TWM495943U - A drilling entry board - Google Patents

A drilling entry board Download PDF

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TWM495943U
TWM495943U TW103218278U TW103218278U TWM495943U TW M495943 U TWM495943 U TW M495943U TW 103218278 U TW103218278 U TW 103218278U TW 103218278 U TW103218278 U TW 103218278U TW M495943 U TWM495943 U TW M495943U
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water
weight
composition layer
resin composition
parts
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TW103218278U
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Chinese (zh)
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Yun-Chao Yeh
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Uniplus Electronics Co Ltd
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Priority to TW103218278U priority Critical patent/TWM495943U/en
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Description

鑽孔用蓋板Drilling cover

本創作係有關一種鑽孔用蓋板,尤指一種可用於IC載板、PCB、BGA板等領域使用之鑽孔用蓋板,其具有結構簡單、可形成較佳的孔壁粗糙度與較少的鑽頭上樹脂捲附之優點。The present invention relates to a drilling cover plate, in particular to a drilling cover plate which can be used in the fields of IC carrier board, PCB, BGA board, etc., which has a simple structure and can form a better hole wall roughness and comparison. The advantage of the resin wound on the less drill bit.

近年來,電子產品趨向輕薄、多功能及高速度發展,使得印刷電路板於微孔數量與密度比例急遽增加,基於此趨勢下,鑽孔品質、孔位精準度與鑽針壽命等功效然為重要指標,然而傳統鋁箔或酚醛樹脂等蓋板等傳統輔助板,早已不適用此需求之應用上,若勉強使用則易斷針、孔偏與鑽針磨損等不良缺失發生。In recent years, electronic products have become light, versatile and high-speed development, which has led to an increase in the number and density of micro-holes in printed circuit boards. Based on this trend, the quality of drilling, the accuracy of hole position and the life of the bur are the same. Important indicators, however, traditional aluminum foil or phenolic resin and other traditional auxiliary plates, has long been unsuitable for this application, if it is barely used, it is easy to break the needle, hole deviation and drilling pin wear and other undesirable defects.

現今,不同型態所與構成的鑽孔金屬蓋板(鋁蓋板最多)相應而生,但可穩定且無疑被應用者鮮寡,主要係於潤滑層配方複雜且於緩衝鑽孔下角壓力、潤滑鑽針(減少鑽針磨損)與密著金屬箔(鑽針散熱功能)等功能上皆顯不足。例如以屬於水溶性潤滑混合物、合成蠟與紙片所製成的鑽孔板,但卻有鑽針無法散熱與黏性問題;以聚乙二醇或聚醚酯類改良黏性問題,但卻有鑽針無法排屑與孔偏問題;以水溶性樹脂混合水不溶性潤滑劑製成膠片、膠片與鋁箔之複合材、膠片、鋁箔間塗佈熱固性樹脂,共三種不同組合構造的鑽孔蓋板,但配方與生產皆複雜且結合用之熱 固性樹脂層,因硬度高易使得鑽針打滑而孔偏移或斷針。Nowadays, different types of drilled metal cover plates (maximum aluminum cover plates) are formed correspondingly, but they can be stabilized and undoubtedly used by the application, mainly due to the complicated formula of the lubricating layer and the angular pressure under the buffer hole. Lubrication of the drill (reducing the wear of the drill) and the adhesion of the metal foil (drill cooling function) are insufficient. For example, a drilled plate made of a water-soluble lubricating mixture, a synthetic wax and a paper sheet, but there is a problem that the drill pin cannot dissipate heat and viscosity; the polyethylene glycol or polyether ester improves the viscosity problem, but there is The drill needle can not be chipped and the hole is biased; the water-soluble resin mixed with water-insoluble lubricant is used to make the film, the film and the aluminum foil composite, the film and the aluminum foil are coated with the thermosetting resin, and the drilling cover plate has three different combinations. But the formula and production are complex and combined with the heat The solid resin layer is easy to make the drill slip and the hole is broken or broken due to high hardness.

本創作之主要目的在提供一種結構簡單、可形成較佳的孔壁粗糙度與較少的鑽頭上樹脂捲附之鑽孔用蓋板。The main object of the present invention is to provide a drilling cover plate which has a simple structure and can form a preferred hole wall roughness and a small resin wound on the drill bit.

