CN102387665A - Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet - Google Patents
Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet Download PDFInfo
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- CN102387665A CN102387665A CN2010102737090A CN201010273709A CN102387665A CN 102387665 A CN102387665 A CN 102387665A CN 2010102737090 A CN2010102737090 A CN 2010102737090A CN 201010273709 A CN201010273709 A CN 201010273709A CN 102387665 A CN102387665 A CN 102387665A
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- emulsion sheet
- cover sheet
- aluminum cover
- drill point
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to an aluminum cover sheet and a micro-hole processing method of a printed circuit board adopting the aluminum cover sheet. The micro-hole processing method of the printed circuit board comprises the steps that: a drilling rig is provided; the drilling rig comprises a drilling rig platform and a drill bit, and the drill bit can rotate at high speed and move to a direction which is basically vertical to the drilling rig platform; the printed circuit board is provided; the printed circuit board is fixed on the drilling rig platform; the aluminum cover sheet is provided, the aluminum cover sheet is provided with at least one rough surface, the surface roughness Ra of the rough surface is 0.2mu m to 0.6mu m; the aluminum cover sheet is fixed on the printed circuit board and the rough surface is towards the drill bit; and the drill bit rotates at high speed and moves towards the direction which is basically vertical to the drilling rig platform, so that micro-holes are processed on the printed circuit board. The invention also provides the aluminum cover sheet which is adopted in the micro-hole processing method. The processing method has the advantages of low processing cost and high product precision.
Description
Technical field
The present invention relates to a kind of aluminium emulsion sheet and adopt the capillary processing method of the printed substrate of said aluminium emulsion sheet.
Background technology
Printed wiring board because of can be more conveniently for the fixedly assembling of various electronic devices and components provide mechanical support, realizes the wiring between the various electronic devices and components and be electrically connected, provides desired electrical characteristic, in extensive use to the various electronic equipments.
Printed wiring board is generally sandwich construction, usually realizes being electrically connected with the inwall formation electrodeposited coating of micropore through conducting electricity at interlayer between each layer.
In the prior art, micropore is processed to form through special drilling machine.Be specially: printed substrate is placed on the drilling machine platform of rig, presses the aluminium emulsion sheet at print circuit board surface, then, the drill point of high speed rotating moves to drilling machine platform with certain speed.
Drill point drills the aluminium emulsion sheet earlier, and then on printed substrate, forms the micropore of preliminary dimension.The effect of aluminium emulsion sheet mainly is to prevent to hole that the edge of micropore burr occurs, carry out the drill point guiding and takes away the heat that produces in the boring course of processing rapidly on the printed substrate of back, thereby reaches the purpose of degradation processing temperature.
The diameter of the micropore of above-mentioned processing method processing is generally greater than 0.25 millimeter.Along with developing rapidly of electronics industry, electronic product develops to microminiaturization, high integrated, high performance direction day by day, and the diameter of the micropore of printed substrate is more and more littler, and density is increasing.
But at the processing diameter during, occur frequently that drill point fractures and problems such as deviation appear in position, hole precision, cause manufacturing cost height and the low problem of product precision less than 0.2 millimeter micropore.
Summary of the invention
In view of the above problems, be necessary to provide the capillary processing method of the printed substrate that a kind of processing cost is low and the product precision is high and the aluminium emulsion sheet of employing thereof.
A kind of capillary processing method of printed substrate, it comprises: rig is provided, and said rig comprises drilling machine platform and drill point, but said drill point high speed rotating and to the motion of the direction of vertical basically said drilling machine platform; Printed substrate is provided; Printed substrate is fixed on the drilling machine platform; The aluminium emulsion sheet is provided, and said aluminium emulsion sheet has at least one matsurface, and the surface roughness Ra of said matsurface is 0.2 micron to 0.6 micron; Said aluminium emulsion sheet is fixed in printed substrate and matsurface towards drill point; Said drill point high speed rotating and to the motion of the direction of vertical basically said drilling machine platform, thus process micropore at printed substrate.
A kind of capillary processing aluminium emulsion sheet that is applied to printed substrate; It comprises that first surface reaches and said first surface opposing second surface; Said first surface and second surface one of them is a matsurface at least, the surface roughness Ra of said matsurface is 0.2 micron to 0.6 micron.
In the capillary processing method of printed substrate of the present invention; The first surface of aluminium emulsion sheet and second surface one of them is a matsurface at least; The surface roughness Ra of said matsurface is 0.2 micron to 0.6 micron, skids biased the moving in hole of avoiding drill point to fracture and cause thus when avoiding drill point to contact with the aluminium emulsion sheet on aluminium emulsion sheet surface; Therefore, said capillary processing method has the low and product advantage of high precision of processing cost.
Description of drawings
Sketch map when Fig. 1 is the micropore of the processing printed wiring board of rig of preferred embodiment of the present invention.
Fig. 2 is the generalized section of aluminium emulsion sheet shown in Figure 1.
Fig. 3 is the sketch map after the printed substrate processing shown in Figure 1.
Embodiment
The present invention provides a kind of aluminium emulsion sheet and adopts the capillary processing method of the printed substrate of said aluminium emulsion sheet, and detailed step is following:
See also Fig. 1, rig 100 is provided, said rig 100 comprises drilling machine platform 110 and drill point 130, but said drill point 130 high speed rotating and to the motion of the direction of vertical basically said drilling machine platform 110.The diameter of phi 1 of said drill point 130 is less than 0.2 millimeter.
Printed substrate 200 is provided, and the gross thickness T1 of printed substrate 200 is 4.5 millimeters to 4.8 millimeters.
Printed substrate 200 is fixed on the drilling machine platform 110.
