JP2005159116A - Method for manufacturing printed wiring board - Google Patents

Method for manufacturing printed wiring board Download PDF

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Publication number
JP2005159116A
JP2005159116A JP2003397142A JP2003397142A JP2005159116A JP 2005159116 A JP2005159116 A JP 2005159116A JP 2003397142 A JP2003397142 A JP 2003397142A JP 2003397142 A JP2003397142 A JP 2003397142A JP 2005159116 A JP2005159116 A JP 2005159116A
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Prior art keywords
wiring board
printed wiring
sheet
drilling
punching
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Inventor
Tetsushi Nemoto
哲志 根本
Kazunori Sakuma
和則 佐久間
Atsushi Inoue
敦史 井上
Yasushi Oyama
泰 大山
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Priority to JP2003397142A priority Critical patent/JP2005159116A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board using a sheet for punching a printed wiring board for highly precisely carrying out the punching of the printed wiring board, and for obtaining a high quality printed wiring board by minimizing the wobbling of a drill bit, and reducing drill smear or internal wall roughness. <P>SOLUTION: This sheet for punching a printed wiring board in which adhesive added with lubricant is interposed by thermoplastic resin films is inserted between a printed wiring board and a backup board to carry out the punching of the printed wiring board. In this case, it is desired that the punching of the printed wiring board is carried out from the upper part with such configurations that aluminum foils are laminated on the uppermost part of the printed wiring board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、プリント配線板穴あけ加工用シートを用いたプリント配線板製造方法に関する。   The present invention relates to a printed wiring board manufacturing method using a printed wiring board drilling sheet.

近年パソコンや携帯電話等の普及により電子製品は小型化・軽量化、高機能化が求められている。それに伴い用いられるプリント配線板のパターンの高密度化、高多層化が急速に進み、その結果プリント配線板のライン幅と間隔は狭まり、さらにスルーホールは小口径化が進むと同時にその数は増大している。それに加えて接続用の穴位置についても必然的に高い精度が要求されてきている。今後もパターンの高密度化、高多層化はより一層進行し、ドリルによる穴あけ加工の回数、小口径化はますます増大するものと予想される。   In recent years, with the spread of personal computers and mobile phones, electronic products are required to be smaller, lighter, and more functional. Along with this, the density of printed wiring boards and the increase in the number of layers are rapidly progressing. As a result, the line width and spacing of printed wiring boards are narrowed, and the number of through-holes increases as the diameter of through-holes increases. doing. In addition to that, high precision is inevitably required for the hole positions for connection. In the future, the pattern density and the number of layers will continue to increase further, and the number of drilling operations with drills and smaller diameters are expected to increase.

このような小口径の穴あけ加工を行うには、一般的にプリント配線板に加工用シートを重ねてドリル加工を行うことで、配線板に加工される穴位置の精度が向上し、穴内壁の粗さを低減して精度よく穴あけが行うことができることが知られている。
ここで用いられる加工用シートとしては、熱可塑性フィルムを用いてドリル加工する方法(特許文献1)、アルミニウム箔の両面を紙で挟んだシートを用いてプリント配線板をドリル加工する方法(特許文献2)、アルミニウム箔を接着剤で貼リ合せたシートを用いる方法(特許文献3)やアルミニウム箔に水溶性樹脂および水溶性滑材からなるシートを用いる方法(特許文献4)などの小口径穴あけ加工用シートが提案されている。
In order to perform such a small-diameter drilling process, drilling is generally performed by stacking a processing sheet on a printed wiring board, so that the accuracy of the hole position processed in the wiring board is improved and the inner wall of the hole is improved. It is known that drilling can be performed accurately with reduced roughness.
As a processing sheet used here, a method of drilling using a thermoplastic film (Patent Document 1), a method of drilling a printed wiring board using a sheet in which both sides of an aluminum foil are sandwiched by paper (Patent Document) 2) Small-diameter drilling such as a method using a sheet obtained by bonding an aluminum foil with an adhesive (Patent Document 3) or a method using a sheet made of a water-soluble resin and a water-soluble lubricant on an aluminum foil (Patent Document 4) Processing sheets have been proposed.