為達上述之目的,本創作所設之一種鑽孔用蓋板,包括一金屬箔以及至少一層的親水性樹脂組成物層,其中該親水性樹脂組成物層係結合於該金屬箔上,且該親水性樹脂組成物層之反應熱焓值介於10~40(J/g),且熔點為介於48~70℃之間。In order to achieve the above object, a drilling cover plate provided by the present invention comprises a metal foil and at least one layer of a hydrophilic resin composition layer, wherein the hydrophilic resin composition layer is bonded to the metal foil, and The hydrophilic resin composition layer has a reaction enthalpy of 10 to 40 (J/g) and a melting point of between 48 and 70 °C.

實施時,該金屬箔之厚度為0.05mm~0.2mm。When implemented, the thickness of the metal foil is 0.05 mm to 0.2 mm.

實施時,該親水性樹脂組成物層之厚度為0.02mm~0.15mm。When implemented, the hydrophilic resin composition layer has a thickness of 0.02 mm to 0.15 mm.

實施時,該親水性樹脂組成物層係包括一係選自於聚環氧丙烷、聚環氧乙烷、聚伸丁二醇、聚烯烴乙二醇聚酯、羧甲基纖維素、聚乙烯吡咯啶酮、聚丙烯醯胺及聚丙烯酸鈉其中一種之具有結晶性之水溶性樹脂;或,親水性樹脂組成物層係包括一選自於聚乙二醇酚醚、聚乙二醇烷基醚等醇醚類之具有結晶性之水溶性樹脂;或,該親水性樹脂組成物層係包括一選自於己六醇、丙二醇、丙三醇等醇類之具有結晶性之水溶性樹脂。When implemented, the hydrophilic resin composition layer comprises a series selected from the group consisting of polypropylene oxide, polyethylene oxide, polybutylene glycol, polyolefin ethylene glycol polyester, carboxymethyl cellulose, and polyethylene. a water-soluble resin having a crystallinity of one of pyrrolidone, polypropylene decylamine and sodium polyacrylate; or a hydrophilic resin composition layer comprising one selected from the group consisting of polyethylene glycol phenol ether and polyethylene glycol alkyl group A water-soluble resin having crystallinity such as an ether ether such as ether; or the hydrophilic resin composition layer comprising a water-soluble resin having crystallinity selected from the group consisting of alcohols such as hexahexol, propylene glycol and glycerin.

實施時,該水溶性樹脂另混合有一無機化合物、一消泡劑及一界面活性劑,以形成該親水性樹脂組成物層。When implemented, the water-soluble resin is further mixed with an inorganic compound, an antifoaming agent and a surfactant to form the hydrophilic resin composition layer.

實施時,該無機化合物係為滑石粉、二硫化鉬、鉬酸鋅、碳酸鈣、石墨、氮化硼、氮化鋁、氧化鋁、氫氧化鋁等其中一種或兩種以上之物質。In practice, the inorganic compound is one or more of talc, molybdenum disulfide, zinc molybdate, calcium carbonate, graphite, boron nitride, aluminum nitride, aluminum oxide, and aluminum hydroxide.

實施時,該消泡劑係為改質之聚矽氧烷(Polysiloxane)樹脂 及其相關之衍生物、矽力康(Silicone)及其脂肪酸、脂肪酸胺、聚醚化合物等其中一種或兩種以上之物質。When implemented, the antifoaming agent is a modified polysiloxane resin. And related derivatives thereof, Silicone and its fatty acids, fatty acid amines, polyether compounds, and the like.

實施時,該界面活性劑為一分子中有親水性(hydrophilic part)部份與親脂性(lipophilic part)部份共存之化合物,其中該親水性部份則有碳酸鹽、硫酸鹽等,該親脂性部份有直鍊、側鍊甚或環狀芳香族碳氫原子團。When implemented, the surfactant is a compound having a hydrophilic part and a lipophilic part in one molecule, wherein the hydrophilic portion has a carbonate, a sulfate, etc., the pro The fatty portion has a linear chain, a side chain or even a cyclic aromatic hydrocarbon group.

