TWI490272B - Water soluble composition, entry board for drilling and production method of water soluble composition - Google Patents

Water soluble composition, entry board for drilling and production method of water soluble composition Download PDF

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TWI490272B
TWI490272B TW102119359A TW102119359A TWI490272B TW I490272 B TWI490272 B TW I490272B TW 102119359 A TW102119359 A TW 102119359A TW 102119359 A TW102119359 A TW 102119359A TW I490272 B TWI490272 B TW I490272B
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water
soluble composition
polyethylene oxide
oxide copolymer
copolymer
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TW102119359A
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TW201444911A (en
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Fu Le Lin
Chung Lu Shen
Chia Feng Chen
Yi Chang Lin
Chih Chiang Wu
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Koatech Technology Corp
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水溶性組成物、鑽孔用蓋板及水溶性組成物的製作方法Water-soluble composition, drilling cover plate and water-soluble composition manufacturing method

本發明是有關於一種水溶性組成物、水溶性組成物的製作方法及應用水溶性組成物的鑽孔用蓋板。The present invention relates to a water-soluble composition, a method for producing a water-soluble composition, and a cover for drilling a water-soluble composition.

現今印刷電路板材料所使用的包銅層壓板或多層板的鑽頭鑽孔加工方法,通常在鑽孔前,會將一蓋板做為輔助板,置放在包銅層壓板或多層板的頂面上。Drilling methods for copper-clad laminates or multi-layer boards used in printed circuit board materials today, usually before drilling, a cover is used as an auxiliary board placed on top of a copper-clad laminate or multi-layer board. On the surface.

近年來,伴隨著對印刷電路板材料的可靠性提高的要求或高密度化的進步,為了因應可靠性增長的要求和高度緻密化的發展,印刷電路板亦需要高品質的鑽孔,例如:提高孔位精度、孔璧品質並有效降低斷針率。In recent years, with the demand for improved reliability of printed circuit board materials or the progress of high density, in order to cope with the demand for reliability growth and the development of high densification, printed circuit boards also require high-quality drill holes, for example: Improve hole accuracy, hole quality and effectively reduce needle breakage.

目前市面上的輔助板,其產品結構多為三層結構,包含一層鋁箔板、一層非水溶性樹脂作為底塗以及一層以上水溶性樹脂作為面塗,其中底塗為有效強化水溶性樹脂與鋁箔板的密著能 力,但此舉卻可能在鑽孔後殘留在包銅層壓板或多層板的孔璧內部,而在印刷電路板後段製程中水洗無法去除造成鍍銅品質不佳甚至形成短路。At present, the auxiliary board on the market has a three-layer structure, which comprises a layer of aluminum foil, a layer of water-insoluble resin as a primer and more than one layer of water-soluble resin as a top coating, wherein the primer is effective to strengthen the water-soluble resin and aluminum foil. Board's adhesion Force, but this may remain inside the hole of the copper-clad laminate or multi-layer board after drilling, and the water washing in the back-end process of the printed circuit board cannot be removed to cause poor copper plating quality or even short circuit.

本發明提供一種水溶性組成物及其製作方法,以使水溶性組成物具有相對於金屬基材較佳的附著性,且應用其之蓋板在鑽孔時具有較佳的潤滑程度與散熱效果。The invention provides a water-soluble composition and a preparation method thereof, so that the water-soluble composition has better adhesion with respect to the metal substrate, and the cover plate applied thereto has better lubrication degree and heat dissipation effect when drilling. .

本發明的水溶性組成物,適用於鑽孔用蓋板。水溶性組成物包括水性聚氨酯樹脂與聚環氧乙烯共聚物。聚環氧乙烯共聚物的側鏈上包含烷基,且聚環氧乙烯共聚物的黏度為1000 cps至10000cps。The water-soluble composition of the present invention is suitable for use in a cover plate for drilling. The water soluble composition includes an aqueous polyurethane resin and a polyethylene oxide copolymer. The polyethylene oxide copolymer has an alkyl group on its side chain, and the polyethylene oxide copolymer has a viscosity of from 1000 cps to 10,000 cps.

