CN111251366A - PCB drilling cover plate - Google Patents

PCB drilling cover plate Download PDF

Info

Publication number
CN111251366A
CN111251366A CN202010055227.1A CN202010055227A CN111251366A CN 111251366 A CN111251366 A CN 111251366A CN 202010055227 A CN202010055227 A CN 202010055227A CN 111251366 A CN111251366 A CN 111251366A
Authority
CN
China
Prior art keywords
paper
layer
drilling
acrylic emulsion
cover plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010055227.1A
Other languages
Chinese (zh)
Inventor
孟清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Hailun Special Aluminum Co Ltd
Zhuhai Zonghang Technology Co Ltd
Original Assignee
Jiangsu Hailun Special Aluminum Co Ltd
Zhuhai Zonghang Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Hailun Special Aluminum Co Ltd, Zhuhai Zonghang Technology Co Ltd filed Critical Jiangsu Hailun Special Aluminum Co Ltd
Priority to CN202010055227.1A priority Critical patent/CN111251366A/en
Publication of CN111251366A publication Critical patent/CN111251366A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/36—Coatings with pigments
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/36—Coatings with pigments
    • D21H19/44—Coatings with pigments characterised by the other ingredients, e.g. the binder or dispersing agent
    • D21H19/46—Non-macromolecular organic compounds
    • D21H19/48—Diolefins, e.g. butadiene; Aromatic vinyl monomers, e.g. styrene; Polymerisable unsaturated acids or derivatives thereof, e.g. acrylic acid
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/36—Coatings with pigments
    • D21H19/44—Coatings with pigments characterised by the other ingredients, e.g. the binder or dispersing agent
    • D21H19/62—Macromolecular organic compounds or oligomers thereof obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
    • D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
    • D21H23/22—Addition to the formed paper
    • D21H23/52—Addition to the formed paper by contacting paper with a device carrying the material
    • D21H23/56—Rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/12—Coating on the layer surface on paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/744—Non-slip, anti-slip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paper (AREA)

Abstract

According to the cover plate for PCB drilling, the upper surface and the lower surface of an aluminum sheet or a copper sheet are compounded with a layer of paper, and a layer of resin or printing ink is coated outside the paper on the upper surface. The wood fiber contained in the paper has the function of removing chips, the problem of troublesome wire winding generated in the drilling process can be solved, and the effect of the composite double-layer paper is better. The resin layer on the outer surface of the paper layer has buffering, anti-skidding and lubricating effects, so that the positioning precision of the drill point can be improved, the drilling quality can be improved, the drill point can be protected, and the hole plugging and scrapping of drilling holes can be reduced. The experiment of computer proves that this kind of apron has better chip removal effect, and the location is accurate moreover, has effectively improved the drilling precision and has reduced the stifled hole of drilling and scrap.

