1360476 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種鑽孔加工製程用板材，該板材可以適 用於印刷電路板鑽孔加工製程中，並有助於高效製作高品 質之印刷電路板。 【先前技術】 印刷電路板的功能是把電子零件裝貼於其上，並使電 鲁 +零件互相形成電氣連接狀態，是構成電氣產品的重要内 部零件。 1〇夕製造上述印刷電路板時，在墊板(Backup Board)上積層 夕層基板後，把蓋板(Entry Board)配置到最上層基板的上 面，進而從其上面對進出之基板進行貫通孔加工，於此同 時，使用鑽頭在基板的正面形成小孔，即可在印刷電路板 用基板上形成小孔。 15 ^蓋板板材通常使用不含潤滑層的純鋁板材，例如Αίοοο • '系列材料的銘板材，主要是為了在印刷電路板用基板上鑽 〗孔時，可防止基板破損、減少毛邊(burr)及改善位置精度。 近年來，由於電子零件高密度地安裝在印刷電路板上， 因此電路線寬及間隔曰益變小，鑽孔加工設備的速度提高， 2〇基板的可積層數也逐漸增加，所以需要鑽孔直徑小於 Π1ΓΠ的小孔。 …使用不含潤滑層的純鋁板作為蓋板時，在經過小孔作 業後容易影響位置精度並造成鑽針(Driu Bit)破損。由於使 用鋁板材時，鑽頭的刀會常常破損或是鑽針本身會斷裂， 5 1360476 以致於無法針對印刷電路板供應用鑽孔去進而增加基板的 積層數’因而降低了鑽孔加工效率。此外，鑽頭刃在基板 表面上出現的打滑動作，會導致其無法在準確位置上鑽出 小孔。另一個問題是，小孔内壁面的表面會變得粗糙，使 5得後續的電鍍製程發生問題。 為了防止鑽頭刀刀的破損及斷裂、防止小孔的内壁變 粗糙、以及改善基板上小孔的位置準確度，因此有人開發 了一種透過在基板的其中一面上貼附潤滑材料，而使金屬 板成為在其一面上形成有潤滑層的樹脂坡覆金屬板。 1〇 例如’韓國專利公開第2002-0018984號公開了一種在厚 度為5 μιη到500 μιη的金屬箔的一表面上，形成有厚度為2 到300 μιη的有機物質層之印刷電路板鑽孔用潤滑劑板材。 具體地說’該印刷電路板鑽孔用潤滑劑板材的有機物質層 是含有聚醚酯、固相水溶性潤滑劑及聚乙二醇的混合物； 15或者是含有聚醚酯 '固相水溶性潤滑劑及液相水溶性潤滑 劑的混合物。 此外’韓國專利公開第2003-0036041號公開了一種含有 水溶性樹脂及非水溶性潤滑劑的鑽孔蓋板板材，係以其一 表面與金屬落進行結合。 20 此外’韓國專利公開第2005-0056149號公開了金屬板的 其中一面被熱塑性樹脂披覆的覆樹脂金屬板，這裡的熱塑 性樹脂實質上屬於非水溶性，根據JIS Κ7121規格量測的熱 塑性樹脂，其最高熔解溫度為6〇°C到120°C，而在150°C的 溫度下溶融熱塑性樹脂時，溶融黏度在剪切速度為200 mm/ 6 1360476 秒的情形下’係維持在lxl〇3到ixi〇4泊(p〇ise)的範圍内， 在3000 mm/秒的情形下則維持在5x102到5x103泊的範圍 内’根據JIS K7125以D硬度計(Durometer)量測熱塑性樹 脂，其硬度在20到45的範圍内。 5 上述技術所揭示之板材的共同點為，為了賦予金屬層 的其中一面潤滑性，因而具有有機物質層（潤滑層）。 在印刷電路板的鑽孔加工製程中，與作為基板的銅箔 接觸之面是金屬層，當鑽孔加工製程用板材的金屬層與作 為基板的銅笛接觸時，由於銅箔與板材之間的緊密接觸性 10減弱，因而在其間隙處形成空氣層，並且由於無法吸收鑽 孔加工機的旋轉振動，而出現細微的打滑現象。該現象將 在鑽頭的鑽孔加工製程中引起滑動，當來自潤滑層之潤滑 劑物質與鑽了小孔後所產生的基板屑片混合且一併被吸入 (吸入屑片）時，由於無法順利地排放，又被鑽孔用板材 15的基板接觸面阻擔而重新埋人，因此使鑽孔加工機出現錯 誤動作，造成無法執行所設計之孔加工作業的結果。 【發明内容】 本申凊人在探索提高印刷電路板的鑽孔加工過程中， 2〇鑽孔加工製程用板材與基板之間的緊密接觸性，並獲得高 品質的效率之方法時’發現如果使金屬層背面（亦即相對 於以下所提及之有機物質層的那一面）_值在滑動試驗中 大於特定值’則鑽孔加工製程用板材與基板之間的緊密接 觸性就能獲得改善，並可防止層與層之間的打滑現象，進 1360476 而完成了本發明。 因此’本發明的目的是提供一種可以在印刷電路板的 m中，防止鑽孔加工製程用板材與基板之間的 打α現象之鑽孔加工製程用板材。 孔加s的疋提供一種可以在印刷電路板的鑽 孔加^程t ’改善鑽頭直進性之鑽孔加工製程用板材。 性之鑽孔加工製程用供種可以維持鑽頭的耐磨耗 層斑題可以猎由包含具有潤滑功能的有機物質 二、加工製程用板材加以解決。該板材係為 15 背滑動(Slip)法進行傾斜實驗時，其金屬層 面上=P相對於有機物質層的那一面）開始相 進仃滑動時的t_值大錢。之鑽孔加卫製程用板材。 了勺ίΐί當的做法為，本發明之鑽孔加卫製程用板材除 雜的有機物㈣之外，金屬層背面還應 防3 述有機㈣層相同材料或其它黯所組成的 較^適當的做法為，防滑層包括了由乙埽、乙稀·醋酸 中'、竖、聚物乙基丙烯酸及曱基丙烯酸乙酯所組成的群組 ，選擇至少一種以上的單體所製成的聚合物或共聚合物。 較為適當的做法為，具有潤滑功能的有機物質層或防 π層的其中—層的背面包括著色層。 20 1360476 較為適當的做法為，金屬層背面經過了表面改質的過 程。 、 較為適當的做法為，金屬層背面之表面粗糙度（Ra值） 大於0.3 μιη。 下面對本發明做進一步說明。 本發明的鑽孔加工製程用板材，係在金屬層的一面上 形成具有潤滑功能的有機物質層（潤滑層），當使用滑動試 驗機以滑動法進行傾斜實驗時，該金屬層背面（亦即相對 1〇於該有機物質層的那一面）開始相對於銅箔進行滑動時的 tan0值大於20。〇 15 在滑動試驗中，當金屬層背面開始相對於銅箱進行滑 動時的_值大於20。時，其油_組絲板的表面之間 存，著較大的雜力，可以在觀加工時提高其位置精度， 也就是說，可以滿足所規定的cpk值。金屬層背面之仏沾大 於20時，對最終製作完畢的鑽孔加I製程用板材量測的 _值介於2」到2.4的範_，顯現出優異的位置精度。 上述tan0值表* 了其雜力大於金屬層（即通常所使用 2金屬）與_之間固有的麵力。如果金屬層背面在 π動式驗中開始相對於鋼紐行滑動時的_值小於2〇。， 則無法防止鑽孔加工製㈣板材與銅㈣基板之間的滑動 在金屬層上含有潤滑層之本發明的鑽孔加工製程用板 材，並沒有限定使金屬層背面之tane值在滑動試驗中符合上 20 ==方：’例如在金屬層背面形成樹脂層 ，其所❹之方料受限制 ’ g身面形成樹脂層時，只要能得到符合上述範 圍的tane值即可，並不计， 』灯〇上迷叙 4喊成分，但使料黏性的樹 二二，：:Λ時效果更好’該成分可以是和潤滑層相同 ' 可以疋其它樹脂層（本發明簡稱其為「防滑層」）。 機物質加工製程用板材中具有潤滑功能的有 ' ⑺a)可以是水溶性、非水溶性聚合物與水 溶性、非水溶性潤滑劑。 、 做為具體的例子，水溶性有機物質層可以是包含聚喊 醋：固/目及數目平均分子量為細到_的聚 乙醇之此δ物，也可以是包含聚趟酯、固相水溶性潤滑 劑及液相水溶性潤滑劑之混合物。 較為適當的做法為’有機物質層是屬於非水溶性者。 因為如果是水溶性樹脂，其會降低樹脂與金屬層之間的緊 密黏接性，且與金屬的吸收率差異也比較大，可能會引起 金屬板本躺彎曲躲。因此，作絲材(Matrix)的樹脂應 該屬於非水溶性或者是具有些微水溶性的「實質非水溶性」 有機物質層。 潤滑層的厚度應該維持在20到300 μιη的範圍内，若厚 度太薄則無法在鑽孔加工時發揮潤滑劑的作用及排放屑片 的作用’反之’若厚度太厚則會降低鑽孔加工的精密度或 引起鑽頭破損。 如果本發明的鑽孔加工製程用板材之防滑層與潤滑層 1360476 具有同一組成成分，則防滑層的非水系成分應該和潤滑層 的較佳非水系成分相同。 上述防滑層不僅可以改善板材與基板之間的緊密接觸 性’還具有緩衝層的作用可減少鑽頭振動，進而改善了鑽 5孔時的直進性。而提高鑽孔時的直進性，就能減少鑽孔加 工過程中屑片重新埋入基板的現象，也就是說能減少膠渣 (smear) ’進而提高鑽孔加工後的基板品質。並可以在鑽孔 時發揮緩衝作用，減少鑽頭磨耗。 以孔加工的作業性來說，上述防滑層的厚度應小於50 10 μπι。 