本發明的鑽孔用蓋板包括基板與水溶性組成物,其中水溶性組成物配置在基板的表面上。The drilling cover plate of the present invention comprises a substrate and a water-soluble composition, wherein the water-soluble composition is disposed on the surface of the substrate.

本發明的水溶性組成物的製作方法,包括:提供水性聚氨酯樹脂;混合聚乙二醇、聚丙二醇、聚環氧乙烯共聚物及聚乙烯吡咯烷酮而形成預混合溶液;混合水性聚氨酯樹脂、界面活性劑、聚醚-矽氧烷共聚物、支鏈矽氧烷共聚物與預混合溶液而形成水溶性組成物。The method for preparing the water-soluble composition of the present invention comprises: providing an aqueous polyurethane resin; mixing polyethylene glycol, polypropylene glycol, polyethylene oxide copolymer and polyvinylpyrrolidone to form a premixed solution; mixing aqueous polyurethane resin, interfacial activity The agent, the polyether-oxirane copolymer, the branched alkane copolymer and the premixed solution form a water-soluble composition.

在本發明的一實施例中,上述的聚環氧乙烯共聚物的平均分子量介於150000至400000之間。In an embodiment of the invention, the above polyethylene oxide copolymer has an average molecular weight of between 150,000 and 400,000.

在本發明的一實施例中,上述在聚環氧乙烯共聚物側鏈 上的烷基包含甲基(CH3 )、丙烯甲基醚(CH2 OCH2 CH=CH2 )或其混合組成物。In an embodiment of the invention, the alkyl group on the side chain of the polyethylene oxide copolymer comprises methyl (CH 3 ), propylene methyl ether (CH 2 OCH 2 CH=CH 2 ) or a mixed composition thereof. .

在本發明的一實施例中,上述的水性聚氨酯樹脂的平均分子量介於10000至400000之間,水溶性組成物的硬度(Shore Hardness)蕭氏(Shore D)範圍為20至40之間,且水性聚氨酯樹脂的主鏈上含有乙基氧(ethylene oxide)親水性基團以及在側鏈上含有磺酸鈉乙二胺的乳化親水性基團。In an embodiment of the invention, the aqueous polyurethane resin has an average molecular weight of between 10,000 and 400,000, and the Shore Hardness of the water-soluble composition ranges from 20 to 40, and The main chain of the aqueous polyurethane resin contains an ethylene oxide hydrophilic group and an emulsified hydrophilic group containing sodium sulfonate ethylene glycol in a side chain.

在本發明的一實施例中,上述的水性聚氨酯樹脂佔水溶性組成物之整體固成分介於10wt%至45wt%之間。In an embodiment of the invention, the aqueous polyurethane resin comprises an overall solid content of the water-soluble composition of between 10% by weight and 45% by weight.

在本發明的一實施例中,水溶性組成物還包括聚乙二醇、聚丙二醇、聚醚-矽氧烷共聚物、支鏈矽氧烷共聚物,以及聚乙烯吡咯烷酮(PVP)。In an embodiment of the invention, the water soluble composition further comprises polyethylene glycol, polypropylene glycol, a polyether-xanylene oxide copolymer, a branched alkane copolymer, and polyvinylpyrrolidone (PVP).

在本發明的一實施例中,上述的聚環氧乙烯共聚物含量與聚乙烯吡咯烷酮含量的比例介於1:4至4:1之間。In an embodiment of the invention, the ratio of the polyethylene oxide copolymer content to the polyvinylpyrrolidone content is between 1:4 and 4:1.

在本發明的一實施例中,上述的聚乙二醇的平均分子量介於2000至10000之間,聚乙烯吡咯烷酮的平均分子量介於10000至200000之間。In an embodiment of the invention, the polyethylene glycol has an average molecular weight of between 2,000 and 10,000, and the polyvinylpyrrolidone has an average molecular weight of between 10,000 and 200,000.

