TW201902648A - Auxiliary plate for micro diameter drilling and drilling method using the same - Google Patents

Auxiliary plate for micro diameter drilling and drilling method using the same Download PDF

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TW201902648A
TW201902648A TW107118392A TW107118392A TW201902648A TW 201902648 A TW201902648 A TW 201902648A TW 107118392 A TW107118392 A TW 107118392A TW 107118392 A TW107118392 A TW 107118392A TW 201902648 A TW201902648 A TW 201902648A
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Taiwan
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drilling
diameter
less
auxiliary plate
mass
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TW107118392A
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Chinese (zh)
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龜井孝幸
松山洋介
石藏賢二
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日商三菱瓦斯化學股份有限公司
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Publication of TW201902648A publication Critical patent/TW201902648A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B49/00Measuring or gauging equipment on boring machines for positioning or guiding the drill; Devices for indicating failure of drills during boring; Centering devices for holes to be bored
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16Perforating by tool or tools of the drill type
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/10Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M105/14Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms polyhydroxy
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/32Esters
    • C10M105/40Esters containing free hydroxy or carboxyl groups
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/20Lubricating compositions characterised by the base-material being a macromolecular compound containing oxygen
    • C10M107/30Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M107/32Condensation polymers of aldehydes or ketones; Polyesters; Polyethers
    • C10M107/34Polyoxyalkylenes
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M145/00Lubricating compositions characterised by the additive being a macromolecular compound containing oxygen
    • C10M145/02Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M145/10Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a carboxyl radical, e.g. acrylate
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M145/00Lubricating compositions characterised by the additive being a macromolecular compound containing oxygen
    • C10M145/18Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M145/24Polyethers
    • C10M145/26Polyoxyalkylenes
    • C10M145/28Polyoxyalkylenes of alkylene oxides containing 2 carbon atoms only
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M145/00Lubricating compositions characterised by the additive being a macromolecular compound containing oxygen
    • C10M145/18Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M145/24Polyethers
    • C10M145/26Polyoxyalkylenes
    • C10M145/30Polyoxyalkylenes of alkylene oxides containing 3 carbon atoms only
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M145/00Lubricating compositions characterised by the additive being a macromolecular compound containing oxygen
    • C10M145/40Polysaccharides, e.g. cellulose
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M149/00Lubricating compositions characterised by the additive being a macromolecular compound containing nitrogen
    • C10M149/02Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M149/10Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a nitrogen-containing hetero ring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Lubricants (AREA)
  • Drilling And Boring (AREA)

Abstract

An entry sheet for boring a very fine drill hole with a diameter of 0.075 mm or less, the entry sheet having a metal foil, and, on at least one side of the metal foil, a layer of a resin composition containing a polyolefin resin (A), a low-molecular weight water-soluble lubricant (B), and a water-soluble resin (C), wherein the water-soluble resin (C) contains a high-molecular weight water-soluble resin (c-1) and a medium-molecular weight water-soluble resin (c-2), and per 100 parts by mass in total of the polyolefin resin (A), the low-molecular weight water-soluble lubricant (B) and the water-soluble resin (C), an amount of the polyolefin resin (A) is at least 15 parts by mass but not more than 25 parts by mass, an amount of the low-molecular weight water-soluble lubricant (B) is at least 5 parts by mass but not more than 40 parts by mass, and an amount of the water-soluble resin (C) is at least 35 parts by mass but not more than 80 parts by mass.

Description

微細直徑鑽孔加工用之輔助板及利用該輔助板的鑽孔加工方法Auxiliary plate for micro-diameter drilling and drilling method using the same

本發明關於微細直徑鑽孔加工用之輔助板及利用該輔助板的鑽孔加工方法。The present invention relates to an auxiliary plate for micro-diameter drilling processing and a drilling processing method using the auxiliary plate.

就使用於印刷電路板材料的疊層板、多層板之鑽孔加工方法而言,一般採用如下方法:重疊1片或多片之疊層板或多層板,在其最頂部配置作為抵接板之鋁箔單體或於鋁箔表面形成樹脂組成物之層而成之板片(以下,本說明書中將此「板片」稱為「鑽孔加工用之輔助板」),並進行開孔加工。As for the drilling processing method of laminated boards and multilayer boards used for printed circuit board materials, the following methods are generally used: one or more laminated boards or multilayer boards are stacked and arranged as abutting boards at the top A sheet of aluminum foil alone or a layer of a resin composition formed on the surface of the aluminum foil (hereinafter, this "sheet" is referred to as an "auxiliary plate for drilling processing" in this specification), and a hole is processed.

近年來,伴隨對於印刷電路板之可靠性增進之要求、高密度化之進展,對於疊層板或多層板之鑽孔加工也要求孔位置精度增進、孔壁粗糙度減低等高品質的鑽孔加工。In recent years, with the requirements for the reliability improvement of printed circuit boards and the progress of high density, the drilling of laminated or multilayer boards also requires high-quality drilling such as improved hole position accuracy and reduced hole wall roughness. machining.

為了因應上述孔位置精度增進、孔壁粗糙度減低等要求,例如專利文獻1提出使用了由聚乙二醇等水溶性樹脂構成之板片之開孔加工法。又,專利文獻2提出在金屬箔形成水溶性樹脂層而成之開孔加工用潤滑劑板片。再者,專利文獻3提出在已形成有熱硬化性樹脂薄膜之鋁箔形成水溶性樹脂層而成之開孔加工用輔助板。再者,專利文獻4提出在潤滑樹脂組成物中摻合無鹵素之著色劑而得之開孔加工用潤滑劑板片。In order to respond to the above-mentioned requirements for improved hole position accuracy and reduced hole wall roughness, for example, Patent Document 1 proposes a hole-cutting method using a plate made of a water-soluble resin such as polyethylene glycol. In addition, Patent Document 2 proposes a lubricant sheet for hole processing in which a water-soluble resin layer is formed on a metal foil. Furthermore, Patent Document 3 proposes an auxiliary plate for hole processing in which a water-soluble resin layer is formed on an aluminum foil on which a thermosetting resin film has been formed. Furthermore, Patent Document 4 proposes a lubricant sheet for hole processing obtained by blending a halogen-free coloring agent in a lubricating resin composition.

有人提出由金屬箔與至少形成於該金屬箔之單面之樹脂組成物之層構成之形態作為鑽孔加工用之輔助板之一形態。但,金屬箔與樹脂組成物之層的黏著強度弱,故若為金屬箔與樹脂組成物之層係直接接觸的鑽孔加工用之輔助板之構成的話,往往會在鑽孔加工時發生樹脂組成物之層剝離,鑽機跟隨該已剝離之樹脂組成物之層,而造成孔位置精度惡化、鑽機之折損頻度惡化。又,鑽孔加工用之輔助板,通常係配置於多片之疊層板或多層板之兩面並以固定用之膠帶製成為1組而用於開孔加工,但有時固定用膠帶會和樹脂組成物之層一起剝離,造成輔助板之位置偏離。因此,為了改善金屬箔與樹脂組成物之層的黏著強度,實用上係以在金屬箔與樹脂組成物之層之間形成有由胺甲酸酯系化合物、乙酸乙烯酯系化合物、氯乙烯系化合物、聚酯系化合物、及它們的聚合物、環氧系化合物、氰酸酯系化合物等構成之黏著層(黏著皮膜)之形態使用(例如參照專利文獻5)。 [先前技術文獻] [專利文獻]It has been proposed that a form consisting of a metal foil and a layer of a resin composition formed on at least one side of the metal foil is one form of an auxiliary plate for drilling. However, the adhesion strength between the metal foil and the resin composition layer is weak. Therefore, if the metal foil and the resin composition layer are in direct contact with each other for the auxiliary plate for drilling processing, the resin tends to occur during the drilling process. The layer of the composition is peeled off, and the drill follows the layer of the resin composition that has been peeled off, causing the hole position accuracy to deteriorate and the frequency of breakage of the drill to deteriorate. In addition, the auxiliary plate for drilling processing is generally arranged on both sides of a multi-layer laminated board or a multilayer board and is made into a group with a fixing tape for opening processing, but the fixing tape may The layers of the resin composition are peeled together, causing the position of the auxiliary plate to deviate. Therefore, in order to improve the adhesion strength between the metal foil and the resin composition layer, it is practical to form a urethane-based compound, a vinyl acetate-based compound, or a vinyl chloride-based compound between the metal foil and the resin composition layer. Compounds, polyester-based compounds, and their polymers, epoxy-based compounds, cyanate-based compounds, and the like are used in the form of an adhesive layer (adhesive film) (for example, refer to Patent Document 5). [Prior Art Literature] [Patent Literature]

[專利文獻1] 日本特開平4-92494號公報 [專利文獻2] 日本特開平5-169400號公報 [專利文獻3] 日本特開2003-136485號公報 [專利文獻4] 日本特開2004-230470號公報 [專利文獻5] 日本特開2011-183548號公報[Patent Document 1] Japanese Patent Laid-Open No. 4-92494 [Patent Document 2] Japanese Patent Laid-Open No. 5-169400 [Patent Document 3] Japanese Patent Laid-Open No. 2003-136485 [Patent Document 4] Japanese Patent Laid-Open No. 2004-230470 [Patent Document 5] Japanese Patent Laid-Open No. 2011-183548

[發明所欲解決之課題][Problems to be Solved by the Invention]

但,另一方面,在金屬箔與樹脂組成物之層之間設置黏著層的話,黏著層會妨礙樹脂組成物之潤滑效果,故有時會有對於鑽孔加工用之輔助板要求的重要特性即孔位置精度惡化之情形。因此,期盼開發一種在金屬箔與樹脂組成物之層之間不設置黏著層,金屬箔與樹脂組成物之層的黏著強度強,且孔位置精度優異之鑽孔加工用之輔助板。However, on the other hand, if an adhesive layer is provided between the metal foil and the resin composition layer, the adhesive layer may hinder the lubricating effect of the resin composition. Therefore, it may have important characteristics required for an auxiliary plate for drilling processing. That is, the hole position accuracy deteriorates. Therefore, it is desired to develop an auxiliary plate for drilling processing in which an adhesive layer is not provided between the metal foil and the resin composition layer, the adhesive strength of the metal foil and resin composition layer is strong, and the hole position accuracy is excellent.

再者,印刷電路板持續朝高密度化進展,針對疊層板、多層板之鑽孔加工之最近之動向可列舉以下之特徵。第一,因配線電路之高密度化而使得鑽孔加工孔之間隔越來越窄。亦即為了保持鑽孔加工孔間之絕緣性,優異的孔位置精度係重要。In addition, printed circuit boards continue to progress toward higher densities. Recent trends in the drilling of laminated boards and multilayer boards include the following features. First, due to the high density of wiring circuits, the interval between drilled holes becomes narrower and narrower. That is, in order to maintain the insulation between the drilled holes, excellent hole position accuracy is important.

第二,鑽孔加工孔更趨向小徑化,已開始廣泛使用直徑為0.075mmΦ~0.05mmΦ之鑽頭。隨著鑽頭之直徑變小,鑽頭之剛性會變低,故鑽孔加工時之鑽頭折損成為問題。亦即,需要優異的耐鑽頭折損性。Second, drilling holes are becoming smaller, and drills with a diameter of 0.075mmΦ ~ 0.05mmΦ have begun to be widely used. As the diameter of the drill bit becomes smaller, the rigidity of the drill bit becomes lower, so drill breakage during drilling becomes a problem. That is, excellent drill break resistance is required.

本發明係鑑於上述問題而生,目的為:提供一種鑽孔加工用之輔助板,即便為在金屬箔與樹脂組成物之層之間不設置黏著層之情況,金屬箔與樹脂組成物之層的黏著強度仍強,使用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機進行開孔加工時之孔位置精度優異,耐鑽頭折損性亦優異;並提供利用該輔助板的鑽孔加工方法。 [解決課題之手段]The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide an auxiliary plate for drilling processing, even if an adhesive layer is not provided between the metal foil and the resin composition layer, and the metal foil and the resin composition layer are provided. The adhesive strength is still strong. When using a drill with a diameter of less than 0.075mm for drilling, the hole position accuracy is excellent, and the drill bit break resistance is also excellent; and a drilling method using the auxiliary plate is provided. [Means for solving problems]

本案發明人等為了解決上述課題而進行各種探討,結果發現藉由形成於金屬箔表面之樹脂組成物之層含有聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C),且樹脂組成物之層中的聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之含量各為特定之範圍,可解決上述課題,乃完成本發明。The present inventors conducted various investigations in order to solve the above-mentioned problems. As a result, they found that the layer of the resin composition formed on the surface of the metal foil contained a polyolefin resin (A), a low-molecular-weight water-soluble lubricant (B), and a water-soluble resin (C), and the contents of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C) in the layer of the resin composition are each in a specific range, which can solve the above problems, but The present invention has been completed.

