TW201235169A - Drill entry sheet - Google Patents

Drill entry sheet Download PDF

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Publication number
TW201235169A
TW201235169A TW100149246A TW100149246A TW201235169A TW 201235169 A TW201235169 A TW 201235169A TW 100149246 A TW100149246 A TW 100149246A TW 100149246 A TW100149246 A TW 100149246A TW 201235169 A TW201235169 A TW 201235169A
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TW
Taiwan
Prior art keywords
drilling
resin composition
solid lubricant
weight
resin
Prior art date
Application number
TW100149246A
Other languages
Chinese (zh)
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TWI547358B (en
Inventor
Takayuki Kamei
Shigeru Horie
Takuya Hasaki
Yousuke Matsuyama
Tetsurou Miyahira
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Mitsubishi Gas Chemical Co
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Publication of TW201235169A publication Critical patent/TW201235169A/en
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Publication of TWI547358B publication Critical patent/TWI547358B/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16Perforating by tool or tools of the drill type
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling

Abstract

Disclosed is an drill entry sheet which, compared with conventional drill entry sheets, has excellent hole position accuracy and reduced drill bit breakage. A layer comprising a resin composition is formed on at least one side of a metal support foil. The aforementioned resin composition is blended with a solid lubricant containing zinc molybdate and/or molybdenum trioxide. The thickness of the aforementioned resin composition layer is in the range of 0.02-0.3mm.

Description

201235169 六、發明說明: 【發明所屬之技術領域】 [0001] 明係關於包銅疊層基板或多層板之鑽孔加工時使用之鑽 孔用盖板。 【先前技術】 [0002] 作為使用於印刷電路板材料之包銅疊層基板或多層板之鑽孔 f工方法,—般係採用:取1片包銅疊層基板或多層板或是將複 f片J疊’並將在辦金屬料體或金屬絲面軸樹脂組成物 層之薄片(以下,在本說明書中,通常將此薄片稱為「鑽孔用蓋板 配置作為抵住其最上部之板,然後進行鑽孔加工之方法。 [0003] j年來,對於屬於印刷電路板材料之包銅疊層基板或多層板 & Y,包含尚岔度化發展、生產性提升、成本降低與信賴性 ^ ’並要求使孔位置精確度提升之高品㈣鑽孔加卫。為了對應 要求,例如在專利文獻丨中提出一種使用聚乙二醇等水溶 成之則的鑽孔加工法。又,在專利文獻2中提出-k 在金屬泊上形成水溶性樹脂層之鑽孔用滑劑薄片。甚至,在 =3中提出-種於形成有熱硬化性樹脂薄膜之絲上形成水溶 層之鑽孔用蓋板。而且加上,在專利文獻4〜5中提 摻合奈米粉末延長鑽頭刃部壽命之辅助材料。 裡 然而,相較於半導體技術之進展,印刷電路板技術的進 f賴技T有所偏離。為此’對於印刷電路板高密度化盘 ϋ性提升的要求,越來越高。舉例而言,在量產中最小刃 ί 5 *18ηΐΐηφ'〇·15-Φ> ^ 〇.105,πηφ οοΓ A ’有極4的"""部分’在對抗雷射開孔技術下嘗試了 卜G.G5mm㈣鑽糊孔。奴,因為全球I 化成的齡與新湘家需求_係,生產性提升與成本降低=201235169 VI. Description of the Invention: [Technical Field of the Invention] [0001] A cover plate for a drill hole for use in drilling a copper-clad laminate substrate or a multilayer board. [Prior Art] [0002] As a method of drilling a copper-clad laminate substrate or a multi-layer board for use in a printed circuit board material, it is generally used to take one copper-clad laminate substrate or a multi-layer board or to f sheet J stack 'will be used as a sheet of a metal material or a wire surface resin composition layer (hereinafter, in the present specification, this sheet is generally referred to as "a drilling cover plate is disposed as the uppermost portion thereof" The board is then drilled. [0003] For the past seven years, copper-clad laminates or multilayer boards belonging to printed circuit board materials have been developed, improved in productivity, and reduced in cost. Reliable ^ ' and require high-quality (4) drilling and hoisting to improve the accuracy of the hole position. For the corresponding requirements, for example, in the patent document, a drilling method using water-soluble polyethylene glycol or the like is proposed. Patent Document 2 proposes a smoothing agent sheet for drilling a water-soluble resin layer on a metal poise. Even in the case of =3, it is proposed to form a water-soluble layer on the wire on which the thermosetting resin film is formed. Drilling cover. And plus, in In the literature 4 to 5, the nano-doped powder is used to extend the life of the drill blade. However, compared with the advancement of semiconductor technology, the printed circuit board technology has deviated. The requirement for high density of printed circuit boards is increasing. For example, in mass production, the minimum edge ί 5 *18ηΐΐηφ'〇·15-Φ> ^ 〇.105, πηφ οοΓ A 'very pole 4's """partially tried the G.G5mm (4) drill hole in the anti-laser opening technology. The slave, because of the age of the global I and the demand of the new Xiang family, the productivity increase and the cost reduction =