實施時,該親水性樹脂組成物層係為數量平均分子量300000至400000之水溶性樹脂20重量份,與數量平均分子量10000至80000之水溶性樹脂60重量份溶解在水中後,添加8重量份之無機化合物攪拌並使之完全分散於水溶性樹脂水溶液中,接著再添加2重量份之消泡劑與2重量份之界面活性劑後攪拌並使之完全分散於水溶性樹脂水溶液中所形成。When implemented, the hydrophilic resin composition layer is 20 parts by weight of a water-soluble resin having a number average molecular weight of 300,000 to 400,000, and after dissolving in water with 60 parts by weight of a water-soluble resin having a number average molecular weight of 10,000 to 80,000, 8 parts by weight is added. The inorganic compound is stirred and completely dispersed in the aqueous solution of the water-soluble resin, followed by further adding 2 parts by weight of the antifoaming agent and 2 parts by weight of the surfactant, followed by stirring and completely dispersing in the aqueous solution of the water-soluble resin.

實施時,該親水性樹脂組成物層係為數量平均分子量200000至300000之水溶性樹脂20重量份,與數量平均分子量300000至400000之水溶性樹脂60重量份溶解在水中後,添加8重量份之無機化合物攪拌並使之完全分散於水溶性樹脂水溶液中,接著再添加2重量份之消泡劑與2重量份之界面活性劑後攪拌並使之完全分散於水溶性樹脂水溶液中所形成。When implemented, the hydrophilic resin composition layer is 20 parts by weight of a water-soluble resin having a number average molecular weight of 200,000 to 300,000, and after being dissolved in water with 60 parts by weight of a water-soluble resin having a number average molecular weight of 300,000 to 400,000, 8 parts by weight is added. The inorganic compound is stirred and completely dispersed in the aqueous solution of the water-soluble resin, followed by further adding 2 parts by weight of the antifoaming agent and 2 parts by weight of the surfactant, followed by stirring and completely dispersing in the aqueous solution of the water-soluble resin.

實施時,該金屬箔與該親水性樹脂組成物層之間係設有一底膠層。When implemented, a primer layer is disposed between the metal foil and the hydrophilic resin composition layer.

實施時,該底膠層係為熱塑性樹脂或是熱固性樹脂中任何一種或是兩種混合使用。When implemented, the primer layer is either a thermoplastic resin or a thermosetting resin or a mixture of two.

為進一步了解本創作,以下舉較佳之實施例,配合圖式、圖號,將本創作之具體構成內容及其所達成的功效詳細說明如下。In order to further understand the present invention, the preferred embodiments of the present invention, together with the drawings and figure numbers, detail the specific components of the present creation and the effects achieved thereby.

1‧‧‧金屬箔1‧‧‧metal foil

2‧‧‧親水性樹脂組成物層2‧‧‧Hydrophilic resin composition layer

第1圖係為本創作實施例鑽孔用蓋板之結構示意圖。Fig. 1 is a schematic view showing the structure of a cover plate for drilling according to the present embodiment.

第2圖係為本創作實施例增設底膠層後之結構示意圖。Fig. 2 is a schematic view showing the structure after adding a primer layer to the present embodiment.

請參閱第1圖,其為本創作一種鑽孔用蓋板之一實施例,其包括一金屬箔1以及至少一層的親水性樹脂組成物層2。Please refer to FIG. 1 , which is an embodiment of a drilling cover plate comprising a metal foil 1 and at least one layer of a hydrophilic resin composition layer 2 .

該金屬箔1係為鋁箔,厚度為0.05mm~0.2mm。The metal foil 1 is an aluminum foil and has a thickness of 0.05 mm to 0.2 mm.

該親水性樹脂組成物層2厚度為0.02mm~0.15mm,供結合於該金屬箔1上,且該親水性樹脂組成物層2之反應熱焓值介於10~40(J/g),且熔點為介於48~70℃之間。The hydrophilic resin composition layer 2 has a thickness of 0.02 mm to 0.15 mm for bonding to the metal foil 1, and the hydrophilic resin composition layer 2 has a reaction enthalpy of 10 to 40 (J/g). And the melting point is between 48~70 °C.