亦即,本發明如下。 [1] 一種直徑0.075mm以下之微細直徑鑽孔加工用之輔助板, 具有:金屬箔;及至少設置在該金屬箔之單面之含有聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之樹脂組成物之層, 該水溶性樹脂(C)含有高分子量水溶性樹脂(c-1)與中分子量水溶性樹脂(c-2), 相對於該聚烯烴樹脂(A)、該低分子水溶性潤滑劑(B)、與該水溶性樹脂(C)之合計100質量份, 該聚烯烴樹脂(A)之含量為15質量份以上25質量份以下, 該低分子水溶性潤滑劑(B)之含量為5質量份以上40質量份以下, 該水溶性樹脂(C)之含量為35質量份以上80質量份以下。 [2] 如[1]之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該聚烯烴樹脂(A)含有具有來自烯烴之構成單元與來自丙烯酸及/或甲基丙烯酸之構成單元之烯烴-(甲基)丙烯酸共聚物。 [3] 如[2]之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該來自烯烴之構成單元含有來自乙烯之構成單元。 [4] 如[2]或[3]之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該烯烴-(甲基)丙烯酸共聚物為具下列通式(1)之結構之乙烯-(甲基)丙烯酸嵌段共聚物; 【化1】(1) 式(1)中,R1 、R2 、R3 各自獨立地表示氫原子或甲基,m與n各自獨立地為1以上之整數。 [5] 如[2]至[4]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該烯烴-(甲基)丙烯酸共聚物中,來自該烯烴之該構成單元之含量,相對於來自該烯烴之該構成單元與來自該丙烯酸及/或該甲基丙烯酸之該構成單元之合計100莫耳%為60~99莫耳%。 [6] 如[1]至[5]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該聚烯烴樹脂(A)之重量平均分子量為5×103 以上1×105 以下。 [7] 如[1]至[6]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該低分子水溶性潤滑劑(B)之重量平均分子量為6×102 以上2.5×103 以下。 [8] 如[1]至[7]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該低分子水溶性潤滑劑(B)係選自由聚乙二醇、聚四亞甲基二醇等甘醇化合物、聚氧乙烯油醚、聚氧乙烯鯨蠟醚、聚氧乙烯硬脂醚、聚氧乙烯月桂醚、聚氧乙烯壬基苯醚、聚氧乙烯辛基苯醚等聚氧乙烯之單醚化合物、聚氧乙烯單月桂酸酯、聚氧乙烯單硬脂酸酯、聚氧乙烯單油酸酯、聚氧乙烯二硬脂酸酯、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐單油酸酯、聚甘油單硬脂酸酯化合物、聚氧乙烯丙烯共聚物、及它們的衍生物構成之群組中之1種或2種以上。 [9] 如[1]至[8]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該水溶性樹脂(C)含有選自由聚環氧乙烷、聚環氧丙烷、聚乙烯基吡咯烷酮、纖維素衍生物、聚乙二醇、聚丙二醇、聚四亞甲基二醇、聚氧乙烯之單醚化合物、聚氧乙烯單硬脂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚甘油單硬脂酸酯化合物、聚環氧乙烷-聚環氧丙烷共聚物、及它們的衍生物構成之群組中之1種或2種以上。 [10] 如[1]至[9]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該樹脂組成物之層之厚度為0.02~0.3mm。 [11] 如[1]至[10]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該金屬箔之厚度為0.05mm~0.3mm。 [12] 一種微細直徑鑽孔加工方法,具有下列步驟: 使用如[1]至[11]中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,利用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機在疊層板或多層板形成孔。 [發明之效果]That is, the present invention is as follows. [1] An auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less, comprising: a metal foil; and a polyolefin resin (A) and a low-molecular-weight water-soluble lubricant (at least on one side of the metal foil) B). A layer of a resin composition with a water-soluble resin (C). The water-soluble resin (C) contains a high-molecular-weight water-soluble resin (c-1) and a medium-molecular-weight water-soluble resin (c-2). The polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C) total 100 parts by mass, and the content of the polyolefin resin (A) is 15 parts by mass or more and 25 parts by mass or less The content of the low-molecular-weight water-soluble lubricant (B) is 5 parts by mass or more and 40 parts by mass or less, and the content of the water-soluble resin (C) is 35 parts by mass or more and 80 parts by mass or less. [2] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less as in [1], wherein the polyolefin resin (A) contains a constituent unit derived from an olefin and a constituent derived from acrylic acid and / or methacrylic acid Unit olefin- (meth) acrylic copolymer. [3] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less as in [2], wherein the constituent unit derived from olefin contains a constituent unit derived from ethylene. [4] The auxiliary plate for drilling a micro-diameter with a diameter smaller than 0.075 mm as in [2] or [3], wherein the olefin- (meth) acrylic copolymer has a structure of the following general formula (1) Ethylene- (meth) acrylic block copolymer; (1) In formula (1), R 1 , R 2 , and R 3 each independently represent a hydrogen atom or a methyl group, and m and n are each independently an integer of 1 or more. [5] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [2] to [4], wherein the olefin- (meth) acrylic copolymer is derived from the olefin The content of the structural unit is 60 to 99 mol% relative to the total 100 mol% of the structural unit derived from the olefin and the structural unit derived from the acrylic acid and / or the methacrylic acid. [6] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [1] to [5], wherein the weight average molecular weight of the polyolefin resin (A) is 5 × 10 3 or more 1 × 10 5 or less. [7] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [1] to [6], wherein the weight-average molecular weight of the low-molecular-weight water-soluble lubricant (B) is 6 × 10 2 or more and 2.5 × 10 3 or less. [8] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [1] to [7], wherein the low-molecular-weight water-soluble lubricant (B) is selected from polyethylene glycol Glycol compounds such as polytetramethylene glycol, polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene Mono-ether compounds of polyoxyethylene such as octylphenyl ether, polyoxyethylene monolaurate, polyoxyethylene monostearate, polyoxyethylene monooleate, polyoxyethylene distearate, polyoxyethylene Sorbitan monolaurate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate, polyglycerol monostearate compounds, polyoxyethylene propylene copolymers, and their One or more of the group consisting of derivatives. [9] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [1] to [8], wherein the water-soluble resin (C) contains a material selected from the group consisting of polyethylene oxide, polymer Polypropylene oxide, polyvinylpyrrolidone, cellulose derivative, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyoxyethylene monoether compound, polyoxyethylene monostearate, polyoxyethylene One or more types of sorbitan monostearate, polyglycerol monostearate compound, polyethylene oxide-polypropylene oxide copolymer, and their derivatives. [10] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [1] to [9], wherein the thickness of the layer of the resin composition is 0.02 to 0.3 mm. [11] The auxiliary plate for drilling with a fine diameter of 0.075 mm or less according to any one of [1] to [10], wherein the thickness of the metal foil is 0.05 mm to 0.3 mm. [12] A method for drilling a micro-diameter with the following steps: Use an auxiliary plate for drilling a micro-diameter having a diameter of 0.075 mm or less as in any of [1] to [11], and use a diameter of 0.075 mm or less A drill for micro-diameter drilling is used to form holes in laminated or multilayer boards. [Effect of the invention]

依據本發明,可提供一種鑽孔加工用之輔助板,即便為在金屬箔與樹脂組成物之層之間不設置黏著層之情況,金屬箔與樹脂組成物之層的黏著強度仍強,使用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機進行開孔加工時之孔位置精度優異,耐鑽頭折損性亦優異;並可提供利用該輔助板的鑽孔加工方法。又,無需設置黏著層,故能減低原料成本,亦能簡化鑽孔加工用之輔助板之製造步驟。According to the present invention, an auxiliary plate for drilling can be provided. Even if an adhesive layer is not provided between the layer of the metal foil and the resin composition, the adhesion strength of the layer of the metal foil and the resin composition is still strong. The drill with a fine diameter of less than 0.075mm is used for drilling with excellent hole position accuracy and drill bit breakage resistance, and it can provide a drilling method using the auxiliary plate. In addition, there is no need to provide an adhesive layer, so the cost of raw materials can be reduced, and the manufacturing steps of the auxiliary plate for drilling processing can be simplified.

以下,針對本發明之實施形態(以下稱為「本實施形態」。)詳細地說明,但本發明不限於此,可在不脫離其要旨之範圍內進行各式各樣的變形。Hereinafter, an embodiment of the present invention (hereinafter referred to as "this embodiment") will be described in detail, but the present invention is not limited to this, and various modifications can be made without departing from the gist thereof.

[鑽孔加工用之輔助板] 本實施形態之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板(以下,也簡單稱為「輔助板」。),具有金屬箔、及至少設置在該金屬箔之單面之含有聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之樹脂組成物之層,該水溶性樹脂(C)含有高分子量水溶性樹脂(c-1)與中分子量水溶性樹脂(c-2),相對於該聚烯烴樹脂(A)、該低分子水溶性潤滑劑(B)、與該水溶性樹脂(C)之合計100質量份,該聚烯烴樹脂(A)之含量為15質量份以上25質量份以下,該低分子水溶性潤滑劑(B)之含量為5質量份以上40質量份以下,該水溶性樹脂(C)之含量為35質量份以上80質量份以下。[Auxiliary plate for drilling processing] An auxiliary plate (hereinafter, also simply referred to as an "auxiliary plate") for drilling a micro-diameter with a diameter of 0.075 mm or less in this embodiment, includes a metal foil, and at least A layer of a resin composition comprising a polyolefin resin (A), a low-molecular-weight water-soluble lubricant (B), and a water-soluble resin (C) on one side of a metal foil, and the water-soluble resin (C) contains a high-molecular-weight water-soluble The resin (c-1) and the medium molecular weight water-soluble resin (c-2) are 100 with respect to the total of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C). The content of the polyolefin resin (A) is 15 parts by mass or more and 25 parts by mass or less, and the content of the low-molecular-weight water-soluble lubricant (B) is 5 parts by mass or more and 40 parts by mass or less. The water-soluble resin (C ) Is contained in an amount of 35 parts by mass or more and 80 parts by mass or less.

圖1展示本實施形態之鑽孔加工用之輔助板及利用該輔助板的鑽孔加工方法之一態樣。如圖1所示,本實施形態之輔助板具有金屬箔2、及至少配置在該金屬箔2之單面之樹脂組成物之層1。藉由使用具上述組成之樹脂組成物之層1,成為即便為在金屬箔2與樹脂組成物之層1之間不設置黏著層之情況,金屬箔2與樹脂組成物之層1的黏著強度仍強,而且鑽孔加工時之孔位置精度優異,耐鑽頭折損性亦優異之輔助板。是以,本實施形態之輔助板,在金屬箔與樹脂組成物之層之間可不具有用以調整金屬箔與樹脂組成物之層的黏著力之黏著層。以下,針對本實施形態之輔助板之構成更詳細地說明。FIG. 1 shows an aspect of an auxiliary plate for drilling processing and a method of drilling processing using the auxiliary plate in the present embodiment. As shown in FIG. 1, the auxiliary plate of this embodiment includes a metal foil 2 and a layer 1 of a resin composition arranged on at least one side of the metal foil 2. By using the layer 1 of the resin composition having the above-mentioned composition, even if an adhesive layer is not provided between the metal foil 2 and the layer 1 of the resin composition, the adhesion strength between the metal foil 2 and the layer 1 of the resin composition is obtained. Auxiliary plate that is still strong and has excellent hole position accuracy during drilling and excellent drill breakage resistance. Therefore, the auxiliary plate of this embodiment may not have an adhesive layer between the metal foil and the resin composition layer for adjusting the adhesion between the metal foil and the resin composition layer. Hereinafter, the configuration of the auxiliary plate of this embodiment will be described in more detail.

[金屬箔] 金屬箔之材料不特別限定,宜為與後述之樹脂組成物之層的黏合性高且能耐受鑽頭所造成之衝擊之金屬材料。就金屬箔之金屬種類而言,考量取得性、成本及加工性之觀點,例如可列舉鋁。就鋁箔之材質而言,宜為純度95%以上之鋁。如此的鋁箔例如可列舉規定於JIS-H4160之5052、3004、3003、1N30、1N99、1050、1070、1100、1085、8021。藉由使用鋁純度95%以上之鋁箔作為金屬箔,會緩和鑽頭所造成之衝擊並改善與鑽頭前端部之鑽入性,並和樹脂組成物所帶來的鑽頭之潤滑效果相輔相成,而能更提高加工孔之孔位置精度。[Metal Foil] The material of the metal foil is not particularly limited, and is preferably a metal material having high adhesion to a layer of a resin composition described later and capable of withstanding the impact caused by a drill. Regarding the type of metal of the metal foil, from the viewpoints of availability, cost, and processability, for example, aluminum can be cited. As far as the material of aluminum foil is concerned, aluminum with a purity of more than 95% is preferred. Examples of such aluminum foil include 5052, 3004, 3003, 1N30, 1N99, 1050, 1070, 1100, 1085, and 8021 specified in JIS-H4160. By using an aluminum foil with an aluminum purity of 95% or more as the metal foil, the impact caused by the drill bit is reduced, and the penetration of the drill tip is improved, and the lubricating effect of the drill bit brought by the resin composition is complementary, and it can be more effective. Improve the hole position accuracy of the machined hole.

金屬箔之厚度宜為0.05~0.5mm,更佳為0.05~0.3mm。藉由金屬箔之厚度為0.05mm以上,有更能抑制鑽孔加工時開孔對象物(例如疊層板)發生毛邊之傾向。又,藉由金屬箔之厚度為0.5mm以下,有鑽孔加工時產生之切削屑更容易排出之傾向。The thickness of the metal foil should be 0.05 ~ 0.5mm, more preferably 0.05 ~ 0.3mm. When the thickness of the metal foil is 0.05 mm or more, there is a tendency that the occurrence of burrs in the object to be punched (for example, a laminated board) during drilling is more suppressed. In addition, when the thickness of the metal foil is 0.5 mm or less, the chips generated during the drilling process tend to be more easily discharged.

構成本實施形態之輔助板的各層之厚度係以如下方式測定。首先,使用剖面拋光儀(日本電子DATUM(股)公司製,商品名「CROSS-SECTION POLISHER SM-09010」)、或超薄切片機(Leica公司製,型號「EM UC7」),將輔助板沿各層之疊層方向切斷。然後,使用SEM(掃描型電子顯微鏡(Scanning Electron Microscope),KEYENCE公司製,型號「VE-7800」),從垂直於切斷而顯現之剖面之方向觀察該剖面,並測定構成之各層例如金屬箔及樹脂組成物之層之厚度。對於1視野測定5處之厚度,將其平均值定義為各層之厚度。The thickness of each layer constituting the auxiliary plate of this embodiment is measured as follows. First, use a profile polisher (manufactured by Japan Electronics DATUM Co., Ltd. under the trade name "CROSS-SECTION POLISHER SM-09010") or an ultra-thin microtome (manufactured by Leica, model "EM UC7"). The stacking direction of each layer is cut. Then, using a SEM (Scanning Electron Microscope, manufactured by KEYENCE Corporation, model "VE-7800"), the section is viewed from a direction perpendicular to the section that appears when cut, and the layers such as metal foil are measured. And the thickness of the layer of the resin composition. The thickness was measured at 5 places per field of view, and the average value was defined as the thickness of each layer.

[樹脂組成物之層] 樹脂組成物之層係至少配置在該金屬箔之單面,並含有聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)。[Layer composition layer] The resin composition layer is disposed on at least one side of the metal foil, and contains a polyolefin resin (A), a low-molecular-weight water-soluble lubricant (B), and a water-soluble resin (C).