較為適當的做法為，樹脂層是由乙基丙烯酸或甲基丙 稀酸乙醋單體所組成的聚合物或共聚合物。 製造本發明的鑽孔加工製程用板材時，金屬層、潤滑 層及防滑層的黏接可以使用乾式積層、濕式積層及高溫積 15層法中的任何一種方法’也可以使用公知的黏接劑進行黏 接。例如’市面上的乾式積層用黏接劑包括丙烯酸系、胺 曱自曰系及gs系專，咼溫積層用黏接劑包括乙烯_醋酸乙 稀共聚物樹脂系、稀烴系及橡㈣等，只要在這些黏接劑 中適當地選擇即可。1360476 IX. Description of the Invention: [Technical Field] The present invention relates to a sheet for drilling processing, which can be applied to a drilling process of a printed circuit board, and contributes to efficient production of a high quality printed circuit board . [Prior Art] The function of the printed circuit board is to attach electronic components to the electronic components and to electrically connect the components to each other, which is an important internal component of the electrical product. When the printed circuit board is manufactured on the 1st eve, after the slab is laminated on the Backup Board, the Entry Board is placed on the uppermost substrate, and the substrate is inserted through the substrate. Hole processing, at the same time, a small hole is formed in the front surface of the substrate by using a drill to form a small hole in the substrate for a printed circuit board. 15 ^The cover plate usually uses a pure aluminum plate without a lubricating layer, for example, Αίοοο • 'Ming material of the series material, mainly for drilling the hole on the printed circuit board substrate, preventing the substrate from being damaged and reducing the burr (burr ) and improve positional accuracy. In recent years, since electronic components are mounted on a printed circuit board at a high density, the circuit line width and spacing are reduced, the speed of the drilling processing equipment is increased, and the number of layers of the substrate is gradually increased, so that drilling is required. A small hole with a diameter smaller than Π1ΓΠ. ...When a pure aluminum plate without a lubricating layer is used as a cover plate, it is easy to affect the positional accuracy and cause damage to the Driu Bit after passing through the small hole. Due to the use of aluminum sheets, the knives of the drill bit are often broken or the burs themselves are broken, so that the drilling of the printed circuit board cannot be used to increase the number of layers of the substrate, thus reducing the efficiency of the drilling process. In addition, the slipping action of the drill bit on the surface of the substrate causes it to be unable to drill holes in the exact position. Another problem is that the surface of the inner wall of the small hole becomes rough, causing problems in the subsequent plating process. In order to prevent breakage and breakage of the drill cutter, to prevent roughening of the inner wall of the small hole, and to improve the positional accuracy of the small holes on the substrate, it has been developed to provide a metal plate by attaching a lubricating material to one side of the substrate. A resin-coated metal sheet having a lubricating layer formed on one surface thereof. For example, 'Korean Patent Publication No. 2002-0018984 discloses a printed circuit board for drilling an organic material layer having a thickness of 2 to 300 μm on a surface of a metal foil having a thickness of 5 μm to 500 μm. Lubricant sheet. Specifically, the organic material layer of the lubricant plate for drilling a printed circuit board is a mixture containing a polyether ester, a solid phase water-soluble lubricant, and polyethylene glycol; 15 or a polyether ester-containing solid phase water-soluble A mixture of a lubricant and a liquid phase water soluble lubricant. Further, the