CN103402314B - The manufacture method of pcb board and obtained pcb board - Google Patents
The manufacture method of pcb board and obtained pcb board Download PDFInfo
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- CN103402314B CN103402314B CN201310319560.9A CN201310319560A CN103402314B CN 103402314 B CN103402314 B CN 103402314B CN 201310319560 A CN201310319560 A CN 201310319560A CN 103402314 B CN103402314 B CN 103402314B
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- bonded copper
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Abstract
The invention provides a kind of manufacture method of pcb board and obtained pcb board.The manufacture method of this pcb board, comprising: 1) provide resin plate and pre-bonded copper base, and when pre-bonded copper base and resin plate are placed overlappingly, the spacing at the edge corresponding with resin plate, edge of pre-bonded copper base is at more than 12.5mm; 2) in resin plate, make at least one groove, the edge of pre-bonded copper base to the spacing at the corresponding edge of groove, makes at least two blind slots be connected with arbitrary groove, obtains step pad frame within 5mm; 3) pre-bonded copper base is put into above-mentioned step pad frame and copper foil layer is close to cascaded surface, make line pattern on the copper foil layer surface of pre-bonded copper base.In the manufacture method of pcb board of the present invention, horizontal line polish-brush and roller rumble contact with step pad frame or copper plate layer, and the frequency dielectric layer avoiding pre-bonded copper base contacts roller rumble or polish-brush and produces indenture, concave point with copper foil layer.
Description
Technical field
The present invention relates to printed circuit board technology, particularly a kind of without indenture, without the manufacture method of the pcb board of concave point and obtained pcb board.
Background technology
Copper base is mainly used on high power, firing frequency equipment key position power discharging device, in heat transfer, electric property, mechanical performance etc., there is excellent characteristic, the PCB of copper base generally adopts firing frequency board making, to meet the requirement of radio circuit Signal transmissions.
Pre-bonding (pre-bonded) copper base is formed (as shown in Figure 1) by the copper coin of certain thickness (generally between 0.5mm-4.0mm) and Dielectric Materials at Radio Frequencies, Copper Foil pressing.Make the individual layer circuit copper base PCB containing groove/opening/line pattern on its surface, this type copper base is communicated with high-frequency dielectric and copper coin by blind hole, ensures that copper base meets high power, firing frequency requirement.Pre-bonded copper base generally forms by without the PTFE material of glass (fiber glass reinforcement) and the pressing of 3.0mm thickness copper coin, frequency dielectric layer is the PTFE material without glass, PTFE material is softer, and do not have fiber glass reinforcement to support, when pre-bonded copper base adopts etch process to make line pattern at copper foil surface, due to horizontal line polish-brush and the effect of roller rumble, pre-bonded copper base PTFE dielectric layer and copper foil layer surface can produce a large amount of indentures, concave point.
Summary of the invention
In view of the above, the present invention is necessary to provide a kind of without indenture, manufacture method without the pcb board of concave point.
In addition, the present invention's pcb board of there is a need to provide a kind of said method obtained.
A manufacture method for pcb board, comprises the steps:
1) resin plate and pre-bonded copper base are provided, described pre-bonded copper base comprises copper plate layer, frequency dielectric layer and copper foil layer, described frequency dielectric layer is between described copper plate layer and described copper foil layer, the size of described resin plate meets following requirement: when described pre-bonded copper base and described resin plate are placed overlappingly, the spacing at the edge corresponding with described resin plate, edge of described pre-bonded copper base is at more than 12.5mm;
2) adopt mechanical milling technology in resin plate, make at least one groove, the spacing at the edge corresponding with described groove, edge of described pre-bonded copper base is within 5mm, and the entity of described pre-bonded copper base and described resin plate overlaps; Adopt the dark milling technology of control to make at least two blind slots be connected with arbitrary groove, the described blind slot be connected and groove form one or more step groove, and so, obtained step pad frame, in order to carry pre-bonded copper base;
3) pre-bonded copper base is put into a step groove of above-mentioned step pad frame, and the copper foil layer of described pre-bonded copper base is close to this cascaded surface, and the spacing of the edge of described pre-bonded copper base and the perisporium of described step groove is 1mm-5mm, etch process is adopted to make line pattern on the copper foil layer surface of pre-bonded copper base, when adopting etch process, horizontal line polish-brush and roller rumble contact with step pad frame, so, and obtained pcb board.
Wherein, the described step pad frame blind slot degree of depth is less than or equal to the thickness of pre-bonded copper base, and after ensureing that pre-bonded copper base puts into step pad frame, copper plate layer is concordant with step pad frame height or protrude step pad frame.
Wherein, the step 1 in the manufacture method of described pcb board) in, when described pre-bonded copper base and described resin plate are placed coaxially, the spacing at the edge corresponding with described resin plate, edge of described pre-bonded copper base is 12.5mm-25mm.
Wherein, described groove is " cross ", and described resin plate offers four blind slots, and four blind slots lay respectively at four nooks of " cross " groove.
Wherein, described groove is rectangle, the length of described groove is greater than the length of described pre-bonded copper base, and the difference of the length of the length of described groove and pre-bonded copper base is 2mm-10mm, the width of described groove is less than the width of described pre-bonded copper base, and the difference of the described width of pre-bonded copper base and the width of described groove is 5mm-15mm.
Wherein, described resin plate offers two blind slots be connected with two long limits of described groove respectively, and described groove is equal with two edge lengths that described blind slot coincides.
Wherein, the width of described blind slot is at least 5mm, and thickness is at least 0.3mm.
Wherein, above-mentioned 3) in step adopt etch process time, horizontal line polish-brush and roller rumble contact with step pad frame, avoid frequency dielectric layer contact roller rumble or the polish-brush of pre-bonded copper base, and then the frequency dielectric layer avoiding pre-bonded copper base produce indenture, concave point.
Wherein, described frequency dielectric layer can be polytetrafluoroethylene (PTFE), liquid crystal polymer, aluminium oxide ceramics or aluminium nitride ceramics.
Wherein, described resin plate is epoxy resin board, and thickness is 1.0mm-3.0mm.
Wherein, above-mentioned preparation method also comprises post-processing step: taken out from described step pad frame by described pre-bonded copper base.
In addition, the invention provides a kind of pcb board be made up of above-mentioned PCB plate production method.
Compared to prior art, in the manufacture method of pcb board of the present invention, horizontal line polish-brush and roller rumble contact with step pad frame or copper plate layer, and the frequency dielectric layer avoiding pre-bonded copper base contacts roller rumble or polish-brush with copper foil layer, and then avoid producing indenture, concave point.
Accompanying drawing explanation
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, accompanying drawing in description is only correspond to specific embodiments of the invention, to those skilled in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings when needing.
Fig. 1 is the schematic cross-section of the pre-bonded copper base in pcb board of the present invention;
Fig. 2 is the structural representation of the resin plate in the manufacture method of pcb board of the present invention;
Fig. 3 is that in Fig. 2, resin plate offers the structural representation after groove;
Fig. 4 is that in Fig. 3, resin plate offers the structural representation after blind slot;
Pre-bonded copper base is put into the schematic cross-section after after step pad frame in the manufacture method of pcb board of the present invention by Fig. 5.
Embodiment
In order to elaborate the technical scheme that the present invention takes for reaching predetermined technique object, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only section Example of the present invention, instead of whole embodiments, and, under the prerequisite not paying creative work, technological means in embodiments of the invention or technical characteristic can be replaced, below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
Refer to Fig. 1, pre-bonded copper base 2 shown in present pre-ferred embodiments, comprise copper plate layer 21, frequency dielectric layer 22 and copper foil layer 23, described frequency dielectric layer 22 is between described copper plate layer 21 and described copper foil layer 23, described copper plate layer 21 thickness is 0.5mm-4.0mm, and described frequency dielectric layer 22 is polytetrafluoroethylene, liquid crystal polymer, aluminium oxide ceramics or aluminium nitride ceramics.