しかし、特許文献1に記載の熱可塑性フィルムを用いてドリル加工する方法は、多層板配線板を重ねて穴あけ加工すると穴位置精度が悪化してしまう。特許文献2に記載のアルミニウム箔の両面を紙で挟んだシートを用いてプリント配線板をドリル加工する方法は、紙の粉末が発生しその後の工程に悪影響を及ぼす可能性が高く、特許文献3に記載のアルミニウム箔を接着剤で貼り合せたシートを用いる方法では、アルミニウム箔を2枚貼り合せるためコストが高くなることが否めない。
また、特許文献4に記載のアルミニウム箔に水溶性樹脂および水溶性滑材から生成した皮膜を構成したシートを用いる方法では水溶性樹脂および水溶性滑材で構成されているため湿度の管理が必要であり、さらに融点が常温に近いため温度管理も必要になるといった問題がある。
However, in the method of drilling using the thermoplastic film described in Patent Document 1, the hole position accuracy is deteriorated when the multilayer board wiring board is punched. The method of drilling a printed wiring board using a sheet in which both sides of an aluminum foil described in Patent Document 2 are sandwiched with paper is highly likely to generate paper powder and adversely affect subsequent processes. In the method using the sheet in which the aluminum foil described in (2) is bonded with an adhesive, it cannot be denied that the cost increases because two aluminum foils are bonded.
Further, in the method using a sheet comprising a film formed from a water-soluble resin and a water-soluble lubricant on the aluminum foil described in Patent Document 4, humidity control is required because the sheet is composed of a water-soluble resin and a water-soluble lubricant. Furthermore, since the melting point is close to room temperature, there is a problem that temperature management is required.

特公平7−50831号公報Japanese Patent Publication No. 7-50831 特開昭62−214000号公報Japanese Patent Laid-Open No. 62-214000 特開平11−48196号公報Japanese Patent Laid-Open No. 11-48196 特開平10−335780号公報JP-A-10-335780

本発明はかかる実状に鑑みなされたもので、プリント配線板の穴あけ加工を精度のよく行うことができるプリント配線板穴あけ加工用シートを用いたプリント配線板の製造方法を提供するものである。
本発明は、また、ドリルの軸ぶれが少なくドリルスミアや内壁粗さを低減して高品質なプリント配線板を得ることのできるプリント配線板穴あけ加工用シートを用いたプリント配線板の製造方法を提供するものである。
The present invention has been made in view of such a situation, and provides a method for manufacturing a printed wiring board using a printed wiring board drilling sheet capable of accurately drilling a printed wiring board.
The present invention also provides a method of manufacturing a printed wiring board using a printed wiring board drilling sheet that can obtain a high-quality printed wiring board by reducing drill smear and inner wall roughness with less axial deflection of the drill. To do.

本発明は、次のものに関する。
1.潤滑剤を添加した粘着剤を熱可塑性樹脂フィルムで挟み込んだプリント配線板穴あけ加工用シートを、プリント配線板とバックアップボードとの間に挿入して、プリント配線板の穴あけ加工することを特徴とするプリント配線版の製造方法。
2.プリント配線板の最上部にアルミ箔を積層した構成で上方よりドリルによって穴あけ加工する項1記載のプリント配線板の製造方法。
The present invention relates to the following.
1. A printed wiring board drilling sheet in which an adhesive containing a lubricant is sandwiched between thermoplastic resin films is inserted between the printed wiring board and a backup board, and the printed wiring board is punched. Manufacturing method of printed wiring board.
2. Item 2. The method for producing a printed wiring board according to item 1, wherein the aluminum foil is laminated on the uppermost part of the printed wiring board, and drilling is performed from above with a drill.