Korean Patent Publication No. 2003-0036041 discloses a drilled cover sheet material containing a water-soluble resin and a water-insoluble lubricant, which is bonded to a metal falling surface thereof. In addition, the Korean Patent Publication No. 2005-0056149 discloses a resin-coated metal plate in which one side of a metal plate is coated with a thermoplastic resin, and the thermoplastic resin herein is substantially water-insoluble, and the thermoplastic resin measured according to JIS Κ7121 specification, The maximum melting temperature is 6 ° C to 120 ° C, and when the thermoplastic resin is melted at a temperature of 150 ° C, the melt viscosity is maintained at lxl 〇 3 at a shear rate of 200 mm / 6 1360476 seconds. In the range of ixi 〇 4 poise (p〇ise), it is maintained in the range of 5x102 to 5x103 poise in the case of 3000 mm/sec. 'The hardness of the thermoplastic resin is measured according to JIS K7125 by D Durometer. In the range of 20 to 45. 5 The material disclosed in the above technique has in common that an organic substance layer (lubricating layer) is provided in order to impart lubricity to one side of the metal layer. In the drilling process of the printed circuit board, the surface in contact with the copper foil as the substrate is a metal layer, and when the metal layer of the material for the drilling process is in contact with the copper flute as the substrate, due to the copper foil and the plate The close contact 10 is weakened, thus forming an air layer at the gap thereof, and a slight slip phenomenon occurs due to the inability to absorb the rotational vibration of the drilling machine. This phenomenon will cause slippage during the drilling process of the drill bit. When the lubricant substance from the lubricating layer is mixed with the substrate chips generated after drilling the small holes and is sucked in (pumping chips), it is not smooth. The ground discharge is again blocked by the substrate contact surface of the drill plate 15 and is re-buried, so that the drilling machine malfunctions and the result of the designed hole machining operation cannot be performed. SUMMARY OF THE INVENTION In order to improve the close contact between the board and the substrate for the drilling process, and to obtain a high-quality method, the applicant finds out if the method of improving the drilling process of the printed circuit board is The close contact between the back surface of the metal layer (that is, the side of the organic material layer mentioned below) is greater than the specific value in the sliding test, and the close contact between the sheet for the drilling process and the substrate can be improved. The present invention can be accomplished by preventing slippage between layers and entering 1360476. Therefore, it is an object of the present invention to provide a plate material for a drilling process which can prevent the α phenomenon between the plate material for a drilling process and the substrate in the m of the printed circuit board. The 加 孔 疋 疋 provides a boring process sheet that can improve the straightness of the drill bit in the drill hole of the printed circuit board. The drilling process for the drilling process can maintain the wear resistance of the drill bit. The layer problem can be solved by the organic material containing the lubricating function. The sheet is a t_value at the time when the tilting test is carried out by the Slip method, and the side of the metal layer = P with respect to the organic material layer starts to slide. The hole is used to strengthen the process sheet. The method of scooping the ΐ ΐ 当 为 为 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本The anti-slip layer comprises a group consisting of acetamethylene, ethyl acetate, acetic acid, ethyl acrylate and ethyl methacrylate, and at least one monomer is selected to be a polymer or Copolymer. More suitably, the back side of the layer of the organic substance layer or the anti-π layer having a lubricating function includes a colored layer. 