CN100566897C - Use the boring method of single face copper clad plate as the back drill cover plate - Google Patents
Use the boring method of single face copper clad plate as the back drill cover plate Download PDFInfo
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- CN100566897C CN100566897C CNB2008101423224A CN200810142322A CN100566897C CN 100566897 C CN100566897 C CN 100566897C CN B2008101423224 A CNB2008101423224 A CN B2008101423224A CN 200810142322 A CN200810142322 A CN 200810142322A CN 100566897 C CN100566897 C CN 100566897C
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Abstract
The present invention relates to a kind of boring method that uses the single face copper clad plate as the back drill cover plate, may further comprise the steps: provide the single face copper clad plate as the back drill cover plate, the single face copper clad plate comprises backing material plate and is located at the copper coin of backing material plate one side; The single face copper clad plate is installed on pcb board, and the substrate surface of single face copper clad plate makes progress, and copper face contacts with pcb board downwards; Pcb board is carried out back drill technology.The present invention utilizes the single face copper clad plate as the back drill cover plate, its thickness is thicker and hardness is big and difficult being picked up, and, the thick tolerance of the copper of single face copper clad plate is less, can reduce the influence to the back drill precision, in addition, the substrate surface of single face copper clad plate has cleaning to bore the effect of cutter, can effectively avoid dust, copper scale, aluminium bits etc. to residue in boring causing on the cutter high-frequency circuit in advance or fall behind conducting and cause depth error, thereby can effectively improve the back drill precision.
Description
Technical field
The present invention relates to the printed circuit field, relate in particular to a kind of boring method that uses the single face copper clad plate as the back drill cover plate.
Background technology
In the manufacturing process of pcb board, need blind hole to realize the electrical connection of internal layer circuit interlayer, blind hole is often produced by rig, its operation principle contacts with pcb board or aluminium flake (conductor) for boring cutter, system forms the loop by the high-frequency electronic conducting, and from then on begin to calculate down drilling depth, so the thickness deviation of conductive layer can influence the precision of back drill (back drill) in the cover plate.
Conventional aluminium flake thickness specification is 0.18 ± 0.015mm, and its tolerance is bigger.And aluminium flake is very thin, is picked up by the suction of dust catcher easily and leaves the pcb board face and cause precision to reduce.Therefore be necessary to improve.
Summary of the invention
The object of the present invention is to provide a kind of boring method that uses the single face copper clad plate as the back drill cover plate, it adopts single-side coated copper plate as cover plate, can effectively control the depth tolerances of back drill, improves the precision of back drill.
For achieving the above object, the invention provides a kind of boring method that uses the single face copper clad plate as the back drill cover plate, may further comprise the steps:
Step 1: provide the single face copper clad plate as the back drill cover plate, the single face copper clad plate comprises backing material plate and is located at the copper coin of backing material plate one side;
Step 2: the single face copper clad plate is installed on pcb board, and the substrate surface of single face copper clad plate makes progress, and copper face contacts with pcb board downwards;
Step 3: pcb board is carried out back drill technology.
Beneficial effect of the present invention: utilize the single face copper clad plate as the back drill cover plate, its thickness is thicker and hardness is big and difficult being picked up, and, the thick tolerance of the copper of single face copper clad plate is less, can reduce the influence to the back drill precision, in addition, the substrate surface of single face copper clad plate has cleaning to bore the effect of cutter, can effectively avoid dust, copper scale, aluminium bits etc. to residue in boring causing on the cutter high-frequency circuit in advance or fall behind conducting and cause depth error, thereby can effectively improve the back drill precision.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 uses the flow chart of single face copper clad plate as the boring method of back drill cover plate for the present invention;
Fig. 2 is the schematic diagram of single face copper clad plate and pcb board;
Fig. 3 is the schematic diagram of the back drill technology among Fig. 1.
The specific embodiment
Describe the present invention below in conjunction with accompanying drawing.