在本發明的一實施例中,上述的聚環氧乙烯共聚物固體含量與水性聚氨酯樹脂含量的比例為1:1至1:4之間。In an embodiment of the invention, the ratio of the polyethylene oxide copolymer solid content to the aqueous polyurethane resin content is between 1:1 and 1:4.

在本發明的一實施例中,上述的聚乙烯吡咯烷酮的固體含量佔水溶性組成物之整體固成分介於15wt%至40wt%之間。In an embodiment of the invention, the polyvinylpyrrolidone has a solid content of from 15% by weight to 40% by weight based on the total solid content of the water-soluble composition.

在本發明的一實施例中,上述的聚乙二醇固體含量與水 性聚氨酯樹脂含量的比例為1:1至1:4之間。In an embodiment of the invention, the above polyethylene glycol solid content and water The ratio of the content of the urethane resin is between 1:1 and 1:4.

在本發明的一實施例中,上述的基板的材質包含鋁。In an embodiment of the invention, the material of the substrate comprises aluminum.

基於上述,在本發明的上述實施例中,藉由在水溶性組成物中加入側鏈包含烷基的聚環氧乙烯共聚物,且聚環氧乙烯共聚物的黏度為1000cps至10000cps,因而在基板上配置該水溶性組成物而作為鑽孔用蓋板後,能因聚環氧乙烯共聚物的特性而提高鑽孔時的潤滑效果,亦即讓水溶性組成物能緩衝鑽針貫穿時的衝擊力量,並降低因鑽孔之高速摩擦所生成的熱能,進而有效提昇鑽孔準確度、延長鑽針壽命及降低加工成本。Based on the above, in the above embodiment of the present invention, by adding a polyethylene oxide copolymer having a side chain containing an alkyl group to the water-soluble composition, and the viscosity of the polyethylene oxide copolymer is from 1000 cps to 10000 cps, When the water-soluble composition is disposed on the substrate and used as a cover for drilling, the lubricating effect during drilling can be improved by the characteristics of the polyethylene-epoxy copolymer, that is, when the water-soluble composition can buffer the penetration of the drill needle Impacts the force and reduces the heat generated by the high-speed friction of the borehole, thereby effectively improving the drilling accuracy, extending the life of the drill and reducing the processing cost.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧鑽孔用蓋板100‧‧‧Drilling cover

110‧‧‧基板110‧‧‧Substrate

120‧‧‧水溶性組成物120‧‧‧Water-soluble composition

200‧‧‧印刷電路板200‧‧‧Printed circuit board

300‧‧‧下方墊板300‧‧‧lower pad

S310~S330‧‧‧步驟S310~S330‧‧‧Steps

圖1是本發明一實施例的一種鑽孔用蓋板的示意圖。1 is a schematic view of a cover plate for drilling according to an embodiment of the present invention.

圖2是圖1的鑽孔用蓋板的應用示意圖。Figure 2 is a schematic view of the application of the drilling cover of Figure 1.

圖3是本發明一實施例的水溶性組成物的調配示意圖。Fig. 3 is a schematic view showing the blending of a water-soluble composition according to an embodiment of the present invention.

圖1是本發明一實施例的一種鑽孔用蓋板的示意圖。圖2是圖1的鑽孔用蓋板的應用示意圖,其用以繪示應用本實施例的鑽孔用蓋板100對印刷電路板200進行鑽孔。請同時參考圖1與 圖2,在本實施例中,鑽孔用蓋板100包括基板110與配置在基板110其中一表面上的水溶性組成物120。基板110例如是導電基板,其材質包含鋁,且在本實施例中,基板110為厚度30um至250um的鋁箔板。接著,水溶性組成物120是藉由塗佈(或相關製程)配置在鋁箔板的其中一表面,完成後便得以將此鑽孔用蓋板100覆蓋於印刷電路板200上以進行鑽孔加工製程。1 is a schematic view of a cover plate for drilling according to an embodiment of the present invention. 2 is a schematic view of the application of the drilling cover plate of FIG. 1 for illustrating the drilling of the printed circuit board 200 by using the drilling cover plate 100 of the present embodiment. Please also refer to Figure 1 with 2, in the present embodiment, the drilling cover 100 includes a substrate 110 and a water-soluble composition 120 disposed on one surface of the substrate 110. The substrate 110 is, for example, a conductive substrate whose material contains aluminum, and in the present embodiment, the substrate 110 is an aluminum foil plate having a thickness of 30 um to 250 um. Then, the water-soluble composition 120 is disposed on one surface of the aluminum foil plate by coating (or related process), and after completion, the drilling cover plate 100 is covered on the printed circuit board 200 for drilling. Process.