20 1360476 It is more appropriate to have the surface of the metal layer undergo a surface modification process. It is more appropriate that the surface roughness (Ra value) of the back side of the metal layer is greater than 0.3 μm. The invention is further illustrated below. The plate for drilling processing of the present invention forms an organic substance layer (lubricating layer) having a lubricating function on one side of the metal layer, and when the tilting test is performed by a sliding method using a sliding tester, the back side of the metal layer (ie, The tan0 value at the time of starting to slide relative to the copper foil relative to the side of the organic material layer is greater than 20. 〇 15 In the sliding test, the _ value when the back side of the metal layer began to slide relative to the copper box was greater than 20. When the surface of the oil-component wire plate is stored with a large amount of miscellaneous force, the positional accuracy can be improved during the processing, that is, the prescribed cpk value can be satisfied. When the thickness of the back side of the metal layer is greater than 20, the _ value of the final fabricated hole-added I-process sheet is between 2" and 2.4, showing excellent positional accuracy. The above tan0 value table * has a heterogeneous force greater than the intrinsic surface force between the metal layer (i.e., the commonly used 2 metal) and _. If the back side of the metal layer starts to slide relative to the steel line in the π motion test, the value of _ is less than 2 〇. Therefore, it is impossible to prevent the drilling process (4) sliding between the plate and the copper (four) substrate. The drilling process sheet of the present invention containing the lubricating layer on the metal layer is not limited to the tane value of the back side of the metal layer in the sliding test. In accordance with the above 20 == square: 'For example, when a resin layer is formed on the back surface of the metal layer, and the square material is limited to form a resin layer, as long as a tane value that satisfies the above range can be obtained, it does not count, 』 The lamp 迷 迷 4 4 4 4 4 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , "). The oil-soluble, water-insoluble polymer and water-soluble, water-insoluble lubricant can be used for the lubrication of the material processing process. As a specific example, the water-soluble organic substance layer may be a delta containing polyacetal: a solid/mesh and a number average molecular weight of fine poly to _, or may be a polydecyl ester, a solid phase water-soluble A mixture of a lubricant and a liquid phase water soluble lubricant. A more appropriate approach is that the organic layer is a water insoluble. Because if it is a water-soluble resin, it will reduce the tight adhesion between the resin and the metal layer, and the difference in absorption rate with the metal is also large, which may cause the metal plate to lie and hide. Therefore, the resin of the wire