CN201586769U - Upper cover plate used in hole-drilling process of printed circuit board - Google Patents
Upper cover plate used in hole-drilling process of printed circuit board Download PDFInfo
- Publication number
- CN201586769U CN201586769U CN2009202601318U CN200920260131U CN201586769U CN 201586769 U CN201586769 U CN 201586769U CN 2009202601318 U CN2009202601318 U CN 2009202601318U CN 200920260131 U CN200920260131 U CN 200920260131U CN 201586769 U CN201586769 U CN 201586769U
- Authority
- CN
- China
- Prior art keywords
- hole
- upper cover
- cover plate
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The utility model discloses an upper cover plate used in the hole-drilling process of a printed circuit board (PCB), which is applied to assist a drilling bit to drill a small hole on the printed circuit board. The upper cover plate comprises a buffer layer and a rigid layer, wherein the buffer layer is configured to be a first aluminium plate in the annealed condition and used for buffering the impact force of the drilling bit during the hole-drilling process; and the rigid layer is configured to be a second aluminium plate in the work-hardened condition and used for reducing the formation of burrs in the position of the hole of the printed circuit board during the hole-drilling process. By adopting the double-layer laminated plate structure based on the soft-hard combination of the buffer layer and the rigid layer, the upper cover plate integrates both the excellent buffing and heat-transfer performances of the aluminium plate in the annealed condition to minimize the formation of the deviated hole and the characteristics of better stiffness of the aluminium plate in the work-hardened condition to ensure the tight binding between the outer surface of the rigid layer and the upper surface of the printed circuit board, reduces the probability of forming the burrs in the position of the hole of the PCB, improves the hole-drilling quality, and meets the hole-drilling requirements for high-precision PCB.
Description
Technical field
The utility model relates to the subsidiary products field of using in the printed wiring board boring procedure, and in particular, what improvement related to is a kind of upper cover plate that uses in the printed wiring board boring procedure.
Background technology
Develop rapidly along with the world technology level, communications industry, aircraft industry, high-tech areas such as shipbuilding technology are increasing to the use amount of PCB (Printed Circuit Board) printed wiring board, instructions for use is also more and more higher, some HDI (High Density Interlinkage) high density interconnect plate particularly, multi-layer sheet and super multi-layer sheet, because its cost is very high, the for example American-European superelevation layer pcb board of producing can be sold for hundreds of thousands yuan, that have even can reach one of RMB up to a million, so when these sheet materials of processing, almost be not allow to occur any mistake.
But, from the present PCB industry normally used upper cover plate of holing, be broadly divided into two kinds of phenolic aldehyde cold punching plate and single layer aluminium sheets, as shown in Figure 1, no matter be to use that a kind of sheet material, be lamina 101, its punching broken needle rate is 0.06%, drilling precision CPK (processing procedure ability)≤1.3 obviously can't satisfy the boring requirement of high accuracy pcb board.
Therefore, prior art still haves much room for improvement and develops.
The utility model content
The purpose of this utility model is, is to provide a kind of upper cover plate that uses in the printed wiring board boring procedure, can improve the borehole accuracy of pcb board, reduces the generation in inclined to one side hole, can satisfy the boring requirement of high accuracy pcb board.
The technical solution of the utility model is as follows:
A kind of upper cover plate that uses in the printed wiring board boring procedure is used for auxiliary drill bit and gets out aperture on printed wiring board, and wherein, described upper cover plate comprises a cushion and a rigid layer, and fitting side by side is provided with; Described cushion is set to first aluminium sheet under the annealed condition, is used for slowing down impulsive force from described drill bit at boring procedure; Described rigid layer is set to second aluminium sheet under the work-hardened condition, is used for reducing boring procedure and produces burr at the place, aperture of described printed wiring board.
Described upper cover plate, wherein, described first aluminium sheet is set to the aluminium foil of state under the O attitude.
Described upper cover plate, wherein, described second aluminium sheet is set to the aluminium foil of state under H18.
Described upper cover plate, wherein, described first aluminium sheet and described second aluminium sheet are bonding by adhesive, and described adhesive is water-soluble or thermosetting resin adhesive.