S 3 201235169 ^刀期盼因此’因應如此要求開發之新型鑽孔用蓋板是受到 [先前技術文獻] [專利文獻] [0004] f利文獻1:曰本特開平4_92494號公報 f利文獻2 :日本特開平5-169400號公報 f利文獻3 :日本特開2003-136485號公報 ,文獻4 :日本實崎案迎⑵號公報 寻利文獻5 :日未特開2〇〇7_2814〇4號公報 【發明内容】 [發明所欲解決的問題] [0005] 罢明之目的在於:鑑於這樣的觀,提以彳―:?丨用 位置精度優異之鑽孔用蓋板。因密^; [解決問題之技術手段] [0006] 之'一 合更容易,而兔應Γ 。藉此,發現鑽頭刃部咬 ;’發現由於_及:=:=:==;並 藉此可防止切^ 鑽孔人,為解決上述問題進行種種檢討之結果,發現·在 ^為,體潤_(B) ’並最佳化絲合量。藉此,人、甲 防止因為鑽頭刀邱籍5,丨M^ ~二〜。&quot;月、培风视落下, 頊刀箱到塊狀的切割屑造成鑽頭刃部的折損問題 201235169 ,層表面。若單單只 性,並導致孔位置精度惡化。lj刀谷易橫向滑動而損及向心 [0008] ΓίΞίίίΐΙ知識所製作出來,其要旨如町所述。 脂組成㈣狀層,師η屬至少單社形成有由樹 劑⑼之舰辞及三氧化錮至少^中 1月1组成曰2有當做固體潤滑 度為0.02至G.3mm之範圍。 之—,且該_組成物層之厚 [0009] 性樹述第1項之鑽孔用盖板’其中,該樹脂組成物含有水溶 [0010] 3.如上述第1項之鑽孔用蓋板,复 樹月分觸重量份’摻合該固體潤滑劑^合言^ ^量^^該 重莖TO。 [0011] 〜7μ1 如&quot;述第1項之鑽孔用蓋板,其中,該銦酸鋅平均粒徑為1 [0012] 3〜述第1項之鑽制蓋板,其中,該三氧化解均粒徑為 [0013] 鐵頭1狀_級’ _ 下之 [0014] 7.如上述第1項之鐵㈣蓋板’其中,該金屬 〇.〇5〜〇,5職之範圍。 又扭从度馬 [0015] 201235169 .有做8為=第膜用蓋板,其中,於該金屬蝴之上具 [0016] 滑劑上述第8項之鑽孔用蓋板,其中,該底漆層含有該固體潤 [0017] 10·如上述第9項之鑽孔用蓋板,其中,該固體潤滑劑田)於底 :層之摻合量,相對於該底漆之組成物100重量份為1重量份〜-2〇重量份。 里1刀 [0018] 之麻!1·如上述第1項之鑽孔用蓋板,其係使用於包銅疊層基板或 多增板之加工。 〆 [發明之效果] [0019] 使用本發明之鑽孔用蓋板時,由於鑽孔加工時優異的孔位置 精度及樹脂組成物層優異的潤滑性,可減少於鑽孔加工 ,的,損。因此’更加高密度設計,高品f且生產性優異的鑽孔 ,工成為可能。而且,鑽孔加工時可增加單次堆疊片數, 提升生產性及降低成本。 、 【實施方式】 [實施發明之形態] [0021] 本發明之鑽孔用蓋板,係於金屬支撐箔的至少單面上形 由樹脂組成物構成之層(以下,稱為「樹脂組成物層」)之鑽孔 反^^明之鑽孔用蓋板其特徵為樹脂纽成物含有固體潤滑劑⑻。 ^本=中,固體潤滑劑⑻係指為了保縣面不受相對運動 =貝二,少摩擦與磨耗,而做為薄膜或是粉末使 體’其為3航以上,放置在比本發明使用溫度更高的;度 6 201235169 2〇m齡可維絲蚊叫會融化。 然後,最佳化鉬酸鋅及三氧 固體潤滑劑⑼。據此,鑽頭之;^做為 心性提升’孔位置精度也提升,’因鑽頭刃部之向 屬的排出變得順利,防止切鳴:,為潤滑性的增加使切割 宜。在此,上述水^^^^^^容性樹脂㈧之虹成物為 (Β)的水溶性潤滑劑。 ,4曰水溶性樹脂、非固體潤滑劑 [0025] L上述樹脂組成物’亦可含有廣為周知的敎可塑性的非 ^ tti' 例如·核劑、者色劑、熱安定化劑等。 肖j [0026] ㈣述樹f、组成物之樹脂部份,係指水溶性樹脂(A)、非固 劑(B)運至鎮雜_㈣減肖 t 4;lf ® [0027] 上述固體潤滑劑⑼,相對於樹脂組成物之樹脂部份1〇 伤’合計共摻合1重量份〜4〇重量份,以摻合丨重量份〜3〇重旦 ,為佳,摻合5重量份〜20重量份較佳,摻合1〇重量份〜2〇 ^ 量伤更佳。固體潤滑劑(B)在未滿1重量份的情況看不出效果 體潤滑劑(B)在超過40重量份的情況,沒有經濟的合理性,且固 潤滑劑(B)變得谷易凝集。目巾,產生製造上的困難,結果有會 導致孔位置精度惡化的情況。 [0028] 於本發明的固體潤滑劑(B),係為鉬酸鋅(M〇〇4zn,炫點 201235169 900。〇,及三氧化鉬(Mo〇3 ’炫點795。〇之至少其中一種。三氧化 鉬過去雖被指出無法發揮固體潤滑性,但發現摻合作為 板的固體潤滑劑(B)是有用的。固體潤滑劑只要含有 中至少一種以上即可。 一貝&lt; 上述之固體潤滑劑(B),因發現與二硫化顧、雲S 3 201235169 ^There is therefore a new type of drilling cover that has been developed in response to such a request. [Prior Art Document] [Patent Literature] [0004] Fli Document 1: 曰本特开平4_92494号Japanese Patent Laid-Open No. Hei 5-169400, Japanese Patent Laid-Open No. Hei. No. 2003-136485, Document 4: Japanese Shisaki Case (2), No. 5, No. 2: No. 2, No. 2, No. 2, No. 4, No. 4, No. 4, No. 4 [Brief Description of the Invention] [Problem to be Solved by the Invention] [0005] The purpose of the invention is to provide a drilling cover plate having excellent positional accuracy in view of such a viewpoint. Because of the secret ^; [technical means to solve the problem] [0006] the 'combination is easier, and the rabbit should be. In this way, it was found that the bit of the drill bit was bitten; 'found because _ and :=:=:==; and this can prevent the driller from being drilled, and the results of various reviews to solve the above problems are found. Run _(B) ' and optimize the silk content. In this way, people, A, because of the bit knife, Qi, 5, 丨 M ^ ~ two ~. &quot;月,培风视落, the file from the file box to the block cutting debris caused the problem of the bit of the drill bit 201235169, layer surface. If it is only singular, it will lead to deterioration of the hole position accuracy. Lj knives are easy to slide laterally and damage the centripetal [0008] ΓίΞίίίΐΙ knowledge is produced, the gist of which is described in Machi. The composition of the lipid (four) layer, the division of the genus η is formed by the sap of the sap (9) and the samarium trioxide at least in January 1 曰 2 has a solid lubrication degree of 0.02 to G. 3 mm. - The thickness of the _ composition layer [0009] The slab of the drilling of the first item, wherein the resin composition contains water-soluble [0010] 3. The drilling cover of the above item 1 Plate, complex tree monthly touch weight part 'mixed with the solid lubricant ^ 合 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; The solution average particle size is [0013] iron head 1 shape _ grade ' _ under [0014] 7. The iron (four) cover plate of the above item 1 wherein the metal 〇. 〇 5 ~ 〇, 5 positions. And twisted from the horse [0015] 201235169. There is a cover plate for the film cover, wherein the cover plate for the film of the above item 8 is provided on the metal butterfly, wherein the bottom plate The lacquer layer contains the solid lubricant [0017] 10. The casing for drilling according to the above item 9, wherein the solid lubricant field is at the bottom: the blending amount of the layer, relative to the composition of the primer 100 weight The serving is 1 part by weight to 2 to 2 parts by weight. 