(聚烯烴樹脂(A)) 聚烯烴樹脂(A)不特別限定,例如可列舉:烯烴之均聚物;烯烴與能和烯烴共聚合之其它共聚單體之共聚物。在此,作為烯烴可列舉乙烯、丙烯、丁烯、己烯、辛烯等。其中,乙烯、丙烯較佳,乙烯更佳。聚烯烴樹脂(A)可單獨使用1種,也可併用2種以上。(Polyolefin resin (A)) The polyolefin resin (A) is not particularly limited, and examples thereof include: homopolymers of olefins; copolymers of olefins and other comonomers capable of copolymerizing with olefins. Examples of the olefin include ethylene, propylene, butene, hexene, and octene. Among them, ethylene and propylene are preferred, and ethylene is more preferred. Polyolefin resin (A) may be used individually by 1 type, and may use 2 or more types together.

烯烴之均聚物不特別限定,例如可列舉聚乙烯系樹脂、聚丙烯系樹脂、聚丁二烯系樹脂、環烯烴系樹脂、聚丁烯系樹脂。The olefin homopolymer is not particularly limited, and examples thereof include polyethylene resins, polypropylene resins, polybutadiene resins, cycloolefin resins, and polybutene resins.

又,就構成烯烴之共聚物之共聚單體而言,只要為具有能與烯烴聚合的官能基者即可,不特別限定,例如可列舉:乙酸乙烯酯、乙烯醇等乙烯基系單體;丙烯酸、甲基丙烯酸、馬來酸、衣康酸、富馬酸等不飽和羧酸系單體;甲基丙烯酸酯、丙烯酸酯等不飽和酯系單體等。其中,丙烯酸、甲基丙烯酸較佳,丙烯酸更佳。又,乙烯-丙烯共聚物系樹脂等具有來自2種烯烴之構成單元之樹脂也包含於烯烴之共聚物。The comonomer constituting the olefin copolymer is not particularly limited as long as it has a functional group capable of polymerizing with the olefin, and examples thereof include vinyl-based monomers such as vinyl acetate and vinyl alcohol; Unsaturated carboxylic acid-based monomers such as acrylic acid, methacrylic acid, maleic acid, itaconic acid, and fumaric acid; unsaturated ester-based monomers such as methacrylate and acrylate. Among them, acrylic acid and methacrylic acid are preferable, and acrylic acid is more preferable. In addition, a resin having a constituent unit derived from two olefins, such as an ethylene-propylene copolymer resin, is also included in the olefin copolymer.

其中,聚烯烴樹脂(A)宜為含有來自烯烴之構成單元與來自不飽和羧酸系單體之構成單元之共聚物(以下,也稱為「烯烴-不飽和羧酸共聚物」。),為含有來自烯烴之構成單元與來自丙烯酸及/或甲基丙烯酸(以下,也稱為「(甲基)丙烯酸」。)之構成單元之共聚物(以下,也稱為「烯烴-(甲基)丙烯酸共聚物」)更佳,為含有來自乙烯之構成單元與來自丙烯酸及/或甲基丙烯酸之構成單元之共聚物(以下,也稱為「乙烯-(甲基)丙烯酸共聚物」。)又更佳,為含有來自乙烯之構成單元與來自丙烯酸之構成單元之共聚物特佳。藉由使用如此之聚烯烴樹脂(A),金屬箔與樹脂組成物之層的黏著強度更為改善,成為鑽孔加工時之孔位置精度不良、鑽機折損之原因的樹脂組成物之層的剝離有更受到抑制之傾向。因此,有孔位置精度更為增進,鑽機加工壽命變得更長之傾向。Among them, the polyolefin resin (A) is preferably a copolymer (hereinafter, also referred to as "olefin-unsaturated carboxylic acid copolymer") containing a constituent unit derived from an olefin and a constituent unit derived from an unsaturated carboxylic acid-based monomer, It is a copolymer (hereinafter, also referred to as "olefin- (methyl)" containing a structural unit derived from an olefin and a structural unit derived from acrylic acid and / or methacrylic acid (hereinafter, also referred to as "(meth) acrylic acid"). Acrylic copolymer ") is more preferably a copolymer containing constituent units derived from ethylene and constituent units derived from acrylic acid and / or methacrylic acid (hereinafter, also referred to as" ethylene- (meth) acrylic copolymer "). More preferably, it is a copolymer containing a structural unit derived from ethylene and a structural unit derived from acrylic acid. By using such a polyolefin resin (A), the adhesion strength of the layer of the metal foil and the resin composition is further improved, and the resin composition layer is peeled off due to poor hole position accuracy during drilling and drill breakage. There is a tendency to be more suppressed. Therefore, the accuracy of the hole position is further improved, and the processing life of the drill tends to be longer.

上述烯烴-(甲基)丙烯酸共聚物不特別限制,例如可列舉具下列通式(1)之結構之乙烯-(甲基)丙烯酸嵌段共聚物。藉由使用如此之乙烯-(甲基)丙烯酸嵌段共聚物,有金屬箔與樹脂組成物之層的黏著強度更為改善,且鑽孔加工時之孔位置精度更為增進之傾向。尤其,藉由形成為嵌段共聚物,結晶性更為充分地改善,會在鑽孔加工時效率良好地熔融,故孔位置精度有更為增進之傾向。 【化2】(1) (式(1)中,R1 、R2 、R3 各自獨立地表示氫原子或甲基,m與n各自獨立地為1以上之整數。)The olefin- (meth) acrylic copolymer is not particularly limited, and examples thereof include ethylene- (meth) acrylic block copolymers having a structure of the following general formula (1). By using such an ethylene- (meth) acrylic block copolymer, the adhesion strength of a layer having a metal foil and a resin composition is further improved, and the hole position accuracy during drilling processing tends to be more improved. In particular, by forming a block copolymer, the crystallinity is more fully improved, and it is efficiently melted during the drilling process, so the hole position accuracy tends to be further improved. [Chemical 2] (1) (In the formula (1), R 1 , R 2 , and R 3 each independently represent a hydrogen atom or a methyl group, and m and n are each independently an integer of 1 or more.)

上述通式(1)中,m為1以上,較佳為200以上,更佳為500以上。m之上限較佳為3400以下,更佳為2500以下,又更佳為2000以下。又,通式(1)中,n為1以上,較佳為50以上,更佳為100以上。n之上限較佳為870以下,更佳為750以下,又更佳為500以下。In the general formula (1), m is 1 or more, preferably 200 or more, and more preferably 500 or more. The upper limit of m is preferably 3400 or less, more preferably 2500 or less, and even more preferably 2000 or less. In the general formula (1), n is 1 or more, preferably 50 or more, and more preferably 100 or more. The upper limit of n is preferably 870 or less, more preferably 750 or less, and still more preferably 500 or less.

又,乙烯-(甲基)丙烯酸嵌段共聚物可單獨使用1種,也可將R1 、R2 、R3 、m、或n不同之聚合物併用2種以上。The ethylene- (meth) acrylic block copolymer may be used alone or in combination of two or more polymers having different R 1 , R 2 , R 3 , m, or n.

上述烯烴-不飽和羧酸共聚物中,來自烯烴之構成單元之含量,相對於來自烯烴之構成單元與來自不飽和羧酸系單體之構成單元之合計100莫耳%,宜為60~99莫耳%,更佳為65~95莫耳%,又更佳為80~95莫耳%。又,來自不飽和羧酸系單體之構成單元之含量,相對於來自烯烴之構成單元與來自不飽和羧酸系單體之構成單元之合計100莫耳%,宜為1~40莫耳%,更佳為5~35莫耳%,又更佳為5~20莫耳%。藉由來自烯烴之構成單元之含量為60莫耳%以上,該共聚物之結晶性為充分,會在鑽孔加工時效率良好地熔融,故切削屑之排出性佳,從而有孔位置精度優異或耐鑽頭折損性改善之傾向。另一方面,藉由來自不飽和羧酸系單體之構成單元之含量為1莫耳%以上,將該共聚物製造成為水分散體時之穩定性有更為改善之傾向。The content of the constituent units derived from the olefin in the olefin-unsaturated carboxylic acid copolymer is preferably 60 to 99% with respect to the total of the constituent units derived from the olefin and the constituent units derived from the unsaturated carboxylic acid-based monomer. Mole%, more preferably 65 to 95 mole%, and even more preferably 80 to 95 mole%. In addition, the content of the constituent units derived from the unsaturated carboxylic acid monomer is preferably 1 to 40 mol% relative to the total of the constituent units derived from the olefin and the constituent units derived from the unsaturated carboxylic acid monomer. , More preferably 5 to 35 mole%, and still more preferably 5 to 20 mole%. When the content of the constituent unit derived from the olefin is 60 mol% or more, the copolymer has sufficient crystallinity and will melt efficiently during drilling processing, so the chip discharge is good, and the accuracy of the hole position is excellent. Or the tendency of drill bit breakage resistance to improve. On the other hand, when the content of the constituent unit derived from the unsaturated carboxylic acid-based monomer is 1 mol% or more, the stability when the copolymer is produced into an aqueous dispersion tends to be further improved.

上述烯烴-(甲基)丙烯酸共聚物中,來自烯烴之構成單元之含量,相對於來自烯烴之構成單元與來自(甲基)丙烯酸之構成單元之合計100莫耳%,宜為60~99莫耳%,更佳為65~95莫耳%,又更佳為80~95莫耳%。又,來自(甲基)丙烯酸之構成單元之含量,相對於來自烯烴之構成單元與來自(甲基)丙烯酸之構成單元之合計100莫耳%,宜為1~40莫耳%,更佳為5~35莫耳%,又更佳為5~20莫耳%。藉由來自烯烴之構成單元之含量為60莫耳%以上,該共聚物之結晶性為充分,會在鑽孔加工時效率良好地熔融,故切削屑之排出性佳,從而有孔位置精度優異或耐鑽頭折損性改善之傾向。另一方面,藉由來自(甲基)丙烯酸之構成單元之含量為1莫耳%以上,將該共聚物製造成為水分散體時之穩定性有更為改善之傾向。In the above olefin- (meth) acrylic acid copolymer, the content of the constituent units derived from the olefin is preferably 60 to 99 mole% relative to the total of the constituent units derived from the olefin and the constituent units derived from the (meth) acrylic acid. Ear%, more preferably 65 to 95 mole%, and even more preferably 80 to 95 mole%. In addition, the content of the constituent units derived from (meth) acrylic acid is preferably 1 to 40 mol% relative to the total of 100 mol% of the constituent units derived from olefins and the constituent units derived from (meth) acrylic acid, and more preferably 5 ~ 35 mole%, and more preferably 5 ~ 20 mole%. When the content of the constituent unit derived from the olefin is 60 mol% or more, the copolymer has sufficient crystallinity and will melt efficiently during drilling processing, so the chip discharge is good, and the accuracy of the hole position is excellent. Or the tendency of drill bit breakage resistance to improve. On the other hand, when the content of the structural unit derived from (meth) acrylic acid is 1 mol% or more, the stability when the copolymer is produced into an aqueous dispersion tends to be further improved.

上述通式(1)表示之乙烯-(甲基)丙烯酸共聚物中,來自乙烯之構成單元之含量,相對於來自乙烯之構成單元與來自(甲基)丙烯酸之構成單元之合計100莫耳%,宜為60~99莫耳%,更佳為65~95莫耳%,又更佳為80~95莫耳%。又,來自(甲基)丙烯酸之構成單元之含量,相對於來自乙烯之構成單元與來自(甲基)丙烯酸之構成單元之合計100莫耳%,宜為1~40莫耳%,更佳為5~35莫耳%,又更佳為5~20莫耳%。藉由來自乙烯之構成單元之含量為60莫耳%以上,該共聚物之結晶性為充分,會在鑽孔加工時效率良好地熔融,故切削屑之排出性佳,從而有孔位置精度優異或耐鑽頭折損性改善之傾向。另一方面,藉由來自(甲基)丙烯酸之構成單元之含量為1莫耳%以上,將該共聚物製造成為水分散體時之穩定性有更為改善之傾向。尤其,藉由乙烯-(甲基)丙烯酸共聚物中來自乙烯之構成單元數(m)與來自(甲基)丙烯酸之構成單元數(n)之比(m:n)為80:20~95:5,有鑽孔加工時之孔位置精度更優異之傾向。The content of constituent units derived from ethylene in the ethylene- (meth) acrylic acid copolymer represented by the above general formula (1) is 100 mol% relative to the total of constituent units derived from ethylene and constituent units derived from (meth) acrylic acid It is preferably 60 to 99 mole%, more preferably 65 to 95 mole%, and even more preferably 80 to 95 mole%. In addition, the content of the constituent units derived from (meth) acrylic acid is preferably 1 to 40 mol%, more preferably 100% by mole relative to the total of the constituent units derived from ethylene and the constituent units derived from (meth) acrylic acid. 5 ~ 35 mole%, and more preferably 5 ~ 20 mole%. When the content of the constituent unit derived from ethylene is 60 mol% or more, the copolymer has sufficient crystallinity, and it will melt efficiently during drilling processing, so the chip discharge is good, and the accuracy of the hole position is excellent. Or the tendency of drill bit breakage resistance to improve. On the other hand, when the content of the structural unit derived from (meth) acrylic acid is 1 mol% or more, the stability when the copolymer is produced into an aqueous dispersion tends to be further improved. In particular, the ratio (m: n) of the number of constituent units (m) derived from ethylene to the number of constituent units (n) derived from (meth) acrylic acid in the ethylene- (meth) acrylic copolymer is 80: 20 ~ 95 : 5, there is a tendency that the hole position accuracy is better when drilling.