A kind of upper cover plate that in the printed wiring board boring procedure, uses provided by the utility model, because the composite plate that has adopted cushion and rigid layer to combine, annealed condition lower aluminum sheet excellent in cushioning properties energy and heat conductivility had both been utilized, absorbed the impulsive force that produces when drill bit runs up, improve borehole accuracy, reduced the generation in inclined to one side hole to greatest extent; Utilized the work-hardened condition lower aluminum sheet to have the characteristics of rigidity preferably or deflection again, make the outer surface of rigid layer and the upper epidermis of printed substrate tightly fit, reduced the possibility that produces burr at place, pcb board aperture, improve the quality of boring, satisfied the boring requirement of high accuracy pcb board.
Description of drawings
Fig. 1 is a upper cover plate perspective view of the prior art;
Fig. 2 is the upper cover plate perspective view in the utility model;
Fig. 3 a is for using the hole position precision statistics figure of upper cover plate of the prior art after first time testing bore holes;
Fig. 3 b is for using the hole position precision statistics figure of upper cover plate after first time testing bore holes in the utility model;
Fig. 4 a is for using the hole position precision statistics figure of upper cover plate of the prior art after second time testing bore holes;
Fig. 4 b is for using the hole position precision statistics figure of upper cover plate after second time testing bore holes in the utility model.
The specific embodiment
Below with reference to accompanying drawing, the device specific embodiment of the present utility model and embodiment are described in detail.
A kind of upper cover plate that in the printed wiring board boring procedure, uses of the present utility model, be arranged on the printed wiring board surface, be used for secondary process and go out aperture on the printed wiring board, one of its specific embodiment, as shown in Figure 2, described upper cover plate comprises fit side by side and be provided with two-layer up and down, the upper strata is a cushion, can adopt first aluminium sheet under the annealed condition, the aluminium foil of state under the O attitude for example is used for absorbing or slowing down impulsive force from drill bit at boring procedure; Lower floor is a rigid layer, promptly be fitted in the bottom on described printed wiring board surface, can adopt second aluminium sheet under the work-hardened condition, for example the aluminium foil of state under H18 is used for being fitted in the surface of described printed wiring board to reduce the generation of described printed wiring board aperture burr at boring procedure." state " among above-mentioned " state is under the O attitude " and " state is under H18 " specifically refers to appropriate section is put down in writing among the CNS GB-T-3198-2003 " state ".
" O " in the soft aluminium sheet of so-called O attitude refers to annealed condition, promptly full soft state; " H " in the H18 duralumin plate refers to work-hardened condition, and it is unannealed that " 1 " refers to only work hardening, and " 8 " refer to the sclerosis grade, is the hardest degree; In addition, the hardness state of aluminium sheet also has ranks such as H14, H26 or H32, comprises how producing soft aluminium sheet of O attitude and H18 duralumin plate, is not to belong to improvement of the present utility model, does not repeat them here.
Need to prove, the utility model is divided into the two-layer up and down of cushion and rigid layer with described upper cover plate, on the one hand, described cushion can cushion the impulse force that drill bit descends well when boring, the drill bit of rotation is at a high speed accurately located, and reduces the generation in inclined to one side hole to greatest extent, the aluminium sheet material that described cushion uses is soft more, with regard to easy more drill bit is settled at one go, and use aluminium sheet can assist the drill bit heat radiation, guarantee the rigidity of drill bit; On the other hand, described rigid layer is in the gap that can reduce between upper cover plate and the pcb board, can make drill bit directly pass upper cover plate when descending and enters in the pcb board, avoids producing burr at the place, aperture of pcb board, thereby improves the quality of boring.
Through evidence, compared with prior art, adopt the broken needle rate of the utility model soft or hard aluminium foil double layer composite board will be far smaller than 0.06%; And drilling precision 1.3≤CPK (processing procedure ability)≤1.67, can obviously find out from the test result of accompanying drawing 3a, 4a and accompanying drawing 3b, 4b, wherein, point is represented the center, hole of once the holing differential location to theoretical center, point among accompanying drawing 3a and the 4a is concentrated after statistics and is also shown as ellipse, and the point among accompanying drawing 3b and the 4b is approaching circular after statistics, compared with prior art, adopt the utility model soft or hard aluminium foil double layer composite board to make upper cover plate, obviously improve the degree of accuracy of boring, reached the boring requirement of high accuracy pcb board.