Please consult Fig. 2 in the lump, aluminium emulsion sheet 300 is provided, the thickness T 2 of aluminium emulsion sheet 300 is 0.15 millimeter to 0.2 millimeter.Aluminium emulsion sheet 300 comprises first surface 310 and and first surface 310 opposing second surface 330.First surface 310 is a matsurface, and its surface roughness Ra is 0.2 micron to 0.6 micron.In this execution mode, the material of aluminium emulsion sheet 300 is a fine aluminium.Be appreciated that second surface 330 also can be matsurface.
Surface and first surface 310 that aluminium emulsion sheet 300 is fixed in printed substrate 200 are towards drill point 130.
Please consult Fig. 3 in the lump, drill point 130 high speed rotating and to the direction motion of basic vertical drilling machine platform 110, thus process micropore 350 at printed substrate 300.The diameter of phi 2 of each micropore 350 is less than 0.2 millimeter.In this execution mode, the rotating speed of drill point 130 is 140000～200000 commentaries on classics/per minutes, and drill point 130 feed speeds are 1～2 meter/minute, and drill point 130 withdrawing speed are 5～10 meters/minute.
Because the first surface 310 of aluminium emulsion sheet 300 is a matsurface; The surface roughness Ra of said matsurface is 0.2 micron to 0.6 micron; First surface 310 at aluminium emulsion sheet 300 when avoiding drill point 130 to contact with aluminium emulsion sheet 300 skids; The hole of avoiding broken needle 130 and causing thus is biased to be moved, and therefore, above-mentioned capillary processing method has the low and product advantage of high precision of processing cost.
Claims (10)
1. the capillary processing method of a printed substrate, it comprises:
Rig is provided, and said rig comprises drilling machine platform and drill point, but said drill point high speed rotating and to the motion of the direction of vertical basically said drilling machine platform;
Printed substrate is provided;
Printed substrate is fixed on the drilling machine platform;
The aluminium emulsion sheet is provided, and said aluminium emulsion sheet has at least one matsurface, and the surface roughness Ra of said matsurface is 0.2 micron to 0.6 micron;
Said aluminium emulsion sheet is fixed in printed substrate and said matsurface towards drill point;
Said drill point high speed rotating and to the motion of the direction of vertical basically said drilling machine platform, thus process micropore at printed substrate.
2. capillary processing method as claimed in claim 1 is characterized in that: said aluminium emulsion sheet thickness is 0.15 millimeter to 0.2 millimeter.
3. capillary processing method as claimed in claim 1 is characterized in that: the diameter of said drill point is less than 0.2 millimeter.
4. capillary processing method as claimed in claim 1 is characterized in that: the rotating speed of said drill point is 140000～200000 commentaries on classics/per minutes.
5. capillary processing method as claimed in claim 1 is characterized in that: said drill point feed speed is 1～2 meter/minute.
6. capillary processing method as claimed in claim 1 is characterized in that: said drill point withdrawing speed is 5～10 meters/minute.
7. capillary processing method as claimed in claim 1 is characterized in that: the gross thickness of said printed substrate is 4.5 millimeters to 4.8 millimeters.
8. capillary processing aluminium emulsion sheet that is applied to printed substrate; It comprises that first surface reaches and said first surface opposing second surface; It is characterized in that: said first surface and second surface one of them is for matsurface at least, the surface roughness Ra of said matsurface is 0.2 micron to 0.6 micron.
9. aluminium emulsion sheet as claimed in claim 9 is characterized in that: said aluminium emulsion sheet thickness is 0.15 millimeter to 0.2 millimeter.
10. aluminium emulsion sheet as claimed in claim 9 is characterized in that: the material of said aluminium emulsion sheet is a fine aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102737090A CN102387665A (en) | 2010-09-06 | 2010-09-06 | Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102737090A CN102387665A (en) | 2010-09-06 | 2010-09-06 | Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102387665A true CN102387665A (en) | 2012-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102737090A Pending CN102387665A (en) | 2010-09-06 | 2010-09-06 | Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet |
Country Status (1)
| Country | Link |
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| CN (1) | CN102387665A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711383A (en) * | 2012-06-27 | 2012-10-03 | 深圳市星河电路有限公司 | Processing method for high-thickness small-aperture high-frequency copper substrate |
| CN107371330A (en) * | 2017-07-25 | 2017-11-21 | 深圳市景旺电子股份有限公司 | A kind of capillary processing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222816A (en) * | 2006-12-15 | 2008-07-16 | 洪富镇 | Sheets for drilling |
-
2010
- 2010-09-06 CN CN2010102737090A patent/CN102387665A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222816A (en) * | 2006-12-15 | 2008-07-16 | 洪富镇 | Sheets for drilling |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711383A (en) * | 2012-06-27 | 2012-10-03 | 深圳市星河电路有限公司 | Processing method for high-thickness small-aperture high-frequency copper substrate |
| CN102711383B (en) * | 2012-06-27 | 2016-01-20 | 深圳市星河电路有限公司 | The processing method of a kind of high thickness small-bore high-frequency copper substrate |
| CN107371330A (en) * | 2017-07-25 | 2017-11-21 | 深圳市景旺电子股份有限公司 | A kind of capillary processing method |
| CN107371330B (en) * | 2017-07-25 | 2019-09-13 | 深圳市景旺电子股份有限公司 | A kind of capillary processing method |
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| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Shanghai H-Fast Electronic Co., Ltd. Document name: the First Notification of an Office Action |
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| DD01 | Delivery of document by public notice |
Addressee: Liu Tongfa Document name: Notification of an Office Action |
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| DD01 | Delivery of document by public notice |
Addressee: Liu Tongfa Document name: Notification that Application Deemed to be Withdrawn |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120321 |