Incorporated by reference to consulting Fig. 2 to Fig. 5, the manufacturing process of pcb board of the present invention is as follows:
1) resin plate 1 is provided, the thickness of described resin plate 1 is 1.0mm-3.0mm, the size of described resin plate 1 meets following requirement: when described pre-bonded copper base 2 is placed overlappingly with described resin plate 1, the edge of described pre-bonded copper base 2 to the spacing at the described corresponding edge of resin plate 1 at more than 12.5mm; Described resin plate 1 is epoxy resin board;
2) adopt mechanical milling technology to make groove 12 in resin plate 1, the edge of described pre-bonded copper base 2 and the spacing at the described corresponding edge of groove 12 are within 5mm, and described pre-bonded copper base 2 overlaps with the entity of described resin plate 1.Adopt the dark milling technology of control to make at least two blind slots 13 be connected with described groove 12, form step groove, the length of blind slot 13 and wide all at least 5mm, thickness is 0.3mm at least, and obtained step pad frame, in order to carry pre-bonded copper base 2; The thickness of described blind slot 13 is less than or equal to the thickness of pre-bonded copper base 2, and after ensureing that pre-bonded copper base 2 puts into step pad frame, copper plate layer 21 is concordant with step pad frame height or protrude step pad frame; In the present embodiment, described groove 12 is " cross ", the length of described groove 12 and width are greater than length and the width of described pre-bonded copper base 2, the difference of the length of groove 12 and the length of pre-bonded copper base 2 is 2mm-10mm, and the difference of the width of described groove 12 and the width of pre-bonded copper base 2 is 2mm-10mm; Described resin plate 1 offers four blind slots 13, is located at four nooks of groove 12, the step groove of formation one rectangle on the surface being engaged in described resin plate 1 with described groove 12.
3) pre-bonded copper base 2 is put into above-mentioned step pad frame, and the copper foil layer 23 of described pre-bonded copper base 2 is close to the bottom of four blind slots 13, namely, the copper foil layer 23 of described pre-bonded copper base 2 is close to the cascaded surface of this step groove, and the length of rectangle step groove and wide with corresponding pre-bonded copper base 2 length are 2mm-10mm with wide difference, etch process is adopted to make line pattern on copper foil layer 23 surface of pre-bonded copper base 2, so, obtained pcb board.
So, when adopting etch process to make line pattern on copper foil layer 23 surface of pre-bonded copper base 2, horizontal line polish-brush and roller rumble contact with step pad frame or copper plate layer 21, the frequency dielectric layer 22 avoiding pre-bonded copper base 2 contacts roller rumble or polish-brush with copper foil layer 23, and then avoids the frequency dielectric layer 22 of pre-bonded copper base 2 and copper foil layer 23 produces indenture, concave point.
Be appreciated that, in the manufacturing process of described pcb board 2) in step, make step pad frame and be not limited only to said structure, can also be, adopt mechanical milling technology in resin plate 1, make the groove 12 of rectangle, the length of described groove 12 is greater than the length of pre-bonded copper base 2, and the difference of the described length of groove 12 and the length of pre-bonded copper base 2 is 2mm-10mm.The width of described groove 12 is less than the wide of pre-bonded copper base 2, and the difference of the width of pre-bonded copper base 2 and the width of described groove 12 is at least 5mm, is preferably 5mm-15mm further.Described resin plate 1 offers two blind slots 13 be connected with two long limits of described groove 12 respectively, and described groove 12 is equal with two edge lengths that described blind slot 13 coincides.Two blind slots 13 form step groove, the thickness at least 0.3mm of described blind slot 13 with groove 12 in described resin plate 1.The width of described blind slot is at least 5mm, further preferred 5mm-15mm.So, obtained step pad frame.
Be appreciated that and an above-mentioned resin plate 1 can be provided with multiple step groove, surface etching can be carried out by holding multiple pieces pre-bonded copper base 2 simultaneously.
Be appreciated that, the shape described resin plate 1 offering the step groove of blind slot 13 side can be identical with the surface configuration of pre-bonded copper base 2 to be processed, the edge of described pre-bonded copper base 2 is 1mm-5mm to the spacing at the corresponding edge of described step groove, and described pre-bonded copper base 2 can be positioned on the cascaded surface of described step groove.
To sum up, in the manufacture method of pcb board of the present invention, horizontal line polish-brush and roller rumble contact with step pad frame or copper plate layer 21, and the frequency dielectric layer 22 avoiding pre-bonded copper base 2 contacts roller rumble or polish-brush with copper foil layer 23, and then avoid producing indenture, concave point.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, according to technical spirit of the present invention, within the spirit and principles in the present invention, to any simple amendment that above embodiment is done, equivalent replacement and improvement etc., within the protection range all still belonging to technical solution of the present invention.