其中,該親水性樹脂組成物層2係包括一係選自於聚環氧丙烷、聚環氧乙烷、聚伸丁二醇、聚烯烴乙二醇聚酯、羧甲基纖維素、聚乙烯吡咯啶酮、聚丙烯醯胺及聚丙烯酸鈉其中一種之具有結晶性之水溶性樹脂;或,親水性樹脂組成物層係包括一選自於聚乙二醇酚醚、聚乙二醇烷基醚等醇醚類之具有結晶性之水溶性樹脂;或,該親水性樹脂組成物層係包括一選自於己六醇、丙二醇、丙三醇等醇類之具有結晶性之水溶性樹脂。Wherein, the hydrophilic resin composition layer 2 comprises a series selected from the group consisting of polypropylene oxide, polyethylene oxide, polybutylene glycol, polyolefin ethylene glycol polyester, carboxymethyl cellulose, polyethylene. a water-soluble resin having a crystallinity of one of pyrrolidone, polypropylene decylamine and sodium polyacrylate; or a hydrophilic resin composition layer comprising one selected from the group consisting of polyethylene glycol phenol ether and polyethylene glycol alkyl group A water-soluble resin having crystallinity such as an ether ether such as ether; or the hydrophilic resin composition layer comprising a water-soluble resin having crystallinity selected from the group consisting of alcohols such as hexahexol, propylene glycol and glycerin.

而本創作最佳實施方式係為將該水溶性樹脂另混合有一無機化合物、一消泡劑及一界面活性劑,以形成該親水性樹脂組成物層2。其中,該無機化合物係為滑石粉、二硫化鉬、鉬酸鋅、碳酸鈣、石墨、氮化硼、氮化鋁、氧化鋁、氫氧化鋁等其中一種之物質。該消泡劑係為改質之聚矽氧烷(Polysiloxane)樹脂及其相關之衍生物、矽力康(Silicone)及其 脂肪酸、脂肪酸胺、聚醚化合物等其中一種物質。該界面活性劑為一分子中有親水性(hydrophilic part)部份與親脂性(lipophilic part)部份共存之化合物,其中該親水性部份則有碳酸鹽、硫酸鹽等,該親脂性部份有直鍊、側鍊甚或環狀芳香族碳氫原子團。The preferred embodiment of the present invention is to further mix the water-soluble resin with an inorganic compound, an antifoaming agent and a surfactant to form the hydrophilic resin composition layer 2. The inorganic compound is one of talc, molybdenum disulfide, zinc molybdate, calcium carbonate, graphite, boron nitride, aluminum nitride, aluminum oxide, aluminum hydroxide or the like. The antifoaming agent is a modified polysiloxane resin and related derivatives thereof, Silicone and its One of a fatty acid, a fatty acid amine, a polyether compound, and the like. The surfactant is a compound in which a hydrophilic part and a lipophilic part coexist in one molecule, wherein the hydrophilic part has a carbonate, a sulfate, etc., the lipophilic part There are linear, side chain or even cyclic aromatic hydrocarbon groups.

因此,實際實施時,該金屬箔1採用純度98以上之鋁箔,可緩和來自鑽頭刃部的衝擊,並提高鑽針刃部前端部的密合性,該親水性樹脂組成物層2係為數量平均分子量300000至400000之水溶性樹脂20重量份,與數量平均分子量10000至80000之水溶性樹脂60重量份溶解在水中後,添加8重量份之無機化合物攪拌並使之完全分散於水溶性樹脂水溶液中,接著再添加2重量份之消泡劑與2重量份之界面活性劑後攪拌並使之完全分散於水溶性樹脂水溶液中所形成。將乾燥後之親水性樹脂組成物層2製成為0.03mm之方式,採用雙輥筒Comma Coater塗佈此親水性樹脂組成物層2於單面形成厚度0.01mm之金屬箔1後,再利用乾燥機使之冷卻,藉以形成本創作之鑽孔用蓋板(上為第1實施例)。Therefore, in actual practice, the metal foil 1 is made of an aluminum foil having a purity of 98 or more, which can alleviate the impact from the edge portion of the drill and improve the adhesion of the tip end portion of the drill blade portion, and the hydrophilic resin composition layer 2 is the number. 20 parts by weight of a water-soluble resin having an average molecular weight of 300,000 to 400,000, and 60 parts by weight of a water-soluble resin having a number average molecular weight of 10,000 to 80,000 are dissolved in water, and then 8 parts by weight of an inorganic compound is added and stirred and completely dispersed in a water-soluble resin aqueous solution. Then, 2 parts by weight of an antifoaming agent and 2 parts by weight of a surfactant are added, followed by stirring and completely dispersing in an aqueous solution of a water-soluble resin. The hydrophilic resin composition layer 2 after drying was formed to have a thickness of 0.03 mm, and the hydrophilic resin composition layer 2 was applied by a two-roller Comma Coater to form a metal foil 1 having a thickness of 0.01 mm on one side, and then dried. The machine is cooled to form the cover for drilling of the present invention (the first embodiment is shown above).