上述通式(1)表示之乙烯-(甲基)丙烯酸共聚物為乙烯-丙烯酸共聚物時,來自乙烯之構成單元之含量,相對於來自乙烯之構成單元與來自丙烯酸之構成單元之合計100莫耳%,宜為60~99莫耳%,更佳為65~95莫耳%,又更佳為80~95莫耳%。又,來自丙烯酸之構成單元之含量,相對於來自乙烯之構成單元與來自丙烯酸之構成單元之合計100莫耳%,宜為1~40莫耳%,更佳為5~35莫耳%,又更佳為5~20莫耳%。藉由來自乙烯之構成單元之含量為60莫耳%以上,該共聚物之結晶性為充分,會在鑽孔加工時效率良好地熔融,故切削屑之排出性佳,從而有孔位置精度優異或耐鑽頭折損性改善之傾向。另一方面,藉由來自丙烯酸之構成單元之含量為1莫耳%以上,將該共聚物製造成為水分散體時之穩定性有更為改善之傾向。尤其,藉由乙烯-丙烯酸共聚物中來自乙烯之構成單元數與來自丙烯酸之構成單元數之比(莫耳比)為80:20~95:5,鑽孔加工時之孔位置精度有更優異之傾向。When the ethylene- (meth) acrylic acid copolymer represented by the general formula (1) is an ethylene-acrylic acid copolymer, the content of the constituent units derived from ethylene is 100 moles relative to the total of the constituent units derived from ethylene and the constituent units derived from acrylic acid. Ear%, preferably 60 to 99 mole%, more preferably 65 to 95 mole%, and even more preferably 80 to 95 mole%. In addition, the content of the constituent units derived from acrylic acid is preferably 1 to 40 mol%, more preferably 5 to 35 mol% relative to the total of 100 mol% of the constituent units derived from ethylene and the constituent units derived from acrylic acid. More preferably, it is 5-20 mol%. When the content of the constituent unit derived from ethylene is 60 mol% or more, the copolymer has sufficient crystallinity, and it will melt efficiently during drilling processing, so the chip discharge is good, and the accuracy of the hole position is excellent. Or the tendency of drill bit breakage resistance to improve. On the other hand, when the content of the constituent unit derived from acrylic acid is 1 mol% or more, the stability when the copolymer is produced into an aqueous dispersion tends to be further improved. In particular, since the ratio (molar ratio) of the number of constituent units derived from ethylene to the number of constituent units derived from acrylic acid in the ethylene-acrylic acid copolymer is 80:20 to 95: 5, the hole position accuracy during drilling is more excellent. The tendency.

聚烯烴樹脂(A)之重量平均分子量宜為5×103 以上1×105 以下,更佳為2×104 以上8×104 以下,又更佳為4×104 以上7×104 以下。藉由重量平均分子量為5×103 以上,有更抑制輔助板彼此黏在一起之黏連(以下,亦簡單稱為「黏連」),輔助板之操作性更為改善之傾向。又,藉由重量平均分子量為1×105 以下,有鑽孔加工時之切削屑之排出性更為改善,孔位置精度更為增進,鑽機折損更受到抑制之傾向。聚烯烴樹脂(A)之重量平均分子量可依常規方法使用GPC管柱,以聚苯乙烯作為標準物質而進行測定。The weight average molecular weight of the polyolefin resin (A) is preferably 5 × 10 3 or more and 1 × 10 5 or less, more preferably 2 × 10 4 or more and 8 × 10 4 or less, and still more preferably 4 × 10 4 or more 7 × 10 4 the following. When the weight average molecular weight is 5 × 10 3 or more, the adhesion of the auxiliary plates to each other (hereinafter, also simply referred to as “adhesion”) is more suppressed, and the operability of the auxiliary plates tends to be more improved. In addition, when the weight average molecular weight is 1 × 10 5 or less, the dischargeability of cutting chips during drilling is improved, the accuracy of the hole position is further improved, and the breakage of the drill tends to be more suppressed. The weight average molecular weight of the polyolefin resin (A) can be measured using a GPC column according to a conventional method, and using polystyrene as a standard substance.

樹脂組成物之層中之聚烯烴樹脂(A)之含量,係考量使用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機進行開孔加工時之孔位置精度及該微細直徑鑽孔加工用之鑽機之耐鑽頭折損性之平衡之觀點而規定。聚烯烴樹脂(A)之含量,相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份,為15質量份以上25質量份以下,較佳為20質量份以上25質量份以下。藉由聚烯烴樹脂(A)之含量為15質量份以上,金屬箔與樹脂組成物之層的黏著強度更為改善,故開孔加工時成為孔位置精度不良、鑽機折損之原因的樹脂組成物之層之剝離更受到抑制。因此,孔位置精度增進,耐鑽頭折損性更為改善。另一方面,藉由聚烯烴樹脂(A)之含量為25質量份以下,可將樹脂組成物之層中之低分子水溶性潤滑劑(B)及水溶性樹脂(C)之含量調整為會達成對於鑽孔加工為充分的潤滑性之量,故開孔加工時之孔位置精度與耐鑽頭折損性優異。尤其,藉由聚烯烴樹脂(A)之含量為20質量份以上25質量份以下,金屬箔與樹脂組成物之層的黏著強度、及開孔加工時之孔位置精度、耐鑽頭折損性皆優異。The content of the polyolefin resin (A) in the layer of the resin composition is determined by considering the position accuracy of the hole when using a drill with a diameter of 0.075 mm or less for drilling and the diameter of the fine diameter for drilling. It is stipulated from the viewpoint of the balance of the drill bit break resistance. The content of the polyolefin resin (A) is 15 mass parts or more and 25 mass parts or less based on 100 mass parts of the total of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C). It is preferably 20 parts by mass or more and 25 parts by mass or less. When the content of the polyolefin resin (A) is 15 parts by mass or more, the adhesive strength of the layer of the metal foil and the resin composition is further improved. Therefore, the resin composition is caused by poor hole position accuracy and drill breakage during hole-opening processing. The peeling of the layer is more suppressed. Therefore, the accuracy of the hole position is improved, and the resistance to drill breakage is further improved. On the other hand, when the content of the polyolefin resin (A) is 25 parts by mass or less, the content of the low-molecular-weight water-soluble lubricant (B) and the water-soluble resin (C) in the layer of the resin composition can be adjusted to Achieving sufficient lubricity for drilling, the hole position accuracy and drill breakage resistance during drilling are excellent. In particular, when the content of the polyolefin resin (A) is 20 parts by mass or more and 25 parts by mass or less, the adhesive strength of the layer of the metal foil and the resin composition, the position accuracy of the hole during the drilling process, and the resistance to drill breakage are excellent. .

係為均聚物之聚烯烴樹脂(A)之製造方法不特別限制,可使用以往公知的方法。又,係為共聚物之聚烯烴樹脂(A)之製造方法亦不特別限制,可使用依以往公知的方法使烯烴單體與共聚單體進行聚合之方法。例如就上述烯烴-不飽和羧酸共聚物之製造方法而言,不特別限定,可使乙烯單體、丙烯單體等烯烴單體與不飽和羧酸系單體進行共聚合反應並製造。The manufacturing method of the polyolefin resin (A) which is a homopolymer is not specifically limited, A conventionally well-known method can be used. The method for producing the polyolefin resin (A) which is a copolymer is not particularly limited, and a method of polymerizing an olefin monomer and a comonomer by a conventionally known method can be used. For example, the method for producing the above-mentioned olefin-unsaturated carboxylic acid copolymer is not particularly limited, and an olefin monomer such as an ethylene monomer and a propylene monomer can be copolymerized with an unsaturated carboxylic acid monomer and produced.

(低分子水溶性潤滑劑(B)) 低分子水溶性潤滑劑(B)之含量,相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份,為5質量份以上40質量份以下,較佳為10質量份以上35質量份以下,更佳為10質量份以上30質量份以下。藉由低分子水溶性潤滑劑(B)之含量為5質量份以上,鑽孔加工時之樹脂組成物之層之潤滑性更為改善,孔位置精度及/或耐鑽頭折損性更為增進。藉由低分子水溶性潤滑劑(B)之含量為40質量份以下,可抑制黏連之發生,操作性更為改善。(Low-molecular-weight water-soluble lubricant (B)) The content of the low-molecular-weight water-soluble lubricant (B) is relative to that of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C). A total of 100 parts by mass is 5 to 40 parts by mass, preferably 10 to 35 parts by mass, more preferably 10 to 30 parts by mass. When the content of the low-molecular-weight water-soluble lubricant (B) is 5 parts by mass or more, the lubricity of the resin composition layer during the drilling process is further improved, and the hole position accuracy and / or the drill bit breakage resistance are further improved. When the content of the low-molecular-weight water-soluble lubricant (B) is 40 parts by mass or less, occurrence of blocking can be suppressed, and workability is further improved.

低分子水溶性潤滑劑(B)之重量平均分子量宜為6×102 以上2.5×103 以下。藉由低分子水溶性潤滑劑(B)之重量平均分子量為6×102 以上,有可抑制黏連之發生,操作性更為改善之傾向。藉由低分子水溶性潤滑劑(B)之重量平均分子量為2.5×103 以下,有樹脂組成物之層之潤滑性更為改善,孔位置精度更為增進,耐鑽頭折損性更為改善之傾向。The weight-average molecular weight of the low-molecular-weight water-soluble lubricant (B) is preferably 6 × 10 2 or more and 2.5 × 10 3 or less. When the weight-average molecular weight of the low-molecular-weight water-soluble lubricant (B) is 6 × 10 2 or more, the occurrence of blocking can be suppressed, and the workability tends to be further improved. With the weight-average molecular weight of the low-molecular-weight water-soluble lubricant (B) being 2.5 × 10 3 or less, the lubricity of the layer with the resin composition is further improved, the accuracy of the hole position is further improved, and the resistance to drill breakage is further improved. tendency.

低分子水溶性潤滑劑(B)不特別限制,例如宜為選自於由下列之物質構成之群組中之1種或2種以上:聚乙二醇、聚四亞甲基二醇等甘醇化合物;聚氧乙烯油醚、聚氧乙烯鯨蠟醚、聚氧乙烯硬脂醚、聚氧乙烯月桂醚、聚氧乙烯壬基苯醚、聚氧乙烯辛基苯醚等聚氧乙烯之單醚化合物;聚氧乙烯單月桂酸酯、聚氧乙烯單硬脂酸酯、聚氧乙烯單油酸酯、聚氧乙烯二硬脂酸酯、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐單油酸酯、聚甘油單硬脂酸酯化合物、聚氧乙烯丙烯共聚物、及它們的衍生物;更佳為聚氧乙烯單月桂酸酯、聚氧乙烯單硬脂酸酯、聚氧乙烯單油酸酯、聚氧乙烯二硬脂酸酯、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐單油酸酯,其中,又以聚氧乙烯單硬脂酸酯為較佳。該等化合物可單獨使用1種,也可將2種以上組合使用。The low-molecular-weight water-soluble lubricant (B) is not particularly limited. For example, it is preferably one or two or more selected from the group consisting of polyethylene glycol, polytetramethylene glycol, and the like. Alcohol compounds; polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, etc. Ether compounds; polyoxyethylene monolaurate, polyoxyethylene monostearate, polyoxyethylene monooleate, polyoxyethylene distearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene Ethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate, polyglycerol monostearate compounds, polyoxyethylene propylene copolymers, and their derivatives; more preferably polyoxyethylene monostearate Lauric acid ester, polyoxyethylene monostearate, polyoxyethylene monooleate, polyoxyethylene distearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monostearate Acid esters, polyoxyethylene sorbitan monooleate, and polyoxyethylene monostearate is preferred. These compounds may be used individually by 1 type, and may be used in combination of 2 or more type.

低分子水溶性潤滑劑(B)也可使用市售品。作為低分子水溶性潤滑劑(B)之市售品,可例示日油(股)公司製NONION S15.4(聚氧乙烯單硬脂酸酯,重量平均分子量1,540)。A commercially available low molecular weight water-soluble lubricant (B) can also be used. As a commercially available product of the low-molecular-weight water-soluble lubricant (B), NONION S15.4 (polyoxyethylene monostearate, weight average molecular weight 1,540) manufactured by Nippon Oil Co., Ltd. can be exemplified.

(水溶性樹脂(C)) 水溶性樹脂(C)含有高分子量水溶性樹脂(c-1)與中分子量水溶性樹脂(c-2)。如此之水溶性樹脂(C)只要為水溶性的樹脂即可,不特別限定,宜為選自於由聚環氧乙烷、聚環氧丙烷、聚乙烯基吡咯烷酮、纖維素衍生物、聚乙二醇、聚丙二醇、聚四亞甲基二醇、聚氧乙烯之單醚化合物、聚氧乙烯單硬脂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚甘油單硬脂酸酯化合物、聚環氧乙烷-聚環氧丙烷共聚物、及它們的衍生物構成之群組中之1種或2種以上。藉由使用如此的水溶性樹脂(C),樹脂組成物之層之成型性及作為輔助板之潤滑材之效果有更為改善之傾向。另外,「水溶性的樹脂」係指在25℃、1大氣壓相對於水100g溶解1g以上之樹脂。(Water-soluble resin (C)) The water-soluble resin (C) contains a high-molecular-weight water-soluble resin (c-1) and a medium-molecular-weight water-soluble resin (c-2). Such a water-soluble resin (C) is not particularly limited as long as it is a water-soluble resin, and is preferably selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, cellulose derivatives, and polyethylene. Diols, polypropylene glycols, polytetramethylene glycols, monoether compounds of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyglycerol monostearate One or two or more of the group consisting of compounds, polyethylene oxide-polypropylene oxide copolymers, and their derivatives. By using such a water-soluble resin (C), the moldability of the layer of a resin composition and the effect as a lubricating material of an auxiliary board tend to improve more. The "water-soluble resin" means a resin that dissolves 1 g or more with respect to 100 g of water at 25 ° C and 1 atmosphere.

水溶性樹脂(C)之含量,係考量使用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機進行開孔加工時之孔位置精度及該微細直徑鑽孔加工用之鑽機之耐鑽頭折損性之平衡之觀點而規定。水溶性樹脂(C)之含量,相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份,為35質量份以上80質量份以下,較佳為35質量份以上60質量份以下。藉由水溶性樹脂(C)之含量為35質量份以上,可形成均勻的樹脂組成物之層,可賦予樹脂組成物之層對於鑽孔加工為充分的潤滑性。因此,鑽孔加工時之孔位置精度更為增進。另一方面,藉由水溶性樹脂(C)之含量為80質量份以下,相應於此會使樹脂組成物之層中之聚烯烴樹脂(A)之含量增大,結果金屬箔與樹脂組成物之層的黏著強度更為改善,鑽孔加工時之孔位置精度、耐鑽頭折損性優異。The content of the water-soluble resin (C) refers to the accuracy of the hole position when drilling with a drill with a fine diameter of 0.075 mm or less and the resistance to the breakage of the drill bit. Stipulated in terms of balance. The content of the water-soluble resin (C) is 35 mass parts or more and 80 mass parts or less based on 100 mass parts of the total of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C). It is preferably 35 parts by mass or more and 60 parts by mass or less. When the content of the water-soluble resin (C) is 35 parts by mass or more, a layer of a uniform resin composition can be formed, and the layer of the resin composition can be provided with sufficient lubricity for drilling processing. Therefore, the accuracy of the hole position during drilling is further improved. On the other hand, when the content of the water-soluble resin (C) is 80 parts by mass or less, the content of the polyolefin resin (A) in the layer of the resin composition is increased accordingly, and as a result, the metal foil and the resin composition The adhesive strength of the layer is further improved, and the hole position accuracy and drill bit breakage resistance during drilling are excellent.