進一步地說,本實施例的水溶性組成物120包括水性聚氨酯樹脂與聚環氧乙烯共聚物,其中水性聚氨酯樹脂的通式如下: Further, the water-soluble composition 120 of the present embodiment comprises an aqueous polyurethane resin and a polyethylene oxide copolymer, wherein the formula of the aqueous polyurethane resin is as follows:

其平均分子粒徑小於0.2um,一般而言是介於0.0001um至0.2um之間,且平均分子量介於10000與400000之間。此液型水性聚氨酯樹脂(不含水分)的主鏈上含有0.1%-15%重量比的乙基氧(ethylene oxide)親水性基團以及側鏈上含有0.1%至15%的磺酸鈉乙二胺的乳化親水性基團,而整體的親水性基團比例介於5%-30%間。再者,水性聚氨酯樹脂相對於水溶性組成物120的有效固體含量介於10wt%至45wt%間,而其較佳的薄膜硬度(Shore Hardness)蕭氏D(Shore D)範圍介於20至40間。另須一提的是,經試驗發現,在薄膜硬度(Shore Hardness)蕭氏D(Shore D)範圍大於40則在進行鑽孔時容易發生斷針,而低於20則表面容易沾黏。The average molecular particle size is less than 0.2 um, generally between 0.0001 um and 0.2 um, and the average molecular weight is between 10,000 and 400,000. The liquid-type aqueous polyurethane resin (without moisture) has 0.1% to 15% by weight of an ethylene oxide hydrophilic group in the main chain and 0.1% to 15% of sodium sulfonate B in the side chain. The diamine emulsifies the hydrophilic group, and the overall hydrophilic group ratio is between 5% and 30%. Further, the effective solid content of the aqueous polyurethane resin relative to the water-soluble composition 120 is between 10% by weight and 455% by weight, and the preferred Shore Hardness of the Shore D range is from 20 to 40. between. It should also be mentioned that, in the test, it is found that when the Shore D of the Shore Hardness is greater than 40, the needle breakage is likely to occur during drilling, and below 20, the surface is easily adhered.

本實施例所用的水性聚氨酯樹脂屬於綠色化學中的一種 材料,是使用水來替代一般溶劑型聚氨酯反應條件的絕佳材料。在操作過程中是以水做為載體,水取代了傳統溶劑型聚氨酯塗料所使用的大部分或全部的揮發性有機物(Volatile organic compound,VOC)及有害空氣污染物(Hazardous Air Pollutant,HAP),但是潤滑層的性能並無降低。另外,在使用本實施例的散熱板材時,在鑽孔後殘餘在鑽針上的物質經過水震盪清洗後即可清除而不會殘留在鑽針上,此在清潔上具有節省成本與降低污染的效果。The aqueous polyurethane resin used in this embodiment belongs to one of green chemistry Materials are excellent materials that use water to replace the general solvent-based polyurethane reaction conditions. In the process of using water as a carrier, water replaces most or all of the volatile organic compounds (VOC) and Hazardous Air Pollutant (HAP) used in traditional solvent-based polyurethane coatings. However, the performance of the lubricating layer is not reduced. In addition, when the heat dissipating plate of the embodiment is used, the material remaining on the drill pin after the drilling is removed by water shock cleaning without remaining on the drill pin, which saves cost and reduces pollution in cleaning. Effect.