In the preferred embodiment of lower bolster described in the utility model, described first aluminium sheet and described second aluminium sheet can be bonding by adhesive, with the gap between two-layer about reducing, it is the gap between described heat dissipating layer and the described rigid layer, be beneficial to the heat radiation of drill bit in the decline process, improved the service life of drill bit, for example, described adhesive can adopt water-soluble resin adhesive or thermosetting resin adhesive.
Should be understood that, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection domain of the utility model claims.
Claims (4)
1. a upper cover plate that uses in the printed wiring board boring procedure is used for auxiliary drill bit and gets out aperture on printed wiring board, it is characterized in that described upper cover plate comprises a cushion and a rigid layer, and fitting side by side is provided with; Described cushion is set to first aluminium sheet under the annealed condition, is used for slowing down impulsive force from described drill bit at boring procedure; Described rigid layer is set to second aluminium sheet under the work-hardened condition, is used for reducing boring procedure and produces burr at the place, aperture of described printed wiring board.
2. upper cover plate according to claim 1 is characterized in that, described first aluminium sheet is set to the aluminium foil of state under the O attitude.
3. upper cover plate according to claim 1 is characterized in that, described second aluminium sheet is set to the aluminium foil of state under H18.
4. upper cover plate according to claim 1 is characterized in that, described first aluminium sheet and described second aluminium sheet are bonding by adhesive, and described adhesive is water-soluble or thermosetting resin adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202601318U CN201586769U (en) | 2009-11-04 | 2009-11-04 | Upper cover plate used in hole-drilling process of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202601318U CN201586769U (en) | 2009-11-04 | 2009-11-04 | Upper cover plate used in hole-drilling process of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201586769U true CN201586769U (en) | 2010-09-22 |
Family
ID=42746537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202601318U Ceased CN201586769U (en) | 2009-11-04 | 2009-11-04 | Upper cover plate used in hole-drilling process of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201586769U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151880A (en) * | 2011-03-11 | 2011-08-17 | 深圳市崇达电路技术股份有限公司 | Clamping pin positioning drilling machine and clamping pin positioning method |
| CN103842116A (en) * | 2013-05-10 | 2014-06-04 | 文霞 | Drilling method on sheet metal |
| CN104174898A (en) * | 2013-05-22 | 2014-12-03 | 深圳市大族激光科技股份有限公司 | Micro hole processing device and micro hole processing method |
| CN104476902A (en) * | 2014-12-30 | 2015-04-01 | 烟台柳鑫新材料科技有限公司 | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof |
| CN104552415A (en) * | 2014-12-31 | 2015-04-29 | 广东工业大学 | Multi-layer structured cover plate for improving drilling position precision of flexible PCB (printed circuit board) |
| CN104626267A (en) * | 2015-01-20 | 2015-05-20 | 深圳市柳鑫实业有限公司 | Novel phenolic paper cover plate for PCB drilling and manufacturing method of novel phenolic paper cover plate |
| CN105057726A (en) * | 2015-07-17 | 2015-11-18 | 大连崇达电路有限公司 | Superhard PCB (Printed Circuit Board) processing method capable of effectively prolonging service life of cutting tool |
| CN106001696A (en) * | 2016-05-26 | 2016-10-12 | 深圳市柳鑫实业股份有限公司 | PCB mechanically-drilled cover plate and preparation method thereof |
| CN112872143A (en) * | 2020-12-10 | 2021-06-01 | 东莞盛翔精密金属有限公司 | Composite net, and composite net punching method and device |
| CN113978055A (en) * | 2021-10-13 | 2022-01-28 | 长沙众兴新材料科技有限公司 | Aluminum-based layered composite material and preparation method and application thereof |
-
2009
- 2009-11-04 CN CN2009202601318U patent/CN201586769U/en not_active Ceased
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151880A (en) * | 2011-03-11 | 2011-08-17 | 深圳市崇达电路技术股份有限公司 | Clamping pin positioning drilling machine and clamping pin positioning method |