Description

PCB drilling cover plate
Technical Field
The application relates to the field of PCB manufacturing and processing, in particular to a cover plate for PCB drilling.
Background
The existing PCB drilling cover plate is roughly divided into two types: one is that the aluminum sheet or the copper sheet is coated with resin, which can achieve positioning, but has no effect on clearing winding wires generated in the drilling process and possibly has adverse effect, thus reducing the service life of the drill point; in addition, the composite paper is the composite paper on the upper surface of the aluminum sheet or the copper sheet, and the wood fiber rich in the paper has the function of removing chips, so that the problem of troublesome winding phenomenon generated in the drilling process can be solved.
Disclosure of Invention
The technical problem that this application will be solved provides a PCB is apron for drilling.
In order to solve the technical problem, the present application provides a cover plate for PCB drilling, the cover plate includes a metal plate, a paper layer covering the upper and lower surfaces of the metal plate, and a resin layer coated on the outer surface of the paper layer.
Preferably, the resin layer comprises one or more of polyurethane, acrylic acid, epoxy resin, polyethylene glycol 2000-8000, polyvinyl alcohol, polyethylene oxide 50000-100000 and polyvinylpyrrolidone.
Preferably, the resin layer is formed by mixing polyurethane emulsion and acrylic emulsion, coating the mixture on the outer surface of the paper layer by using roll coating equipment and drying the mixture.
Preferably, the mass ratio of the polyurethane emulsion to the acrylic emulsion is as follows: 1: (1-3).
Preferably, the green or blue pigment is added in a mass ratio of 0.5-5% after the polyurethane emulsion and the acrylic emulsion are mixed.
Preferably, the resin layer is formed by mixing polyethylene oxide 50000, polyethylene glycol 4000 and acrylic emulsion and coating the mixture on the outer surface of the paper layer by using a roller coating device.
Preferably, the mass ratio of the polyoxyethylene 50000 to the polyethylene glycol 4000 to the acrylic emulsion is 1: (2-5): (2-10).
Preferably, 0.5 to 5 mass percent of green or blue pigment is added after the polyethylene glycol 4000 and the polyethylene oxide 100000 are mixed.
Preferably, the paper layer is one of white board paper, coated paper and coated craft paper.
According to the cover plate for PCB drilling, the upper surface and the lower surface of an aluminum sheet or a copper sheet are compounded with a layer of paper, and a layer of resin or printing ink is coated outside the paper on the upper surface.
The wood fiber contained in the paper has the function of removing chips, the problem of troublesome wire winding generated in the drilling process can be solved, and the effect of the composite double-layer paper is better. The resin layer on the outer surface of the paper layer has buffering, anti-skidding and lubricating effects, so that the positioning precision of the drill point can be improved, the drilling quality can be improved, the drill point can be protected, and the hole plugging and scrapping of drilling holes can be reduced. The experiment of computer proves that this kind of apron has better chip removal effect, and the location is accurate moreover, has effectively improved the drilling precision and has reduced the stifled hole of drilling and scrap.
Detailed Description
The present application is further described below in conjunction with specific examples to enable those skilled in the art to better understand the present application and to practice it, which are not intended to limit the present application.
Example one
The paper layer is covered on the upper surface and the lower surface of the aluminum plate in a viscose bonding mode, the gram weight of the paper is 140 grams, the problem of wire winding of the drill point can be effectively solved by double-layer paper compounding, and the chip removal effect is better.
Example two
Coating paper layers on the upper surface and the lower surface of an aluminum plate in a viscose bonding mode, wherein the gram weight of the paper is 140 g, coating polyurethane emulsion and acrylic emulsion on the surfaces of the upper paper layer and the lower paper layer by using roll coating equipment, and mixing the polyurethane emulsion and the acrylic emulsion in a mass ratio of 1: 3, and 0.5 to 5 percent of green pigment is added, the double-layer paper can effectively solve the problem of wire winding of the drill point, the chip removal effect is better, and the resin coating can improve the positioning precision.
EXAMPLE III
Coating paper layers on the upper surface and the lower surface of an aluminum plate in a viscose bonding mode, wherein the gram weight of the paper is 140 g, coating polyoxyethylene 50000, polyethylene glycol 4000 and acrylic emulsion on the surfaces of the upper paper layer and the lower paper layer by using roll coating equipment, and mixing the polyoxyethylene 50000, the polyethylene glycol 4000 and the acrylic emulsion according to the mass ratio of 1: 2: 2, 0.5 to 5 percent of blue pigment is added, the problem of wire winding of the drill point can be effectively solved by double-layer paper coating, the chip removal effect is better, and the positioning precision can be improved by the resin coating.
In the first embodiment, the second embodiment and the third embodiment, the upper layer and the lower layer of the metal plate are paper layers, so that the aluminum layer is not easily scratched in the storage and transportation processes, and the accuracy of back drilling is not affected.
Comparative example 1
The upper surface of the aluminum plate is covered with a paper layer in a viscose bonding mode, and the gram weight of the paper is 200 g.
Comparative example No. two
Coating polyurethane emulsion and acrylic emulsion on the upper and lower surfaces of an aluminum plate through roll coating equipment, wherein the mass ratio of the polyurethane emulsion to the acrylic emulsion is as follows: 1: 2.
the results of the examples of the present application are compared with those of the comparative examples as shown in the following table.
Example one Example two EXAMPLE III Comparative example 1 Comparative example No. two
Hole site accuracy 1.52 1.68 1.75 1.45 1.42
Pore wall quality 4.8um 3.5um 3um 4.9um 5.6um
Phenomenon of wire winding Is free of Is free of Is free of Light and slight Severe severity of disease
Scrap rate 0.041％ 0.038％ 0.031％ 0.052％ 0.094％
Rate of broken needles 0 0 0 0 0.001％
The above-described embodiments are merely preferred embodiments for fully illustrating the present application, and the scope of the present application is not limited thereto. The equivalent substitution or change made by the person skilled in the art on the basis of the present application is within the protection scope of the present application. The protection scope of this application is subject to the claims.