此外值得注意的是,本實施例的聚環氧乙烯共聚物的通式與結構如下: It is also worth noting that the general formula and structure of the polyethylene-epoxy copolymer of the present embodiment are as follows:

其相對於水溶性組成物120的有效固體含量介於5wt%至15wt%間,其中聚環氧乙烯共聚物的平均分子量介於150000至400000之間,且其在環氧結構的側鏈上包含烷基。在此,位在聚 環氧乙烯共聚物側鏈上的烷基包含甲基(CH3 )、丙烯甲基醚(CH2 OCH2 CH=CH2 )或其混合組成物,而聚環氧乙烯共聚物的黏度為1000cps至10000cps,且合成後之水溶性組成物120的黏度約介於500cps至3000cps之間。據此,藉由水溶性組成物120的聚環氧乙烯共聚物,而有效提昇其應用於鑽孔用蓋板100的潤滑性,其中水溶性組成物因此而進一步地得以緩衝鑽針貫穿印刷電路板200所產生的衝擊力量,且能有效地降低因鑽孔之高速摩擦所生成的熱能,進而提昇鑽孔準確度、延長鑽針壽命及降低加工成本。It has an effective solids content of between 5 wt% and 15 wt% relative to the water soluble composition 120, wherein the polyethylene oxide copolymer has an average molecular weight between 150,000 and 400,000 and which is included on the side chain of the epoxy structure alkyl. Here, the alkyl group located on the side chain of the polyethylene oxide copolymer comprises methyl (CH 3 ), propylene methyl ether (CH 2 OCH 2 CH=CH 2 ) or a mixed composition thereof, and polyethylene oxide The viscosity of the copolymer is from 1000 cps to 10,000 cps, and the viscosity of the synthesized water-soluble composition 120 is between about 500 cps and 3000 cps. Accordingly, the polyepoxyethylene copolymer of the water-soluble composition 120 is effectively improved in the lubricity applied to the drilling cover 100, wherein the water-soluble composition is further buffered by the drill through the printed circuit. The impact force generated by the plate 200 can effectively reduce the heat energy generated by the high-speed friction of the drill hole, thereby improving the drilling accuracy, extending the life of the drill needle, and reducing the processing cost.

另一方面,本實施例的水溶性組成物120還包括聚乙二醇、聚丙二醇、聚醚-矽氧烷共聚物、支鏈矽氧烷共聚物,以及聚乙烯吡咯烷酮(PVP),其中聚環氧乙烯共聚物含量與聚乙烯吡咯烷酮含量的比例介於1:4至4:1之間,聚乙二醇的平均分子量介於2000至10000之間,聚乙烯吡咯烷酮的平均分子量介於10000至200000之間,聚環氧乙烯共聚物固體含量與水性聚氨酯樹脂含量的比例為1:1至1:4之間,聚乙烯吡咯烷酮的固體含量佔水溶性組成物之整體固成分介於15wt%至40wt%之間。On the other hand, the water-soluble composition 120 of the present embodiment further includes polyethylene glycol, polypropylene glycol, a polyether-oxyalkylene copolymer, a branched alkane copolymer, and polyvinylpyrrolidone (PVP), wherein the poly The ratio of ethylene oxide copolymer content to polyvinylpyrrolidone content is between 1:4 and 4:1, the average molecular weight of polyethylene glycol is between 2,000 and 10,000, and the average molecular weight of polyvinylpyrrolidone is between 10,000 and 10,000. Between 200000, the ratio of the solid content of the polyethylene oxide copolymer to the content of the aqueous polyurethane resin is between 1:1 and 1:4, and the solid content of the polyvinylpyrrolidone accounts for 15% by weight of the total solid content of the water-soluble composition. Between 40wt%.