1 刀 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ 〆 [Effects of the Invention] When the drilling cover plate of the present invention is used, the hole position accuracy during the drilling process and the lubricity of the resin composition layer are excellent, and the drilling process can be reduced. . Therefore, it is possible to make a drill with a higher density and a high quality and excellent productivity. Moreover, the number of stacked sheets can be increased during drilling, which improves productivity and reduces costs. [Embodiment] The present invention is a layer formed of a resin composition on at least one surface of a metal supporting foil (hereinafter referred to as "resin composition". The hole for the drilling of the layer" is characterized in that the resin sheet contains a solid lubricant (8). ^本=中,Solid Lubricant (8) means that in order to protect the county from relative motion = Bei 2, less friction and wear, and as a film or powder to make it '3 flights or more, placed in use than the present invention The temperature is higher; degree 6 201235169 2〇m-age can be melted. Then, zinc molybdate and a trioxane solid lubricant (9) are optimized. According to this, the position of the drill bit is improved, and the positional accuracy of the hole is also improved, and the discharge of the blade portion is smooth, and the cut is prevented: the cutting is preferable for the increase in lubricity. Here, the above-mentioned water-based resin (eight) is a water-soluble lubricant of (Β). 4 曰Water-soluble resin, non-solid lubricant The above-mentioned resin composition ' may also contain a well-known bismuth plasticity such as a nucleating agent, a coloring agent, a thermal stabilizer, and the like.肖j [0026] (d) The tree f, the resin part of the composition, refers to the water-soluble resin (A), non-solid agent (B) shipped to the town _ (four) minus Xiao t 4; lf ® [0027] The lubricant (9) is blended in a total amount of 1 part by weight to 4 parts by weight with respect to the resin portion 1 of the resin composition, preferably blended with yttrium by weight of yttrium, preferably 5 parts by weight. It is preferably -20 parts by weight, more preferably 1 part by weight of the mixture. When the solid lubricant (B) is less than 1 part by weight, the effect of the bulk lubricant (B) is more than 40 parts by weight, and there is no economic rationality, and the solid lubricant (B) becomes easy to aggregate. . The eyeglasses are difficult to manufacture, and as a result, the accuracy of the hole position is deteriorated. [0028] The solid lubricant (B) of the present invention is zinc molybdate (M〇〇4zn, dazzle 201235169 900. 〇, and molybdenum trioxide (Mo〇3 'Hyun point 795. at least one of 〇) Although molybdenum trioxide has been pointed out in the past that it cannot exhibit solid lubricity, it has been found to be useful as a solid lubricant (B) which is blended into a sheet. The solid lubricant may contain at least one of at least one of them. Lubricant (B), found and disulfide Gu, cloud

劑^比,少量的摻合即有崎的作獄果而令人滿意。發現少J ,ίίίΪΐ作用效果’在擴大樹脂組成物之樹脂的選項這點而言 [0029] 固體潤滑劑(Β)之作用機制,目前認為Α致如 層中含有適當硬度的固體,鑽頭刃部的前端接觸到固第^ 合。因此,初_孔位置精度良好。第二,因為潤取 溝槽中附著著固體潤滑齊門、由於鑽頭刀部 另外’鑽頭刃部的磨耗可分類成2種。坌/、:· 鐵頭刀部在開始使用時,遭受衝擊成二期磨耗。亦即’ ^ 3 =潤滑劑⑻的情況相比,是有受到的。第2二= 耗。亦即,鑽頭刃部伴隨著镨丨童 的第2,吊態磨 體潤滑_有特有的但是,由於固 比,常態磨耗亦受到抑制。因此,孔位;^潤滑劑_情況相 的情況,惡化狀況與累積鑽孔數成精f2含固體潤滑劑⑻ 的情況下,則可逐漸地受到抑制。 “,、、而在含固體潤滑劑(B) [0030] m^;)^ 201235169 層對孔位置精度是有幫助的。前述固體潤滑劑 底之組成物100重量份,合計摻合i重量份〜2〇重) 重量份〜1G重量份為佳。固體潤滑劑⑼的Hi ϋ量份Ϊ情況看不出效果。固體潤滑劑⑻的摻合i在ϊί 20重1份的情況’沒有經濟的合理性,並有妨 過 】與,屬支持箱之間的黏著性的情況。.摻合固體“ 層之樹脂、,熱硬化性樹脂或熱可塑性樹脂任一種皆可、一上 層之樹脂為熱硬化性樹脂時,孔位置精度則較佳。 氐/J、 [0031] 尸對應包銅疊層基板或多層板的規格,選擇最適合的 徑、以及摻合量之固體潤滑劑(B)更為理想。 、” 例如以鉬酸辞作為固體潤滑劑(B)時,效果奏 ,^為1〜7μπι,擁有體積及適當硬度的固體。較佳的 2〜6μιη。更佳的平均粒徑為3〜5师。因為該特性 = 精度重要的小徑鑽頭刀部而言,可使鑽頭刃部易於咬合。、又, ^鋅因層狀構造而較薄,在鑽頭刀部旋轉時易被捲人^ 故 有助於切割屑的排出。 八糟故 化Ϊ作用效果奏效之理由如以下所述。三氧化銦為二硫 氧化而成,係柱狀構造,粒徑為〇.7μιη〜55μιη之範圍,平均 ,徑為3〜35μιη,擁有體積及適當硬度的固體。較佳的 為5〜20μπι。更佳的平均粒徑為1〇〜18μιη。因為該特性 位置精度重要的小徑鑽頭刃部而言,可使鑽頭刀部易於咬合。又, 二氧化鉬因為平均粒徑與鑽頭刃部之溝槽相比較小,σ 旋轉時易被捲入其溝槽,故有助於切割屑的排出。 ° [0032] 關於固體潤滑劑⑻的粒徑,比起最大粒徑值,平均粒徑值較 ,重要。原因在於,樹脂組成物中佔有比例高的固體潤滑劑之粒 徑,對於鑽孔用蓋板特性的孔位置精度、潤滑性會有影塑。因此, 為了提升鑛孔用蓋板之性能,管理固體潤滑劑⑼的平^粒徑變得 % 9 201235169 =二所二間滑劑(B)的粒度分佈中所佔之最大粒徑的比 例太间,使侍平均粒徑值大幅提高,有時 爾性’故比較不理想。固體潤滑劑測:== 的六偏磷酸溶液與數滴10%的環丙嘧啶ί 的粒徑,並將曲線之含有量尖 [0033] 特別是,固體潤滑劑(Β)為鉬酸辞與二 非膨潤性的_為,將在,裡’ 未上定義為分散或膨潤,= 非膨濁。本發=目=,義至為_ _*為21=高至度=為;=== 子。同樣地,本發明之三氧仙,至液兩層的例 化鉬之沉澱部頂面為5聰,沉 ’=…τ ’至二氧 澱部頂面到液面為止為白濁的鮮。又為14/0 ’係二氧化翻的沉 優點如之溶液時,有下面的 在孔内時,比較;J清==製== ^。)之冷液時’因為固體潤滑劑⑻會產生濃度梯度,故二須攪 [0034] 研磨劑硬度’超過例如摩氏硬度5的範圍就會變成 研_而_不適合。固體潤滑劑⑻最佳摻合量,依鑽 201235169 f刷J路板的規格而仰。财含無機猶的印刷電路板材料相 比,各有無機填料的印刷電路板材料,因為相對地鑽頭刃部 耗較大,故摻合多一些固體潤滑劑田)是比較好的。 [0035] 上述水溶雌雖)_類’作為水灘樹脂,並沒有特別限 由聚環氧乙烧、聚環氧丙燒、聚丙職納、聚丙稀酿 ,、广乙婦四虱賴、絲?基纖_、聚丁二醇及料煙乙二 組1的群組中選擇1種或是2種以上為佳。聚烯烴乙 之认係聚烯輕乙二醇與二元酸反應而得之縮合物。關於聚 炸烴乙二醇,例如:聚乙二醇、聚丙二醇、聚丁二醇或這些 合物所例福乙二_,又以二元酸來說宜從苯二甲酸、間g二 甲酸、對苯二情、癸二酸及苯均喊等的多價羧酸之部分醋、 酸酐等選擇為佳。就非固姻滑劑⑻之水溶 15 聚乙二醇、聚丙二醇;聚氧乙稀油基酸、聚氧乙 乙稀巧脂SI、聚氧乙稀月桂越、聚氧乙稀壬基苯基驗、聚氧乙 t基基越等所例示的聚氧乙烯的單醚類;聚氧乙稀單硬脂= 酯、聚氧乙烯去水山梨醇單硬脂酸醋;六聚甘油單硬脂酸醋 六聚甘科硬麟畴_示的料油單 丙nr等,宜使用1種或2種以上適當地捧^^ 以熱可塑性之非水溶性樹脂而言,並沒有特別限 也ί、ΐ用::如:嶋的橡膠、丁二烯系的橡膠:酯 ::聚:低密度聚乙烯、氣化聚乙稀、二茂金== 树月曰、乙烯•丙烯酸酯•順丁烯二酸酐共聚合物、乙 缩2油酉1共聚合物、乙烯·乙酸乙烯酉旨共聚合樹脂4 十匕乙,她乙@夂乙烯醋共聚合樹脂、乙烯.(曱基)丙烯酸共聚 月曰、^^聚合物樹脂、乙烯,(甲基)丙稀酸醋共聚合樹脂等口。 財固體潤滑劑⑼之非水溶性騎劑而言,並沒有特別限The ratio of the agent is satisfactory, and a small amount of blending is satisfactorily. Found that less J, ίίίΪΐ effect 'in terms of expanding the resin composition of the resin. [0029] The mechanism of action of the solid lubricant (Β), it is currently believed that the layer contains solids of appropriate hardness, the edge of the drill The front end is in contact with the solid body. Therefore, the initial_hole position is excellent in accuracy. Second, since the solid lubrication door is attached to the groove, the wear of the drill blade portion can be classified into two types.坌/,:· When the iron head knife is used, it is subjected to impact in the second stage of wear. That is, the case of '^3=lubricant (8) is compared. The second two = consumption. That is, the bit portion of the drill is accompanied by the second of the child, and the lubrication of the grinding body is unique. However, the normal wear is also suppressed due to the solid ratio. Therefore, in the case of the hole position, the lubricant _ condition phase, and the deterioration condition and the cumulative number of drill holes are fine f2 containing the solid lubricant (8), it can be gradually suppressed. ",, and in the solid lubricant (B) [0030] m ^;) ^ 201235169 layer to the hole position accuracy is helpful. The above solid lubricant bottom composition 100 parts by weight, a total of i parts by weight ~2〇)) Parts by weight of ~1G are preferred. The amount of Hi ϋ of the solid lubricant (9) does not show the effect. The blending of the solid lubricant (8) is not economical in the case of 20 20 20 parts by weight. Reasonable, and may be caused by the adhesion between the support box. Blending solid "layer of resin, thermosetting resin or thermoplastic resin, any one of the upper layer of resin is hot In the case of a curable resin, the hole positional accuracy is preferable.氐/J, [0031] It is more preferable to select the most suitable diameter and the amount of solid lubricant (B) for the embossed copper-clad laminate or multi-layer board. For example, when the molybdenum acid is used as the solid lubricant (B), the effect is 1 to 7 μm, and the solid having a volume and a suitable hardness is preferably 2 to 6 μm. More preferably, the average particle diameter is 3 to 5. Because this characteristic = the small-diameter bit of the precision is important, the bit of the drill can be easily engaged. Moreover, the zinc is thin due to the layered structure, and it is easy to be wounded when the bit is rotated. It is helpful for the discharge of cutting chips. The reason for the effect of the smashing effect is as follows. Indium trioxide is formed by oxidation of disulfide, which is a columnar structure with a particle size of 〇.7μιη~55μιη, average The diameter is 3 to 35 μm, and the solid has a volume and a suitable hardness. It is preferably 5 to 20 μm. The average particle diameter is preferably 1 to 18 μm. Because of the small diameter drill blade whose positional accuracy is important, The bit knives can be easily occluded. Moreover, since the average particle size of the molybdenum dioxide is smaller than that of the groove of the drill bit, the σ is easily entangled in the groove when it is rotated, which contributes to the discharge of the cutting chips. 0032] Regarding the particle size of the solid lubricant (8), compared to the maximum particle size The average particle diameter value is important because the particle diameter of the solid lubricant which is high in the resin composition is affected by the hole position accuracy and lubricity of the characteristics of the cover plate for drilling. The performance of the cover plate for the hole, the flat particle size of the solid lubricant (9) is changed to become % 9 201235169 = the ratio of the largest particle size in the particle size distribution of the two-part lubricant (B) is too large, so that the average The particle size value is greatly improved, and sometimes it is not ideal. The solid lubricant is measured: == the hexametaphosphoric acid solution with a few drops of 10% cyprodinil, and the content of the curve is sharp [ 0033] In particular, the solid lubricant (Β) is a molybdenum acid and a non-swellable _ is, and it is not defined as dispersing or swelling, = non-inflated. For the _ _ * is 21 = high to degree = is; = = = sub. Similarly, the top side of the precipitated molybdenum of the present invention, the two sides of the liquid to the liquid layer is 5 Cong, sinking '=...