should be a water-insoluble or slightly water-soluble "substantially water-insoluble" organic substance layer. The thickness of the lubricating layer should be maintained within the range of 20 to 300 μηη. If the thickness is too thin, it will not function as a lubricant during drilling and the role of the discharge chip. Otherwise, if the thickness is too thick, the drilling process will be reduced. The precision may cause damage to the drill bit. If the anti-slip layer of the sheet for drilling processing of the present invention has the same composition as the lubricating layer 1360476, the non-aqueous component of the anti-slip layer should be the same as the preferred non-aqueous component of the lubricating layer. The anti-slip layer not only improves the close contact between the sheet and the substrate, but also has the function of a buffer layer to reduce the vibration of the drill bit, thereby improving the straightness when drilling a hole. Increasing the straightness during drilling can reduce the phenomenon that the chips are reburied in the substrate during the drilling process, which means that the smear can be reduced to improve the quality of the substrate after drilling. It can also act as a buffer during drilling to reduce bit wear. In terms of the workability of the hole processing, the thickness of the above non-slip layer should be less than 50 10 μm. More suitably, the resin layer is a polymer or a copolymer composed of ethacrylic acid or ethyl methacrylate monomer. When manufacturing the sheet for drilling processing of the present invention, the bonding of the metal layer, the lubricating layer and the anti-slip layer may be performed by any one of dry lamination, wet lamination and high-temperature lamination, and a known bonding may be used. The agent is bonded. For example, the adhesives for dry laminates on the market include acrylics, amines, and gs-based adhesives, and adhesives for thermosetting laminates include ethylene-vinyl acetate copolymer resin, dilute hydrocarbons, and rubber (four). As long as it is appropriately selected among these adhesives.
2Q 比此外，當本發明的鑽孔加工製程用板材的金屬層之兩 面皆具有樹脂層時，若潤滑層與防滑層的組成成分不同， 則在準備鑽孔加工作業時，由於需要區分板材的上下兩面， 因此在潤滑層或防滑層中會加上著色層。 本發明也可以在樹脂層的組成成分中加入防靜電性 11 1360476 能’以避免因靜電所引起的微細灰塵吸附或鑽孔加工設備 的錯誤動作。 此外，使金屬層背面的tan0值符合本發明之要求的其它 方法為，在不另外添加樹脂層的情形下，透過物理或化學 5的方法對金屬層背面進行表面改質。 此日π ’物理方法可以使用粗縫化(patterning)或浮雕處 理等方式’但不限定於此；化學方法可以使用酸處理的表 面改質，但不限定於此。使用物理或化學方法對金屬層背 面進行表面改質時’應使金屬層背面的表面粗链度大於0.3 ίο μιη。若其表面粗糙度小於〇 3从111時，金屬層背面之仏沾值將 無法介於上述範圍。 表面粗糙度指的是，使用表面粗糙度量測儀（小阪 SE-30C產品）所量測的表面粗縫度。 鑽孔加工製程用板材的金屬層通常使用鋁製成，最好 Μ使用純度達99.0%的純鋁。上述金屬層的厚度應介於5到 5〇〇 μιη的範圍内，3〇到3〇〇 μιη較佳，5〇到2〇〇卿則更 佳。 如前所述，本發明之具有潤滑功能的有機物質層與金 屬層之鑽孔加工製程用板材，該板材之金屬層背面開始相 2〇對於銅ν§面進行滑動時的加❻值大於一定值時，可以提高 ，與基板之_緊密接觸性，並防止其與基板之間形成= 乳層，進而改善鑽孔加工時的綱直進性，減少鑽頭振動， 因此可以維持鑽頭的耐磨耗性並延長鑽頭更換週期，亦可 防止鑽孔屑片流入基板與金屬層之間以免除出現錯誤動作In addition, when the metal layer of the sheet for drilling processing of the present invention has a resin layer on both sides, if the composition of the lubricating layer and the non-slip layer are different, it is necessary to distinguish the sheet material when preparing the drilling operation. Upper and lower sides, so a colored layer is added to the lubricating layer or the non-slip layer. The present invention can also incorporate an antistatic property 11 1360476 into the composition of the resin layer to avoid the adsorption of fine dust due to static electricity or the malfunction of the drilling apparatus. Further, another method of making the tan0 value of the back surface of the metal layer conform