另需提及的是,本實施例中藉由控制聚環氧乙烯共聚物含量與聚乙烯吡咯烷酮含量的比例而調整水溶性組成物120的潤滑性與親水性。經試驗得知,若聚環氧乙烯共聚物的含量比例過高,則塗佈在基板上的水溶性組成物120所形成的潤滑層容易產生龜裂紋或結晶紋,導致膜面外觀不佳,而過低則導致潤滑效果 不佳,散熱不足,易造成鑽頭斷針。類似地,若聚乙烯吡咯烷酮的含量比例過高,則因造成親水性較高而容易產生黏沾情形,若過低則會導致水溶性不佳。It is also to be noted that in the present embodiment, the lubricity and hydrophilicity of the water-soluble composition 120 are adjusted by controlling the ratio of the content of the polyethylene oxide copolymer to the polyvinylpyrrolidone content. It has been experimentally found that if the content ratio of the polyethylene oxide copolymer is too high, the lubricating layer formed by the water-soluble composition 120 coated on the substrate is liable to cause cracks or crystal grains of the turtle, resulting in poor appearance of the film surface. And too low leads to lubrication Poor, insufficient heat dissipation, easy to cause the drill bit to break. Similarly, if the content ratio of polyvinylpyrrolidone is too high, the hydrophilicity is high and the adhesion is likely to occur, and if it is too low, the water solubility is poor.

圖3是本發明一實施例的水溶性組成物的調配示意圖。請參考圖3,在步驟S310中,提供水性聚氨酯樹脂。進一步地說,水性聚氨酯樹脂可先經過乳化處理,以常溫下均質產生微胞,並加入界面活性劑且予以升溫。Fig. 3 is a schematic view showing the blending of a water-soluble composition according to an embodiment of the present invention. Referring to FIG. 3, in step S310, an aqueous polyurethane resin is provided. Further, the aqueous polyurethane resin may be subjected to an emulsification treatment to homogenize the micelles at a normal temperature, and a surfactant is added and heated.

另,在步驟S320中需混合聚乙二醇、聚丙二醇、聚環氧乙烯共聚物及聚乙烯吡咯烷酮而形成預混合溶液。進一步地說,乳化後的聚乙二醇在與聚丙二醇混合後,加入聚環氧乙烯共聚物和聚乙烯吡咯烷酮而形成膠體狀的預混合溶液,其中由於聚乙二醇和聚乙烯吡咯烷酮的相容性較差,因此須把聚乙烯吡咯烷酮奈米化研磨,並加入環氧樹脂。Further, in step S320, polyethylene glycol, polypropylene glycol, a polyethylene oxide copolymer, and polyvinylpyrrolidone are mixed to form a premixed solution. Further, after the emulsified polyethylene glycol is mixed with the polypropylene glycol, the polyethylene oxide copolymer and the polyvinylpyrrolidone are added to form a colloidal premixed solution, wherein the polyethylene glycol and the polyvinylpyrrolidone are compatible. Poorly, it is necessary to grind polyvinylpyrrolidone and add epoxy resin.

最後,在步驟S330中,在常溫下混合上述水性聚氨酯樹脂與界面活性劑、預混合溶液,以及聚醚-矽氧烷共聚物、支鏈矽氧烷共聚物,便完成本實施例的水溶性組成物120。Finally, in step S330, the water-soluble polyurethane resin and the surfactant, the premixed solution, and the polyether-oxyalkylene copolymer and the branched alkane copolymer are mixed at normal temperature to complete the water solubility of the present embodiment. Composition 120.

基於上述,本發明之鑽孔用蓋板100依上述完成後,以下述實驗例進行鑽孔測試,其中並參照圖2所繪示之鑽孔示意圖。在此以本案的鑽孔用蓋板100為實驗組,而以現有技術之鑽孔用蓋板作為對照組。在此以製程能力指數(Cpk)作為評斷鑽孔定位的準確性與精確性的依據,而得出下表1、表2之結果。Based on the above, the drilling cover 100 of the present invention is subjected to the drilling test in the following experimental example after completion of the above, and the drilling schematic shown in FIG. 2 is referred to. Here, the drilling cover plate 100 of the present invention is used as an experimental group, and the prior art drilling cover plate is used as a control group. Here, the process capability index (Cpk) is used as the basis for judging the accuracy and accuracy of the drilling location, and the results of Table 1 and Table 2 are obtained.