本発明の加工用シートを用いプリント配線板製造方法は、高精度な穴あけが要求されるプリント配線板の穴あけに用いられ、スミアの発生がなく、穴位置精度が高く、さらに穴壁の粗さが小さい高品質なプリント配線板を得ることができる。それに加えドリルの破損を防止し、寿命を延ばすという効果もある。   The printed wiring board manufacturing method using the processing sheet according to the present invention is used for drilling a printed wiring board that requires high-precision drilling, does not generate smear, has high hole position accuracy, and further has a hole wall roughness. Can be obtained. In addition, it has the effect of preventing damage to the drill and extending its life.

本発明になるプリント配線板穴あけ加工用シートを用いたプリント配線板の製造方法を図面を用いて説明する。図1は、本発明になるプリント配線板穴あけ加工用シート1を用いたプリント配線板の製造方法の一例を示す概略断面図である。図2は本発明において用いるプリント配線板加工シート1の一例の断面図を示す。熱可塑性樹脂フィルム2が潤滑剤を添加した粘着剤3を介して貼り合せている。図1において、プリント配線板穴あけ加工用シート1をプリント配線板4とバックアップボード5の間に配置し、さらに基板最上部にアルミニウム箔6を重ね、アルミニウム箔6上部よりドリル7によって穴あけ加工を行う。
従来のアルミニウム箔上に潤滑剤が配置された穴あけ加工用シートを用いた場合に比べて穴の内壁を粗らす原因であるアルミニウム箔の切り屑を基板の間にある潤滑剤がより効果的に排出を促すことで内壁粗さの向上させる。さらに、プリント配線板穴あけ加工用シートを挟み込む位置は、重ねたプリント配線板の下部のバックアップボードとの間が、高品質なプリント配線板を得るに最適であることがわかった。
A method for manufacturing a printed wiring board using the printed wiring board drilling sheet according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view showing an example of a method for producing a printed wiring board using a printed wiring board drilling sheet 1 according to the present invention. FIG. 2 shows a cross-sectional view of an example of the printed wiring board processed sheet 1 used in the present invention. The thermoplastic resin film 2 is bonded through an adhesive 3 to which a lubricant is added. In FIG. 1, a printed wiring board drilling sheet 1 is disposed between a printed wiring board 4 and a backup board 5, and an aluminum foil 6 is stacked on the top of the substrate, and drilling is performed from above the aluminum foil 6 with a drill 7. .
Lubricant between the substrate and aluminum foil chips that cause roughening of the inner wall of the hole is more effective than using a drilling sheet with lubricant on a conventional aluminum foil Improves inner wall roughness by encouraging discharge. Furthermore, it was found that the position where the printed wiring board punching sheet is sandwiched is optimal for obtaining a high-quality printed wiring board between the stacked printed wiring boards and the backup board below.

本発明で用いる熱可塑性樹脂フィルム2の材質としては、ポリエチレン、ポリプロピレン、ポリエチレン−ポリプロピレンブレンドポリマ、ポリビニルアルコール、ポリアミド、ポリ塩化ビニル、ポリエチレンテレフタレート、ポリカーボネート、EVA等があげられるが、融点が90〜250℃のものが好ましい。融点が低くなるとドリルヘの融着が顕著になる傾向があり、融点が高くなるとフィルムへの製膜が困維になる傾向がある。   Examples of the material of the thermoplastic resin film 2 used in the present invention include polyethylene, polypropylene, polyethylene-polypropylene blend polymer, polyvinyl alcohol, polyamide, polyvinyl chloride, polyethylene terephthalate, polycarbonate, EVA and the like, and a melting point of 90 to 250. C. is preferred. When the melting point is low, the fusion to the drill tends to become remarkable, and when the melting point is high, the film formation tends to be difficult.