Claims (10)

1. The cover plate for PCB drilling is characterized by comprising a metal plate, paper layers covering the upper surface and the lower surface of the metal plate and a resin layer coated on the outer surface of the paper layers.
2. The cover plate of claim 1, wherein the resin layer comprises one or more of polyurethane, acrylic, epoxy, polyethylene glycol 2000-8000, polyvinyl alcohol, polyethylene oxide 50000-100000, and polyvinylpyrrolidone.
3. The sheathing of claim 1, wherein the resin layer is formed by mixing a polyurethane emulsion and an acrylic emulsion, coating the mixture on the outer surface of the paper layer using a roll coating apparatus, and drying the mixture.
4. The cover sheet of claim 3, wherein the weight ratio of the polyurethane emulsion to the acrylic emulsion is: 1: (1-3).
5. The sheathing of claim 4, wherein a green or blue pigment is added in a mass ratio of 0.5 to 5% after the polyurethane emulsion and the acrylic emulsion are mixed.
6. The sheathing of claim 1, wherein said resin layer is formed by mixing polyethylene oxide 50000, polyethylene glycol 4000 and acrylic emulsion and coating the outer surface of the paper layer with a roll coating apparatus.
7. The cover sheet of claim 6, wherein the mass ratio of polyethylene oxide 50000, polyethylene glycol 4000 and acrylic emulsion is 1: (2-5): (2-10).
8. The cap of claim 7, wherein the green or blue pigment is added in a mass ratio of 0.5 to 5% after the polyethylene glycol 4000 and the polyethylene oxide 100000 are mixed.
9. The decking of claim 1, wherein the paper layer is one of white board paper, coated board paper, and coated craft paper.
10. The decking of claim 1, wherein the metal sheets are aluminum sheets or copper sheets.
CN202010055227.1A 2020-01-17 2020-01-17 PCB drilling cover plate Pending CN111251366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010055227.1A CN111251366A (en) 2020-01-17 2020-01-17 PCB drilling cover plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010055227.1A CN111251366A (en) 2020-01-17 2020-01-17 PCB drilling cover plate

Publications (1)

Publication Number Publication Date
CN111251366A true CN111251366A (en) 2020-06-09

Family

ID=70948941

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010055227.1A Pending CN111251366A (en) 2020-01-17 2020-01-17 PCB drilling cover plate

Country Status (1)

Country Link
CN (1) CN111251366A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112267323A (en) * 2020-10-28 2021-01-26 深圳市柳鑫实业股份有限公司 Single-sided aluminum composite paper cover plate and preparation method thereof
CN112662314A (en) * 2020-12-10 2021-04-16 深圳市柳鑫实业股份有限公司 Environment-friendly PCB drilling cover plate and preparation method thereof
CN115339176A (en) * 2021-12-06 2022-11-15 深圳市柳鑫实业股份有限公司 Heat dissipation type backing plate, heat dissipation type cover plate and heat dissipation type adhesive

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013030603A (en) * 2011-07-28 2013-02-07 Hitachi Chem Co Ltd Method of manufacturing wiring board
CN104476902A (en) * 2014-12-30 2015-04-01 烟台柳鑫新材料科技有限公司 PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof
CN105034494A (en) * 2015-07-27 2015-11-11 烟台柳鑫新材料科技有限公司 Pad plate for drilling and preparation method and application thereof
CN107803876A (en) * 2017-10-31 2018-03-16 深圳市柳鑫实业股份有限公司 A kind of PCB cover plate for drilling hole and preparation method thereof
CN110626019A (en) * 2019-09-02 2019-12-31 深圳市宏宇辉科技有限公司 Back-drilling aluminum foil cover plate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013030603A (en) * 2011-07-28 2013-02-07 Hitachi Chem Co Ltd Method of manufacturing wiring board
CN104476902A (en) * 2014-12-30 2015-04-01 烟台柳鑫新材料科技有限公司 PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof
CN105034494A (en) * 2015-07-27 2015-11-11 烟台柳鑫新材料科技有限公司 Pad plate for drilling and preparation method and application thereof
CN107803876A (en) * 2017-10-31 2018-03-16 深圳市柳鑫实业股份有限公司 A kind of PCB cover plate for drilling hole and preparation method thereof
CN110626019A (en) * 2019-09-02 2019-12-31 深圳市宏宇辉科技有限公司 Back-drilling aluminum foil cover plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112267323A (en) * 2020-10-28 2021-01-26 深圳市柳鑫实业股份有限公司 Single-sided aluminum composite paper cover plate and preparation method thereof
CN112662314A (en) * 2020-12-10 2021-04-16 深圳市柳鑫实业股份有限公司 Environment-friendly PCB drilling cover plate and preparation method thereof
CN115339176A (en) * 2021-12-06 2022-11-15 深圳市柳鑫实业股份有限公司 Heat dissipation type backing plate, heat dissipation type cover plate and heat dissipation type adhesive

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Application publication date: 20200609

RJ01 Rejection of invention patent application after publication