[實驗參數][Experimental parameters]

鑽孔機台:HITACHI-0105 U2Drilling machine: HITACHI-0105 U2

轉速:300 krpmSpeed: 300 krpm

進刀速度:2.4 m/minFeeding speed: 2.4 m/min

回刀速度:1000 in/minReturn speed: 1000 in/min

孔限:13500 hitsHole limit: 13500 hits

疊片數:BT_HS x 0.11mm x 6Number of laminations: BT_HS x 0.11mm x 6

下方墊板(圖2中標號為300者):厚度1.5mm尿素板(亦可為紙漿板或酚醛板)Lower pad (labeled as 300 in Figure 2): 1.5 mm thick urea plate (can also be pulp or phenolic)

由表1與表2的製程能力分析圖能清楚得知,本案的鑽孔用蓋板100,其在鑽孔的準確率、精確率及對印刷電路板200產生的粗糙度皆較現有鑽孔用蓋板為佳。It can be clearly seen from the process capability analysis charts of Tables 1 and 2 that the drilling cover plate 100 of the present case has better accuracy and precision in drilling and the roughness generated on the printed circuit board 200 than the existing drilling holes. It is better to use a cover plate.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧鑽孔用蓋板100‧‧‧Drilling cover

110‧‧‧基板110‧‧‧Substrate

120‧‧‧水溶性組成物120‧‧‧Water-soluble composition

Claims (13)

