CN204578881U - Heat radiation type flexible circuit board - Google Patents
Heat radiation type flexible circuit board Download PDFInfo
- Publication number
- CN204578881U CN204578881U CN201520145176.6U CN201520145176U CN204578881U CN 204578881 U CN204578881 U CN 204578881U CN 201520145176 U CN201520145176 U CN 201520145176U CN 204578881 U CN204578881 U CN 204578881U
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- China
- Prior art keywords
- plate body
- hole
- circuit layer
- substrate
- silica gel
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Abstract
The utility model relates to heat radiation type flexible circuit board, this heat radiation type flexible circuit board offers the first through hole and the second through hole, and it comprises the first plate body and the second plate body; Described first plate body comprises first substrate; The end face of described first substrate is provided with the first circuit layer, and its bottom surface is provided with second circuit layer; Described first through hole runs through the first plate body and the second plate body; First plate body and the second plate body all offer the second through hole, and this second through hole runs through leading flank and the trailing flank of the first plate body and the second plate body respectively; Be filled with heat conductive silica gel in first through hole, heat conductive silica gel is connected with the second through hole; Described second plate body comprises second substrate, and the end face of second substrate is provided with tertiary circuit layer, and this tertiary circuit layer is fixedly connected with by conductive adhesive with second circuit layer.Heat conductive silica gel by heat conduction to the second through hole on circuit layer, and can be distributed to the external world by the second through hole, has good heat dispersion.
Description
Technical field
The utility model relates to heat radiation type flexible circuit board.
Background technology
Along with electronic product is gradually toward high performance, high frequency, high speed and lightening future development, under such design concept, various electronic correlation part is if CPU, wafer set etc. are all towards high-speed, multi-functional, high power, direction research and development that volume is little.Therefore, cause the heat of the circuit layer of circuit board to improve, especially double-layer circuit board, the continuous accumulation of heat causes damage to the electronic device on circuit layer, must design a kind of flexible circuit board of perfect heat-dissipating.
Utility model content
The purpose of this utility model is to propose a kind of heat radiation type flexible circuit board, and it can solve the problem of poor heat radiation.
In order to achieve the above object, the technical scheme that adopts of the utility model is as follows:
Heat radiation type flexible circuit board, this heat radiation type flexible circuit board offers the first through hole and the second through hole; It comprises the first plate body and the second plate body, and described first plate body comprises first substrate; The end face of described first substrate is provided with the first circuit layer, its bottom surface is provided with second circuit layer, described first through hole runs through the first plate body and the second plate body, first plate body and the second plate body all offer the second through hole, this second through hole runs through leading flank and the trailing flank of the first plate body and the second plate body respectively, be filled with heat conductive silica gel in first through hole, heat conductive silica gel is connected with the second through hole;
Described second plate body comprises second substrate, and the end face of second substrate is provided with tertiary circuit layer,
This tertiary circuit layer is fixedly connected with by conductive adhesive with second circuit layer.
Preferably, described heat conductive silica gel extends to outside the first through hole, and the two ends of this heat conductive silica gel respectively and be positioned at the part surface of the first circuit layer and tertiary circuit layer.
The utility model has following beneficial effect:
Heat conductive silica gel by heat conduction to the second through hole on circuit layer, and can be distributed to the external world by the second through hole, has good heat dispersion.Additionally by the first through hole, contraposition is carried out to the first plate body and the second plate body, improve the precision of the first plate body and the alignment of the second plate body.
Accompanying drawing explanation
Fig. 1 is the structural representation of the heat radiation type flexible circuit board of the utility model preferred embodiment.
Reference numeral: 10, the first through hole; 20, the second through hole; 1, the first plate body; 11, first substrate; 12, the first circuit layer; 13, second circuit layer; 2, the second plate body; 21, second substrate; 22, tertiary circuit layer; 3, heat conductive silica gel; 4, conductive adhesive.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the utility model is described further.As shown in Figure 1, a kind of heat radiation type flexible circuit board, this heat radiation type flexible circuit board offers the first through hole 10 and the second through hole 20.This heat radiation type flexible circuit board comprises the first plate body 1 and the second plate body 2.Described first plate body 1 comprises first substrate 11.The end face of described first substrate 11 is provided with the first circuit layer 12, and its bottom surface is provided with second circuit layer 13.Described first through hole 10 runs through the first plate body 1 and the second plate body 2.First plate body 1 and the second plate body 2 all offer the second through hole 20.This second through hole 20 runs through leading flank and the trailing flank of the first plate body 1 and the second plate body 2 respectively.Heat conductive silica gel 3 is filled with in first through hole 10.Heat conductive silica gel 3 is connected with the second through hole 20.This heat conductive silica gel 3 is filled in the first through hole 10, and is communicated with the second through hole 20, is directed in the second through hole 20 by the heat on each circuit layer by this heat conductive silica gel 3, and realizes radiating effect by the second through hole 20 derivation.
