CN204305460U - A kind of high stability impedance plate structure - Google Patents
A kind of high stability impedance plate structure Download PDFInfo
- Publication number
- CN204305460U CN204305460U CN201420793399.9U CN201420793399U CN204305460U CN 204305460 U CN204305460 U CN 204305460U CN 201420793399 U CN201420793399 U CN 201420793399U CN 204305460 U CN204305460 U CN 204305460U
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- impedance
- line
- layer
- live width
- network layer
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Abstract
The utility model discloses a kind of high stability impedance plate structure, comprise the impedance layer and network layer that are separately positioned on the insulation upper and lower surface of glue-line, it is characterized in that: described impedance layer and network layer form by Copper Foil etching, impedance layer comprises the some groups of impedance lines be parallel to each other, often organize impedance line to be made up of the impedance line that two be arranged in parallel, article two, the live width of impedance line: the ratio of line-spacing is (1:1) ~ (1:2), the live width of grid lines in network layer: the ratio of line-spacing is (3:4) ~ (1:2).The clathrum that the utility model is provided with by the impedance layer back side, the live width of adjustable impedance line thus the loss reduced in signal course of conveying, obtain the impedance plate of high-precision and high-stability.
Description
Technical field
The utility model relates to wiring board and manufactures field, particularly a kind of impedance plate structure of high stability.
Background technology
Current impedance plate on the market, although can control resistance value, if when reaching necessarily required resistance, there will be impedance line wider than little abnormal generation.Easily occur in such production that circuit disconnects phenomenon.In addition, FPC uses during bending and can affect service life and production process is difficult to management and control.Secondly, the impedance line reverse side of impedance plate is on the market the large copper sheet of design, and in processing procedure is produced, on copper sheet, some light contamination is bad all can embody incisively and vividly, and such product appearance has beaten very large discount.
Summary of the invention
In order to overcome the problem of above-mentioned prior art, the utility model provide a kind of can effective management and control impedance live width and improve the high stability impedance plate of product appearance.
The technical solution of the utility model is: a kind of high stability impedance plate structure, comprise the impedance layer and network layer that are separately positioned on the insulation upper and lower surface of glue-line, it is characterized in that: described impedance layer and network layer form by Copper Foil etching, impedance layer comprises the some groups of impedance lines be parallel to each other, often organize impedance line to be made up of the impedance line that two be arranged in parallel, article two, the live width of impedance line: the ratio of line-spacing is (1:1) ~ (1:2), the live width of grid lines in network layer: the ratio of line-spacing is (3:4) ~ (1:2).
Described insulation glue-line is polyimides glue-line.
Described network is located at the impedance layer back side, resistance requirements can be ensured while guarantee FPC bending property, under the state of same impedance line live width line-spacing, resistance value ratio can be made originally to rise 20% after adopting network, because of when requiring same resistance, live width can be raised 10% ~ 20%, make the frequency of delivery of signal more stable.
The beneficial effects of the utility model: the clathrum that the utility model is provided with by the impedance layer back side, the live width of adjustable impedance line thus the loss reduced in signal course of conveying, obtain the impedance plate of high-precision and high-stability, secondly, even if having after large copper sheet Change In Design becomes mesh shape light contamination due to a lot of local copper sheet etched, can not embody the bad anomaly in plate face, and product appearance seems to become clean clean, improves the outward appearance yield of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is front view of the present utility model.
In figure, 1-impedance layer, 2-insulate glue-line, 3-network layer, 4-impedance line, 5-grid lines, 6-earth connection.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is described further.
As shown in Figure 1 and Figure 2, a kind of high stability impedance plate structure, comprise the impedance layer 1 and network layer 3 that are separately positioned on the insulation upper and lower surface of glue-line 2, described impedance layer 1 and network layer 3 form by Copper Foil etching, impedance layer 1 comprises the some groups of impedance lines be parallel to each other, often organize impedance line to be made up of two impedance lines be arranged in parallel 4, article two, the live width of impedance line 4: the ratio of line-spacing is (1:1) ~ (1:2), the live width of grid lines 5 in network layer 3: the ratio of line-spacing is (3:4) ~ (1:2).
Described network 3 is located at impedance layer 1 back side, resistance requirements can be ensured while guarantee FPC bending property, under the same state often organizing impedance line live width line-spacing, resistance value ratio can be made after adopting this network originally to rise 20%, because of when requiring same resistance, live width can be raised 10% ~ 20%, thus the loss reduced in signal course of conveying makes the frequency of delivery of signal more stable, secondly, even if having after large copper sheet Change In Design becomes mesh shape light contamination due to a lot of local copper sheet etched, the bad anomaly in plate face can not be embodied, and product appearance seems to become clean clean, improve the outward appearance yield of product.
Described impedance layer 1 and network layer 3 outer surface are all coated with cover layer.
The described both sides often organizing impedance line 4 are provided with an earth connection 6.
The clathrum structure that the utility model is provided with by the impedance layer back side, is convenient to the live width management and control of producing, thus obtains the impedance plate of high-precision and high-stability.
The above; be only principle of the present utility model and preferred embodiment; but the invention is not limited to described embodiment; those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to the utility model spirit; everyly carry out any simple amendment and change according to essence of the present utility model, all belong within the protection domain required by the utility model.
Claims (2)
1. a high stability impedance plate structure, comprise the impedance layer and network layer that are separately positioned on the insulation upper and lower surface of glue-line, it is characterized in that: described impedance layer and network layer form by Copper Foil etching, impedance layer comprises the some groups of impedance lines be parallel to each other, often organize impedance line to be made up of the impedance line that two be arranged in parallel, article two, the live width of impedance line: the ratio of line-spacing is (1:1) ~ (1:2), the live width of grid lines in network layer: the ratio of line-spacing is (3:4) ~ (1:2).
2. high stability impedance plate structure according to claim 1, is characterized in that: described insulation glue-line is polyimides glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420793399.9U CN204305460U (en) | 2014-12-16 | 2014-12-16 | A kind of high stability impedance plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420793399.9U CN204305460U (en) | 2014-12-16 | 2014-12-16 | A kind of high stability impedance plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204305460U true CN204305460U (en) | 2015-04-29 |
Family
ID=53110961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420793399.9U Expired - Fee Related CN204305460U (en) | 2014-12-16 | 2014-12-16 | A kind of high stability impedance plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204305460U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472875A (en) * | 2015-12-29 | 2016-04-06 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
| CN113709961A (en) * | 2020-05-22 | 2021-11-26 | 北京小米移动软件有限公司 | Circuit board and terminal equipment |
-
2014
- 2014-12-16 CN CN201420793399.9U patent/CN204305460U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472875A (en) * | 2015-12-29 | 2016-04-06 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
| CN105472875B (en) * | 2015-12-29 | 2018-09-04 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
| CN113709961A (en) * | 2020-05-22 | 2021-11-26 | 北京小米移动软件有限公司 | Circuit board and terminal equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150429 Termination date: 20171216 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |