CN102711383A - Processing method for high-thickness small-aperture high-frequency copper substrate - Google Patents
Processing method for high-thickness small-aperture high-frequency copper substrate Download PDFInfo
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- CN102711383A CN102711383A CN2012102159282A CN201210215928A CN102711383A CN 102711383 A CN102711383 A CN 102711383A CN 2012102159282 A CN2012102159282 A CN 2012102159282A CN 201210215928 A CN201210215928 A CN 201210215928A CN 102711383 A CN102711383 A CN 102711383A
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Abstract
The invention discloses a processing method for a high-thickness small-aperture high-frequency copper substrate. The processing method comprises the following steps of: cutting; drilling; forming graphic circuits; performing acidic etching; preparing solder mask green oil; forming; precipitating silver on a surface; and the like. According to the processing method for the high-thickness small-aperture high-frequency copper substrate provided by the invention, a high-frequency copper substrate is cut and drilled, and tools such as a milling cutter and a drill bit in a manufacturing process, processes, processing parameters and the like during formation are correspondingly adjusted according to the processing method and parameters of an FR4 board, so that the problems of breakage of the drill bit and flashing during drilling of the high-frequency copper substrate are effectively solved, and the problems of flashing and burrs during cutting and forming of the high-frequency copper substrate are avoided.
Description
Technical field
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is the processing method of a kind of high thickness small-bore high frequency copper base, mainly is meant copper base thickness>=4.0MM here, aperture≤1.0MM high frequency copper base.
Background technology
Fast development along with HF receiver, high power module power supply; Increasing of PCB components and parts packaging density and integrated level and speeding of signaling rate; Power consumption increases thereupon; Thermal diffusivity requirement and high-frequency transmission to pcb board require increasingly high; The high frequency copper base is owing to have good heat dispersion, good capability of electromagnetic shielding, higher mechanical strength and toughness, and has that angularity is little, the dimensional stability advantages of higher, therefore in present all kinds of metal base printed boards, is widely used.
Because copper base and dielectric layer (polytetrafluoroethylene) in the high frequency copper base all belong to extraordinary sheet material; Its manufacturing process and common FR4 (epoxy resin fiberglass cloth plate) distinguish to some extent; Especially for high thickness small-bore high frequency copper base (copper base thickness>=4.0MM; Aperture≤1.0MM), have following difficult point in its course of processing: one, boring: the material hardness of copper base is big and copper base thickness is big (copper base thickness>=4.0MM), and hole less; Therefore boring occurs the breaking of rod easily and chews phenomenon, particularly (aperture≤1.0MM), small-bore; Two, moulding: copper base material hardness is big to exceed common FR4 plate with thickness of slab, and phenomenons such as burr, burr appear in moulding easily, even the problem of the gong cutter that can occur breaking.
Summary of the invention
The object of the present invention is to provide the processing method of a kind of high thickness small-bore high frequency copper base; To solve present copper base thickness>=4.0MM, occur easily during the boring that is occurred in the high frequency copper base course of processing of aperture≤1.0MM that the breaking of rod is chewed, occur the problem of burr, burr and disconnected gong cutter during moulding easily.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
The processing method of a kind of high thickness small-bore high frequency copper base comprises step:
S1, open material: adopt the folded high frequency copper base leaf thickness of 1PNL/; The corresponding board parameter that mills of adjusting the high frequency copper base of FR4 plate with reference to same size; Make the speed of mainshaft improve 20%-30%, pace decline 60%-85%, feed velocity decline 40%-70%; Adopt the aluminium base milling cutter that the high frequency copper base is carried out gradation then and mill plate and open material, and mill the degree of depth≤1.0MM of plate at every turn;
S2, boring: adopt the folded high frequency copper base leaf thickness of 1PNL/, the drilling parameter of the corresponding adjustment of the drilling parameter high frequency copper base of the same pore size FR4 plate of reference makes speed of mainshaft decline 30%-50%; Carry out speed decline 50%-80%; Withdrawing speed decline 20%-40%, the upper and lower surface that adopts the wolfram steel brill to chew the high frequency copper base then carries out gradation boring, and at first the copper foil layer by the high frequency copper base carries out gradation boring downwards; Each drilling depth≤0.3MM; When boring total depth when getting into 2.6MM, towards last, the bore position on same axis carries out gradation boring downwards again with the copper base of high frequency copper base; Each drilling depth≤0.3MM is drilled up to the hole;
S3, on the copper foil layer of high frequency copper base, carry out graph line road, acid etching and resistance weldering green oil is made, form high frequency copper base circuit board;
S4, moulding: adopt the folded high frequency copper base leaf thickness of 1PNL/; The corresponding board parameter that mills of adjusting the high frequency copper base of FR4 plate with reference to same size; Make the speed of mainshaft improve 20%-30%, pace decline 60%-85%, feed velocity decline 40%-70; Adopt the aluminium base milling cutter that the high frequency copper base is carried out gradation then and mill plate and open material, and mill the degree of depth≤1.0MM of plate at every turn.