As shown in Figure 1, the present invention uses the boring method of single face copper clad plate as the back drill cover plate, may further comprise the steps:
Step 1: provide single face copper clad plate 4 as the back drill cover plate; Described single face copper clad plate 4 comprises backing material plate 41 and is located at the copper coin 42 of backing material plate 41 1 sides, it is made by the two-sided copper clad plate of etching, this two-sided copper clad plate comprises backing material plate and is located at the copper coin of backing material plate two sides, the copper coin of the intact one side of etching, utilize the dielectric material of the copper coin 42 of its another side as the high-frequency electronic conducting, in the present embodiment, the thickness of slab of two-sided copper clad plate is 1.0mm, and the thick specification of its copper is 0.018 ± 0.003mm.
Step 2: single face copper clad plate 4 is installed on pcb board, and as shown in Figure 2, the substrate surface 41 of this single face copper clad plate 4 makes progress, and copper face 42 contacts with pcb board 5 downwards;
Step 3: pcb board is carried out back drill technology.As shown in Figure 3, the rig of back drill technology can pass through existing techniques in realizing, pcb board 5 is placed on the workbench of rig, boring cutter 6 electrically connects with operating system 7, operating system 7 comprises Z axle servo-drive system 71 and the measuring unit 72 that electrically connects with Z axle servo-drive system 71, measuring unit 72 electrically connects with pcb board 5, single-side coated copper plate 4 is placed on the pcb board 5, operating system 7 controls are bored cutter 6 and are moved down, when boring cutter 6 with the copper coin 42 (consulting Fig. 2) of single face copper clad plate 4 when contacting, conducting forms current loop, and from then on begin to calculate down drilling depth, when measuring unit 72 detects apex point with the activation signal on pcb board 5 surfaces, give Z axle servo-drive system 71 with signal feedback, and finish back drill accordingly.
The contrast verification of embodiments of the invention and comparative example is described in detail as follows.
Choose aluminium flake and single face copper clad plate respectively as the back drill cover plate, the pcb board to same model on the same auger spindle of same rig compares test, and drilling parameter during test, to bore cutter all identical, only the cover plate difference.In order to the cover plate of assessment different materials to the influence of pcb board back drill precision.The single face copper clad plate of present embodiment is to be that the thick specification of copper of the two-sided copper clad plate of 1.0mm is that 0.018 ± 0.003mm makes by the etching thickness of slab; The thickness specification of the aluminium flake of comparative example is generally 0.18 ± 0.015mm, and its experimental data is as shown in the table.
The contrast conclusion:
1, above data show that the degree of depth control accuracy of using the single face copper clad plate to make cover plate is apparently higher than using aluminium flake to make the degree of depth control accuracy of cover plate.
Frequent warning when 2, using aluminium flake to make cover plate is to cause high-frequency circuit in advance or fall behind due to the conducting on the cutter because dust, copper scale, aluminium bits etc. residue in to bore, and because aluminium flake is very thin, aluminium flake is picked up by the suction of dust catcher and leaves the pcb board face and cause precision to reduce.
Have when 3, the single face copper clad plate is made cover plate the thicker and hardness of cover plate big and be difficult for being picked up, the thick tolerance of the copper base material less, the single face copper clad plate of single sided board has cleaning to bore the advantages such as effect of cutter, so the error that causes is less, makes the precision of back drill improve.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of accompanying Claim of the present invention.
Claims (2)
1, a kind of boring method that uses the single face copper clad plate as the back drill cover plate is characterized in that, may further comprise the steps:
Step 1: provide the single face copper clad plate as the back drill cover plate, the single face copper clad plate comprises backing material plate and is located at the copper coin of backing material plate one side, this single face copper clad plate is made by the copper coin of the side in the two-sided copper clad plate of etching, and described two-sided copper clad plate thickness is 1.0mm;
Step 2: the single face copper clad plate is installed on pcb board, and the substrate surface of single face copper clad plate makes progress, and copper face contacts with pcb board downwards;
Step 3: pcb board is carried out back drill technology.