本発明おける熱可塑性樹脂フィルム2は、単層でも2層以上の多層フィルムであってもよい。
本発明おける熱可塑性樹脂フィルム2の厚みは12〜150μmであることが好ましい。熱可塑性樹脂フィルムが薄すぎるとシート作製時にシワがはいりやすかったり、厚すぎると厚み精度が損なわれ穴あけ精度を低下させる傾向がある。
The thermoplastic resin film 2 in the present invention may be a single layer or a multilayer film having two or more layers.
The thickness of the thermoplastic resin film 2 in the present invention is preferably 12 to 150 μm. If the thermoplastic resin film is too thin, wrinkles are likely to occur at the time of producing the sheet, and if it is too thick, the thickness accuracy is impaired and the drilling accuracy tends to be lowered.

潤滑剤を添加する粘着剤3には、一般的にブチルアクリレート,エチルアクリレート,ブチルメタクリレートに代表されるアクリル酸エステル,エチルメタクリレート,ブチルメタクリレート、ヘキシルメタクリレート等のメタクリル酸エステルの重合体又は共重合体であるアクリル系粘着剤、イソプレン等の天然ゴム系粘着剤、スチレン−ブタジエン共重合体ゴム、アクリロニトリル−ブタジエン共重合体ゴム,スチレン−エチレン−ブタジエン共重合体ゴム,ポリイソブチレン等の合成ゴム系粘着剤、エチレン−酢酸ビニル共重合体系粘着剤、およびこれらの混合系粘着剤を用いることができる。   As the pressure-sensitive adhesive 3 to which a lubricant is added, a polymer or copolymer of a methacrylic ester such as acrylate, ethyl methacrylate, butyl methacrylate, hexyl methacrylate or the like generally represented by butyl acrylate, ethyl acrylate or butyl methacrylate Acrylic adhesive, natural rubber adhesive such as isoprene, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, styrene-ethylene-butadiene copolymer rubber, synthetic rubber adhesive such as polyisobutylene Agents, ethylene-vinyl acetate copolymer adhesives, and mixed adhesives thereof can be used.

粘着剤に混合される潤滑剤としては、グリセリン脂肪酸エステル等のエステル系合成油、ジフェニルエーテル系合成油、シリコーン系合成油、鉱物油、また固形パラフィンやポリエチレンワックス、二硫化モリブデン、窒化ホウ素などの固形潤滑剤などが挙げられるがこれに限定されるものではなく、これら潤滑剤を単独もしくは混合してもちいる。潤滑剤の使用量は粘着剤100重量部に対し、5〜70重量部が好ましく、15〜60重量部がさらに好ましい。潤滑剤の添加量が少なすぎるとドリルの滑りを促進させる効果が低下し、多すぎると熱可塑性樹脂フィルムとの投錨性が失われ剥がれてしまうという欠点がある。
また、合成油系潤滑剤と固形潤滑剤を混合することで潤滑剤を添加した粘着剤を製膜し易くする効果が得られる。
Lubricants mixed with the adhesive include ester-based synthetic oils such as glycerin fatty acid esters, diphenyl ether-based synthetic oils, silicone-based synthetic oils, mineral oils, and solid paraffin, polyethylene wax, molybdenum disulfide, boron nitride, and the like. Although a lubricant etc. are mentioned, it is not limited to this, These lubricants may be used individually or in mixture. The amount of the lubricant used is preferably 5 to 70 parts by weight, more preferably 15 to 60 parts by weight with respect to 100 parts by weight of the adhesive. If the addition amount of the lubricant is too small, the effect of promoting the sliding of the drill is lowered, and if it is too much, the anchoring property with the thermoplastic resin film is lost and peeled off.
Further, by mixing the synthetic oil-based lubricant and the solid lubricant, an effect of facilitating film formation of the pressure-sensitive adhesive added with the lubricant can be obtained.

潤滑剤を添加した粘着剤3の厚みは10〜100μmが好ましい。10μmよりも薄いと潤滑効果が不十分で内壁粗さを増大させる傾向がある。逆に100μmよりも厚いと切り屑排出の妨げとなり内壁粗さを増大させ、ドリルの磨耗を促進させる傾向がある。   The thickness of the pressure-sensitive adhesive 3 to which a lubricant is added is preferably 10 to 100 μm. If it is thinner than 10 μm, the lubricating effect is insufficient and the inner wall roughness tends to increase. On the contrary, if it is thicker than 100 μm, chip discharge is hindered and the inner wall roughness is increased, and the wear of the drill tends to be accelerated.