| CN102151880B (en) * | 2011-03-11 | 2013-02-06 | 江门崇达电路技术有限公司 | Clamping pin positioning method |
| CN103842116A (en) * | 2013-05-10 | 2014-06-04 | 文霞 | Drilling method on sheet metal |
| CN104174898B (en) * | 2013-05-22 | 2016-12-28 | 大族激光科技产业集团股份有限公司 | Micropore processing device and processing method thereof |
| CN104174898A (en) * | 2013-05-22 | 2014-12-03 | 深圳市大族激光科技股份有限公司 | Micro hole processing device and micro hole processing method |
| CN104476902A (en) * | 2014-12-30 | 2015-04-01 | 烟台柳鑫新材料科技有限公司 | PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof |
| CN104552415A (en) * | 2014-12-31 | 2015-04-29 | 广东工业大学 | Multi-layer structured cover plate for improving drilling position precision of flexible PCB (printed circuit board) |
| CN104552415B (en) * | 2014-12-31 | 2017-07-14 | 广东工业大学 | A kind of sandwich construction cover plate for improving flexible print wiring board drilling hole position precision |
| CN104626267A (en) * | 2015-01-20 | 2015-05-20 | 深圳市柳鑫实业有限公司 | Novel phenolic paper cover plate for PCB drilling and manufacturing method of novel phenolic paper cover plate |
| CN105057726A (en) * | 2015-07-17 | 2015-11-18 | 大连崇达电路有限公司 | Superhard PCB (Printed Circuit Board) processing method capable of effectively prolonging service life of cutting tool |
| CN106001696A (en) * | 2016-05-26 | 2016-10-12 | 深圳市柳鑫实业股份有限公司 | PCB mechanically-drilled cover plate and preparation method thereof |
| CN112872143A (en) * | 2020-12-10 | 2021-06-01 | 东莞盛翔精密金属有限公司 | Composite net, and composite net punching method and device |
| CN112872143B (en) * | 2020-12-10 | 2023-09-08 | 东莞盛翔精密金属有限公司 | Composite net, and method and device for punching composite net |
| CN113978055A (en) * | 2021-10-13 | 2022-01-28 | 长沙众兴新材料科技有限公司 | Aluminum-based layered composite material and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201586769U (en) | Upper cover plate used in hole-drilling process of printed circuit board | |
| CN101541145B (en) | Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate | |
| US20070108588A1 (en) | Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device | |
| WO2008102853A1 (en) | Epoxy resin composition, prepreg, laminates and printed wiring boards | |
| CN101359601A (en) | Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package | |
| EP1174006B1 (en) | Method for drilling circuit boards | |
| KR102183776B1 (en) | A improving method of PCB drilling | |
| CN102248202B (en) | Cover board or backing board for drilling printed circuit board, and processing method thereof | |
| CN105538387A (en) | Cover plate for PCB drilling | |
| CN109996400A (en) | A method of improving asymmetric folded structure pcb board and sticks up | |
| US4853273A (en) | Drill board and method of making the same | |
| CN201529793U (en) | Paper holding composite aluminium plate used in process of drilling print wiring board | |
| CN201750634U (en) | Improved pressing in carrier structure provided with rigid-flexible circuit board | |
| JP3127543U (en) | Multilayer heat radiation type aluminum foil composite cover plate | |
| CN202750332U (en) | PCB circuit board | |
| JP3177296U (en) | Drilling cover plate with metal material on both sides | |
| CN202162412U (en) | Cover plate or bearing plate used in drilling printed circuit board | |
| CN105945326A (en) | Circuit board drilling cover plate for deep drilling control and control method | |
| JP4834157B2 (en) | Wiring board and manufacturing method thereof | |
| CN206533603U (en) | A kind of thickening type MULTILAYER COMPOSITE circuit board | |
| CN104552415B (en) | A kind of sandwich construction cover plate for improving flexible print wiring board drilling hole position precision | |
| CN100502615C (en) | Welding pad disposed on the circuitry | |
| JPWO2009011024A1 (en) | Wiring board and manufacturing method thereof | |
| TWI429338B (en) | Wiring board and method of manufacturing wiring board | |
| JPS60134496A (en) | Method of producing multilayer printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C35 | Partial or whole invalidation of patent or utility model | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20130407 Decision number of declaring invalidation: 20382 Granted publication date: 20100922 |