2, use single face copper clad plate as claimed in claim 1 is characterized in that as the boring method of back drill cover plate, and this two-sided copper clad plate comprises backing material plate and be located at the copper coin of backing material plate two sides that the thickness specification of copper coin is 0.018 ± 0.003mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008101423224A CN100566897C (en) | 2008-08-08 | 2008-08-08 | Use the boring method of single face copper clad plate as the back drill cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008101423224A CN100566897C (en) | 2008-08-08 | 2008-08-08 | Use the boring method of single face copper clad plate as the back drill cover plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101342604A CN101342604A (en) | 2009-01-14 |
| CN100566897C true CN100566897C (en) | 2009-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2008101423224A Active CN100566897C (en) | 2008-08-08 | 2008-08-08 | Use the boring method of single face copper clad plate as the back drill cover plate |
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Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103428999B (en) * | 2012-05-25 | 2016-03-23 | 北大方正集团有限公司 | A kind of pcb board method for processing forming and superimposed sheet |
| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
| CN105598488A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | PCB (printed circuit board) drilling method |
| CN105945326A (en) * | 2016-07-18 | 2016-09-21 | 苏州工业园区杰智汇电子材料有限公司 | Circuit board drilling cover plate for deep drilling control and control method |
| CN106304654B (en) * | 2016-11-01 | 2019-03-05 | 生益电子股份有限公司 | A kind of method promoting back drill STUB precision and the PCB using this method |
| CN106682269A (en) * | 2016-11-29 | 2017-05-17 | 深圳崇达多层线路板有限公司 | PCB drilling tool diameter hole count comparison method |
| CN108882557B (en) * | 2017-05-11 | 2023-07-14 | 中兴通讯股份有限公司 | Back drilling method, device and equipment for PCB |
| CN107801325A (en) * | 2017-08-30 | 2018-03-13 | 江门崇达电路技术有限公司 | Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil |
| CN108235601A (en) * | 2017-12-04 | 2018-06-29 | 深南电路股份有限公司 | PCB intersects method for processing blind hole and with the PCB for intersecting blind hole |
| CN108811333A (en) * | 2018-06-22 | 2018-11-13 | 胜宏科技（惠州）股份有限公司 | A method of improving back drill hole quality |
| CN111716444A (en) * | 2020-06-24 | 2020-09-29 | 江西景旺精密电路有限公司 | PCB drilling method |
| CN112247212A (en) * | 2020-09-02 | 2021-01-22 | 王彩霞 | Punching equipment with function of cleaning metal in advance |
| CN111970836B (en) * | 2020-09-25 | 2024-05-28 | 景旺电子科技(龙川)有限公司 | Manufacturing method of 5G communication PCB back drill |
| CN112399716A (en) * | 2020-10-19 | 2021-02-23 | 沪士电子股份有限公司 | Back drilling method and preparation method of PCB and prepared PCB |
| CN112770506A (en) * | 2020-12-10 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Back drilling method of circuit board and circuit board |
| CN113334493B (en) * | 2021-05-31 | 2023-02-28 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN114871475A (en) * | 2022-03-31 | 2022-08-09 | 深圳市金洲精工科技股份有限公司 | Drill, manufacturing method of drill and circuit board processing system with drill |
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2008
- 2008-08-08 CN CNB2008101423224A patent/CN100566897C/en active Active
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| 印刷线路板(PCB)设计与制作. 曾峰、侯亚宁、曾凡雨，2-7、11-12，电子工业出版社. 2002 |
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| Publication number | Publication date |
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| CN101342604A (en) | 2009-01-14 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 413 No. 523039 Guangdong province Dongguan City Wanjiang Wando spike Avenue Patentee before: Dongguan Shengyi Electronics Ltd. |