CN202262043U - Substrate of high-frequency microwave circuit board - Google Patents
Substrate of high-frequency microwave circuit board Download PDFInfo
- Publication number
- CN202262043U CN202262043U CN2011203605563U CN201120360556U CN202262043U CN 202262043 U CN202262043 U CN 202262043U CN 2011203605563 U CN2011203605563 U CN 2011203605563U CN 201120360556 U CN201120360556 U CN 201120360556U CN 202262043 U CN202262043 U CN 202262043U
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- CN
- China
- Prior art keywords
- copper foil
- foil layer
- frequency microwave
- dielectric layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a substrate of a high-frequency microwave circuit board, which comprises a dielectric layer (1); and the two surfaces of the dielectric layer are respectively laid with a copper foil layer I (2) and a copper foil layer II (3). The base material not only is capable of reducing the loss of medium and expanding the range of dielectric constant, but also is capable of increasing the surface resistance and the volume resistance and reducing the through hole metallization difficulty, so that the service performance of board can be enhanced.
Description
Technical field
The utility model provides a kind of high-frequency microwave board substrate.
Background technology
The dielectric constant range of the dielectric layer of copper foil clad plate of polytetrafluoroethylglass glass cloth is little at present; Sheet resistance, volume resistance value are little; Use is prone to grounding phenomenon, and hole empty metallization difficulty is big, greatly reduces the serviceability of sheet material; A kind of microfibre of external employing strengthens, but its price is high.
Summary of the invention
The utility model provides a kind of high-frequency microwave board substrate, and it not only can reduce the loss of medium, enlarges dielectric constant range, and can increase sheet resistance and volume resistance, and the hole metallization difficulty reduces, thereby strengthens the serviceability of sheet material.
The utility model has adopted following technical scheme: a kind of high-frequency microwave board substrate, it comprises dielectric layer, is covered with copper foil layer I and copper foil layer II respectively on dielectric layer two surfaces.
Described dielectric layer is the mica synthetic glass cloth that is coated with polytetrafluoroethylene.Described copper foil layer I is at least one deck.Described copper foil layer II is at least one deck.The mass ratio 2:8 of described copper foil layer I and copper foil layer II and dielectric layer.
The utlity model has following beneficial effect: the utility model adopts dielectric layer, copper foil layer I and copper foil layer II; Dielectric layer is the mica synthetic glass cloth that is coated with the polytetrafluoroethylene dipping; Described copper foil layer I and copper foil layer II be one deck at least; Copper foil layer I and copper foil layer II and dielectric layer enlarge dielectric constant range than the such loss that not only can reduce medium of 2:8, and dielectric constant range is: 2.2,2.7,3.0,3.5,4.0; And increase sheet resistance, volume resistance, hole metallization difficulty and reduce, strengthen the serviceability of sheet material.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Embodiment
In Fig. 1, the utility model provides a kind of high-frequency microwave board substrate, and it comprises dielectric layer 1; Be covered with copper foil layer I 2 and copper foil layer II 3 respectively on dielectric layer two surfaces, dielectric layer 1 is for being coated with the mica synthetic glass cloth of polytetrafluoroethylene, and copper foil layer I 2 is at least one deck; Present embodiment is set to one deck; Copper foil layer II 3 is at least one deck, and present embodiment is set to one deck, copper foil layer I 2 and the mass ratio 2:8 of copper foil layer II 3 with dielectric layer.
Claims (5)
1. a high-frequency microwave board substrate is characterized in that it comprises dielectric layer (1), is covered with copper foil layer I (2) and copper foil layer II (3) respectively on dielectric layer two surfaces.
2. high-frequency microwave board substrate according to claim 1 is characterized in that described dielectric layer (1) is for being coated with the mica synthetic glass cloth of polytetrafluoroethylene.
3. high-frequency microwave board substrate according to claim 1 is characterized in that described copper foil layer I (2) is at least one deck.
4. high-frequency microwave board substrate according to claim 1 is characterized in that described copper foil layer II (3) is at least one deck.
5. high-frequency microwave board substrate according to claim 1 is characterized in that the mass ratio 2:8 of described copper foil layer I (2) and copper foil layer II (3) and dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203605563U CN202262043U (en) | 2011-09-25 | 2011-09-25 | Substrate of high-frequency microwave circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203605563U CN202262043U (en) | 2011-09-25 | 2011-09-25 | Substrate of high-frequency microwave circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202262043U true CN202262043U (en) | 2012-05-30 |
Family
ID=46123216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203605563U Expired - Fee Related CN202262043U (en) | 2011-09-25 | 2011-09-25 | Substrate of high-frequency microwave circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202262043U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368889A (en) * | 2011-09-25 | 2012-03-07 | 顾根山 | High frequency microwave circuit board base material |
-
2011
- 2011-09-25 CN CN2011203605563U patent/CN202262043U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368889A (en) * | 2011-09-25 | 2012-03-07 | 顾根山 | High frequency microwave circuit board base material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Wangling Insulating Material Plant, Taizhou Assignor: Gu Genshan Contract record no.: 2012320000792 Denomination of utility model: Manufacturing method of high frequency microwave circuit board base material Granted publication date: 20120530 License type: Exclusive License Record date: 20120615 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20130925 |