高分子量水溶性樹脂(c-1)之種類不特別限定,宜為選自於由聚環氧乙烷、聚環氧丙烷、聚乙烯基吡咯烷酮、及纖維素衍生物構成之群組中之1種或2種以上,其中,又以聚乙烯基吡咯烷酮為特佳。該等化合物可單獨使用1種,也可將2種以上組合使用。該等化合物具有板片形成性,故使用該等化合物可使本發明之鑽孔加工用之輔助板之樹脂組成物之層的組成、厚度為均勻。The type of the high-molecular-weight water-soluble resin (c-1) is not particularly limited, but is preferably selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, and cellulose derivatives. One or two or more of them, and polyvinylpyrrolidone is particularly preferred. These compounds may be used individually by 1 type, and may be used in combination of 2 or more type. These compounds have plate-forming properties, so the use of these compounds can make the composition and thickness of the layer of the resin composition of the auxiliary plate for drilling processing of the present invention uniform.

高分子量水溶性樹脂(c-1)之重量平均分子量為6×104 以上1.5×106 以下的話,製造鑽孔加工用之輔助板時之樹脂組成物之層之製膜性會特別良好,故較理想。If the weight average molecular weight of the high molecular weight water-soluble resin (c-1) is 6 × 10 4 or more and 1.5 × 10 6 or less, the film forming property of the resin composition layer when manufacturing the auxiliary plate for drilling processing is particularly good. It is more ideal.

樹脂組成物之層中之高分子量水溶性樹脂(c-1)之含量只要為上述樹脂組成物之層中之水溶性樹脂(C)之含量之範圍內即可,不特別限定,相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份,宜為5質量份以上30質量份以下,更佳為5質量份以上20質量份以下,又更佳為5質量份以上10質量份以下。藉由高分子量水溶性樹脂(c-1)之含量為上述範圍內,可賦予樹脂組成物之層對於鑽孔加工為充分的潤滑性,而且有金屬箔與樹脂組成物之層的黏著強度更為改善,鑽孔加工時之孔位置精度、耐鑽頭折損性優異之傾向。The content of the high-molecular-weight water-soluble resin (c-1) in the layer of the resin composition is not particularly limited as long as it is within the range of the content of the water-soluble resin (C) in the layer of the resin composition. The total amount of the olefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C) is 100 parts by mass, preferably 5 parts by mass or more and 30 parts by mass, and more preferably 5 parts by mass or more and 20 parts by mass Hereinafter, it is more preferably 5 parts by mass or more and 10 parts by mass or less. When the content of the high-molecular-weight water-soluble resin (c-1) is within the above range, the layer of the resin composition can be provided with sufficient lubricity for drilling, and the adhesion strength of the layer having the metal foil and the resin composition is further improved. In order to improve, the hole position accuracy and drill breakage resistance during the drilling process tend to be excellent.

前述中分子量水溶性樹脂(c-2)不特別限制,例如可使用聚乙二醇、聚丙二醇、聚四亞甲基二醇等甘醇化合物;聚氧乙烯油醚、聚氧乙烯鯨蠟醚、聚氧乙烯硬脂醚、聚氧乙烯月桂醚、聚氧乙烯壬基苯醚、聚氧乙烯辛基苯醚等聚氧乙烯之單醚化合物;聚氧乙烯單硬脂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚甘油單硬脂酸酯化合物、聚氧乙烯丙烯共聚物、及它們的衍生物、聚乙烯基吡咯烷酮等。該等化合物、共聚物可單獨使用1種,也可將2種以上組合使用。藉由使用該等化合物,本發明之鑽孔加工用之輔助板可在鑽孔加工時充分地發揮潤滑性之效果。The aforementioned medium molecular weight water-soluble resin (c-2) is not particularly limited, and for example, a glycol compound such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol can be used; polyoxyethylene oleyl ether, polyoxyethylene cetyl ether , Polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, and other polyoxyethylene monoether compounds; polyoxyethylene monostearate, polyoxyethylene Sorbitan monostearate, polyglycerol monostearate compounds, polyoxyethylene propylene copolymers, their derivatives, polyvinylpyrrolidone, and the like. These compounds and copolymers may be used individually by 1 type, and may be used in combination of 2 or more type. By using these compounds, the auxiliary plate for drilling processing of the present invention can sufficiently exhibit the lubricity effect during the drilling processing.

中分子量水溶性樹脂(c-2)之重量平均分子量為3×103 以上5×104 以下的話,則鑽孔加工時之潤滑性之效果優異,故較理想。If the weight average molecular weight of the medium molecular weight water-soluble resin (c-2) is 3 × 10 3 or more and 5 × 10 4 or less, the effect of lubricity during drilling is excellent, which is preferable.

樹脂組成物之層中之中分子量水溶性樹脂(c-2)之含量只要為上述樹脂組成物之層中之水溶性樹脂(C)之含量之範圍內即可,不特別限定,相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份,宜為35質量份以上65質量份以下,更佳為40質量份以上60質量份以下,又更佳為45質量份以上60質量份以下。藉由中分子量水溶性樹脂(c-2)之含量為前述範圍,有金屬箔與樹脂組成物之層的黏著強度、及開孔加工時之孔位置精度、耐鑽頭折損性皆優異之傾向。The content of the molecular weight water-soluble resin (c-2) in the layer of the resin composition is not particularly limited as long as it is within the range of the content of the water-soluble resin (C) in the layer of the resin composition. The total amount of the olefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin (C) is 100 parts by mass, preferably 35 parts by mass or more and 65 parts by mass, and more preferably 40 parts by mass or more and 60 parts by mass Hereinafter, it is more preferably 45 parts by mass or more and 60 parts by mass or less. When the content of the medium-molecular-weight water-soluble resin (c-2) is in the foregoing range, the adhesive strength of the layer of the metal foil and the resin composition, the hole position accuracy during the hole-cutting process, and the drill breakage resistance tend to be excellent.

中分子量水溶性樹脂(c-2)之含量相對於高分子量水溶性樹脂(c-1)之含量之比率宜為3~10,更佳為4~9,又更佳為5~8,特佳為5~7。藉由中分子量水溶性樹脂(c-2)之含量相對於高分子量水溶性樹脂(c-1)之含量之比率為上述範圍內,金屬箔與樹脂組成物之層的黏著強度、及開孔加工時之孔位置精度、耐鑽頭折損性之平衡有更為改善之傾向。The ratio of the content of the medium molecular weight water-soluble resin (c-2) to the content of the high molecular weight water-soluble resin (c-1) is preferably 3 to 10, more preferably 4 to 9, and still more preferably 5 to 8. It is preferably 5 ~ 7. When the ratio of the content of the medium-molecular-weight water-soluble resin (c-2) to the content of the high-molecular-weight water-soluble resin (c-1) is within the above range, the adhesive strength of the metal foil and the layer of the resin composition, and openings The balance of hole position accuracy and drill bit breakage resistance during processing tends to be more improved.

(其它成分) 樹脂組成物之層,視需要也可含有添加劑。添加劑之種類不特別限定,例如可列舉:表面調整劑、塗平劑、抗靜電劑、乳化劑、消泡劑、蠟添加劑、偶聯劑、流變控制劑、防腐劑、防黴劑、抗氧化劑、光穩定劑、甲酸鈉等成核劑、有機填料、無機填料、熱穩定化劑、及著色劑。(Other components) The layer of the resin composition may contain additives if necessary. The type of the additive is not particularly limited, and examples thereof include a surface conditioner, a leveling agent, an antistatic agent, an emulsifier, an antifoaming agent, a wax additive, a coupling agent, a rheology control agent, a preservative, a mold inhibitor, and an anti- Oxidants, light stabilizers, nucleating agents such as sodium formate, organic fillers, inorganic fillers, thermal stabilizers, and coloring agents.

(樹脂組成物之層之厚度) 樹脂組成物之層之厚度,可依鑽孔加工時使用之鑽頭徑、加工之開孔對象物(例如疊層板或多層板等印刷電路板材料)之構成等適當地選擇。如此的樹脂組成物之層之厚度宜為0.02~0.3mm,更佳為0.02~0.2mm。藉由樹脂組成物之層之厚度為0.02mm以上,會獲得更充分的潤滑效果,減輕對於鑽頭之負荷,故有更能抑制鑽頭折損之傾向。又,藉由樹脂組成物之層之厚度為0.3mm以下,能抑制樹脂組成物向鑽頭捲附。(Thickness of the layer of the resin composition) The thickness of the layer of the resin composition can be determined according to the diameter of the drill used in the drilling process and the object to be processed (such as a printed circuit board material such as a laminated board or a multilayer board). Etc. Choose appropriately. The thickness of the layer of such a resin composition is preferably 0.02 to 0.3 mm, and more preferably 0.02 to 0.2 mm. When the thickness of the layer of the resin composition is 0.02 mm or more, a more sufficient lubricating effect will be obtained, and the load on the drill bit will be reduced, so the tendency of the drill bit to break can be more suppressed. In addition, when the thickness of the layer of the resin composition is 0.3 mm or less, the resin composition can be prevented from being wrapped around the drill.

[鑽孔加工用之輔助板之製造方法] 本實施形態之鑽孔加工用之輔助板之製造方法不特別限定,只要為在金屬箔上形成樹脂組成物之層之方法即可,可使用一般的製造方法。[Manufacturing method of auxiliary plate for drilling processing] The manufacturing method of auxiliary plate for drilling processing of this embodiment is not particularly limited, as long as it is a method for forming a layer of a resin composition on a metal foil, a general method may be used Manufacturing method.

形成樹脂組成物之層之方法不特別限定,可使用公知的方法。作為如此之方法,例如可列舉將聚烯烴樹脂(A)之水分散體、低分子水溶性潤滑劑(B)、水溶性樹脂(C)、及視需要而添加之添加劑溶解或分散於溶劑而得之樹脂組成物之溶液利用塗佈法等方法塗覆於金屬箔上,再使其乾燥及/或使其冷卻固化之方法。The method for forming the layer of the resin composition is not particularly limited, and a known method can be used. Examples of such a method include dissolving or dispersing an aqueous dispersion of a polyolefin resin (A), a low-molecular-weight water-soluble lubricant (B), a water-soluble resin (C), and additives added as necessary in a solvent, The solution of the obtained resin composition is applied to a metal foil by a method such as a coating method, and then dried and / or cooled and solidified.

利用塗佈法等將樹脂組成物之溶液塗覆於金屬箔上並使其乾燥而形成樹脂組成物之層時,樹脂組成物之溶液中所使用之溶劑宜為由水與沸點比水低的溶劑構成之混合溶液。使用由水與沸點比水低的溶劑構成之混合溶液可有效地減少樹脂組成物之層中之殘留氣泡。沸點比水低的溶劑之種類不特別限定,例如可列舉乙醇、甲醇、異丙醇等醇化合物,也可使用甲乙酮、丙酮等低沸點溶劑。就其它溶劑而言,可使用在水、醇化合物中混合一部分與樹脂組成物之相容性高的四氫呋喃、乙腈而得之溶劑等。When a solution of a resin composition is coated on a metal foil by a coating method or the like and dried to form a layer of the resin composition, the solvent used in the solution of the resin composition is preferably a mixture of water and a lower boiling point than water. A mixed solution consisting of solvents. The use of a mixed solution composed of water and a solvent having a lower boiling point than water can effectively reduce residual air bubbles in the layer of the resin composition. The type of the solvent having a lower boiling point than water is not particularly limited, and examples thereof include alcohol compounds such as ethanol, methanol, and isopropanol, and low boiling point solvents such as methyl ethyl ketone and acetone may also be used. As for other solvents, solvents such as tetrahydrofuran and acetonitrile, which are highly compatible with the resin composition, are mixed in water and alcohol compounds.

另外,製造鑽孔加工用之輔助板時之聚烯烴樹脂(A)之態樣,亦即形成樹脂組成物之層時之聚烯烴樹脂(A)之態樣不特別限定,宜為水分散體之態樣。聚烯烴樹脂(A)之水分散體之製造方法不特別限定,可使用公知的方法。例如,可列舉使用固液攪拌裝置等將上述烯烴-不飽和羧酸共聚物、水性溶劑、及視需要添加之鹼、乳化劑等其它成分予以攪拌之方法。In addition, the state of the polyolefin resin (A) when manufacturing an auxiliary plate for drilling processing, that is, the state of the polyolefin resin (A) when forming a layer of a resin composition is not particularly limited, and it is preferably an aqueous dispersion Like this. The manufacturing method of the aqueous dispersion of a polyolefin resin (A) is not specifically limited, A well-known method can be used. For example, a method of stirring other components such as the above-mentioned olefin-unsaturated carboxylic acid copolymer, an aqueous solvent, and optionally added alkalis, emulsifiers, etc. using a solid-liquid stirring device can be mentioned.

製造聚烯烴樹脂(A)之水分散體時使用之鹼不特別限定,例如可列舉氨、二乙胺、三乙胺、單乙醇胺、二甲基乙醇胺、二乙基乙醇胺等胺化合物、氫氧化鈉、氫氧化鉀等鹼金屬氫氧化物等,但考量後述製備用以形成樹脂組成物之層之樹脂組成物之溶液時與溶劑之相容性之觀點,氨、二乙胺、三乙胺、單乙醇胺、二甲基乙醇胺、二乙基乙醇胺較佳,氨特佳。The alkali used when producing the aqueous dispersion of the polyolefin resin (A) is not particularly limited, and examples thereof include amine compounds such as ammonia, diethylamine, triethylamine, monoethanolamine, dimethylethanolamine, and diethylethanolamine, and hydroxide Alkali metal hydroxides such as sodium, potassium hydroxide, etc., but considering the compatibility with solvents when preparing a solution of a resin composition for forming a resin composition layer described later, ammonia, diethylamine, and triethylamine Monoethanolamine, dimethylethanolamine, and diethylethanolamine are preferred, and ammonia is particularly preferred.