to the requirements of the present invention is to surface-modify the back surface of the metal layer by physical or chemical means without additionally adding a resin layer. The π ′ physical method may be a method of patterning or embossing, etc., but is not limited thereto; the chemical method may be modified with an acid-treated surface, but is not limited thereto. When the surface of the metal layer is surface-modified by physical or chemical means, the surface of the back side of the metal layer should be thicker than 0.3 ίο μιη. If the surface roughness is less than 〇 3 from 111, the 仏 value of the back side of the metal layer will not be within the above range. The surface roughness refers to the surface roughness measured by using a surface roughness measuring instrument (Kobe SE-30C product). The metal layer of the sheet for the drilling process is usually made of aluminum, and it is preferable to use pure aluminum having a purity of 99.0%. The thickness of the above metal layer should be in the range of 5 to 5 〇〇 μηη, preferably 3 〇 to 3 〇〇 μιη, and more preferably 5 〇 to 2 〇〇 〇〇. As described above, according to the present invention, the organic material layer having the lubricating function and the metal layer are used for the drilling processing process, and the back surface of the metal layer of the material is the same as that of the copper surface. When the value is increased, the contact with the substrate can be improved, and the formation of the = milk layer between the substrate and the substrate can be prevented, thereby improving the straightness in the drilling process and reducing the vibration of the drill bit, thereby maintaining the wear resistance of the drill bit. And extend the bit replacement cycle, and also prevent the drilling chips from flowing between the substrate and the metal layer to avoid erroneous actions.
12 1360476 的危險。 【實施方式】 下面結合實施例對本發明做進一步說明，然而實施例 5 不能限定本發明。 製造例1:防滑層的製造 使用韓化公司產品LLDPE等級3120與三星綜合產品 EVA 120Α，透過吹膜機(Blown Film Extruder)在 170°C的溫 10度下押出厚度30 μιη的膜。 製造例2 :防滑層的製造 使用陶氏化學(Dow Chemical)公司產品AFFINITY等級 PL 1840 ’ 透過吹獏機(Bi〇wn Film Extruder)在 150oC的溫度 15下押出厚度30 μιη的膜。 製造例3 :對銘箔進行表面處理以實現防滑功能 在厚度為130 且其純度達99%以上的鋁板之一面或 兩面進行鋁輥軋時，透過對工作輥軸(w〇rkr〇u)上進行浮雕 2〇處理的方法進行表面處理作業，以提高其粗链度，製得表 面粗糖度大於0.30 μηι的銘笛。 實施例1 在130 μιη厚的純鋁板之兩面，使用乙烯/甲基丙烯酸共 13 1360476 聚物樹脂（杜邦產品，NUCREL，等級：0910)以得到35μπΐ 厚的膜，並將之作為其潤滑層，然後積層上述製造例丨之厚 度達30 μιη的膜，使用積層黏接劑進行積層，並在金屬層的 兩面分別形成潤滑層及防滑層，以製得鑽孔加工製程用板 5材。 . 實施例2 使用與上述實施例1相同的方法製作鑽孔加工製程用 板材，但是防滑層是使用上述製造例2的組成成分。 實施例3 10 使用與上述製造例3相同的方法製作銘，然後使用實 施例i所製得之騎層進行積層，以製得鑽孔加卫製程用被 材0 實施例4 使用與上述實施例2相同的方法製作鑽孔加工製 15板材，但是潤滑層是使用乙烯·醋酸乙烯共聚物樹脂與 # 丙烯酸共聚物樹脂的混合物。 崎 實施例5 使用，上述實施例i相同的方法製作鑽孔加工製程用 板材，但疋防滑層的組成成分與潤滑層相同。 20 實施例6 用 二”，施例2相同的方法製作鑽孔加工製程 板材，仁疋防α層的組成成分與潤滑層相 對照例1 使用與上述實施例14目_方法製作觀加工製程用 14 136047612 1360476 The danger. [Embodiment] The present invention will be further described below in conjunction with the examples, but Example 5 does not limit the present invention. Production Example 1: Production of an anti-slip layer A film having a thickness of 30 μm was extruded through a blown film machine (Blown Film Extruder) at a temperature of 170 ° C by using a film of LLDPE grade 3120 and a Samsung integrated product EVA 120 韩. Production Example 2: Production of a non-slip layer A film having a thickness of 30 μm was extruded at a temperature of 150 ° C by a Tow Chemical Company product AFFINITY grade PL 1840 ' by a blow dryer (Bi〇wn Film Extruder). Production Example 3: Surface treatment of Ming foil to realize anti-slip function When aluminum rolling is