又,本創作該親水性樹脂組成物層2亦可採用數量平均分子量200000至300000之水溶性樹脂20重量份,與數量平均分子量300000至400000之水溶性樹脂60重量份溶解在水中後,添加8重量份之無機化合物攪拌並使之完全分散於水溶性樹脂水溶液中,接著再添加2重量份之消泡劑與2重量份之界面活性劑後攪拌並使之完全分散於水溶性樹脂水溶液中所形成,將乾燥後之親水性樹脂組成物層2製成為0.03mm之方式,採用雙輥筒Comma Coater塗佈此親水性樹脂組成物層2於單面形成厚度0.01mm之金屬箔1後,再利用乾燥機使之冷卻,藉以形成本創作之鑽孔用蓋板(上為第2實 施例)。Further, the hydrophilic resin composition layer 2 may be prepared by dissolving 20 parts by weight of a water-soluble resin having a number average molecular weight of 200,000 to 300,000, and 60 parts by weight of a water-soluble resin having a number average molecular weight of 300,000 to 400,000 in water, and then adding 8 The parts by weight of the inorganic compound are stirred and completely dispersed in the aqueous solution of the water-soluble resin, followed by adding 2 parts by weight of the antifoaming agent and 2 parts by weight of the surfactant, stirring and completely dispersing in the aqueous solution of the water-soluble resin. After forming the hydrophilic resin composition layer 2 after drying to a thickness of 0.03 mm, the hydrophilic resin composition layer 2 is applied by a two-roller Comma Coater to form a metal foil 1 having a thickness of 0.01 mm on one side, and then Cooling with a dryer to form the drilled cover for this creation (on the second Example).