製造聚烯烴樹脂(A)之水分散體時使用之乳化劑不特別限定,例如可列舉硬脂酸、月桂酸、十三酸、肉豆蔻酸、棕櫚酸等飽和脂肪酸、次亞麻油酸(linolenic acid)、亞麻油酸(linoleic acid)、油酸等不飽和脂肪酸,但考量與水性溶劑之相容性、耐氧化性之觀點,硬脂酸較佳。The emulsifier used in the production of the aqueous dispersion of the polyolefin resin (A) is not particularly limited, and examples thereof include saturated fatty acids such as stearic acid, lauric acid, tridecanoic acid, myristic acid, and palmitic acid, and linolenic acid. Unsaturated fatty acids such as acid, linoleic acid, and oleic acid, but from the viewpoint of compatibility with aqueous solvents and oxidation resistance, stearic acid is preferred.

聚烯烴樹脂(A)之水分散體也可使用市售品。作為聚烯烴樹脂(A)之水分散體之市售品,可例示東邦化學工業(股)公司製HITECH S3121(乙烯-丙烯酸共聚物,重量平均分子量6×104 ,來自乙烯之構成單元數與來自丙烯酸之構成單元數之比=90:10,摻合氨作為鹼並摻合硬脂酸作為乳化劑)。As the aqueous dispersion of the polyolefin resin (A), a commercially available product can also be used. As a commercially available product of an aqueous dispersion of a polyolefin resin (A), HITECH S3121 (ethylene-acrylic acid copolymer, weight average molecular weight 6 × 10 4 ) produced by Toho Chemical Industry Co., Ltd. can be exemplified. The ratio of the number of constituent units derived from acrylic acid = 90: 10, with ammonia as the base and stearic acid as the emulsifier).

[用途] 將本實施形態之鑽孔加工用之輔助板用於疊層板或多層板之鑽孔加工的話,會更有效且確實地發揮本發明之目的,故較理想。另外,就疊層板而言,一般常使用「覆銅疊層板」,但本實施形態之疊層板也可為「在外層沒有銅箔之疊層板」。本實施形態中除非特別說明,否則疊層板係指「覆銅疊層板」及/或「在外層沒有銅箔之疊層板」。又,該鑽孔加工為利用直徑(鑽頭徑)0.075mmφ以下之鑽頭所為之鑽孔加工的話,能更有效且確實地發揮本發明之目的。尤其,若為直徑0.05mmφ以上0.075mmφ以下,甚而孔位置精度與耐鑽頭折損性變得重要之直徑0.05mmφ以上0.06mmφ以下之小徑之鑽頭用途的話,就大幅增進孔位置精度及耐鑽頭折損性之觀點為適合。另外,0.05mmφ之鑽頭徑為可取得的鑽頭徑之下限,若能取得更小徑之鑽頭則無上述限制。又,即便在使用直徑超過0.075mmφ之鑽頭之鑽孔加工中採用本實施形態之鑽孔加工用之輔助板也沒有問題。[Application] The use of the auxiliary plate for drilling in the present embodiment for drilling of a laminated board or a multilayer board is more effective and reliable in achieving the object of the present invention, so it is preferable. In addition, as for a laminated board, a "copper-clad laminated board" is generally used, but the laminated board of this embodiment may also be a "laminated board without a copper foil on the outer layer". In this embodiment, unless otherwise specified, a laminated board means a "copper-clad laminated board" and / or a "laminated board without a copper foil on the outer layer". In addition, if the drilling is performed by using a drill having a diameter (drill diameter) of 0.075 mmφ or less, the object of the present invention can be more effectively and reliably achieved. In particular, if the diameter is 0.05mmφ to 0.075mmφ or less, and even a small-diameter drill with a diameter of 0.05mmφ to 0.06mmφ becomes important, hole position accuracy and drill breakage resistance will be greatly improved. Sexuality is appropriate. In addition, the drill diameter of 0.05mmφ is the lower limit of the drill diameter that can be obtained, and there is no such limitation if a smaller diameter drill can be obtained. In addition, there is no problem even if the auxiliary plate for drilling is used in the drilling process using a drill having a diameter exceeding 0.075 mmφ.

本實施形態之鑽孔加工用之輔助板,可適用在例如對印刷電路板材料,更具體而言,對疊層板或多層板進行鑽孔加工之時。具體而言,可至少在重疊1片或多片之疊層板或多層板而得者(印刷電路板材料)之最頂面,以使金屬箔側接觸印刷電路板材料之方式配置鑽孔加工用之輔助板,並從該輔助板之頂面(樹脂組成物之層側)進行鑽孔加工。The auxiliary board for drilling processing according to this embodiment can be applied, for example, when drilling a printed circuit board material, more specifically, a laminated board or a multilayer board. Specifically, the drilling process can be arranged at least on the top surface of the laminated board or multilayer board (printed circuit board material) obtained by overlapping one or more sheets, so that the metal foil side contacts the printed circuit board material. The auxiliary plate is used, and drilling is performed from the top surface (layer side of the resin composition) of the auxiliary plate.

[鑽孔加工方法] 本實施形態之鑽孔加工方法,具有下列步驟:使用上述微細直徑鑽孔加工用之輔助板,利用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機在疊層板或多層板形成孔。此時,如圖1,可使鑽機3從鑽孔加工用之輔助板之樹脂組成物之層1側侵入,也可使鑽機3從金屬箔2側侵入。 [實施例][Drilling processing method] The drilling processing method of this embodiment has the following steps: using the above-mentioned auxiliary plate for micro-diameter drilling processing, and using a drilling machine for micro-diameter drilling processing with a diameter of 0.075 mm or less on a laminated plate or The multilayer board forms a hole. At this time, as shown in FIG. 1, the drilling rig 3 can be penetrated from the layer 1 side of the resin composition of the auxiliary plate for drilling processing, and the drilling rig 3 can be penetrated from the metal foil 2 side. [Example]

以下,對比落在本發明之範圍外之比較例來說明本發明之實施例之效果。另外,「聚乙二醇」有時簡稱為「PEG」,「聚環氧乙烷」有時簡稱為「PEO」。Hereinafter, the effects of the embodiments of the present invention will be described by comparing comparative examples that fall outside the scope of the present invention. In addition, "polyethylene glycol" is sometimes abbreviated as "PEG", and "polyethylene oxide" is sometimes abbreviated as "PEO".

以下,針對實施例及比較例中之黏著性之測定方法、孔位置精度之測定方法、耐鑽頭折損性之評價方法進行說明。Hereinafter, the methods for measuring the adhesion, the methods for measuring the accuracy of hole positions, and the methods for evaluating the resistance to drill breakage in the examples and comparative examples will be described.

<黏著性之評價> 以如下方式評價樹脂組成物之層之黏著性。將實施例及比較例中製得之鑽孔加工用之輔助板以使其樹脂組成物之層在上的方式配置於重疊的覆銅疊層板上,並進行10000次之鑽孔加工。以目視確認鑽孔加工後之樹脂組成物之層有/無剝離。<Evaluation of tackiness> The tackiness of the resin composition layer was evaluated as follows. The auxiliary plates for drilling processing prepared in the examples and comparative examples were arranged on the copper-clad laminated board so that the resin composition layer was on top, and 10,000 times of drilling processing was performed. The presence / absence of peeling of the resin composition layer after the drilling process was visually confirmed.

<孔位置精度之測定> 以如下方式測定孔位置精度。將實施例及比較例中製得之鑽孔加工用之輔助板以使其樹脂組成物之層在上之方式配置於重疊的覆銅疊層板上,並進行預定次數之鑽孔加工。針對在預定次數之鑽孔中直到鑽頭折損為止所加工而得之鑽孔全部,使用孔洞分析儀(型號:HA-1AM,Hitachi viamechanics(股)公司製)測定重疊的覆銅疊層板之最下板之背面(底面)的孔位置與指定座標間之偏離。就每1根鑽頭之鑽孔份量,針對其偏離計算平均值及標準偏差(σ),並算出「平均值+3σ」。然後,針對所使用的n根鑽頭算出對各「平均值+3σ」之值的平均值,以作為鑽孔加工整體之孔位置精度。用於算出孔位置精度之算式如下。 【數1】(在此,n表示所使用之鑽頭之根數。)<Measurement of Hole Position Accuracy> The hole position accuracy was measured as follows. The auxiliary plates for drilling processing obtained in the examples and comparative examples were arranged on the overlapping copper-clad laminates so that the layers of the resin composition thereof were on top, and a predetermined number of drilling operations were performed. A hole analyzer (model: HA-1AM, manufactured by Hitachi viamechanics (Co., Ltd.)) was used to measure the maximum number of overlapping copper-clad laminates for all the drilled holes that were processed until the drill bit was broken in a predetermined number of drilled holes. The deviation between the hole position on the back (bottom) of the lower plate and the designated coordinates. For the amount of drilling per one drill bit, calculate the average and standard deviation (σ) for the deviation, and calculate "average + 3σ". Then, an average value of the values of each "average value + 3σ" is calculated for the n drills to be used as the hole position accuracy of the entire drilling process. The calculation formula used to calculate the hole position accuracy is as follows. [Number 1] (Here, n is the number of drill bits used.)

針對孔位置精度,若在預定次數之開孔加工中加工孔數增加的話,則鑽頭之前端刃之磨耗加劇而鑽頭之向芯性降低,「平均值+3σ」有增大之傾向。是以,若加工孔數少亦即耐鑽頭折損性差的話,則孔位置精度有變小之傾向。Regarding the accuracy of the hole position, if the number of holes to be processed increases in a predetermined number of holes, the abrasion of the front edge of the drill bit will increase and the core's coreness will decrease. The "average value + 3σ" tends to increase. Therefore, if the number of holes to be processed is small, that is, the resistance to drill breakage is poor, the accuracy of the hole position tends to decrease.

<耐鑽頭折損性之評價> 以如下方式評價耐鑽頭折損性。將實施例及比較例中製得之鑽孔加工用之輔助板以使其樹脂組成物之層在上之方式配置於重疊的覆銅疊層板上,並進行預定次數之鑽孔加工。使用孔洞分析儀(型號:HA-1AM、Hitachi viamechanics(股)公司製)測定在預定次數之鑽孔加工中每1根鑽頭直到鑽頭折損為止之鑽孔數,算出其平均值,並將該平均值定義為「加工孔數」。用於算出加工孔數之算式如下。 【數2】(在此,n表示所使用之鑽頭之根數。)<Evaluation of bit break resistance> The bit break resistance was evaluated as follows. The auxiliary plates for drilling processing obtained in the examples and comparative examples were arranged on the overlapping copper-clad laminates so that the layers of the resin composition thereof were on top, and a predetermined number of drilling operations were performed. A hole analyzer (model: HA-1AM, manufactured by Hitachi viamechanics Co., Ltd.) was used to measure the number of drilled holes per drill until the drill was broken in a predetermined number of drilling operations, and calculated the average value. The value is defined as "number of machined holes". The formula used to calculate the number of processed holes is as follows. [Number 2] (Here, n is the number of drill bits used.)

用以測定實施例及比較例之孔位置精度、加工孔數、耐鑽頭折損性之開孔加工條件如下。在重疊6片厚度0.04mm之覆銅疊層板(商品名:HL832NS-L,銅箔厚度5μm,兩面板,三菱瓦斯化學(股)公司製)而得者之頂面配置鑽孔加工用之輔助板,使該輔助板之樹脂組成物之層側成為頂面,並在重疊的覆銅疊層板的最下板的背面(底面)配置厚度1.5mm之抵接板(紙苯酚疊層板PS1160-G,利昌(股)公司製)。使用0.06mmφ鑽頭(Uniontool(股)公司製),於轉速:330,000rpm、遞送速度:2.64m/min進行開孔。開孔係使用6根鑽頭,每根鑽頭各進行10,000孔之開孔。針對10,000孔當中直到鑽頭折損為止所加工而得之孔全部進行孔位置精度之評價。The conditions for hole processing used to determine the hole position accuracy, number of holes processed, and resistance to drill breakage in the examples and comparative examples are as follows. The top surface of the copper clad laminate (trade name: HL832NS-L, copper foil thickness 5 μm, two panels, manufactured by Mitsubishi Gas Chemical Co., Ltd.) with 6 pieces of 0.04 mm thickness is arranged for drilling. Auxiliary plate with the resin composition layer side of the auxiliary plate as the top surface, and abutment plate (paper phenol laminated plate) with a thickness of 1.5 mm is arranged on the back (bottom surface) of the lowermost plate of the overlapped copper-clad laminated plate PS1160-G, made by Lichang Co., Ltd.). A 0.06 mmφ drill (manufactured by Uniontool Co., Ltd.) was used, and holes were opened at a rotation speed of 330,000 rpm and a delivery speed of 2.64 m / min. The drilling system uses 6 drills, and each drill has 10,000 holes. The hole position accuracy was evaluated for all the holes processed until the drill was broken out of 10,000 holes.

<原材料> 表1顯示製造實施例及比較例之鑽孔加工用之輔助板時使用的原材料。<Raw Materials> Table 1 shows the raw materials used in manufacturing the auxiliary plate for drilling in the working examples and comparative examples.

[表1] [Table 1]

表2顯示聚烯烴樹脂(A)之規格。聚烯烴樹脂(A)為水分散體,水分散體中之樹脂固體成分之量(質量%)如下。又,使用之聚烯烴樹脂(A)為乙烯-丙烯酸共聚物,其來自乙烯之構成單元數(m)與來自(甲基)丙烯酸之構成單元數(n)之比(m:n)、及重量平均分子量如下所示。另外,比(m:n)係由屬於核磁共振分光法的1 H-NMR法與DQF-COSY法算出。重量平均分子量依後述之方法測定。Table 2 shows the specifications of the polyolefin resin (A). The polyolefin resin (A) is an aqueous dispersion, and the amount (mass%) of the resin solid content in the aqueous dispersion is as follows. The polyolefin resin (A) used is an ethylene-acrylic acid copolymer, and the ratio (m: n) of the number of constituent units (m) derived from ethylene to the number (n) of constituent units derived from (meth) acrylic acid, and The weight average molecular weight is shown below. The ratio (m: n) is calculated from the 1 H-NMR method and the DQF-COSY method, which are nuclear magnetic resonance spectroscopic methods. The weight average molecular weight is measured by the method mentioned later.

[表2]※1 m:n;來自乙烯之構成單元數(m)與來自(甲基)丙烯酸之構成單元數(n)之比[Table 2] ※ 1 m: n; the ratio of the number of constituent units (m) derived from ethylene to the number of constituent units (n) derived from (meth) acrylic acid

又,表1中之低分子水溶性潤滑劑(B)及水溶性樹脂(C)之重量平均分子量依後述之方法測定。The weight-average molecular weights of the low-molecular-weight water-soluble lubricant (B) and the water-soluble resin (C) in Table 1 were measured by a method described later.