ここで穴あけ加工シート1を作製する手順としては、有機溶剤により潤滑剤を添加した粘着剤の粘度を調整し、塗布等の手段により薄膜上に潤滑剤添加の粘着剤を形成した後、もう一方の薄膜をラミネートする方法が一般的に挙げられるがこれに限定されるものではない。   Here, as a procedure for producing the punched sheet 1, the viscosity of the adhesive added with the lubricant is adjusted with an organic solvent, and the adhesive added with the lubricant is formed on the thin film by means of coating or the like. Although the method of laminating the thin film is generally mentioned, it is not limited to this.

対象となるプリント配線板は特に制限はないが、代表的には2層以上の多層板で、スルーホールの加工をするのに使用する。使用するドリルとしては特に高回転でドリルへの負荷が大きい、直径0.1〜1.0mmのような小口径穴あけに適している。   The target printed wiring board is not particularly limited, but is typically a multilayer board having two or more layers, which is used to process through holes. The drill to be used is particularly suitable for drilling a small-diameter hole having a diameter of 0.1 to 1.0 mm, which has a high rotation and a large load on the drill.

このような穴あけ加工シートを用いて穴あけ加工する場合、穴あけシートの挿入位置によって穴あけ加工性が影響されることがわかった。種々の検討の結果、穴あけ加工シートは、プリント配線板とバックアップボードとの間に挿入する場合が、プリント配線板の上部あるいはプリント配線板の間に挿入する場合と比較して、穴あけ加工性に優れていることがわかった。穴あけシートをプリント配線板の間に挿入する場合は、バックアップボードの切り屑排出の効果が十分に得られず、穴詰りが発生する傾向がある。さらにプリント配線板の最上部には穴あけ用の当て板としてアルミニウム箔を積層した構成で上方よりドリルによって穴あけ加工することが望ましい。 この場合の当て板として用いるアルミニウム箔の厚みは50〜200μmが好ましい。アルミニウム箔の厚みが50μmよりも薄いとドリルのぶれを抑える効果が低下し、それに伴い穴位置精度が悪化する。また、200μmよりも厚い場合はドリルの磨耗を促進させる傾向がある。   When drilling using such a punched sheet, it was found that the drilling workability is affected by the insertion position of the drilled sheet. As a result of various investigations, the hole punching sheet has better drilling performance when inserted between the printed wiring board and the backup board than when inserted between the upper part of the printed wiring board or the printed wiring board. I found out. When inserting a punching sheet between printed wiring boards, the effect of discharging chips from the backup board cannot be obtained sufficiently, and clogging tends to occur. Further, it is desirable to perform a drilling process from above with a drill in a configuration in which an aluminum foil is laminated on the uppermost part of the printed wiring board as a punching plate. The thickness of the aluminum foil used as the backing plate in this case is preferably 50 to 200 μm. When the thickness of the aluminum foil is less than 50 μm, the effect of suppressing the shake of the drill is lowered, and the hole position accuracy is deteriorated accordingly. Moreover, when thicker than 200 micrometers, there exists a tendency to promote wear of a drill.