performed on one or both sides of an aluminum plate having a thickness of 130 and a purity of 99% or more, it is transmitted through a pair of work rolls (w〇rkr〇u) The surface treatment operation was carried out by performing the embossing treatment to improve the thick chain degree, and the surface flute having a surface roughness of more than 0.30 μη was obtained. Example 1 On both sides of a 130 μm thick pure aluminum plate, a total of 13 1360476 polymer resin (DuPont product, NUCREL, grade: 0910) of ethylene/methacrylic acid was used to obtain a 35 μπ thick film as a lubricating layer. Then, a film having a thickness of 30 μm was produced by laminating the above-mentioned production example, and a layered adhesive was used for lamination, and a lubricating layer and a non-slip layer were formed on both sides of the metal layer to obtain a sheet 5 for drilling processing. [Example 2] A material for a drilling process was produced in the same manner as in the above-mentioned Example 1, but the composition of the above-mentioned Production Example 2 was used for the anti-slip layer. [Example 3] 10 was produced in the same manner as in the above Production Example 3, and then laminated using the riding layer obtained in Example i to obtain a material for the drilling and curing process. Example 4 Use and the above embodiment 2 The same method was used to produce 15 sheets for drilling, but the lubricating layer was a mixture of ethylene-vinyl acetate copolymer resin and #acrylic copolymer resin. Example 5 Using the same method as in the above Example i, a sheet for drilling processing was produced, but the composition of the anti-slip layer was the same as that of the lubricating layer. 20 Example 6 A drilling process sheet was produced in the same manner as in Example 2, and the composition of the core layer of the lanthanum lanthanum and the lubricating layer was compared with Example 1 using the above-mentioned Example 14 method. 1360476
10 板材，但是只具有潤滑層而不具有防滑層。 對照例2 使用與上述實施例3相同的方法製作鑽孔加工製程用 板材’但是只具有潤滑層而不具有防滑層。 對照例3 使用與上述實施例4相同的方法製作鑽孔加工製程用 板材’但是只具有潤滑層而不具有防滑層。 為了比較上述實施例1到6以及對照例_所製成的鑽 孔加工製程用板材與銅羯之間的摩擦力，使用滑動試驗機 (大成試驗機公司產品，魏YX_219)叫紐進行傾斜 實驗’並量測上述板材開始相對於_面進行滑動時的_ 值，其結果如表1所示。 【表1】 實施例 1 m /ci >aj 9 ) 25 2 30 3 —丨 — 27 4 28 5 27 6 27 對照例 1 ~ 18 2 19 3 18 實驗例 對於上逃實施例1到6及對照例1到3所製成的各鑽孔加 工製程用板材·進行鑽孔加工，然後評估孔位置的精密度、 孔内壁之袓糙度、鑽頭斷裂性及孔内之膠渣(smear)現象。 鑽孔加工的方法為，將實施例1到6之板材的防滑層、 15 15 1360476 以及對照例1到3的金屬層配置到鄰接厚度為〇 4 mm的雙面 銅箔印刷電路板（FR-4產品，銅箔厚18μηι)之位置，並積 層7枚印刷電路板，之後在其下方配置由1.5 mm厚之電木 (bakelite)板製成的靠板，然後進行印刷電路板的鑽孔加工 5作業。 鑽孔加工的條件如下。 鑽針：直徑0.25 mm 旋轉速度：125,000 rpm 移送速度：2.5 m/分鐘 10 相鄰加工孔中心之間的距離：0.5 mm 鑽針數：5000針(hit) (1) 積層7枚印刷電路板並進行5000次（鑽孔）後，針 對最下方（第7枚）的基板評估其孔位置的精密度。也就是 is說，針對最下方基板的5〇〇〇個孔來量測其孔中心部位的誤 差間隔’並計算其最大值。最大值小於5〇 μπι者標示◎，介 於50到70 者標示〇，介於70到100 μιη者標示△，大於1〇〇 μιη者標示X。 (2) 針對第5枚基板評估其孔内壁的粗糙度，量測第 2〇 4000個孔及前後2個孔的各鑽孔壁面的左右内壁之粗糙 度’其平均值小於5·0μιη者標示◎，小於7.0μιη者標示〇， 小於10 μιη者標示△，大於10 μιη者標示X。 (3) 檢查鑽孔加工試驗中所製成的孔之膠渣(smear)現 象。膠漬是因摩擦熱的擴散不充份而導致鑽針溫度昇高， 16 136047610 sheets, but only with a lubricating layer and no anti-slip layer. Comparative Example 2 Using the same method as in the above Example 3, a sheet for drilling processing was produced, but only a lubricating layer was provided without an anti-slip layer. Comparative Example 3 Using the same method as in the above Example 4, a sheet for drilling processing was produced, but only a lubricating layer was provided without an anti-slip layer. In order to compare the friction between the sheet material for the drilling process and the copper crucible prepared in the above Examples 1 to 6 and Comparative Example _, a tilt test was performed using a sliding tester (product of Dacheng Testing Machine Co., Ltd., Wei YX_219). 'And the _ value at which the above-mentioned sheet began to slide with respect to the _ plane was measured, and the results are shown in Table 1. [Table 1] Example 1 m /ci > aj 9 ) 25 2 30 3 - 丨 - 27 4 28 5 27 6 27 Comparative Example 1 ~ 18 2 19 3 18 Experimental Examples For the escape Examples 1 to 6 and the control Each of the drilling processing sheets produced in Examples 1 to 3 was subjected to drilling, and then the precision of the hole position, the roughness of the inner wall of the hole, the fracture property of the drill, and the smear phenomenon in the hole were evaluated. The drilling process was carried out by disposing the anti-slip layer of the sheets of Examples 1 to 6, 15 15 1360476 and the metal layers of Comparative Examples 1 to 3 to a double-sided copper foil printed circuit board (FR-) having a thickness of 〇4 mm. 4 products, copper foil thickness 18μηι), and 7 layers of printed circuit boards, then placed under the 1.5 mm thick bakelite board, and then the printed circuit board drilling 5 homework. The conditions for drilling are as follows. Drill: Diameter 0.25 mm Rotation speed: 125,000 rpm Transfer speed: 2.5 m/min 10 Distance between centers of adjacent machining holes: 0.5 mm Number of drills: 5000 needles (1) Laminated 7 printed circuit boards and After 5000 times (drilling), the precision of the hole position was evaluated for the lowest (7th) substrate. That is, it is said that the error interval ' at the center of the hole is measured for 5 holes of the lowermost substrate and the maximum value thereof is calculated. The maximum value is less than 5〇 μπι, the mark is ◎, the 50 to 70 is marked with 〇, the 70 to 100 μηη is marked with △, and the greater than 1〇〇 μιη is marked with X. (2) The roughness of the inner wall of the hole is evaluated for the fifth substrate, and the roughness of the left and right inner walls of each of the second 4,000 holes and the two holes of the front and rear holes is measured, and the average value is less than 5·0 μιη. ◎, less than 7.0μιη is marked with 〇, less than 10 μιη is marked with △, and greater than 10 μιη is marked with X. (3) Check the smear of the hole made in the drilling test. Glue is caused by insufficient diffusion of frictional heat and causes the temperature of the bur to rise. 16 1360476
使芯片的樹脂部位软化並炼解，進而重新黏接在貫通孔内 壁的内層銅讀面之縣^清洗後使關微_察20個貫 通孔的截© 有發現給予lG分發現微量膠 渣則給予5分，從整體上發現膠渔則給予〇分。下表2為上述 (1)到(3)項各別的量測結果。 【表2】The resin portion of the chip is softened and refined, and then re-bonded to the inner copper reading surface of the inner wall of the through-hole. After cleaning, the micro-cutting of 20 through-holes is observed. Give 5 points, and find that the rubber fishing is given as a whole. Table 2 below shows the measurement results for each of the above items (1) to (3). 【Table 2】
由上述表2的結果可知，如本發明使㈣滑層時，不僅It can be seen from the results of Table 2 above that, as the present invention enables (4) to slip the layer, not only
10 可以改善孔的精密度’還可以降低内壁的粗Μ度。但是， 如果鄰接基板的面是金屬層，則其與基板之間的緊密接觸 性會減弱並影響孔的精密度，還會對孔内壁的表面粗縫度 造成不良影響。10 can improve the precision of the hole' can also reduce the roughness of the inner wall. However, if the surface of the adjacent substrate is a metal layer, the close contact between the substrate and the substrate is weakened and the precision of the hole is affected, and the surface roughness of the inner wall of the hole is adversely affected.
1717