因此,將上述兩實施例所獲得之鑽孔用蓋板,於6片厚度0.1mm之貼銅積層板之後,以該親水性樹脂組成物層2為上之方式進行配置,於經重疊之貼銅積層板下側,配置下墊板(尿素板),以鑽頭0.105 Φ(0.105mm*2.2mm)、旋轉速200000rpm、進刀速25mm/sec、退刀速423mm/sec之條件,對每一之鑽針以3000hits進行鑽孔,透過採用熱示差掃瞄卡量計以每分鐘10℃之升溫速率量測範圍為40~80℃進行量測,針對上述實施例1、2之鑽孔用蓋板上任意選擇之3個不同區域進行實際測量,可發現其熱焓值為17(J/g),熔點為60℃,並經過孔壁粗糙度測試(鑽孔加工後對於加工孔的中心的剖面切斷進行研磨,對孔壁的一個側面內的最大凸部跟最深凹部為止之距離進行測定。測定部位為鑽頭之第2999孔的加工孔做兩次之平均做為孔壁粗糙度之值)、孔位精準度測試(利用孔分析儀對所重疊的銅箔積層板中最下方的銅箔積層板的背面中3000hits的孔位置與指定座標的偏移進行測定,對每一根鑽針計算平均值及標準偏差(δ),計算出平均值+3 δ及最大值,記載7次鑽頭鑽孔加工之平均值)、樹脂捲附量程度之判定(利用倍率為25倍的光學顯微鏡對3000hits後之7根鑽針分別進行觀察相對於鑽針徑的樹脂捲附的最大徑及鑽頭軸方向長度來判斷樹脂捲附量程度)後可發現,透過本創作所設之鑽孔用蓋板確實可形成較佳的孔壁粗糙度與較少的鑽頭上樹脂捲附。Therefore, the cover plate for drilling obtained in the above two embodiments is placed on the copper-clad laminate having a thickness of 0.1 mm, and then the hydrophilic resin composition layer 2 is placed on top of the layer. On the lower side of the copper laminate, the lower backing plate (urea plate) is arranged, with the conditions of 0.105 Φ (0.105mm*2.2mm), rotating speed 200000rpm, feed speed 25mm/sec, and retracting speed 423mm/sec. The drill hole is drilled at 3000hits, and is measured by a thermal differential scanning card gauge at a temperature increase rate of 10 ° C per minute, and the measurement range is 40 to 80 ° C. For the drilling caps of the above embodiments 1 and 2 The actual measurement was carried out in 3 different areas of any choice on the board. The hot enthalpy value was found to be 17 (J/g), the melting point was 60 ° C, and the hole wall roughness test was performed (after drilling the hole for the center of the machined hole) The cross-section is cut and polished, and the distance between the largest convex portion and the deepest concave portion on one side of the hole wall is measured. The measured portion is the average of the processed hole of the 2999 hole of the drill bit as the value of the hole wall roughness. ), hole position accuracy test (using a hole analyzer for overlapping copper foil laminates) The offset of the 3000hits hole in the back of the copper foil laminate is measured with the offset of the specified coordinates. The average value and standard deviation (δ) are calculated for each drill, and the average value +3 δ and the maximum value are calculated. The average value of the drill bit drilling process and the degree of the amount of the resin roll (the maximum diameter of the resin roll attached to the drill hole diameter is observed by an optical microscope with a magnification of 25 times for each of the 3000hits) And the length of the bit axis direction to determine the degree of resin coiling), it can be found that the drilling cover plate provided by the present invention can form a better hole wall roughness and less resin reeling on the drill bit.

此外,如第2圖所示,為使該金屬箔與該親水性樹脂組成物層之密合性增加,可以預先於金屬箔上形成厚度0.001~0.01mm之底膠層為最理想。該底膠層只要可以提升樹脂組成物密合性之物質即可,其他並無任 何限定,也可以使用熱塑性或是熱固性樹脂中任何一種或是兩種混合使用,熱塑型樹脂例如乙酸乙烯酯聚合體、聚酯系聚合體、丙烯醯基系聚合體即該等物質或是混合物,熱固型樹脂例如環氧基系樹脂與氰酸酯系列之樹脂等。Further, as shown in Fig. 2, in order to increase the adhesion between the metal foil and the hydrophilic resin composition layer, it is preferable to form a primer layer having a thickness of 0.001 to 0.01 mm on the metal foil in advance. The primer layer may be any one that can improve the adhesion of the resin composition. Any limitation, it is also possible to use any one or a mixture of thermoplastic or thermosetting resins, such as a vinyl acetate polymer, a polyester polymer, an acryl-based polymer, or the like. Mixtures, thermosetting resins such as epoxy-based resins and cyanate series resins.

因此,本創作鑽孔用鋁蓋板透過親水性樹脂組成物層具有特定範圍之熱焓與熔點值,對於鑽針可提供適當之散熱與潤滑程度,故而可針對鑽孔加工時之孔壁粗糙度與鑽針上樹脂捲附有所貢獻。Therefore, the aluminum cover plate for drilling the present invention has a specific range of enthalpy and melting point values through the hydrophilic resin composition layer, and provides appropriate heat dissipation and lubrication degree for the drill needle, so that the hole wall roughness during drilling processing can be performed. Degree and contribution to the resin coil on the drill.

以上所述乃是本創作之具體實施例及所運用之技術手段,根據本文的揭露或教導可衍生推導出許多的變更與修正,仍可視為本創作之構想所作之等效改變,其所產生之作用仍未超出說明書及圖式所涵蓋之實質精神,均應視為在本創作之技術範疇之內,合先陳明。The foregoing is a specific embodiment of the present invention and the technical means employed, and many variations and modifications can be derived therefrom based on the disclosure or teachings herein, and can still be regarded as equivalent changes made by the inventive concept. The role of the spirit and the spirit of the text and the scope of the text should be considered within the technical scope of this creation.