<聚烯烴樹脂(A)之重量平均分子量之測定方法> 聚烯烴樹脂(A)之重量平均分子量,係使用配備GPC管柱之液相層析儀(島津製作所(股)公司製),將聚苯乙烯作為標準物質進行測定,並以相對平均分子量之形式算出。以下顯示使用設備、分析條件。 (使用設備) 島津高速液相層析儀ProminenceLIQUID 系統控制器 : CBM-20A 輸液單元 : LC-20AD 線上脫氣器 : DGU-20A3 自動取樣器 : SIL-20AHT 管柱烘箱 : CTO-20A 差示折射率檢測器 : RIO-10A LC工作站 : LCSolution (分析條件) 管柱 : 將下列Phenomenex製管柱按照以下順序串聯連接 Phenogel 5μ 10E5A 7.8×300×1根 Phenogel 5μ 10E4A 7.8×300×1根 Phenogel 5μ 10E3A 7.8×300×1根 保護管柱:Phenogel guard column 7.8×50×1根 溶離液 : 高速液相層析用四氫呋喃 關東化學(股)公司製 流量 : 1.00mL/min 管柱溫度 : 45℃ (檢量線製作用聚苯乙烯) 昭和電工製 Shodex standard SL105、SM105 標準聚苯乙烯之重量平均分子量:580,1390,2750,6790,13200,18500,50600,123000,259000,639000,1320000,2480000<Method for measuring weight average molecular weight of polyolefin resin (A)> The weight average molecular weight of polyolefin resin (A) is a liquid chromatograph equipped with a GPC column (manufactured by Shimadzu Corporation). Styrene was measured as a standard substance and calculated as a relative average molecular weight. The equipment and analysis conditions are shown below. (Used equipment) Shimadzu High-speed Liquid Chromatograph ProminenceLIQUID System controller: CBM-20A Infusion unit: LC-20AD Online degasser: DGU-20A3 Autosampler: SIL-20AHT column oven: CTO-20A Differential refraction Rate detector: RIO-10A LC workstation: LCSolution (analysis conditions) Columns: The following Phenomenex columns are connected in series in the following order: Phenogel 5μ 10E5A 7.8 × 300 × 1 Phenogel 5μ 10E4A 7.8 × 300 × 1 Phenogel 5μ 10E3A 7.8 × 300 × 1 guard column: Phenogel guard column 7.8 × 50 × 1 eluent: Tetrahydrofuran for high-speed liquid chromatography manufactured by Kanto Chemical Co., Ltd. Flow rate: 1.00mL / min Column temperature: 45 ° C (check Polystyrene for measuring line production) Showa Denko Shodex standard SL105, SM Weight average molecular weight of 105 standard polystyrene: 580,1390,2750,6790,13200,18500,50600,123000,259000,639000,1320000,2480000

<低分子水溶性潤滑劑(B)、水溶性樹脂(C)之重量平均分子量之測定方法> 低分子水溶性潤滑劑(B)、水溶性樹脂(C)之重量平均分子量,係使用配備GPC管柱之液相層析儀(島津製作所(股)公司製),將聚乙二醇作為標準物質進行測定,並以相對平均分子量之形式算出。以下顯示分析條件。另外,使用設備係使用和用於聚烯烴樹脂(A)之重量平均分子量測定之設備同樣之設備。 (分析條件) 管柱 :將下列東曹(股)公司製管柱按照以下順序串聯連接 TSK-GEL G3000PW(12)7.5×300×2根 TSK-GEL GMPW(17)7.5×300×2根 保護管柱 :TSKGUARDCOLUMN PWH 7.5×75×1根 東曹(股)公司製 溶離液 :0.05mol/L之氯化鈉水溶液(將氯化鈉 和光純藥(股)公司製 特級、及離子交換水混合而製備) 流量 :1.00mL/min 管柱溫度 :45℃ (檢量線製作用聚乙二醇) VARIAN製 Polyethylene Glycol Calibration Kit PEG-10 (檢量線製作用聚環氧乙烷) 東曹(股)公司製 TSKstandard Poly(Ethylene oxide) 標準聚乙二醇及標準聚環氧乙烷之重量平均分子量:106,615,1970,3930,7920,21030,43000,101000,185000,580000<Method for measuring weight average molecular weight of low molecular weight water-soluble lubricant (B) and water-soluble resin (C)> The weight average molecular weight of low molecular weight water-soluble lubricant (B) and water-soluble resin (C) is based on GPC The liquid chromatography of the column (manufactured by Shimadzu Corporation) was measured using polyethylene glycol as a standard substance, and was calculated as a relative average molecular weight. The analysis conditions are shown below. The equipment used is the same equipment used for the weight average molecular weight measurement of the polyolefin resin (A). (Analytical conditions) Tubing: Connect the following Tosoh (stock) company-made tubular columns in series in the following order: TSK-GEL G3000PW (12) 7.5 × 300 × 2 TSK-GEL GMPW (17) 7.5 × 300 × 2 Column: TSKGUARDCOLUMN PWH 7.5 × 75 × 1 Dissolved liquid from Tosoh Corporation: 0.05mol / L sodium chloride aqueous solution (Mix sodium chloride with special grade manufactured by Guangshun Pharmaceutical Co., Ltd., and ion-exchanged water And preparation) flow rate: 1.00mL / min column temperature: 45 ° C (polyethylene glycol for calibration line production) Polyethylene Glycol Calibration Kit PEG-10 (polyethylene oxide for calibration line production) Tosoh ( The weight average molecular weight of TSK standard Poly (Ethylene oxide) standard polyethylene glycol and standard polyethylene oxide manufactured by the company: 106,615,1970,3930,7920,21030,43000,101000,185000,580,000

以下,說明實施例及比較例之鑽孔加工用之輔助板之製造方法。 <實施例1> 將聚烯烴樹脂(A)之水分散體(商品名:HITECH S3121,東邦化學工業(股)公司製,重量平均分子量6×104 ,m:n=90:10)80質量份(樹脂固體成分經換算係為20質量份)、作為低分子水溶性潤滑劑(B)之聚氧乙烯單硬脂酸酯(商品名:NONION S15.4,日油(股)公司製,重量平均分子量1,540)15.0質量份、作為高分子量水溶性樹脂(c-1)之聚環氧乙烷(商品名:Alkox E-45,明成化學工業(股)公司製,重量平均分子量5.6×105 )8.0質量份、作為中分子量水溶性樹脂(c-2)之聚乙二醇(商品名:PEG4000S,三洋化成工業(股)公司製,重量平均分子量3.3×103 )57.0質量份溶解於甲醇(三菱瓦斯化學(股)公司製),製備就樹脂組成物而言之固體成分濃度為30質量%之溶液。相對於此溶液中之樹脂組成物固體成分100質量份,添加1.2質量份之表面調整劑(BYK349,BYK Chemie Japan(股)公司製)與1.5質量份之消泡劑(BYK022,BYK Chemie Japan(股)公司製),而且相對於前述溶液中之樹脂組成物固體成分100質量份,添加0.17質量份之甲酸鈉(三菱瓦斯化學(股)公司製),使其均勻地分散,得到用以形成樹脂組成物之層的樹脂組成物之溶液。使用塗佈棒將得到的樹脂組成物之溶液以使乾燥、固化後之樹脂組成物之層之厚度成為0.05mm的方式塗佈於鋁箔(使用鋁箔:JIS-A1100H1.80,厚度0.07mm,三菱鋁業(股)公司製)。接著,使用乾燥機於90℃乾燥3分鐘,然後使其冷卻、固化,製得鑽孔加工用之輔助板。依上述方法進行開孔加工,並針對金屬箔與樹脂組成物之層的黏著性、孔位置精度、耐鑽頭折損性進行評價。將該等結果示於表3。Hereinafter, a method for manufacturing an auxiliary plate for drilling in Examples and Comparative Examples will be described. <Example 1> An aqueous dispersion of a polyolefin resin (A) (trade name: HITECH S3121, manufactured by Toho Chemical Industry Co., Ltd., weight average molecular weight 6 × 10 4 , m: n = 90: 10) 80 mass Parts (resin solid content is 20 parts by mass based on conversion), and polyoxyethylene monostearate (trade name: NONION S15.4, manufactured by Nippon Oil Corporation) as a low-molecular-weight water-soluble lubricant (B), Weight average molecular weight 1,540) 15.0 parts by mass of polyethylene oxide (trade name: Alkox E-45, manufactured by Meisei Chemical Industry Co., Ltd.) as a high molecular weight water-soluble resin (c-1), weight average molecular weight 5.6 × 10 5 ) 8.0 parts by mass of 57.0 parts by mass of polyethylene glycol (trade name: PEG4000S, manufactured by Sanyo Chemical Industry Co., Ltd., a weight average molecular weight of 3.3 × 10 3 ) as a medium molecular weight water-soluble resin (c-2) Methanol (manufactured by Mitsubishi Gas Chemical Co., Ltd.) to prepare a solution having a solid content concentration of 30% by mass of the resin composition. With respect to 100 parts by mass of the solid content of the resin composition in this solution, 1.2 parts by mass of a surface conditioner (BYK349, manufactured by BYK Chemie Japan Co., Ltd.) and 1.5 parts by mass of an antifoaming agent (BYK022, BYK Chemie Japan ( Co., Ltd.), and 0.17 parts by mass of sodium formate (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was added to 100 parts by mass of the solid content of the resin composition in the solution, and uniformly dispersed to obtain a resin for forming the resin. A solution of a resin composition of the composition layer. The obtained resin composition solution was applied to an aluminum foil using a coating bar so that the thickness of the dried and cured resin composition layer was 0.05 mm (using aluminum foil: JIS-A1100H1.80, thickness 0.07 mm, Mitsubishi Aluminum (stock) company system). Next, it dried at 90 degreeC for 3 minutes using the dryer, it was made to cool and solidify, and the auxiliary board for drilling processing was obtained. The hole-cutting process was performed according to the above method, and the adhesion of the layer of the metal foil and the resin composition, the accuracy of the hole position, and the resistance to the breakage of the drill were evaluated. These results are shown in Table 3.

<實施例2、3> 依循實施例1,以表3所示之原材料之種類及摻合量製備樹脂組成物之溶液,製得乾燥、固化後之樹脂組成物之層之厚度為0.05mm之鑽孔加工用之輔助板。就獲得之鑽孔加工用之輔助板,針對金屬箔與樹脂組成物之層的黏著性、孔位置精度、耐鑽頭折損性進行評價。將該等結果示於表3。〈Examples 2 and 3〉 According to Example 1, a resin composition solution was prepared by using the types of raw materials and blending amounts shown in Table 3 to obtain a dried and cured resin composition layer having a thickness of 0.05 mm. Auxiliary plate for drilling. With respect to the obtained auxiliary plate for drilling processing, the adhesion of the layer of the metal foil and the resin composition, the accuracy of the hole position, and the resistance to the breakage of the drill were evaluated. These results are shown in Table 3.

<比較例1~6> 依循實施例1,以表3所示之原材料之種類及摻合量製備樹脂組成物之溶液,製得乾燥、固化後之樹脂組成物之層之厚度為0.05mm之鑽孔加工用之輔助板。就獲得之鑽孔加工用之輔助板,針對金屬箔與樹脂組成物之層之間的黏著性、孔位置精度、耐鑽頭折損性進行評價。將該等結果示於表3。<Comparative Examples 1 to 6> According to Example 1, a resin composition solution was prepared by using the types of raw materials and blending amounts shown in Table 3, and the thickness of the dried and cured resin composition layer was 0.05 mm. Auxiliary plate for drilling. With respect to the obtained auxiliary plate for drilling, the adhesion between the metal foil and the layer of the resin composition, the accuracy of the hole position, and the resistance to the breakage of the drill were evaluated. These results are shown in Table 3.

表3所示之金屬箔與樹脂組成物之層的黏著性之判定基準如下。由於鑽孔加工時有加工時之負荷施於輔助板,若金屬箔與樹脂組成物之層的黏著力弱的話則樹脂組成物之層會剝離。鑽孔加工時未發生樹脂組成物之層的剝離時,標記為代表優異的『+++』;發生樹脂組成物之層的剝離時,標記為『+』。The criteria for determining the adhesion of the metal foil and the resin composition layer shown in Table 3 are as follows. Since a load is applied to the auxiliary plate during the drilling process, if the adhesion between the metal foil and the resin composition layer is weak, the resin composition layer will peel off. When peeling of the resin composition layer did not occur during drilling, it was marked as excellent "+++"; when peeling of the resin composition layer occurred, it was marked as "+".

表3所示之孔位置精度之判斷基準如下。由式(1)之算式算出之孔位置精度未達14μm時,標記為代表優異的『+++』;為14μm以上且未達15μm時,標記為代表良好的『++』;為15μm以上時,標記為『+』;無法進行加工時,標記為『-』。The judgment criteria of the hole position accuracy shown in Table 3 are as follows. When the hole position accuracy calculated by the formula (1) is less than 14 μm, it is marked as excellent “+++”; when it is 14 μm or more and less than 15 μm, it is marked as good “++”; it is 15 μm or more If it cannot be processed, it will be marked as "+".

表3所示之耐鑽頭折損性之判斷基準如下。由式(2)之算式算出之加工孔數為9,000hits以上時,標記為代表優異的『+++』;為8,000hits以上且未達9,000hits時,標記為代表良好的『++』;未達8,000hits時,標記為『+』;無法進行加工時,標記為『-』。The judgment criteria for drill breakage resistance shown in Table 3 are as follows. When the number of processed holes calculated from the formula (2) is 9,000hits or more, it is marked as excellent "+++"; when it is 8,000hits or more and less than 9,000hits, it is marked as good "++"; If it is less than 8,000 hits, it will be marked as "+"; if it cannot be processed, it will be marked as "-".

表3所示之綜合判定如下。以與金屬箔之黏著判定、孔位置精度判定、耐鑽頭折損性判定當中最差的判定作為綜合判定。The comprehensive judgment shown in Table 3 is as follows. The worst judgment among the adhesion judgment with the metal foil, the hole location accuracy judgment, and the drill bit breakage resistance judgment is taken as the comprehensive judgment.