Preferably, said high frequency copper base is made up of copper base, dielectric layer and copper foil layer, and said dielectric layer is a polytetrafluoroethylene, between copper base and copper foil layer, and said copper base thickness >=4.0MM, be preferably 4.2MM.
Preferably, the cover plate of plate face adopts the etching tabula rasa in the step S2 boring procedure.
Preferably, adopt the processing method of FR4 plate that the high frequency copper base is carried out figure circuit, acid etching and the making of resistance weldering green oil among the said S3.
Preferably, also comprise step
The processing method of S5, employing FR4 plate is carried out the heavy silver in surface to the high frequency copper base and is handled.
The processing method of high thickness provided by the present invention small-bore high frequency copper base is according to the processing method and the parameter of FR4 plate; Driving milling cutter in material, boring and the forming process, bore instrument, technology and the machined parameters etc. chewed etc. in the manufacture craft and carry out correspondence adjustment the high frequency copper base; The problem that the breaking of rod is chewed and burr occurred takes place to efficiently solve high frequency copper base when boring, and the burr Burr Problem when having avoided the high frequency copper base to open material and moulding.
Description of drawings
Fig. 1 is the structural representation of high frequency copper base of the present invention.
Identifier declaration among the figure: copper base 1, dielectric layer 2, copper foil layer 3.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also shown in Figure 1ly, Fig. 1 is the structural representation of high frequency copper base of the present invention.High frequency copper base of the present invention is made up of copper base 1, dielectric layer 2 and copper foil layer 3; Said dielectric layer 2 is processed by polytetrafluoroethylene; Between copper base 1 and copper foil layer 3, the thickness >=4.0MM of said copper base 1, the thickness of slab of medium-high frequency copper base wherein of the present invention are 4.8MM; The thickness of copper base 1 is 4.2MM, and the thickness of dielectric layer 2 and copper foil layer 3 is 0.6MM together.
The processing method of high thickness provided by the present invention small-bore high frequency copper base; Be mainly used in and solve present copper base thickness>=4.0MM; And in the course of processing of the high frequency copper base of boring aperture≤1.0MM, occur easily during the boring that occurred that the breaking of rod is chewed, occur the problem of burr, burr and disconnected gong cutter during moulding easily.
Method wherein of the present invention comprises that step is following:
S1, open material: adopt the folded high frequency copper base leaf thickness of 1PNL/; The corresponding board parameter that mills of adjusting the high frequency copper base of FR4 plate with reference to same size; Make the speed of mainshaft improve 20%-30%, pace decline 60%-85%, feed velocity decline 40%-70%; Adopt the aluminium base milling cutter that the high frequency copper base is carried out gradation then and mill plate and open material, and mill the degree of depth≤1.0MM of plate at every turn;
Wherein selected here high frequency copper base surface coated with protective film can effectively avoid the copper basal plane by scratch and pollution adding man-hour.