綜上所述,依上文所揭示之內容,本創作確可達到新型之預期目的,提供一種鑽孔用蓋板,極具產業上利用之價值,爰依法提出新型專利申請。In summary, according to the content disclosed above, this creation can achieve the new intended purpose, providing a cover plate for drilling, which is of great value for industrial use, and proposes a new type of patent application according to law.

1‧‧‧金屬箔1‧‧‧metal foil

2‧‧‧親水性樹脂組成物層2‧‧‧Hydrophilic resin composition layer

Claims (14)

一種鑽孔用蓋板,包括:一金屬箔;以及至少一層的親水性樹脂組成物層,係結合於該金屬箔上,且該親水性樹脂組成物層其反應熱焓值介於10~40(J/g),且熔點為介於48~70℃之間。A drilling cover plate comprising: a metal foil; and at least one layer of a hydrophilic resin composition layer bonded to the metal foil, wherein the hydrophilic resin composition layer has a reaction enthalpy value of 10 to 40 (J/g) with a melting point between 48 and 70 °C. 如申請專利範圍第1項所述之鑽孔用蓋板,其中該金屬箔之厚度為0.05mm~0.2mm。The cover plate for drilling according to the first aspect of the invention, wherein the metal foil has a thickness of 0.05 mm to 0.2 mm. 如申請專利範圍第1項所述之鑽孔用蓋板,其中該親水性樹脂組成物層之厚度為0.02mm~0.15mm。The cover sheet for drilling according to the first aspect of the invention, wherein the hydrophilic resin composition layer has a thickness of 0.02 mm to 0.15 mm. 如申請專利範圍第1項所述之鑽孔用蓋板,其中該親水性樹脂組成物層係包括一係選自於聚環氧丙烷、聚環氧乙烷、聚伸丁二醇、聚烯烴乙二醇聚酯、羧甲基纖維素、聚乙烯吡咯啶酮、聚丙烯醯胺及聚丙烯酸鈉其中一種之具有結晶性之水溶性樹脂。The cover plate for drilling according to claim 1, wherein the hydrophilic resin composition layer comprises a series selected from the group consisting of polypropylene oxide, polyethylene oxide, polybutylene glycol, and polyolefin. A water-soluble resin having crystallinity of one of ethylene glycol polyester, carboxymethyl cellulose, polyvinylpyrrolidone, polypropylene decylamine and sodium polyacrylate. 如申請專利範圍第1項所述之鑽孔用蓋板,其中該親水性樹脂組成物層係包括一選自於聚乙二醇酚醚、聚乙二醇烷基醚等醇醚類之具有結晶性之水溶性樹脂。The cover plate for drilling according to claim 1, wherein the hydrophilic resin composition layer comprises an alcohol ether selected from the group consisting of polyethylene glycol phenol ether and polyethylene glycol alkyl ether. Crystalline water-soluble resin. 如申請專利範圍第1項所述之鑽孔用蓋板,其中該親水性樹脂組成物層係包括一選自於己六醇、丙二醇、丙三醇等醇類之具有結晶性之水溶性樹脂。The cover sheet for drilling according to claim 1, wherein the hydrophilic resin composition layer comprises a crystalline water-soluble resin selected from the group consisting of alcohols such as hexahydrin, propylene glycol and glycerin. . 如申請專利範圍第4、5或6項所述之鑽孔用蓋板,其中該水溶性樹脂另混合有一無機化合物、一消泡劑及一界面活性劑,以形成該親水性樹脂組成物層。The slab for drilling according to the invention of claim 4, wherein the water-soluble resin is further mixed with an inorganic compound, an antifoaming agent and a surfactant to form the hydrophilic resin composition layer. . 如申請專利範圍第7項所述之鑽孔用蓋板,其中該無機化合物係為滑石 粉、二硫化鉬、鉬酸鋅、碳酸鈣、石墨、氮化硼、氮化鋁、氧化鋁、氫氧化鋁等其中一種或兩種以上之物質。The cover plate for drilling according to claim 7, wherein the inorganic compound is talc One or more of powder, molybdenum disulfide, zinc molybdate, calcium carbonate, graphite, boron nitride, aluminum nitride, aluminum oxide, aluminum hydroxide, or the like. 如申請專利範圍第7項所述之鑽孔用蓋板,其中該消泡劑係為改質之聚矽氧烷樹脂及其相關之衍生物、矽力康及其脂肪酸、脂肪酸胺、聚醚化合物等其中一種或兩種以上物質。