[表3] [table 3]

由表3之實施例1~3可知,若鑽孔加工用之輔助板之樹脂組成物之層中聚烯烴樹脂(A)之含量相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份為15質量份~25質量份,且低分子水溶性潤滑劑(B)之含量為5質量份以上40質量份以下的話,則鑽孔加工用之輔助板之金屬箔與樹脂組成物之層的黏著力強,使用了該輔助板的開孔加工之孔位置精度、耐鑽頭折損性為良好。As can be seen from Examples 1 to 3 in Table 3, if the content of the polyolefin resin (A) in the layer of the resin composition of the auxiliary plate for drilling is relative to the polyolefin resin (A) and the low-molecular-weight water-soluble lubricant ( B). If the total 100 parts by mass with the water-soluble resin (C) is 15 parts by mass to 25 parts by mass, and the content of the low-molecular-weight water-soluble lubricant (B) is 5 parts by mass or more and 40 parts by mass or less, drilling is performed. The metal foil of the auxiliary plate for processing and the layer of the resin composition have strong adhesive force, and the hole position accuracy and the drill bit break resistance of the auxiliary plate using the auxiliary plate are good.

另一方面,由比較例1~3可知,若樹脂組成物之層中聚烯烴樹脂(A)之含量相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份係未達15質量份的話,則鑽孔加工用之輔助板之金屬箔與樹脂組成物之層的黏著力弱,在使用了該輔助板的開孔加工中,發生樹脂組成物之層的剝離,無法進行鑽孔加工。On the other hand, from Comparative Examples 1 to 3, if the content of the polyolefin resin (A) in the layer of the resin composition is higher than that of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble resin, (C) If the total 100 parts by mass is less than 15 parts by mass, the adhesion between the metal foil of the auxiliary plate for drilling and the layer of the resin composition is weak, and in the drilling process using the auxiliary plate, Peeling of the resin composition layer occurred, and drilling was impossible.

又,就樹脂組成物之層中聚烯烴樹脂(A)之含量超過25質量份之比較例4而言,鑽孔加工用之輔助板之金屬箔與樹脂組成物之層的黏著力強,但具有潤滑效果之低分子水溶性潤滑劑(B)之含量即便為5質量份以上40質量份以下,樹脂組成物之層之潤滑性仍未有改善,鑽孔加工時之切削屑之排出性差,孔位置精度不佳。就聚烯烴樹脂(A)之含量更多的比較例5而言,鑽孔加工時之切削屑之排出性更差,耐鑽頭折損性惡化。比較例5之孔位置精度較比較例4小,這是因為加工孔數少,鑽頭前端之磨耗並未加劇,從而孔位置精度變小。In Comparative Example 4 in which the content of the polyolefin resin (A) in the layer of the resin composition exceeded 25 parts by mass, the adhesion between the metal foil of the auxiliary plate for drilling and the layer of the resin composition was strong, but Even if the content of the low-molecular-weight water-soluble lubricant (B) with a lubricating effect is 5 mass parts or more and 40 mass parts or less, the lubricity of the resin composition layer has not been improved, and the cutting chip discharge performance during drilling is poor. Poor hole accuracy. In Comparative Example 5 in which the content of the polyolefin resin (A) was larger, the discharge of cutting chips during drilling was worse, and the drill break resistance was deteriorated. The hole position accuracy of Comparative Example 5 is smaller than that of Comparative Example 4. This is because the number of holes processed is small, and the wear of the drill tip has not increased, so that the hole position accuracy becomes smaller.

再者,就未含有低分子水溶性潤滑劑(B)之比較例6而言,鑽孔加工時之切削屑之排出性不佳,孔位置精度不佳,而且耐鑽頭折損性亦不佳。Further, in Comparative Example 6 which does not contain the low-molecular-weight water-soluble lubricant (B), the chip dischargeability during drilling was poor, the accuracy of the hole position was poor, and the resistance to drill breakage was also poor.

綜上可知,構成鑽孔加工用之輔助板的樹脂組成物之層中,聚烯烴樹脂(A)之含量相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份為15質量份以上25質量份以下,低分子水溶性潤滑劑(B)之含量相對於聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之合計100質量份為5質量份以上40質量份以下,水溶性樹脂(C)之含量為35質量份以上80質量份以下的話,則鑽孔加工用之輔助板之金屬箔與樹脂組成物之層的黏著力強,且使用了該輔助板的開孔加工之孔位置精度、耐鑽頭折損性亦為良好。In summary, it can be seen that the content of the polyolefin resin (A) in the layer of the resin composition constituting the auxiliary plate for drilling is higher than that of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and the water-soluble The total 100 parts by mass of the resin (C) is 15 parts by mass or more and 25 parts by mass or less. The content of the low-molecular-weight water-soluble lubricant (B) is higher than that of the polyolefin resin (A), the low-molecular-weight water-soluble lubricant (B), and If the total 100 parts by mass of the water-soluble resin (C) is 5 parts by mass or more and 40 parts by mass or less, and if the content of the water-soluble resin (C) is 35 parts by mass or more and 80 parts by mass or less, the metal of the auxiliary plate for drilling processing The layer of the foil and the resin composition has strong adhesive force, and the hole position accuracy and drill bit breakage resistance using the auxiliary plate are also good.

依據本發明,可提供一種鑽孔加工用之輔助板,相較於以往之鑽孔加工用之輔助板,微細直徑鑽孔加工時之孔位置精度優異,金屬箔與樹脂組成物之層的剝離所致之鑽頭折損之發生受到抑制,且無需以往係必要之黏著層,故經濟性亦優異。According to the present invention, it is possible to provide an auxiliary plate for drilling processing. Compared with the conventional auxiliary plate for drilling processing, the hole position accuracy during micro-diameter drilling is excellent, and the layer of the metal foil and the resin composition is peeled off. The occurrence of drill bit breakage is suppressed, and no necessary adhesive layer is required in the past, so the economy is also excellent.

本申請案係基於2017年6月1日向日本專利局提申之日本專利申請案(日本特願2017-109285),其內容納入於此作為參考。 [產業上利用性]This application is based on a Japanese patent application filed with the Japan Patent Office on June 1, 2017 (Japanese Patent Application No. 2017-109285), the contents of which are incorporated herein by reference. [Industrial availability]

本發明之鑽孔加工用之輔助板,於疊層板或多層板之鑽孔加工具有產業上利用性。The auxiliary plate for drilling processing of the present invention has industrial applicability for drilling processing of a laminated board or a multilayer board.

1‧‧‧樹脂組成物之層1‧‧‧ layer of resin composition

2‧‧‧金屬箔2‧‧‧ metal foil

3‧‧‧鑽機3‧‧‧ Rig

[圖1]係表示本實施形態之鑽孔加工用之輔助板及利用該輔助板的鑽孔加工方法之一態樣之概略圖。[Fig. 1] It is a schematic diagram showing an aspect of an auxiliary plate for drilling processing and a method of drilling processing using the auxiliary plate according to this embodiment.

Claims (12)

075mm以下之微細直徑鑽孔加工用之輔助板, 具有:金屬箔;及至少設置在該金屬箔之單面之含有聚烯烴樹脂(A)、低分子水溶性潤滑劑(B)、與水溶性樹脂(C)之樹脂組成物之層, 該水溶性樹脂(C)含有高分子量水溶性樹脂(c-1)與中分子量水溶性樹脂(c-2), 相對於該聚烯烴樹脂(A)、該低分子水溶性潤滑劑(B)、與該水溶性樹脂(C)之合計100質量份, 該聚烯烴樹脂(A)之含量為15質量份以上25質量份以下, 該低分子水溶性潤滑劑(B)之含量為5質量份以上40質量份以下, 該水溶性樹脂(C)之含量為35質量份以上80質量份以下。Auxiliary plates for drilling with a micro diameter of 075 mm or less, comprising: a metal foil; and a polyolefin resin (A), a low-molecular-weight water-soluble lubricant (B), and a water-soluble component provided on at least one side of the metal foil A layer of a resin composition of a resin (C), the water-soluble resin (C) contains a high-molecular-weight water-soluble resin (c-1) and a medium-molecular-weight water-soluble resin (c-2), and the polyolefin resin (A) The low-molecular-weight water-soluble lubricant (B) and a total of 100 parts by mass of the water-soluble resin (C); the content of the polyolefin resin (A) is 15 parts by mass or more and 25 parts by mass or less; The content of the lubricant (B) is 5 parts by mass or more and 40 parts by mass or less, and the content of the water-soluble resin (C) is 35 parts by mass or more and 80 parts by mass or less. 如申請專利範圍第1項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該聚烯烴樹脂(A)含有具有來自烯烴之構成單元與來自丙烯酸及/或甲基丙烯酸之構成單元之烯烴-(甲基)丙烯酸共聚物。For example, the auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less in the first patent application scope, wherein the polyolefin resin (A) contains a constituent unit derived from an olefin and a constituent derived from acrylic acid and / or methacrylic acid. Unit olefin- (meth) acrylic copolymer. 如申請專利範圍第2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該來自烯烴之構成單元含有來自乙烯之構成單元。For example, the auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less in the second scope of the patent application, wherein the constituent unit derived from olefin contains a constituent unit derived from ethylene. 如申請專利範圍第2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該烯烴-(甲基)丙烯酸共聚物為具下列通式(1)之結構之乙烯-(甲基)丙烯酸嵌段共聚物; [化1](1) 式(1)中,R1 、R2 、R3 各自獨立地表示氫原子或甲基,m與n各自獨立地為1以上之整數。For example, the auxiliary plate for drilling with a fine diameter of 0.075 mm or less in the second scope of the patent application, wherein the olefin- (meth) acrylic copolymer is an ethylene- (formaldehyde) having the structure of the following general formula (1) Group) acrylic block copolymer; (1) In formula (1), R 1 , R 2 , and R 3 each independently represent a hydrogen atom or a methyl group, and m and n are each independently an integer of 1 or more. 如申請專利範圍第2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該烯烴-(甲基)丙烯酸共聚物中,來自該烯烴之該構成單元之含量,相對於來自該烯烴之該構成單元與來自該丙烯酸及/或該甲基丙烯酸之該構成單元之合計100莫耳%為60~99莫耳%。For example, the auxiliary plate for drilling with a fine diameter of 0.075 mm or less in the second scope of the patent application, wherein the content of the constituent unit derived from the olefin in the olefin- (meth) acrylic acid copolymer is relative to that derived from The total 100 mol% of the constituent unit of the olefin and the structural unit derived from the acrylic acid and / or the methacrylic acid is 60 to 99 mol%. 如申請專利範圍第1或2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該聚烯烴樹脂(A)之重量平均分子量為5×103 以上1×105 以下。For example, the auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less in the scope of the patent application No. 1 or 2, wherein the weight average molecular weight of the polyolefin resin (A) is 5 × 10 3 or more and 1 × 10 5 or less. 如申請專利範圍第1或2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該低分子水溶性潤滑劑(B)之重量平均分子量為6×102 以上2.5×103 以下。For example, the auxiliary plate for drilling a micro-diameter with a diameter of less than 0.075 mm in the scope of the patent application No. 1 or 2, wherein the weight average molecular weight of the low-molecular-weight water-soluble lubricant (B) is 6 × 10 2 or more and 2.5 × 10 or more. 3 or less. 如申請專利範圍第1或2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該低分子水溶性潤滑劑(B)係選自由甘醇化合物、聚氧乙烯之單醚化合物、聚氧乙烯單月桂酸酯、聚氧乙烯單硬脂酸酯、聚氧乙烯單油酸酯、聚氧乙烯二硬脂酸酯、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐單油酸酯、聚甘油單硬脂酸酯化合物、聚氧乙烯丙烯共聚物、及它們的衍生物構成之群組中之1種或2種以上。For example, the auxiliary plate for drilling a micro-diameter with a diameter of less than 0.075 mm in the scope of application for patents 1 or 2, wherein the low-molecular-weight water-soluble lubricant (B) is selected from the group consisting of a monoether of a glycol compound and polyoxyethylene Compound, polyoxyethylene monolaurate, polyoxyethylene monostearate, polyoxyethylene monooleate, polyoxyethylene distearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene One of the group consisting of sorbitan monostearate, polyoxyethylene sorbitan monooleate, polyglycerol monostearate compound, polyoxyethylene propylene copolymer, and their derivatives, or 2 or more. 如申請專利範圍第1或2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該水溶性樹脂(C)含有選自由聚環氧乙烷、聚環氧丙烷、聚乙烯基吡咯烷酮、纖維素衍生物、聚乙二醇、聚丙二醇、聚四亞甲基二醇、聚氧乙烯之單醚化合物、聚氧乙烯單硬脂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚甘油單硬脂酸酯化合物、聚環氧乙烷-聚環氧丙烷共聚物、及它們的衍生物構成之群組中之1種或2種以上。For example, the auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less in the first or second scope of the patent application, wherein the water-soluble resin (C) contains a material selected from the group consisting of polyethylene oxide, polypropylene oxide, and polyethylene. Pyrrolidone, cellulose derivatives, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, monoether compound of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate One or two or more of the group consisting of an acid ester, a polyglycerol monostearate compound, a polyethylene oxide-polypropylene oxide copolymer, and their derivatives. 如申請專利範圍第1或2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該樹脂組成物之層之厚度為0.02~0.3mm。For example, the auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less in the scope of application for the patent item 1 or 2, wherein the thickness of the layer of the resin composition is 0.02-0.3 mm. 如申請專利範圍第1或2項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,其中,該金屬箔之厚度為0.05mm~0.3mm。For example, if the auxiliary plate for drilling a micro-diameter with a diameter of 0.075 mm or less is in the scope of the first or second patent application, the thickness of the metal foil is 0.05 mm to 0.3 mm. 一種微細直徑鑽孔加工方法,具有下列步驟: 使用如申請專利範圍第1至11項中任一項之直徑0.075mm以下之微細直徑鑽孔加工用之輔助板,利用直徑0.075mm以下之微細直徑鑽孔加工用之鑽機在疊層板或多層板形成孔。A method for drilling a micro-diameter, having the following steps: using an auxiliary plate for micro-diameter drilling of 0.075 mm or less in diameter as in any one of the claims 1 to 11, and using a micro-diameter of 0.075 mm A drill for drilling is used to form holes in laminated or multilayer boards.
TW107118392A 2017-06-01 2018-05-30 Auxiliary plate for micro diameter drilling and drilling method using the same TW201902648A (en)

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