S2, boring: adopt the folded high frequency copper base leaf thickness of 1PNL/, the drilling parameter of the corresponding adjustment of the drilling parameter high frequency copper base of the same pore size FR4 plate of reference makes speed of mainshaft decline 30%-50%; Carry out speed decline 50%-80%, withdrawing speed decline 20%-40%, the upper and lower surface that adopts the wolfram steel brill to chew the high frequency copper base then carries out gradation boring; At first the copper foil layer by the high frequency copper base carries out gradation boring downwards, and each drilling depth≤0.3MM is when the boring total depth gets into 2.6MM; With the copper base of high frequency copper base towards last; Bore position on same axis carries out gradation boring downwards again, and each drilling depth≤0.3MM is drilled up to the hole; And the cover plate of plate face adopts the etching tabula rasa in the boring procedure, need not use aluminium sheet.
The reason that occurs of having problems during owing to high frequency copper base boring at present is following: it is improper that the boring fabrication process parameters is provided with; Copper base and brill can produce a large amount of heats when chewing friction, can't in time distribute, and cause the breaking of rod to be chewed; The drilling depth of the too thick needs of copper base is big, causes the bad breaking of rod that causes of chip removal to be chewed; The breaking of rod is chewed and the principal element of the quality of holing has the following aspects and influence: one, single working depth: according to pore size; Select suitable single working depth; If the single working depth is excessive, the heat that can cause on the drill bit being produced can't in time distribute, and has a strong impact on and bores the life-span of chewing; Give prominence to influence boring processing thereby cause the breaking of rod to chew phenomenon; Two, the single-sided process degree of depth: along with drilling depth increases gradually, the drill bit chip removal engenders bad, man-hour occurs the breaking of rod and chews phenomenon thereby cause boring to add, and the control of the single-sided process degree of depth will be controlled according to the size in aperture; Three, rotating speed: the too high meeting of rotating speed causes the boring quality burr to occur, and rotating speed is crossed the low breaking of rod that can cause and chewed or stuck rig, therefore need suitably adjust the boring rotating speed according to the aperture; Four, feed speed: feed speed can cause too soon and produce huge heat on the drill bit and can't in time distribute; Have a strong impact on and bore the life-span of chewing, give prominence to, influence boring processing thereby cause the breaking of rod to chew phenomenon; And if that the feed velocity modulation is had suffered is low; Can influence the output of product, therefore on the basis of keyhole quality, feed speed improved; Five, bore and to chew the life-span: bore chew the life-span be provided with too high meeting cause holing quality can not be up to standard; Even the breaking of rod can occur and chew; Chew the life-span and be provided with lowly and bore, can improve the production cost of boring, therefore will chew wear intensity in the course of processing and provide rational brill and chew the life-span according to brill.
Hence one can see that; Brill when holing in order to prevent is chewed problem; Need and bore several aspects such as chewing the life-span and adjust from the single working depth of high frequency copper base, the single-sided process degree of depth, rotating speed, feed speed, following through above-mentioned data being adjusted the experimental result that the back obtained:
Can show by top experimental result, when adopting two sides gradation boring, process by the experiment 5 and the processing conditions of experiment 6; The quality that processes can satisfy quality requirements; Successful solution process the difficult problem of small-bore boring of high thickness copper base, but the production efficiency in order to guarantee to hole adopts experiment 5 to be processed as desirable processing conditions; Its corresponding drilling parameter adjustment of being adopted is a normative reference with the drilling parameter of same pore size FR4 plate; Make speed of mainshaft decline 30%-50%, carry out speed decline 50%-80%, withdrawing speed decline 20%-40%.
