 100%, and no pore diameter abnormality exists
C. and (3) carrying out in-plate slicing on each diameter drill bit, wherein Kong Cu and the nail head are qualified, and no ICD abnormality exists.
While the drilling effect of the comparative example resulted in more burrs.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A leveling compensation method for PCB drilling is characterized by comprising the following steps:
step one, performing silk-screen printing operation on a PCB surface;
printing a UV ink coating on the drilling surface of the drilling tool of the PCB, and standing to enable the UV ink to supplement the appearance of the PCB;
Step three, irradiating the UV ink coating by adopting UV to cure the UV ink coating;
Fourthly, placing a backing plate on the UV ink coating for drilling;
Step five, removing the backing plate, and performing film stripping treatment on the UV ink coating to finish PCB drilling;
Wherein, the UV ink coating comprises the following raw materials in percentage by weight:
80-90% of benzoic acid unsaturated low molecular resin
5% -15% Of epoxy silicone monomer
Benzoin dimethyl ether 0.1-1%
Hydroquinone 1% -3%
1% -2% Of polyurethane leveling agent
0.5 To 2 percent of defoaming agent
0.5 To 2 percent of dispersing agent
Wax 0.5% -2%.
2. The leveling compensation method for PCB drilling according to claim 1, wherein the defoaming agent is a silicone defoaming agent, a polyether defoaming agent, a mineral oil defoaming agent, or a composite defoaming agent.
3. The leveling compensation method for PCB drilling according to claim 1, wherein the dispersant is vinyl alcohol, polyethylenimine or sodium polyacrylate.
4. The method of leveling compensation for PCB drilling of claim 1, wherein the silk screening operation comprises the steps of:
Judging the thickness of the PCB, when the thickness of the PCB is not less than 4mm, checking whether the surface of the PCB is oxidized or has sundries, if so, performing microetching treatment, and then performing first silk screen printing;
and (3) checking the PCB surface after the first silk screen printing, standing for treatment if bubbles exist, and then carrying out UV irradiation on the PCB surface.
5. The leveling compensation method for PCB drilling according to claim 4, wherein the screen used in the first silk screen printing is 18T, and the thickness of the stamp-pad ink is 160-200 μm.
6. The method of leveling compensation for a PCB borehole of claim 4, wherein the step of printing a UV ink coating comprises:
Regulating ink: uniformly mixing a formula amount of benzoic acid unsaturated low molecular resin, an epoxy silicone monomer, benzoin dimethyl ether, hydroquinone, a polyurethane leveling agent, a defoaming agent, a dispersing agent and wax to obtain UV (ultraviolet) ink;
Printing: and printing the UV ink on the PCB surface after the first silk screen printing in a second silk screen printing mode, checking the PCB surface, if bubbles exist, carrying out standing treatment, and then carrying out UV irradiation to finish printing of the UV ink coating, thereby obtaining the UV ink film.
7. The leveling compensation method for PCB drilling of claim 6, wherein the thickness of the UV ink is 180 μm to 200 μm.
8. The leveling compensation method for PCB drilling according to claim 4 or 6, wherein the power of the UV is more than or equal to 1000W and the UV speed is less than or equal to 2.5m/min.
9. The method of leveling compensation for PCB drilling of claim 1, wherein the film stripping step comprises: and soaking the PCB by using tap water, wherein the water temperature of the tap water is 40-50 ℃ and the soaking time is 20-30 min.
10. The leveling compensation method for PCB drilling according to claim 4 or 6, wherein the standing time is 20-30 min.
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| CN202410465986.3A CN118102598A (en) | 2024-04-18 | 2024-04-18 | Leveling compensation method for PCB drilling |
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| CN202410465986.3A CN118102598A (en) | 2024-04-18 | 2024-04-18 | Leveling compensation method for PCB drilling |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990283A (en) * | 2018-08-03 | 2018-12-11 | 深圳市柳鑫实业股份有限公司 | A method of improving soft or hard combination pcb board difference of height drilling |
| CN113025114A (en) * | 2020-02-18 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Drilling ink and application thereof |
| CN113923869A (en) * | 2021-09-09 | 2022-01-11 | 深圳市百柔新材料技术有限公司 | Drilling method of circuit board |
-
2024
- 2024-04-18 CN CN202410465986.3A patent/CN118102598A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990283A (en) * | 2018-08-03 | 2018-12-11 | 深圳市柳鑫实业股份有限公司 | A method of improving soft or hard combination pcb board difference of height drilling |
| CN113025114A (en) * | 2020-02-18 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Drilling ink and application thereof |
| CN113923869A (en) * | 2021-09-09 | 2022-01-11 | 深圳市百柔新材料技术有限公司 | Drilling method of circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 高阳: "不饱和聚酯树脂混凝土设计、性能及动力学研究", 中国博士学位论文电子期刊网 工程科技Ⅱ辑, no. 6, 15 June 2021 (2021-06-15), pages 13 * |
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