τ 'Because the top surface of the dioxon layer is white and turbid to the liquid surface. It is also a 14/0' system. , comparison; J clear == system == ^.) When the cold liquid 'because the solid lubricant (8) will produce a concentration gradient, the second must be stirred [0034] the hardness of the abrasive 'over the range of, for example, Mohs hardness 5 will become Research _ and _ not suitable. The best blending amount of solid lubricant (8), according to the specifications of 201235169 f brush J board, compared with printed circuit board materials containing inorganic inorganic, printed circuit board materials with inorganic filler Because the relative cost of the drill bit is relatively large, it is better to blend more solid lubricant fields. [0035] The above-mentioned water-soluble females are used as water beach resins, and are not particularly limited by polyepoxy. E-burning, poly-epoxy-propyl burning, poly-properate, polypropylene, and Guangzhou women's four 虱, silk? One type or two or more types of the group of the base fiber _, the polytetramethylene glycol, and the raw material group B are preferably selected. A condensate obtained by reacting a polyolefin of a polyolefin with a dibasic acid. Regarding poly (hydrocarbyl glycol), for example, polyethylene glycol, polypropylene glycol, polybutylene glycol or the like, and the dibasic acid is preferably phthalic acid or m-dicarboxylic acid. It is preferred to select a part of vinegar or an acid anhydride of a polyvalent carboxylic acid such as benzoic acid, azelaic acid or benzene. Water-soluble 15 polyethylene glycol, polypropylene glycol for non-solid slip agent (8); polyoxyethylene oleic acid, polyoxyethylene ethylene glycol, polyoxyethylene laurel, polyoxyethylene decyl phenyl Polyoxyethylene monoethers exemplified by polyoxyethylene t-base; polyoxyethylene monostearyl = ester, polyoxyethylene sorbitan monostearate; hexaglycerol monostearate The acid vinegar hexapolyglycol hard lining _ shows the oil single propyl nr, etc., it is preferable to use one or two or more kinds of water-soluble resins which are suitable for thermoplasticity, and there is no particular limitation. ::: For example: rubber of rubber, butadiene rubber: ester:: poly: low density polyethylene, gasified polyethylene, ferrocene == arborvitae, ethylene acrylate, butene Diacid anhydride copolymer, ethylene-2 oil oxime 1 copolymer, ethylene·vinyl acetate 共 copolymerization resin 4 匕 匕 B, her B @夂 ethylene vinegar copolymer resin, ethylene. (fluorenyl) acrylic copolymer copolymer , ^ ^ polymer resin, ethylene, (meth) acrylic acid vinegar copolymer resin, etc. For the non-water-soluble riding agent of the solid lubricant (9), there is no special limit.

S 11 201235169 之物質t能適用。例如:乙稀雙硬脂醯胺、油酸酿 L=r亞甲基雙硬脂醒胺等所例示的醯胺系化合物,月 於二、』t、標搁酸、油酸等所例示的脂肪酸系化合物,硬脂 動石^ 丁,、ί!桂酸乙二,旨等所例示的脂肪酸醋系化合 [0038] 上r:r疊二時=頭 s】t0.02〜〇.3麵的範圍内乂在===: 果,鑽頭刃部的負荷增大導致引起鑽頭刃部的^ μ、、+,f方面,树脂組成物層之厚度超過〇.3mm af,會增加發生 上述树脂組成物捲入鑽頭刃部的情況。 [0039] ⑽^就上珊驗成物層形成方法衫,例如:在上述金屬 佑ft二直接將樹脂組成物的熱溶解物或溶液依塗佈法等的塗 支禮々nt或是預先製作樹脂組成物的薄膜,並與上述金屬 ΐίϋίτ法等。此時’由於在金屬支職上預先形成樹 曰皮^底漆層)可使金屬支撐羯與樹脂組成物之層疊合成一體 化,故車父為理想。細節於後面敘述。 [0040] 擔笔f i说依^法等’採用將樹脂組成物的溶液直接於金屬支 於、乾燥方法的情況,所使用的溶液為含有水與彿點低 谷Γί溶液較為理想。有關沸點低於水的溶劑,並沒有特 另J限疋,例如:醇類等的乙醇、曱醇或異丙醇,也可以使用 等„溶劑。就其他的溶劑而言,可以使用ί 而^、勿互〉谷性向的四氫°夫喃或乙腈部份混合於水或是醇類 而成浴剑。水,及沸點低於水的溶劑之摻合比,' 90/10〜50/50的範圍,在80/20〜50/50的範圍為佳,在期^0/50 12 201235169 i i2二1溶性樹脂(A)會不容易生成敏密的球 罐獻摻合峡㈣的航,_業安定生 [0041] 接於金屬等來說’採用將樹脂組成物的溶液直 蓋板ΐ显i持:===方法的情況,上述編 1 &amp;内從12G C〜16叱降到常溫。超過 16GC,乾燥溫度,會紅業安技產的障礙之虞,並不理^過 不理^常溫在低冷卻溫度’會在後步驟發生結露的情況,並 [0042] 述樹====孔跡只要是與上 料卽άΤ甘amp 此承文來自鑽頭刃部衝擊的金屬材 0.05〜0.5聰、,較佳$ m定。金屬支樓箱的厚度通常為 〇〇5mm 士 : 111111。該金屬支的厚度未滿 b# m ,寺鑽孔加工呀豐層基板容易發生垂陷毛邊,超過〇 5mm 時有發生切割屑的排出變得困難之虞。就金屬支撐 =HH ®(日本1業規格)_H416G中規定的觀、 = =03、麵、1N99、!㈣、_、聰、8紐等。金 純度的鋁’故可緩和來自鑽頭刃部的衝擊,並 仙,可提高加工孔之孔位置精度。又,與樹 :樹浐皮膜上,使聰先於表面形成厚度_2〜a〇2mm @錢支撐11較為理想。在制體潤滑劑⑻ 選況下’可對應固體潤滑劑⑼的粒徑適宜地 裎ΐϋΐί的尽度。有關使用於該樹脂皮膜之樹脂,只要是可 ίϋίίί'ϊ成物密合性的物質即可,其他並無特別限定, ’、了使用,、、、可』性樹脂,熱硬化性樹脂中任一種。熱可塑性樹脂The substance t of S 11 201235169 can be applied. For example, ethylene bis, stearylamine, oleic acid, L = r methylene bis-hard serotonin, etc., exemplified by the guanamine compound, exemplified by the second, the s, the acid, the oleic acid, etc. Fatty acid compound, hard fat moving stone ^ butyl, ί! lauric acid ethane, exemplified by the fatty acid vinegar compound [0038] on r: r stacked two times = head s] t0.02 ~ 〇. 3 face In the range of ===: If the load on the drill blade is increased, the thickness of the resin composition layer exceeds 〇.3mm af, which causes the above resin to increase. The case where the composition is caught in the edge of the drill. [0039] (10) ^ In the case of the Shangshan test layer formation method, for example, in the above metal ft 2 directly to the thermal composition of the resin composition or solution according to the coating method, such as coating or pre-production A film of a resin composition, and the above-mentioned metal ΐίϋίτ method. At this time, since the metal brace and the resin composition are integrated and integrated by the pre-formation of the tree skin and the primer layer on the metal branch, the bicycle is ideal. Details will be described later. In the case where the solution of the resin composition is directly applied to the metal supporting and drying method, the solution to be used is preferably a solution containing water and a low-gluten solution. For solvents with a boiling point lower than water, there is no special limitation. For example, ethanol, sterol or isopropanol such as alcohol, you can also use „solvent. For other solvents, you can use ί and ^ , do not cross each other glutinous tetrahydrofuran or acetonitrile partially mixed with water or alcohol to form a bath sword. Water, and the boiling point of the solvent below the boiling point of water, '90/10~50/50 The range is in the range of 80/20~50/50. In the period of ^0/50 12 201235169 i i2 2 1 soluble resin (A) will not easily generate a dense spherical tank for the blending of the gorge (4). _业安定生[0041] In the case of metal, etc., the case where the solution of the resin composition is used to directly cover the cover: === method, the above code 1 &amp; falls from 12G C~16叱 to Normal temperature. Exceeding 16GC, drying temperature, will be the obstacle of the red industry safety technology, do not care ^ ignore ^ normal temperature at low cooling temperature 'will occur in the later steps of condensation, and [0042] tree == == The hole mark is only 0.05mm to 0.5°C, which is better than the metal material of the drill blade. The thickness of the metal branch box is usually 〇〇5mm.士: 111111. The thickness of the metal branch is less than b# m, and the substrate is drilled and the slab is prone to burr. When it exceeds 〇5mm, the discharge of cutting chips becomes difficult. On the metal support = HH ® (Japan 1 industry specifications) _H416G specified in the view, = = 03, surface, 1N99, ! (four), _, Cong, 8 New Zealand, etc. Gold purity of the aluminum 'thus can ease the impact from the blade edge, and can be Improve the accuracy of the hole position of the machined hole. Also, with the tree: the tree skin film, it is better to form the thickness of the surface before the surface is _2~a〇2mm @钱 support11. Under the condition of the body lubricant (8) The particle size of the solid lubricant (9) is appropriately determined. The resin used in the resin film may be any one that can be ϋ ί ί , , , , , , , , , , , , , , , , , , , , Any of the resins, thermosetting resins, and thermoplastic resins.

S 13 201235169 熱硬化a稀酿基系聚合體及該等物質的共聚合體。 ’、[0043]曰· %氧基系樹脂、氰酸醋系樹脂等的樹脂。 美板ΐΪΪΪί孔用蓋板’係對印刷電路板材料,例如包銅疊芦 而言,可在包鋼= 物層的那的方式配置鑽孔用蓋板,並從樹脂組成 [0044] 上辻·僅為本案發明之實施型態之一例,可在真刹由—主图&amp; 記載的範圍内加上種種的變更。W 了在專利申德圍所 [實施例] [0045] 繼!將本發明的實補之效果,與本發明範圍之外的比較 蕾7 p m另外’將「聚乙二醇」略記為「PEG」,「聚環 氧乙烷」略記為「PEO」。 」取磙 [0046] &lt;實施例1&gt; 八-ηϊΐ量平均分子量卿⑻的聚環氧乙華成化學工業(股) 二13〇ρ Μαΐ50)30重量份,與重量平均分子量2〇,〇〇〇的 二厂醇二洋化成工業㈤公司製PEG20000)70重量份,以樹脂 =份成為30%的狀態’溶解於水/MeOH(甲醇)混合溶液中。此時 =MeOH的比率為6_。並且’此水溶性樹脂組成物之溶液中 乂鉬酉文鋅(日本無機化學工業(股)公司製,粒徑〇 4μηι〜13μηι,平均 3㈣作^固體潤滑劑⑻,相對於水溶性樹脂組成物卿重量 二’以5重f份摻合並充分地分散。將此水雜細旨組成物之溶 用塗佈棒塗佈於單面已形成厚度〇.〇lmm的環氧基樹脂皮膜之 2吏用銘箔:1N30,厚度〇.lmm,灿^聰畑从碰腹剔(股) △司製)上,使乾燥後之水溶性樹脂組成物層厚度成為〇 〇5_, 201235169 於乾燥機以120 C乾燥1分鐘後’冷卻至常溫’製得鑽孔用罢板。 [0047] 孤 〈實施例2〜14&gt; 依照只施例1 ’调配表1所示水溶性樹脂組成物,製作乾燥後 之水溶性樹脂組成物厚度為〇.〇5mm之鑽孔用蓋板。 [0048] &lt;比較例1〜11&gt; 依照實施例1 ’調配表1所示水溶性樹脂組成物,製作乾燥後 之水溶性樹脂組成物厚度為〇.〇5mm之鑽孔用蓋板。 [0049] &lt;評價方法&gt; 有關依實施例及比較例製作之鑽孔用蓋板的各項樣品, 以下之評價。 (1) 孔位置精度 將鑽孔用蓋板於重疊的包銅疊層基板上方,以樹脂組成物層 朝上配置,進行鑽孔加工。每一支鑽頭刃部鑽孔加工6,㈨他如, 使用四支鑽頭刃部重複進行。每i支份鑽頭刃部的每個丨〜丨^⑻、 M,000hits之孔’使用穴位置座標測定器(型號:HA_1AM, \ia Mechanics(股)公司製)測定於重疊的包銅疊層基板之最下板的 巧的孔位置與指定座標之偏差,計算平均值及標準偏差⑷,算 出平均值+3σ」。接著算出4支份鑽頭刃部「平均值+3σ的平 均值’結果如表1所示。 構飞進行鑽頭刃部磨耗1〜之孔位置精度,及進行 =刀^磨耗1〜6,000 hits之孔位置精度,作為孔位置精度的判定 ίΐ〇」虽。1〜U〇0 ^及1〜6,_恤判定為「〇」時,總合評價 (2) 固體潤滑劑(B)的粒度測定法 =^滑_的粒度測定法為,將樣品分散於由α2%六偏罐 鱗(ThritGne)所組成的溶液中,使用 田射繞射式粒度分布測量裝置(型號:SALD_2励,島津製作所股份 15 1 201235169 後=)粒,影出來的固體潤滑劑⑻粒子之最大長度。然 徑,並i曲、旦°將^曲,範圍作為固體潤滑劑⑼的粒 [〇〇5〇] 有里大峰最大時之粒徑作為平均粒徑。S 13 201235169 Thermosetting a thin base polymer and a copolymer of the same. ', [0043] a resin such as a 氧基·% oxy-based resin or a cyanic acid-based resin. For the printed circuit board material, such as the copper-clad laminate, the drilling cover can be configured in the manner of the cladding steel layer, and is composed of resin [0044] In addition, as an example of the embodiment of the present invention, various changes can be added to the range described by the master brake and the master map & W is in the patent Shendewei [Examples] [0045] Following the effect of the actual compensation of the present invention, compared with the scope of the present invention, the bud 7 pm additionally "puts the polyethylene glycol" as "PEG" "Polyethylene oxide" is abbreviated as "PEO".