S3, on the copper foil layer of high frequency copper base, carry out graph line road, acid etching and resistance weldering green oil is made, form high frequency copper base circuit board;
Wherein can adopt the processing method of FR4 plate that the high frequency copper base is carried out figure circuit, acid etching and the making of resistance weldering green oil in this step, its concrete mode is following:
Outer-layer circuit be produced on press mold the time, pressure is reduced on the basis of common plate, other is made with common FR4 does not have obvious difference;
During acid etching, the diaphragm of check copper basal plane has or not breakage earlier, and with protection copper basal plane on the single face sticker, its making is the same with common plate if any breakage;
Resistance weldering, literal: the making of resistance weldering, literal is the same with common sheet material, but when making resistance weldering is developed, in the hole ink residue can not be arranged;
Dyestripping and nog plate: after the diaphragm of copper base torn, again the copper basal plane is carried out nog plate, copper-clad surface does not grind;
Pasting protective film: this flow process is that the copper basal plane that ground is carried out pasting protective film, and institute's pasting protective film necessarily requires its viscosity enough big, and in the back during dyestripping, can not have the glue mark to residue in the copper basal plane.
S4, moulding: adopt the folded high frequency copper base leaf thickness of 1PNL/; The corresponding board parameter that mills of adjusting the high frequency copper base of FR4 plate with reference to same size; Make the speed of mainshaft improve 20%-30%, pace decline 60%-85%, feed velocity decline 40%-70; Adopt the aluminium base milling cutter that the high frequency copper base is carried out gradation then and mill plate and open material, and mill the degree of depth≤1.0MM of plate at every turn.
Because the copper base thickness of high frequency copper base is up to 4.0mm when above; The burr of moulding and burr phenomenon and gong cutter type, the speed of mainshaft, gait of march and processing method have bigger relation, and one, gong cutter type: because the material hardness of copper base is very big, and the ductility of copper is better; Therefore when moulding, can not adopt common gong cutter material and geometry; If it is improper that gong cutter material and geometry are selected, in the time of can causing moulding chip removal bad, and then cause bulk deposition smear metal in the chip area of gong cutter; Cause burr sharply to increase, the gong cutter life-span reduces.Two, the speed of mainshaft: the material according to the gong cutter is different with geometry, selects the suitable speed of mainshaft.The rotating speed of main shaft is low excessively, can cause cutting force low excessively, and burr is excessive, and causes breaking easily.Three, gait of march: gait of march is low more, cuts fully more, and burr is more little, but considers working (machining) efficiency simultaneously, should be within the acceptable range in burr and cutter life, and the raising gait of march.Four, processing method: because the thickness of copper base exceeds common thickness of slab; And the thickness of copper base is up to more than the 4.0mm, and in the process of gong plate, gong cutter and the friction of copper base produce huge heat; And adopt the disposable trade union that adds to cause chip removal bad, thereby problems such as burr, burr appear.Produce for fear of bad quality, can not adopt common gong plate method in the course of processing, should adopt gradation gong plate method to solve above bad problem, and the quality that the low more gong of the degree of depth of each gong plate comes out is just good more, but can influence production efficiency.
Hence one can see that; The problem that occurs burr and burr when preventing the moulding of high frequency copper base; Need adjust from several aspects such as gong cutter type, rotating speed, gait of march and processing method that the moulding of high frequency copper base is adopted, following through the experimental result of being obtained after above-mentioned data are adjusted:
Can know that by above experimental data process according to the slat element of milling of experiment 7, the quality after the moulding can satisfy quality requirements.The board parameter that mills that it is corresponding to be adopted is a normative reference with the board parameter that mills of the FR4 plate of same size, makes the speed of mainshaft improve 20%-30%, pace decline 60%-85%, and feed velocity decline 40%-70%,
The processing method of S5, employing FR4 plate is carried out the heavy silver in surface to the high frequency copper base and is handled and reprocessing.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. the processing method of a high thickness small-bore high frequency copper base is characterized in that comprising step:
S1, open material: adopt the folded high frequency copper base leaf thickness of 1PNL/; The corresponding board parameter that mills of adjusting the high frequency copper base of FR4 plate with reference to same size; Make the speed of mainshaft improve 20%-30%, pace decline 60%-85%, feed velocity decline 40%-70%; Adopt the aluminium base milling cutter that the high frequency copper base is carried out gradation then and mill plate and open material, and mill the degree of depth≤1.0MM of plate at every turn;
S2, boring: adopt the folded high frequency copper base leaf thickness of 1PNL/, the drilling parameter of the corresponding adjustment of the drilling parameter high frequency copper base of the same pore size FR4 plate of reference makes speed of mainshaft decline 30%-50%; Carry out speed decline 50%-80%; Withdrawing speed decline 20%-40%, the upper and lower surface that adopts the wolfram steel brill to chew the high frequency copper base then carries out gradation boring, and at first the copper foil layer by the high frequency copper base carries out gradation boring downwards; Each drilling depth≤0.3MM; When boring total depth when getting into 2.6MM, towards last, the bore position on same axis carries out gradation boring downwards again with the copper base of high frequency copper base; Each drilling depth≤0.3MM is drilled up to the hole;
S3, on the copper foil layer of high frequency copper base, carry out graph line road, acid etching and resistance weldering green oil is made, form high frequency copper base circuit board;
S4, moulding: adopt the folded high frequency copper base leaf thickness of 1PNL/; The corresponding board parameter that mills of adjusting the high frequency copper base of FR4 plate with reference to same size; Make the speed of mainshaft improve 20%-30%, pace decline 60%-85%, feed velocity decline 40%-70; Adopt the aluminium base milling cutter that the high frequency copper base is carried out gradation then and mill plate and open material, and mill the degree of depth≤1.0MM of plate at every turn.
2. the processing method of high thickness according to claim 1 small-bore high frequency copper base; It is characterized in that said high frequency copper base is made up of copper base, dielectric layer and copper foil layer; Said dielectric layer is a polytetrafluoroethylene, between copper base and copper foil layer, and said copper base thickness >=4.0MM.
3. the processing method of high thickness according to claim 1 small-bore high frequency copper base is characterized in that the cover plate of plate face in the step S2 boring procedure adopts the etching tabula rasa.
4. the processing method of high thickness according to claim 1 small-bore high frequency copper base is characterized in that adopting among the said S3 processing method of FR4 plate that the high frequency copper base is carried out figure circuit, acid etching and the making of resistance weldering green oil.
5. the processing method of high thickness according to claim 1 small-bore high frequency copper base is characterized in that also comprising step
The processing method of S5, employing FR4 plate is carried out the heavy silver in surface to the high frequency copper base and is handled.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101352858A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Back drilling method of PCB plate |
| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| CN102145397A (en) * | 2011-03-25 | 2011-08-10 | 奥士康精密电路（惠州）有限公司 | Drilling method for improving benefits |
| CN102387665A (en) * | 2010-09-06 | 2012-03-21 | 上海贺鸿电子有限公司 | Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet |
-
2012
- 2012-06-27 CN CN201210215928.2A patent/CN102711383B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101352858A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Back drilling method of PCB plate |
| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| CN102387665A (en) * | 2010-09-06 | 2012-03-21 | 上海贺鸿电子有限公司 | Aluminum cover sheet and micro-hole processing method of printed circuit board adopting aluminum cover sheet |
| CN102145397A (en) * | 2011-03-25 | 2011-08-10 | 奥士康精密电路（惠州）有限公司 | Drilling method for improving benefits |
Cited By (16)
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|---|---|---|---|---|
| CN103402314B (en) * | 2013-07-26 | 2016-03-02 | 东莞生益电子有限公司 | The manufacture method of pcb board and obtained pcb board |
| CN103402314A (en) * | 2013-07-26 | 2013-11-20 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) board and manufactured PCB board |
| CN104874826B (en) * | 2015-05-04 | 2017-12-26 | 深圳崇达多层线路板有限公司 | A kind of drilling preparation method of thick copper circuit board |
| CN104874826A (en) * | 2015-05-04 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Drilling method of thick copper circuit board |
| CN106332456A (en) * | 2016-08-31 | 2017-01-11 | 奥士康精密电路（惠州）有限公司 | Method for improving groove-making burrs before copper plating |
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| CN109379845A (en) * | 2018-11-02 | 2019-02-22 | 珠海杰赛科技有限公司 | A kind of multilayer circuit board processing technology containing PTFE |
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