一種水溶性組成物,適用於一鑽孔用蓋板,該水溶性組成物包括:水性聚氨酯樹脂、聚環氧乙烯共聚物與聚乙烯吡咯烷酮,其中聚環氧乙烯共聚物的側鏈上包含烷基,且聚環氧乙烯共聚物的黏度為1000cps至10000cps,以及聚環氧乙烯共聚物含量與聚乙烯吡咯烷酮含量的比例介於1:4至4:1之間。 A water-soluble composition suitable for use in a drilling cover plate comprising: an aqueous polyurethane resin, a polyethylene oxide copolymer and a polyvinylpyrrolidone, wherein the polyethylene oxide copolymer comprises an alkane on a side chain thereof The poly(ethylene oxide) copolymer has a viscosity of from 1000 cps to 10,000 cps, and the ratio of the polyethylene oxide copolymer content to the polyvinylpyrrolidone content is between 1:4 and 4:1. 如申請專利範圍第1項所述的水溶性組成物,其中在聚環氧乙烯共聚物側鏈上的烷基包含甲基(CH3 )、丙烯甲基醚(CH2 OCH2 CH=CH2 )或其混合組成物。The water-soluble composition of claim 1, wherein the alkyl group on the side chain of the polyethylene oxide copolymer comprises methyl (CH 3 ), propylene methyl ether (CH 2 OCH 2 CH=CH 2 ) or a mixture thereof. 如申請專利範圍第1項所述的水溶性組成物,其中聚環氧乙烯共聚物的平均分子量介於150000至400000之間。 The water-soluble composition of claim 1, wherein the polyethylene oxide copolymer has an average molecular weight of between 150,000 and 400,000. 如申請專利範圍第1項所述的水溶性組成物,其中水性聚氨酯樹脂的平均分子量介於10000至400000之間,水溶性組成物的硬度(Shore Hardness)蕭氏(Shore D)範圍為20至40之間,且水性聚氨酯樹脂的主鏈上含有乙基氧(ethylene oxide)親水性基團以及在側鏈上含有磺酸鈉乙二胺的乳化親水性基團。 The water-soluble composition according to claim 1, wherein the aqueous polyurethane resin has an average molecular weight of from 10,000 to 400,000, and the Shore Hardness of the water-soluble composition has a Shore D range of from 20 to Between 40, the main chain of the aqueous polyurethane resin contains an ethylene oxide hydrophilic group and an emulsified hydrophilic group containing sodium sulfonate ethylenediamine in the side chain. 如申請專利範圍第1項所述的水溶性組成物,其中水性聚氨酯樹脂佔水溶性組成物之整體固成分介於10wt%至45wt%之間。 The water-soluble composition according to claim 1, wherein the aqueous polyurethane resin accounts for between 10% by weight and 45% by weight of the total solid content of the water-soluble composition. 如申請專利範圍第1項所述的水溶性組成物,還包括:聚乙二醇、聚丙二醇、聚醚-矽氧烷共聚物以及支鏈矽氧烷共聚物。 The water-soluble composition according to claim 1, further comprising polyethylene glycol, polypropylene glycol, a polyether-xanylene oxide copolymer, and a branched alkane copolymer. 如申請專利範圍第6項所述的水溶性組成物,其中聚乙二醇的平均分子量介於2000至10000之間,聚乙烯吡咯烷酮的平均分子量介於10000至200000之間。 The water-soluble composition according to claim 6, wherein the polyethylene glycol has an average molecular weight of from 2,000 to 10,000, and the polyvinylpyrrolidone has an average molecular weight of from 10,000 to 200,000. 如申請專利範圍第6項所述的水溶性組成物,其中聚環氧乙烯共聚物固體含量與水性聚氨酯樹脂含量的比例為1:1至1:4之間。 The water-soluble composition according to claim 6, wherein the ratio of the solid content of the polyethylene oxide copolymer to the content of the aqueous polyurethane resin is between 1:1 and 1:4. 如申請專利範圍第6項所述的水溶性組成物,其中聚乙烯吡咯烷酮的固體含量佔水溶性組成物之整體固成分介於15wt%至40wt%之間。 The water-soluble composition according to claim 6, wherein the polyvinylpyrrolidone has a solid content of from 15% by weight to 40% by weight based on the total solid content of the water-soluble composition. 如申請專利範圍第6項所述的水溶性組成物,其中聚乙二醇固體含量與水性聚氨酯樹脂含量的比例為1:1至1:4之間。 The water-soluble composition according to claim 6, wherein the ratio of the polyethylene glycol solid content to the aqueous polyurethane resin content is between 1:1 and 1:4. 一種鑽孔用蓋板,包括:一基板;以及一申請專利範圍第1項至第10項中任一項所述的水溶性組成物,配置在該基板的表面上。 A cover plate for drilling, comprising: a substrate; and the water-soluble composition according to any one of claims 1 to 10, which is disposed on a surface of the substrate. 如申請專利範圍第11項所述的鑽孔用蓋板,其中該基板的材質包含鋁。 The cover for drilling according to claim 11, wherein the material of the substrate comprises aluminum. 一種水溶性組成物的製作方法,包括:提供水性聚氨酯樹脂;混合聚乙二醇、聚丙二醇、聚環氧乙烯共聚物及聚乙烯吡咯烷酮而形成一預混合溶液,其中在混合前,使聚乙烯吡咯烷酮進 行奈米化研磨,以及其中聚環氧乙烯共聚物的側鏈上包含烷基,且聚環氧乙烯共聚物的黏度為1000cps至10000cps,以及聚環氧乙烯共聚物含量與聚乙烯吡咯烷酮含量的比例介於1:4至4:1之間;以及混合水性聚氨酯樹脂、界面活性劑、聚醚-矽氧烷共聚物、支鏈矽氧烷共聚物與該預混合溶液而形成該水溶性組成物。A method for preparing a water-soluble composition, comprising: providing an aqueous polyurethane resin; mixing polyethylene glycol, polypropylene glycol, polyethylene oxide copolymer and polyvinylpyrrolidone to form a premixed solution, wherein the polyethylene is mixed before mixing Pyrrolidone Nanocrystallization grinding, wherein the polyethylene oxide copolymer has an alkyl group on its side chain, and the viscosity of the polyethylene oxide copolymer is from 1000 cps to 10000 cps, and the content of the polyethylene oxide copolymer and the polyvinylpyrrolidone content a ratio of between 1:4 and 4:1; and a mixed aqueous polyurethane resin, a surfactant, a polyether-oxyalkylene copolymer, a branched alkane copolymer and the premixed solution to form the water-soluble composition Things.
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