Claims (10)
1. a manufacture method for pcb board, comprises the steps:
1) resin plate and pre-bonded copper base are provided, described pre-bonded copper base comprises copper plate layer, frequency dielectric layer and copper foil layer, described frequency dielectric layer is between described copper plate layer and described copper foil layer, the size of described resin plate meets following requirement: when described pre-bonded copper base and described resin plate are placed overlappingly, the spacing at the edge corresponding with described resin plate, edge of described pre-bonded copper base is at more than 12.5mm;
2) adopt mechanical milling technology in resin plate, make at least one groove, the spacing at the edge corresponding with described groove, edge of described pre-bonded copper base is within 5mm, and the entity of described pre-bonded copper base and described resin plate overlaps; Adopt the dark milling technology of control to make at least two blind slots be connected with arbitrary groove, the described blind slot be connected and groove form one or more step groove, and so, obtained step pad frame, in order to carry pre-bonded copper base;
3) pre-bonded copper base is put into a step groove of above-mentioned step pad frame, and the copper foil layer of described pre-bonded copper base is close to this cascaded surface, and the spacing of the edge of described pre-bonded copper base and the perisporium of described step groove is 1mm-5mm, etch process is adopted to make line pattern on the copper foil layer surface of pre-bonded copper base, when adopting etch process, horizontal line polish-brush and roller rumble contact with step pad frame, so, and obtained pcb board.
2. the manufacture method of pcb board according to claim 1, is characterized in that, the blind slot degree of depth of described step pad frame is less than or equal to the thickness of pre-bonded copper base.
3. the manufacture method of pcb board according to claim 1 and 2, it is characterized in that, step 1 in the manufacture method of described pcb board) in, when described pre-bonded copper base and described resin plate are placed coaxially, the edge of described pre-bonded copper base is 12.5mm-25mm with the spacing at the corresponding edge of described resin plate.
4. the manufacture method of pcb board according to claim 1 and 2, is characterized in that, described groove is " cross ", and described resin plate offers four blind slots, and four blind slots lay respectively at four nooks of " cross " groove.
5. the manufacture method of pcb board according to claim 1 and 2, it is characterized in that, described groove is rectangle, the length of described groove is greater than the length of described pre-bonded copper base, and the difference of the length of the length of described groove and pre-bonded copper base is 2mm-10mm, the width of described groove is less than the width of described pre-bonded copper base, and the difference of the described width of pre-bonded copper base and the width of described groove is 5mm-15mm.
6. the manufacture method of pcb board according to claim 5, is characterized in that, described resin plate offers two blind slots be connected with two long limits of described groove respectively, and described groove is equal with two edge lengths that described blind slot coincides.
7. the manufacture method of pcb board according to claim 6, is characterized in that, the width of described blind slot is at least 5mm, and thickness is at least 0.3mm.
8. the manufacture method of pcb board according to claim 1 and 2, is characterized in that, described frequency dielectric layer is polytetrafluoroethylene, liquid crystal polymer, aluminium oxide ceramics or aluminium nitride ceramics.
9. the manufacture method of pcb board according to claim 1 and 2, is characterized in that, described resin plate is epoxy resin board, and thickness is 1.0mm-3.0mm.
10. the pcb board made of the PCB plate production method according to any one of claim 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310319560.9A CN103402314B (en) | 2013-07-26 | 2013-07-26 | The manufacture method of pcb board and obtained pcb board |
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| CN201310319560.9A CN103402314B (en) | 2013-07-26 | 2013-07-26 | The manufacture method of pcb board and obtained pcb board |
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| CN103402314A CN103402314A (en) | 2013-11-20 |
| CN103402314B true CN103402314B (en) | 2016-03-02 |
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| CN114340231B (en) * | 2022-03-14 | 2022-05-13 | 四川英创力电子科技股份有限公司 | Manufacturing device and method for PCB with thick copper stepped copper guide pillar |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102711383A (en) * | 2012-06-27 | 2012-10-03 | 深圳市星河电路有限公司 | Processing method for high-thickness small-aperture high-frequency copper substrate |
| CN103124469A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Step printed circuit board and manufacture method of the step printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10163627A (en) * | 1996-12-04 | 1998-06-19 | Nippon Steel Chem Co Ltd | Method for forming via hole |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN103124469A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Step printed circuit board and manufacture method of the step printed circuit board |
| CN102711383A (en) * | 2012-06-27 | 2012-10-03 | 深圳市星河电路有限公司 | Processing method for high-thickness small-aperture high-frequency copper substrate |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523039, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee before: Dongguan Shengyi Electronics Ltd. |
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Denomination of invention: Method for manufacturing PCB (Printed Circuit Board) board and manufactured PCB board Effective date of registration: 20180103 Granted publication date: 20160302 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Shengyi electronic Limited by Share Ltd Registration number: 2017440000224 |
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Date of cancellation: 20200522 Granted publication date: 20160302 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: SHENGYI ELECTRONICS Co.,Ltd. Registration number: 2017440000224 |
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