以下、本発明を実施例に基づいて説明するが、本発明はこれらの実施例によリ限定されるものでない。
(実施例1)
厚みが40μmのポリプロピレンフィルムにSEBS系粘着剤G−1657(シェル化学(株)製商品名)100重量部に対し潤滑油ネオクールFL−1(松村石油研究所製商品名)20重量部添加した粘着剤をトルエンで溶解し、塗布量20μmとなるように塗布し、もう一つのポリプロピレンフィルムと貼リ合わせして穴あけ加工用シートとした。
この穴あけ加工シートを6層の銅張り積層板を3枚重ねたものと紙フェノール板との間に挿入し、最上部に厚み150μmのアルミニウムを積層した。φ0.3mmのドリルを用いて125krpm、2.5m/min、20μ/revの条件で3000穴の穴あけ加工をし、2981〜3000ショットの20穴について最上部の多層板穴部のスミアの有無、穴位置精度、穴壁粗さを観察した。結果を表1に示す。
EXAMPLES Hereinafter, although this invention is demonstrated based on an Example, this invention is not limited to these Examples.
(Example 1)
Adhesion obtained by adding 20 parts by weight of lubricating oil Neocool FL-1 (trade name, manufactured by Matsumura Oil Research) to 100 parts by weight of SEBS adhesive G-1657 (trade name, manufactured by Shell Chemical Co., Ltd.) on a polypropylene film having a thickness of 40 μm The agent was dissolved in toluene, applied to a coating amount of 20 μm, and pasted with another polypropylene film to form a punching sheet.
The punched sheet was inserted between a stack of three copper-clad laminates of 6 layers and a paper phenol plate, and aluminum having a thickness of 150 μm was laminated on the top. Using a φ0.3 mm drill, drilling 3000 holes under the conditions of 125 krpm, 2.5 m / min, 20 μ / rev, and whether there is smear in the uppermost multilayer plate hole for 20 holes of 2981-3000 shots, The hole position accuracy and hole wall roughness were observed. The results are shown in Table 1.

(実施例2)
SEBS系粘着剤G−1657(シェル化学(株)製商品名)100重量部に対し潤滑油ネオクールFL−1(松村石油研究所製商品名)20重量部と窒化ホウ素5重量部を添加した他は実施例1と同様にして試験した。結果を表1に示す。
(Example 2)
Other than adding 100 parts by weight of SEBS adhesive G-1657 (trade name, manufactured by Shell Chemical Co., Ltd.) 20 parts by weight of lubricating oil Neocool FL-1 (trade name, manufactured by Matsumura Oil Research) and 5 parts by weight of boron nitride Were tested as in Example 1. The results are shown in Table 1.

(実施例3)
熱可塑性フィルムを外層がポリプロピレン ショウアロマFA−465(昭和電工(株)製商品名)、内層がポリエチレン ショウレックスS6005A(昭和電工(株)製商品名)の3層押し出しフィルム 厚み60μmにした他は実施例1と同様にして試験した。結果を表1に示す。
(Example 3)
A thermoplastic film is a three-layer extruded film whose outer layer is polypropylene show aroma FA-465 (trade name, manufactured by Showa Denko KK), and whose inner layer is polyethylene sholex S6005A (trade name, manufactured by Showa Denko KK). The test was performed in the same manner as in Example 1. The results are shown in Table 1.

(比較例1)
6層の銅張り積層板を3枚重ねたものの最上部に厚み150μmのアルミニウムを積層し、最下部には穴あけ加工シートを挿入せずに紙フェノール板のみを設置し、その他は実施例1と同様の条件で試験した。結果を表1に示す。
(Comparative Example 1)
Three layers of six-layer copper-clad laminates were laminated with 150 μm thick aluminum at the top, and only the paper phenol plate was installed at the bottom without inserting a perforated sheet. It tested on the same conditions. The results are shown in Table 1.

(比較例2)
実施例1と同様に方法で作製した穴あけ加工シートを6層の銅張り積層板を3枚重ねたものの上方から1番目と2番目の間に挿入し、最上部に厚み150μmのアルミニウム箔を積層し最下部には紙フェノール板を設置して、その他は実施例1と同様の条件で試験した。結果を表1に示す。
(Comparative Example 2)
A punched sheet produced by the same method as in Example 1 was inserted between the first and second layers of three layers of six copper-clad laminates, and an aluminum foil with a thickness of 150 μm was laminated on the top. A paper phenol plate was installed at the bottom, and the others were tested under the same conditions as in Example 1. The results are shown in Table 1.