磙 [0046] &lt;Example 1&gt; Eight-n ϊΐ 平均 平均 分子量 ( ( 8 ( ( 8 8 8 8 8 8 8 8 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二70 parts by weight of PEG 20000 manufactured by the company's second plant, Eryang Chemical Industry Co., Ltd., was dissolved in a water/MeOH (methanol) mixed solution in a state where the resin = 30% by weight. At this time = the ratio of MeOH is 6_. And in the solution of the water-soluble resin composition, bismuth molybdenum bismuth zinc (manufactured by Nippon Inorganic Chemical Industry Co., Ltd., particle size 〇4μηι~13μηι, average 3 (four) as solid lubricant (8), relative to the water-soluble resin composition The weight of the second is mixed with 5 parts by weight and is sufficiently dispersed. The coating rod of the composition of the water is applied to the epoxy resin film having a thickness of 〇. Use Ming foil: 1N30, thickness 〇.lmm, Can ^ Cong 畑 from the belly 剔 (stock) △ system), so that the thickness of the water-soluble resin composition layer after drying becomes 〇〇5_, 201235169 in the dryer to 120 After drying for 1 minute, 'cooling to normal temperature', a hole for drilling was obtained. [Embodiment 2 to 14&gt; The water-soluble resin composition shown in Table 1 was prepared in accordance with Example 1 only, and a water-repellent resin composition having a thickness of 〇. &lt;Comparative Examples 1 to 11&gt; According to Example 1 ', the water-soluble resin composition shown in Table 1 was prepared, and a water-repellent resin composition having a thickness of 〇. &lt;Evaluation Method&gt; Each sample of the drilling cover plate produced according to the examples and the comparative examples was evaluated as follows. (1) Hole position accuracy The hole for drilling is placed over the overlapping copper-clad laminate substrate, and the resin composition layer is placed upward to perform drilling. Each drill bit is drilled 6 (9). He repeats using four drill blades. Each of the 钻头 丨 丨 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ' ' ' ' ' ' ' ' ' ' ' ' ' 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠 重叠The deviation between the position of the hole of the lowermost plate of the substrate and the specified coordinate, the average value and the standard deviation (4) were calculated, and the average value +3σ was calculated. Next, the result of calculating the "average value of the average value + 3σ" of the four-part drill blade portion is shown in Table 1. The positional accuracy of the drill blade edge wear 1 to the hole is made, and the hole of the tool is worn by 1 to 6,000 hits. Position accuracy, as a judgment of the hole position accuracy ΐ〇 ΐ〇. 1~U〇0 ^ and 1 to 6, when the _ shirt is judged as "〇", the total evaluation (2) The particle size measurement method of the solid lubricant (B) = slick _ the particle size measurement method is to disperse the sample in In the solution consisting of α2% hexagram scales (ThritGne), using a field diffraction type particle size distribution measuring device (model: SALD_2, Shimadzu Corporation 15 1 201235169 after =), the solid lubricant (8) The maximum length of the particle. However, the diameter of the grain and the radius of the grain of the solid lubricant (9) are the particles of the solid lubricant (9).

[0051] 水溶性樹脂(Α)之組成: (^聚裱氧乙烷(明成化學工業(股)公司製ALTOP MG-150, Mw=150,000)30重量份、聚乙二醇(三洋化成工業股份公司製 Pm20_ ’ Mw=20G,()〇〇)7〇 重量份,合計 100 重量份。 (2)聚醚酯(第一工業製藥(股)公司製pA〇GEN pp_15, Mw=100,000)20重量份、聚乙二酵(三洋化成工業(股)公司製 PEG4000S,Mw=4,000)80 重量份,合計 100 重量份。 固體潤滑劑(B)之種類: 16 201235169 (3) 鉬酸鋅(日本無機化學工業(股)公司製,粒徑〇.4pm〜i3pm, 平均粒徑3μιη,層狀構造) (4) 三氧化鉬(曰本無機化學工業(股)公司製,粒徑 〇·7μιη〜55μιη ’平均粒徑16μιη,柱狀構造) (5) 二硫化錮(DAIZO(股)公司製 Μ-5 Powder,粒徑 0.5〜29μπι, 平均粒徑5μιη,層狀構造) (6) 膨潤性雲母(c〇-〇p chemical製ΜΕ-100 ’粒徑5〜7μπι ’層 狀構造) (7) 非膨潤性雲母(C〇op cihemicai 製]VQC-200,粒徑 5〜8μιη, 層狀構造) ⑻未摻合固體潤滑劑(Β) 固體潤滑劑(Β)之摻合量: 相對於樹脂組成物的樹脂份為1〇〇重量份,固體潤滑劑(Β)以 Q ' 5 ' 1〇 ' 20'40、60、80重董份的任何一項摻合。 [0052] 鑽孔加工條件: (1)鑽頭刃·部直徑:〇 股份公司製 CFU020S),轉速.SOC^ooojpjjj,進給速度 zogjn/rev,上升速度: ’加工基材為不含無機充填材的〇2mmt,Cu 12μ,重疊5片 部直徑:〇.2lnm(KTlmgal〇y 股份公司 j S) ’ 轉速:2〇〇,〇00rpm’進給速度 2〇μπι/Γ6ν,上升 12μ,工基材為加入無機充填材的阳卿〇.2_ ’ C [0053] 相比頭〜11, 置精度顯著較^異痛生雲母、非膨潤性雲母相比,^ 201235169 [產業上利用性] [0054] 依據本發明,可提供蛊以分a w ^ 優異,減少綱峨折損之板相比,孔位置精度 【圖式簡單說明】 [0020] 圖1係鉬酸鋅之掃描式電子顯微鏡照片(χ1〇〇〇〇χ曰本無機化 學工業(版)公司製,粒控〇.4pm〜i3pm,平均粒徑3μιη,層狀構 造)。 圖2係三氧化鉬之掃描式電子顯微鏡照片(χ1〇〇〇〇)(日本無機 化學工業(股)公司,粒徑〇·7μιη〜55μιη,平均粒徑16μιη,柱狀構 造)。 圖3係以鑽孔加工條件1加工後實施例及比較例之孔位置精 度比較圖。 圖4係以鑽孔加工條件2加工後實施例及比較例之孔位置精 度比較圖。 【主要元件符號說明】 無。 18[0051] The composition of the water-soluble resin (Α): (^ polyoxyethylene (ALTOP MG-150, Mw=150,000, manufactured by Mingcheng Chemical Industry Co., Ltd.) 30 parts by weight, polyethylene glycol (Sanyo Chemical Industry Co., Ltd.) Company made Pm20_ 'Mw=20G, ()〇〇) 7 parts by weight, total 100 parts by weight. (2) Polyether ester (first industrial pharmaceutical company) pA〇GEN pp_15, Mw=100,000) 20 weight , Polyethylene glycol (Sankyo Chemical Industry Co., Ltd. PEG4000S, Mw = 4,000) 80 parts by weight, total 100 parts by weight Solid lubricant (B) Type: 16 201235169 (3) Zinc molybdate (Japanese inorganic Chemical industry (stock) company, particle size 〇.4pm~i3pm, average particle size 3μιη, layered structure) (4) Molybdenum trioxide (manufactured by Sakamoto Inorganic Chemical Industry Co., Ltd., particle size 〇·7μιη~55μιη 'Average particle size 16 μmη, columnar structure> (5) Antimony