The cover plate for drilling according to claim 7, wherein the antifoaming agent is a modified polyoxyalkylene resin and related derivatives thereof, and the fatty acid, fatty acid amine, polyether thereof One or more of the compounds and the like. 如申請專利範圍第7項所述之鑽孔用蓋板,其中該界面活性劑為一分子中有親水性部份與親脂性部份共存之化合物,其中該親水性部份則有碳酸鹽、硫酸鹽等,該親脂性部份有直鍊、側鍊甚或環狀芳香族碳氫原子團。The cover sheet for drilling according to claim 7, wherein the surfactant is a compound having a hydrophilic portion and a lipophilic portion in one molecule, wherein the hydrophilic portion has a carbonate, Sulfate or the like, the lipophilic moiety has a linear chain, a side chain or even a cyclic aromatic hydrocarbon group. 如申請專利範圍第7項所述之鑽孔用蓋板,其中該親水性樹脂組成物層係為數量平均分子量300000至400000之水溶性樹脂20重量份,與數量平均分子量10000至80000之水溶性樹脂60重量份溶解在水中後,添加8重量份之無機化合物攪拌並使之完全分散於水溶性樹脂水溶液中,接著再添加2重量份之消泡劑與2重量份之界面活性劑後攪拌並使之完全分散於水溶性樹脂水溶液中所形成。The cover sheet for drilling according to claim 7, wherein the hydrophilic resin composition layer is 20 parts by weight of a water-soluble resin having a number average molecular weight of 300,000 to 400,000, and water-soluble with a number average molecular weight of 10,000 to 80,000. After 60 parts by weight of the resin is dissolved in water, 8 parts by weight of the inorganic compound is added and stirred and completely dispersed in the aqueous solution of the water-soluble resin, followed by further adding 2 parts by weight of the antifoaming agent and 2 parts by weight of the surfactant, followed by stirring and It is formed by completely dispersing it in an aqueous solution of a water-soluble resin. 如申請專利範圍第7項所述之鑽孔用蓋板,其中該親水性樹脂組成物層係為數量平均分子量200000至300000之水溶性樹脂20重量份,與數量平均分子量300000至400000之水溶性樹脂60重量份溶解在水中後,添加8重量份之無機化合物攪拌並使之完全分散於水溶性樹脂水溶液中,接著再添加2重量份之消泡劑與2重量份之界面活性劑後攪拌並使之完全分散於水溶性樹脂水溶液中所形成。The cover sheet for drilling according to claim 7, wherein the hydrophilic resin composition layer is 20 parts by weight of a water-soluble resin having a number average molecular weight of 200,000 to 300,000, and water-soluble with a number average molecular weight of 300,000 to 400,000. After 60 parts by weight of the resin is dissolved in water, 8 parts by weight of the inorganic compound is added and stirred and completely dispersed in the aqueous solution of the water-soluble resin, followed by further adding 2 parts by weight of the antifoaming agent and 2 parts by weight of the surfactant, followed by stirring and It is formed by completely dispersing it in an aqueous solution of a water-soluble resin. 如申請專利範圍第1項所述之鑽孔用蓋板,其中該金屬箔與該親水性樹脂組成物層之間係設有一底膠層。The cover plate for drilling according to claim 1, wherein a primer layer is disposed between the metal foil and the hydrophilic resin composition layer. 如申請專利範圍第13項所述之鑽孔用蓋板,其中該底膠層係為熱塑性樹脂或是熱固性樹脂中任何一種或是兩種混合使用。The casing for drilling according to claim 13, wherein the primer layer is a thermoplastic resin or a thermosetting resin or a mixture of two.
TW103218278U 2014-10-15 2014-10-15 A drilling entry board TWM495943U (en)

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