Figure 2005159116
Figure 2005159116

実施例1〜2はスミアの発生がなく、穴位置精度、穴壁粗さ、穴詰りについても良好であった。それに対し、比較例1は潤滑材がないために潤滑効果が低下し穴壁の粗さが大きく、また穴詰りが発生し、比較例2では穴詰りが発生した。   In Examples 1 and 2, smear was not generated, and the hole position accuracy, hole wall roughness, and hole clogging were good. On the other hand, in Comparative Example 1, since there was no lubricant, the lubrication effect was reduced, the hole wall was rough, and clogging occurred. In Comparative Example 2, clogging occurred.

プリント配線板穴あけ加工用シートを用いたプリント配線板製造方法を示す概略断面図。The schematic sectional drawing which shows the printed wiring board manufacturing method using the printed wiring board punching sheet. 本発明にかかるプリント配線板穴あけ加工用シートの断面図。Sectional drawing of the sheet | seat for printed wiring board drilling processing concerning this invention.

符号の説明Explanation of symbols

1 プリント配線板穴あけ加工用シート
2 熱可塑性樹脂フィルム
3 潤滑剤含有粘着剤
4 プリント配線板
5 アルミニウム箔
6 バックアップボード
7 ドリル



DESCRIPTION OF SYMBOLS 1 Sheet for printed wiring board drilling process 2 Thermoplastic resin film 3 Lubricant containing adhesive 4 Printed wiring board 5 Aluminum foil 6 Backup board 7 Drill



Claims (2)

潤滑剤を添加した粘着剤を熱可塑性樹脂フィルムで挟み込んだプリント配線板穴あけ加工用シートを、プリント配線板とバックアップボードとの間に挿入してプリント配線板の穴あけ加工することを特徴とするプリント配線板の製造方法。 Printed circuit board drilling process by inserting a printed wiring board drilling sheet with a lubricant-added adhesive between thermoplastic resin films and inserting it between the printed wiring board and backup board A method for manufacturing a wiring board. プリント配線板の最上部にアルミニウム箔を積層した構成で上方よりドリルによって穴あけ加工する請求項1記載のプリント配線板の製造方法。



The manufacturing method of the printed wiring board of Claim 1 which drills with a drill from the upper direction in the structure which laminated | stacked the aluminum foil on the uppermost part of the printed wiring board.



JP2003397142A 2003-11-27 2003-11-27 Method for manufacturing printed wiring board Pending JP2005159116A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810708B1 (en) * 2006-12-05 2008-03-07 한국전자통신연구원 An adhesion method of a flexible substrate to a carrier for flexible display device
WO2012091179A1 (en) * 2010-12-28 2012-07-05 三菱瓦斯化学株式会社 Drill entry sheet
JPWO2013146612A1 (en) * 2012-03-27 2015-12-14 三菱瓦斯化学株式会社 Entry sheet for drilling holes
US9358618B2 (en) 2013-07-29 2016-06-07 Globalfoundries Inc. Implementing reduced drill smear

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810708B1 (en) * 2006-12-05 2008-03-07 한국전자통신연구원 An adhesion method of a flexible substrate to a carrier for flexible display device
WO2012091179A1 (en) * 2010-12-28 2012-07-05 三菱瓦斯化学株式会社 Drill entry sheet
JPWO2012091179A1 (en) * 2010-12-28 2014-06-09 三菱瓦斯化学株式会社 Entry sheet for drilling holes
RU2526652C1 (en) * 2010-12-28 2014-08-27 Мицубиси Гэс Кемикал Компани, Инк. Drilling mask
JP5842828B2 (en) * 2010-12-28 2016-01-13 三菱瓦斯化学株式会社 Entry sheet for drilling holes
KR101852334B1 (en) 2010-12-28 2018-04-26 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Drill entry sheet
JPWO2013146612A1 (en) * 2012-03-27 2015-12-14 三菱瓦斯化学株式会社 Entry sheet for drilling holes
US9358618B2 (en) 2013-07-29 2016-06-07 Globalfoundries Inc. Implementing reduced drill smear

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