disulfide (D-5, manufactured by DAIZO Co., Ltd., particle size 0.5 to 29 μm, average particle size 5 μιη, layered structure) (6) Swelling mica ( C〇-〇p chemical system-100 'particle size 5~7μπι 'layered structure) (7) non-swelling mica (C〇op cihemicai system) VQ C-200, particle size 5 to 8 μm, layered structure) (8) Unblended solid lubricant (Β) The amount of the solid lubricant (Β) blended: 1 part by weight relative to the resin component of the resin composition, The solid lubricant (Β) is blended with any of Q ' 5 ' 1〇' 20' 40, 60, 80 heavy Dong. [0052] Drilling processing conditions: (1) Drill blade · Part diameter: 〇 shares Company system CFU020S), speed. SOC^ooojpjjj, feed rate zogjn/rev, ascending speed: 'Processed substrate is 〇2mmt without inorganic filler, Cu 12μ, overlap 5 pieces diameter: 〇.2lnm (KTlmgal〇 y stock company j S) 'Speed: 2〇〇, 〇00rpm' feed rate 2〇μπι/Γ6ν, rises 12μ, the working substrate is added to the inorganic filling material Yang Qingxi.2_ 'C [0053] ~11, the setting accuracy is significantly higher than that of the non-swelling mica and the non-swelling mica. ^ 201235169 [Industrial Applicability] [0054] According to the present invention, it is possible to provide a plate which is excellent in aw ^ ^ and reduces the damage of the skeleton Compared to the hole position accuracy [schematic description] [0020] Figure 1 is a scanning electron micrograph of zinc molybdate (χ1〇〇〇〇χ曰本Machine Chemical Industry (Version) manufactured by Grain Size 〇.4pm~i3pm average particle diameter 3μιη, a layered structure made). Fig. 2 is a scanning electron micrograph of molybdenum trioxide (χ1〇〇〇〇) (Nippon Inorganic Chemical Industry Co., Ltd., particle size 〇·7 μιη to 55 μιη, average particle diameter 16 μιη, columnar structure). Fig. 3 is a graph showing the comparison of the hole position precision of the examples and the comparative examples after the drilling processing condition 1. Fig. 4 is a graph showing the comparison of the hole position accuracy of the examples and the comparative examples after the drilling processing condition 2. [Main component symbol description] None. 18

Claims (1)

201235169 七、申請專利範圍: 1. 一種鑽孔用蓋板,係於金屬支撐箔的至少單面上形成有由樹脂 組成物構成之層之鑽孔用蓋板,其特徵為:該樹脂組成物含有 ^做固體潤滑劑(B)之鉬酸鋅及三氧化鉬至少其中之一,且該樹 脂組成物層之厚度為0.02至0.3mm之範圍。 2. 如申請專利範圍第1項之鑽礼用蓋板,其中,該樹脂組成物含 有水溶性樹脂(A)。 3. 如申叫專利範圍第1項之鑽孔用蓋板,其中,該樹脂組成物相 對於該樹脂成分1〇〇重量份,摻合該固體潤滑劑(B)合計丨 份至40重量份。 4. 如申請專利範圍第1項之鑽孔用蓋板,其中,該鉬酸鋅平均粒 徑為1〜7μιπ。 5. 士申明專利範圍第1項之鑽孔用蓋板,其中,該三氧化銦平 粒控為3〜35μιη。 6. 如申請專利範圍第1項之鑽孔用蓋板,其適用於直徑 以下之鑽頭刃部。 Ψ 7. 如申請專利範圍第1項之鑽孔甩蓋板,其中,該金屬支撐箱严 度為0.05〜〇.5mm之範圍。 8. 如申請專利範圍第1項之鑽孔用蓋板,其中,於該金屬支撐箱 之上具有做為樹脂皮膜之底漆層。 9·如申請專利範圍第8項之鑽孔用蓋板,其中,該底漆層含 固體潤滑劑(B)。 茨 10. 如申請專利範圍第9項之鑽孔用蓋板,其中,該固體潤滑劑出 於底漆層之摻合量’相對於該底漆之組成物100重量份為J I 量份〜20重量份。 11. 如申請專利範圍第1項之鑽孔用蓋板,其係使用於包銅 板或多層板之加工。 八、圖式: 19201235169 VII. Patent application scope: 1. A drilling cover plate, which is a drilling cover plate formed with a layer composed of a resin composition on at least one surface of a metal support foil, characterized in that the resin composition At least one of zinc molybdate and molybdenum trioxide containing the solid lubricant (B), and the thickness of the resin composition layer is in the range of 0.02 to 0.3 mm. 2. The drill cover for claim 1, wherein the resin composition contains a water-soluble resin (A). 3. The cover plate for drilling according to the first aspect of the invention, wherein the resin composition is blended with the solid lubricant (B) in an amount of 1 part by weight to 40 parts by weight based on 1 part by weight of the resin component. . 4. The casing for drilling according to the first aspect of the invention, wherein the zinc molybdate has an average particle diameter of from 1 to 7 μm. 5. The casing for drilling according to the first aspect of the invention, wherein the indium trioxide granule is controlled to be 3 to 35 μm. 6. For the drilling cover according to item 1 of the patent application, it is suitable for the drill blade below the diameter. Ψ 7. For the drilled boring cover according to item 1 of the patent application, wherein the metal support box is in the range of 0.05 to 〇.5 mm. 8. The cover for drilling according to the first aspect of the invention, wherein the metal support box has a primer layer as a resin film. 9. The casing for drilling according to item 8 of the patent application, wherein the primer layer contains a solid lubricant (B). The casing for drilling according to the ninth aspect of the invention, wherein the amount of the solid lubricant to be mixed with the primer layer is JI parts by weight relative to 100 parts by weight of the composition of the primer. Parts by weight. 11. For the drilling of the cover plate of the scope of claim 1, it is used for the processing of copper-clad or multi-layer boards. Eight, schema: 19
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