Described second plate body 2 comprises second substrate 21, and the end face of second substrate 21 is provided with tertiary circuit layer 22, and this tertiary circuit layer 22 is fixedly connected with by conductive adhesive 4 with second circuit layer 13.Second substrate 21 is run through by the first through hole 10.This second substrate 21 offers described second through hole 20, and the second through hole 20 runs through the both sides, front and back of second substrate 21.
Described heat conductive silica gel 3 extends to outside the first through hole 10, and the two ends of this heat conductive silica gel 3 respectively and be positioned at the part surface of the first circuit layer 12 and tertiary circuit layer 22.Because heat conductive silica gel 3 is simultaneously through the first circuit layer 12 described in the utility model, second circuit layer 13 and tertiary circuit layer 22, therefore the heat of all circuit layers can all can effectively be taken away by it, improves radiating effect further.
For a person skilled in the art, according to technical scheme described above and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the utility model claim.
Claims (2)
1. heat radiation type flexible circuit board, is characterized in that, this heat radiation type flexible circuit board offers the first through hole and the second through hole, and it comprises the first plate body and the second plate body; Described first plate body comprises first substrate; The end face of described first substrate is provided with the first circuit layer, and its bottom surface is provided with second circuit layer; Described first through hole runs through the first plate body and the second plate body; First plate body and the second plate body all offer the second through hole, and this second through hole runs through leading flank and the trailing flank of the first plate body and the second plate body respectively; Be filled with heat conductive silica gel in first through hole, heat conductive silica gel is connected with the second through hole;
Described second plate body comprises second substrate, and the end face of second substrate is provided with tertiary circuit layer, and this tertiary circuit layer is fixedly connected with by conductive adhesive with second circuit layer.
2. heat radiation type flexible circuit board as claimed in claim 1, it is characterized in that, described heat conductive silica gel extends to outside the first through hole, and the two ends of this heat conductive silica gel respectively and be positioned at the part surface of the first circuit layer and tertiary circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520145176.6U CN204578881U (en) | 2015-03-13 | 2015-03-13 | Heat radiation type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520145176.6U CN204578881U (en) | 2015-03-13 | 2015-03-13 | Heat radiation type flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204578881U true CN204578881U (en) | 2015-08-19 |
Family
ID=53871464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520145176.6U Active CN204578881U (en) | 2015-03-13 | 2015-03-13 | Heat radiation type flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204578881U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455299A (en) * | 2016-10-31 | 2017-02-22 | 张昊辰 | Heat dissipation type double-layer PCB |
| CN108541198A (en) * | 2018-06-25 | 2018-09-14 | 扬州市玄裕电子有限公司 | A kind of intelligent heat dissipation multilayer circuit board |
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
-
2015
- 2015-03-13 CN CN201520145176.6U patent/CN204578881U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455299A (en) * | 2016-10-31 | 2017-02-22 | 张昊辰 | Heat dissipation type double-layer PCB |
| CN108541198A (en) * | 2018-06-25 | 2018-09-14 | 扬州市玄裕电子有限公司 | A kind of intelligent heat dissipation multilayer circuit board |
| CN108541198B (en) * | 2018-06-25 | 2023-12-12 | 江苏卓宝智造科技有限公司 | Intelligent heat dissipation multilayer circuit board |
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" |
Address after: 510663 north of the first floor, No.9, Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangdong Province Patentee after: Guangzhou Yuankang Precision Electronics Co.,Ltd. Address before: 510000 north of the first floor of the first floor, No.9 Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU JP-WH PRECISION CIRCUIT Co.,Ltd. |
|
| CP03 | "change of name, title or address" |