CN112312680A - Method for processing metallized half hole of circuit board - Google Patents
Method for processing metallized half hole of circuit board Download PDFInfo
- Publication number
- CN112312680A CN112312680A CN202011187612.8A CN202011187612A CN112312680A CN 112312680 A CN112312680 A CN 112312680A CN 202011187612 A CN202011187612 A CN 202011187612A CN 112312680 A CN112312680 A CN 112312680A
- Authority
- CN
- China
- Prior art keywords
- milling
- metallized
- circuit board
- slot
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The application provides a processing method of a metallized half hole of a circuit board. The processing method of the circuit board metallized semi-hole comprises the following steps: drilling the circuit board to process a slot on the circuit board; sequentially carrying out copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot of the circuit board to obtain a metalized slot; carrying out pattern electroplating operation on the circuit board subjected to full-board electroplating to obtain an outer-layer circuit of the circuit board; injecting the colloid solution into the metallized slot and heating and curing to fill the colloid in the metallized slot; milling the metallized slot holes by adopting a double-V-shaped directional milling mode; and cleaning the colloid in the metallized slotted hole to obtain a metallized semi-slotted hole. The processing method of the metallized semi-hole of the circuit board can effectively avoid the phenomena of burr, copper sheet falling and copper sheet inward turning during milling.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for processing a metallized half hole of a circuit board.
Background
The half-metallized holes are designed to only leave half of the metallized holes on the outline of the circuit board, and the other half of the metallized holes are milled away during molding processing. The design of the semi-metallized hole is mainly used for power supply boards and personal consumer products, and the design is also available on the back board, but is not common. During welding, the side surface of some semi-metallized holes is used as a matching surface for pressure welding connection, and is mostly used as a daughter board of a mother board, and the semi-metallized holes of the daughter board are welded with the pin of the mother board or a component to enhance the welding performance. If copper wires and burrs remain in the semi-metallized units, the problems of infirm soldering legs, insufficient soldering, even bridge short circuit and the like can be caused. However, it is a difficult problem in circuit board formation to obtain semi-metallized holes with neat and smooth sections and well-preserved PTH plating.
At present, except for the mode of externally cutting a punching die for a product with lower requirements, a main shaft of a numerical control milling machine always rotates clockwise under the general condition, a cutting force is generated on the side surface of a circuit board in the milling process, and a milling cutter mills redundant plates under the action of the cutting force. When the semi-metallized hole is machined, the forming machining quality of the semi-metallized unit can be influenced by the binding force between the copper plating layer and the base material layer, the cutting performance of a milling cutter, the design characteristics of the semi-metallized unit graph, the milling mode and other factors, so that burrs and copper wires can be generated inevitably in the process of milling the metallized hole at one time without adding any auxiliary process, and the defect that the existing milling machining is difficult to overcome is overcome.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a method for processing a metallized half hole of a circuit board, which can avoid burrs, copper sheet falling and copper sheet inward turning during milling.
The purpose of the invention is realized by the following technical scheme:
a processing method of a metallized half hole of a circuit board comprises the following steps:
drilling a circuit board to machine a slot on the circuit board;
sequentially carrying out copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot of the circuit board to obtain a metalized slot;
carrying out pattern electroplating operation on the circuit board subjected to full-board electroplating to obtain an outer layer circuit of the circuit board;
injecting a colloid solution into the metallized slotted hole, and performing heating and curing operation to fill the colloid into the metallized slotted hole;
milling the metallized slotted hole by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises a first V-shaped milling and a second V-shaped milling, the feed direction of the first V-shaped milling is opposite to that of the second V-shaped milling, the milling cutter of the first V-shaped milling forms a first preset included angle with the diameter of two end points passing through the opening of the metallized slotted hole, and the milling cutter of the second V-shaped milling forms a second preset included angle with the diameter of two end points passing through the opening of the metallized slotted hole;
and cleaning the colloid in the metallized slotted hole to obtain the metallized semi-slotted hole.
In one embodiment, the colloidal solution is a silicone gel solution.
In one embodiment, the temperature for heat curing of the silicone gel solution is 175 ℃ to 185 ℃.
In one embodiment, the first predetermined included angle is 30 degrees to 55 degrees.
In one embodiment, the second predetermined included angle is 30 degrees to 55 degrees.
In one embodiment, the lower tool position of the first V-shaped milling is a connection point of the open end of the first metalized slot along the feeding direction of the first V-shaped milling and the diameter of the end point passing through the open end of the first metalized slot.
In one embodiment, the lower cutting location of the second V-shaped milling is a connection point of a second metalized slotted hole opening end along the feeding direction of the second V-shaped milling and a diameter passing through an end point of the second metalized slotted hole opening end.
In one embodiment, the feed speed of the first V-shaped milling is 0.4-0.7 m/min.
In one embodiment, the feed speed of the second V-shaped milling is 0.4-0.7 m/min.
In one embodiment, the milling cutter diameters of the first V-shaped milling and the second V-shaped milling are smaller than the aperture diameter of the metallized slotted hole.
Compared with the prior art, the invention has at least the following advantages:
1. the processing method of the metallized semi-hole of the circuit board adopts a double-V-shaped direction-dividing milling mode to mill the metallized slot hole, the double-V-shaped direction-dividing milling mode comprises first V-shaped milling and second V-shaped milling, the feed direction of the first V-shaped milling is opposite to the feed direction of the second V-shaped milling, and the two ends of the opening of the metallized slot hole and the connection points of the metallized slot hole ring are respectively milled off through the two times of V-shaped milling, so that the problems of copper skin inward turning, burrs and copper skin falling caused by one-time milling are solved. And because the milling cutter and the diameter of the two end points penetrating through the openings of the metallized slotted holes form a preset included angle, the metalized slotted holes with larger hole diameters can be milled, and the metalized slotted holes with smaller hole diameters can also be milled by adjusting the size of the included angle.
2. In the processing method of the metallized semi-hole of the circuit board, the colloid solution is injected into the metallized groove hole, and then the colloid solution is heated and cured to fill the colloid into the metallized groove hole. Because the colloid of filling in the metallization slotted hole has certain hardness after the solidification, can make on the one hand and mill the in-process and not have burr or copper skin and impress in the metallization slotted hole, on the other hand for special printing ink, the colloid clears up more easily, and can not cause the influence to the soldermask in the clearance process.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of a method for processing metallized holes of a circuit board according to an embodiment;
fig. 2 is a schematic view of a feeding manner of a first V-shaped milling in the processing method of the metallized half hole of the circuit board shown in fig. 1, wherein an arrow direction is a feeding direction;
fig. 3 is a schematic view of a feeding manner of a second V-shaped milling in the method for processing a metallized half hole of the circuit board shown in fig. 1, wherein an arrow direction is a feeding direction;
fig. 4 is a flowchart of a method for cleaning the colloid in the metallized slot of the method for processing the metallized half-hole of the circuit board shown in fig. 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application provides a processing method of a metallized half hole of a circuit board. The processing method of the circuit board metallized semi-hole comprises the following steps: drilling a circuit board to machine a slot on the circuit board; sequentially carrying out copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot of the circuit board to obtain a metalized slot; carrying out pattern electroplating operation on the circuit board subjected to full-board electroplating to obtain an outer layer circuit of the circuit board; injecting a colloid solution into the metallized slotted hole, and performing heating and curing operation to fill the colloid into the metallized slotted hole; milling the metallized slotted hole by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises a first V-shaped milling and a second V-shaped milling, the feed direction of the first V-shaped milling is opposite to that of the second V-shaped milling, the milling cutter of the first V-shaped milling forms a first preset included angle with the diameter of two end points passing through the opening of the metallized slotted hole, and the milling cutter of the second V-shaped milling forms a second preset included angle with the diameter of two end points passing through the opening of the metallized slotted hole; and cleaning the colloid in the metallized slotted hole to obtain the metallized semi-slotted hole.
The processing method of the metallized semi-hole of the circuit board adopts a double-V-shaped directional milling mode to mill the metallized slot hole, the double-V-shaped directional milling mode comprises first V-shaped milling and second V-shaped milling, the feed direction of the first V-shaped milling is opposite to the feed direction of the second V-shaped milling, and the two ends of the opening of the metallized slot hole and the connection point of the metallized slot hole ring are respectively milled off through the two times of V-shaped milling, so that the problems of copper skin inward turning, burr and copper skin falling caused by one-time milling are avoided. And because the milling cutter and the diameter of the two end points penetrating through the openings of the metallized slotted holes form a preset included angle, the metalized slotted holes with larger hole diameters can be milled, and the metalized slotted holes with smaller hole diameters can also be milled by adjusting the size of the included angle. Further, the colloid solution is injected into the metalized slot, and then the colloid solution is heated and cured, so that the colloid is filled in the metalized slot. Because the colloid of filling in the metallization slotted hole has certain hardness after the solidification, can make on the one hand and mill the in-process and not have burr or copper skin and impress in the metallization slotted hole, on the other hand for special printing ink, the colloid clears up more easily, and can not cause the influence to the soldermask in the clearance process.
In order to better understand the method for processing the metallized half hole of the circuit board, the method for processing the metallized half hole of the circuit board is further explained below, and the method for processing the metallized half hole of the circuit board of one embodiment comprises the following steps:
s100, drilling the circuit board to process a slot on the circuit board.
In this embodiment, the slot holes are drilled in the circuit board to facilitate subsequent copper deposition and plating operations, thereby creating a via in the circuit board to allow subsequent processing steps to complete electrical performance of the circuit board on, below, or between intermediate circuit layers, ensuring accurate and stable mounting of the circuit board components.
S200, sequentially carrying out copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot of the circuit board to obtain a metalized slot.
In this embodiment, the circuit board after drilling is treated with an activating agent to make the surface of the insulating substrate absorb an active layer of particles, in this embodiment, metallic palladium particles are used, copper ions are first reduced on the active metallic palladium particles, and the reduced metallic copper crystal nuclei themselves become catalytic layers of copper ions, so that the reduction reaction of copper is continued on the surfaces of the new copper crystal nuclei. The purpose is to metallize the resin and glass bundles of the non-conductor portions of the cell walls. The copper deposition operation is followed by a full-plate electroplating operation to complete a metalized hole wall with sufficient conductivity and welding, i.e. to metalize the slot in the circuit board to obtain a metalized slot.
And S300, carrying out pattern electroplating operation on the circuit board subjected to the full-board electroplating to obtain an outer-layer circuit of the circuit board.
It can be understood that after the full-board electroplating, the board needs to be subjected to a pattern electroplating operation after the dry film exposure development, and the pattern electroplating aims to increase the thickness of copper in the circuit and the hole, mainly the thickness of the copper in the hole, so as to ensure the conductivity and other physical properties of the circuit board.
S400, injecting the colloid solution into the metalized slotted hole, and performing heating and curing operation to fill the colloid in the metalized slotted hole.
In this embodiment, a colloidal solution is injected into a metallization slot in a circuit board by a colloidal solution gun to completely fill the metallization slot with the colloidal solution, and then the colloidal solution filled in the metallization slot is subjected to a curing process, and the colloidal solution is heated by a heating gun to be cured and maintained in a semi-gel state. Because the colloid of filling in the metallization slotted hole has certain hardness after the solidification, can make on the one hand and mill the in-process and not have burr or copper skin and impress in the metallization slotted hole, on the other hand for special printing ink, the colloid clears up more easily, and can not cause the influence to the soldermask in the clearance process.
S500, milling the metalized slotted hole by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises first V-shaped milling and second V-shaped milling, the feed direction of the first V-shaped milling is opposite to that of the second V-shaped milling, the milling cutter of the first V-shaped milling forms a first preset included angle with the diameter of two end points penetrating through the opening of the metalized slotted hole, and the milling cutter of the second V-shaped milling forms a second preset included angle with the diameter of two end points penetrating through the opening of the metalized slotted hole.
It can be understood that the rotation direction of the crankshaft of the numerical control milling machine is clockwise, and the milling cutter used is a right-handed milling cutter. In this embodiment, a double V-type directional milling mode is adopted to perform milling operation on the metalized slot, the double V-type directional milling mode includes a first V-type milling and a second V-type milling, a feeding direction of the first V-type milling is opposite to a feeding direction of the second V-type milling, a milling cutter of the first V-type milling forms a first predetermined included angle with a diameter passing through two end points of an opening of the metalized slot, and a milling cutter of the second V-type milling forms a second predetermined included angle with a diameter passing through two end points of the opening of the metalized slot. During the first V-shaped milling, the feeding manner is as shown in fig. 2, the milling cutter uses one side of the metal slot as a starting point, that is, a point a shown in fig. 2, to mill the board along the V-shaped path, the feeding path of the milling cutter first mills from one end of the V-shaped path to the tip of the V-shaped path, that is, in the direction of point d shown in fig. 2, and then mills from the tip of the V-shaped path to the other end of the V-shaped path, during the milling process, the milling cutter bypasses the opening end of the metallized slot along the first V-shaped milling direction and the first intersection point on the circuit board shape, that is, the point B shown in fig. 2, and then mills the opening end of the metallized slot along the first V-shaped milling direction and the second intersection point on the circuit board shape, that is, the point a shown in fig. 2. Because the rotation direction of the milling cutter is clockwise and is consistent with the feed direction of the milling cutter, the open end of the metallized slot along the first V-shaped milling feed direction and a second intersection point on the appearance of the circuit board are caused to bear a first milling force towards the feed direction of the milling cutter at a point A as shown in figure 2, and the action direction of the first milling force is far away from the inside of the metallized slot, so that the problems of inward turning, burr and copper sheet falling of the copper sheet at one end of the opening of the metallized slot, namely the end of the point A are avoided. During the second V-shaped milling, the feeding direction of the second V-shaped milling is opposite to the feeding direction of the first V-shaped milling, the milling cutter uses the other side of the metal slot as a starting point, that is, a point b shown in fig. 3, and mills the board along a V-shaped route, the feeding route of the milling cutter firstly mills the board from one end of the V-shaped route to the tip of the V-shaped route, that is, from the f point direction shown in fig. 3, and then mills the board from the tip of the V-shaped route to the other end of the V-shaped route, during the milling process, the milling cutter bypasses the opening end of the metallized slot along the second V-shaped milling feeding direction and the first intersection point on the circuit board shape, that is, a point D shown in fig. 3, and then mills the opening end of the metallized slot along the first V-shaped milling feeding direction and the second intersection point on the circuit board shape, that is, the point C shown in fig. 4. Because the rotation direction of the milling cutter is clockwise and is consistent with the feed direction of the milling cutter, the open end of the metallized slot along the second V-shaped milling feed direction and a second intersection point on the appearance of the circuit board are caused to bear a second milling force towards the feed direction of the milling cutter at the point C as shown in figure 3, and the action direction of the second milling force is far away from the inside of the metallized slot, thus avoiding the problems of inward turning, burr and copper sheet falling of the copper sheet at the other end of the opening of the metallized slot, namely the point C end.
Furthermore, the milling cutter of the first V-shaped milling forms a first preset included angle with the diameter of two end points penetrating through the opening of the metallized slotted hole, so that the milling effect of the milling cutter of the first V-shaped milling on one end of the opening of the metallized slotted hole, namely the end of the point A is more thorough, and the problems of burrs, copper sheet falling and copper sheet inward turning are reduced. The milling cutter for the second V-shaped milling forms a second preset included angle with the diameter of the two end points penetrating through the opening of the metallized slotted hole, so that the milling effect of the milling cutter for the second V-shaped milling on one end of the opening of the metallized slotted hole, namely the end of the point C is more thorough, and the problems of burrs, copper sheet falling and copper sheet inward turning are reduced. In addition, the cutter moving direction of the first V-shaped milling can be adjusted by adjusting the size of the first preset included angle, and the size of the first preset included angle is adjusted according to the size of the metalized slotted hole, so that the milling effect of the first V-shaped milling is more thorough, and further burrs are prevented from being generated. It can be understood that as the diameter of the metallized slot becomes smaller, i.e., the distance between the two ends of the V-shape becomes smaller, the angle formed by the milling cutter and the diameter of the two ends passing through the opening of the metallized slot becomes larger. Similarly, the cutter moving direction of the first V-shaped milling can be adjusted by adjusting the size of the first preset included angle, and the size of the first preset included angle is adjusted according to the size of the metalized slotted hole, so that the milling effect of the first V-shaped milling is more thorough, and further burrs are prevented from being generated.
S600, cleaning the colloid in the metallized slotted hole to obtain a metallized semi-slotted hole.
It will be appreciated that the gel is easier to clean than a special ink and does not affect the soldermask during cleaning. The traditional special ink is required to be transferred to a developing section together with a circuit board for washing, so that not only is the washing operation complex, but also unnecessary damage is easily caused to the circuit board when the developing section is used for washing, such as corrosion of liquid medicine in developing on the circuit board. In this embodiment, the colloid in the metalized slot that has finished the milling operation is cleaned, most of the colloid can directly fall off from the metalized slot after being cured, and the residual colloid in the metalized slot can be removed only by brushing lightly, so that the colloid is easier to clean compared with special ink.
Further, the cleaning operation of the colloid in the metallized slotted hole comprises the following steps:
s612, pushing the colloid from one opening end to the other opening end of the metalized slotted hole to separate the colloid from the metalized slotted hole. It will be appreciated that the solidified glue is already fixed and formed and has a certain hardness, and the glue can be separated from the metallized slot by pushing the glue from one open end to the other open end of the metallized slot.
And S614, wetting the inner surface of the metalized groove hole. It can be understood that the adhesive force between the colloid remaining on the inner surface of the metalized slot and the metalized slot is weaker by wetting the inner surface of the metalized slot, so that the residual colloid is convenient to clean.
And S616, performing brushing operation on the inner surface of the metalized slot. The brush matched with the metalized slotted hole brushes the inner surface of the metalized slotted hole, so that the residual colloid can be completely separated from the inner surface of the metalized slotted hole.
S618, washing and wiping the metallized slot. In this embodiment, the separated colloid is removed from the metalized slot by washing and wiping the metalized slot.
In one embodiment, the colloidal solution is a silicone gel solution. In this embodiment, the colloidal solution is a silicone gel solution, and the silicone gel solution can be cured into a semi-gel colloid under the heating condition, so that the colloid can be conveniently taken out and kept in the semi-gel semi-solid state, and the colloid has certain hardness, so that no burr or copper sheet is pressed into the semi-hole in the molding and milling process of the metallized semi-hole. In addition, the colloid in the semi-gel state after curing is more convenient to take out from the metallized slot, and is easier to clean after the metallized semi-hole is formed.
In order to facilitate the removal of the colloid and improve the hardness of the colloid, burrs or copper sheets are prevented from being pressed into the metallized half holes during milling, in one embodiment, the temperature for heating and curing the silicone gel solution is 175-185 ℃, and it can be understood that the high-transparency silicone gel is a low-viscosity adhesive gel-like transparent bi-component addition type silicone pouring sealant, can be cured at room temperature and can also be cured by heating, and has the characteristic that the curing is faster when the temperature is higher. Experiments show that when the heating temperature is 175-185 ℃, the silicone gel solution can be rapidly cured, the hardness of the cured colloid is moderate, burrs or copper sheets are effectively prevented from being pressed into the metalized half holes during milling, and the colloid is conveniently taken out of the metalized half holes after milling.
In order to ensure that the plate is milled more thoroughly and prevent burrs from being generated after milling, in one embodiment, the first predetermined included angle is 30-55 degrees. It can be understood that, because the milling cutter and the diameter passing through the two end points of the opening of the metallized slotted hole form a preset included angle, the milling cutter not only can mill the metallized slotted hole with larger diameter, but also can mill the metallized slotted hole with smaller diameter by adjusting the size of the included angle. The cutter moving direction of the first V-shaped milling can be adjusted by adjusting the size of the first preset included angle, and the size of the first preset included angle is adjusted according to the size of the metalized slotted hole, so that the milling effect of the first V-shaped milling is more thorough, and further burrs are prevented from being generated. In this embodiment, the first predetermined angle is 30-55 degrees, that is, the first V-milling cutter forms an angle of 30-55 degrees with the diameter of the two ends passing through the opening of the metallized slot. It can be understood that if the first predetermined included angle is too small, excessive milling is easily caused on the edge of the metallized slotted hole, and the forming of the metallized half hole is damaged; if the first preset included angle is too large, the milling cutter is easy to cause incomplete milling on the connecting point of the opening end of the metallized slot hole and the slot hole ring, and burrs are easy to generate. Through experimental detection, when the first preset included angle is 30-55 degrees, the metalized slotted holes with different apertures can be milled more accurately and more thoroughly, and burrs are effectively prevented from being generated.
In one embodiment, the second predetermined included angle is 30 to 55 degrees. It can be understood that, because the milling cutter and the diameter passing through the two end points of the opening of the metallized slotted hole form a preset included angle, the milling cutter not only can mill the metallized slotted hole with larger diameter, but also can mill the metallized slotted hole with smaller diameter by adjusting the size of the included angle. The cutter moving direction of the second V-shaped milling can be adjusted by adjusting the size of the second preset included angle, and the size of the second preset included angle is adjusted according to the size of the metalized slotted hole, so that the milling effect of the second V-shaped milling is more thorough, and further burrs are prevented from being generated. In this embodiment, the second predetermined angle is 30-55 degrees, that is, the second V-milling cutter forms an angle of 30-55 degrees with the diameter of the two ends of the opening passing through the metallized slot. It can be understood that if the second predetermined included angle is too small, excessive milling is easily caused on the edge of the metallized slotted hole, and the forming of the metallized half hole is damaged; if the second predetermined included angle is too large, the milling cutter is prone to cause incomplete milling on the connecting point of the opening end of the metallized slot hole and the slot ring, and burrs are prone to being generated. Through experimental detection, when the second preset included angle is 30-55 degrees, the metalized slotted holes with different apertures can be milled more accurately and more thoroughly, and burrs are effectively prevented from being generated.
In order to ensure the accuracy of the first V-shaped milling, keep the circuit board frame stable and improve the milling efficiency, in one embodiment, the lower tool position of the first V-shaped milling is a connection point of the open end of the first metallized slot and the slot ring along the feeding direction of the first V-shaped milling. It can be understood that the lower cutter position is one of the important factors for ensuring the milling accuracy, and a good lower cutter position is selected, so that the milling accuracy can be effectively improved, the circuit board frame is kept stable, and the milling efficiency is improved. If the lower cutter position is not well selected, the frame of the circuit board is easy to deform and even the circuit board is scrapped when the lower cutter is used for milling. In this embodiment, the lower tool position of the first V-shaped milling is the connection point between the first metalized slot opening end and the slot ring along the first V-shaped milling feeding direction, and since the milling path of the first V-shaped milling is the V-shaped path, so as to connect the first metalized slot opening end and the slot ring along the first V-shaped milling feeding direction, it can be ensured that the milling tool accurately moves according to the V-shaped path, thereby ensuring the accuracy of the first V-shaped milling, stabilizing the circuit board frame, and improving the milling efficiency.
In one embodiment, the lower tool position of the second V-shaped milling is a connection point of the open end of the first metalized slotted hole and the slotted hole ring along the feeding direction of the second V-shaped milling. It can be understood that the lower cutter position is one of the important factors for ensuring the milling accuracy, and a good lower cutter position is selected, so that the milling accuracy can be effectively improved, the circuit board frame is kept stable, and the milling efficiency is improved. If the lower cutter position is not well selected, the frame of the circuit board is easy to deform and even the circuit board is scrapped when the lower cutter is used for milling. In this embodiment, the lower tool position of the second V-shaped milling is the connection point between the open end of the first metalized slot and the slot ring along the second V-shaped milling feeding direction, and since the milling path of the second V-shaped milling is a V-shaped path, so as to connect the open end of the first metalized slot and the slot ring along the second V-shaped milling feeding direction, it can be ensured that the milling tool moves accurately along the V-shaped path, thereby ensuring the accuracy of the first V-shaped milling, stabilizing the circuit board frame, and improving the milling efficiency.
In order to ensure the accuracy and stability of the first V-shaped milling and prevent the generation of burrs, in one embodiment, the row speed of the milling cutter of the first V-shaped milling is 0.4-0.7 m/min. It will be appreciated that the milling cutter speed of the first V-mill directly affects the efficiency of the first V-mill. However, if the row speed of the milling cutter for the first V-shaped milling is too fast, the milling cutter is easily subjected to continuous high temperature, so that the stability of the milling cutter is affected, and burrs are easily generated in the first V-shaped milling process; if the milling cutter for the first V-shaped milling is too slow in running speed, the circuit board material is easily softened or even melted or burnt due to frictional heat, so that a chip groove of the milling cutter is blocked, the milling cannot be carried out, the milling efficiency of the rough milling operation can be directly influenced, and meanwhile, because the copper sheet in the circuit board has certain flexibility, if the milling cutter is too slow in running speed, the copper sheet cannot be completely milled and cut off, and even the copper sheet is easily turned inwards. In the embodiment, the row speed of the milling cutter of the first V-shaped milling is 0.4-0.7 m/min, and through experimental detection, when the row speed of the milling cutter of the first V-shaped milling is 0.4-0.7 m/min, the accuracy and stability of the first V-shaped milling can be effectively ensured, and burrs are prevented from being generated.
In one embodiment, the row speed of the milling cutter of the second V-shaped milling is 0.4m/min to 0.7 m/min. It will be appreciated that the milling cutter speed of the second V-mill directly affects the efficiency of the second V-mill. However, if the row speed of the milling cutter subjected to the second V-shaped milling is too fast, the milling cutter is easily subjected to continuous high temperature, so that the stability of the milling cutter is affected, and burrs are easily generated in the second V-shaped milling process; if the milling cutter for the second V-shaped milling is too slow in running speed, the circuit board material is easily softened or even melted or burnt due to frictional heat, so that a chip groove of the milling cutter is blocked, the milling cannot be performed, the milling efficiency of the rough milling operation can be directly influenced, and meanwhile, because the copper sheet in the circuit board has certain flexibility, if the milling cutter is too slow in running speed, the copper sheet cannot be completely milled and cut off, and even the copper sheet is easily turned inwards. In the embodiment, the row speed of the milling cutter for the second V-shaped milling is 0.4-0.7 m/min, and through experimental detection, when the row speed of the milling cutter for the second V-shaped milling is 0.4-0.7 m/min, the accuracy and stability of the second V-shaped milling can be effectively ensured, burrs are prevented from being generated, and thus the complete burr-free metallized half hole is obtained.
In order to improve the accuracy of the first V-shaped milling and the second V-shaped milling and avoid the mutual influence of the first V-shaped milling and the second V-shaped milling in the milling process, in one embodiment, the milling cutter diameters of the first V-shaped milling and the second V-shaped milling are both smaller than the aperture of the metallized slot.
In one embodiment, the colloidal solution is injected and heated and cured by a glue discharging device, and the glue discharging device comprises a glue discharging control assembly, a glue solution containing member, a piston member and a glue discharging assembly. The glue outlet control assembly comprises a mounting seat, a control piece and a fixing piece, wherein the control piece is connected to the mounting seat, and the fixing piece is fixedly connected to the mounting seat; the glue solution containing piece is fixedly connected with the fixing piece, and a containing cavity is formed in the glue solution containing piece. The piston piece is slidably connected with the mounting seat, and part of the piston piece is positioned in the accommodating cavity and is slidably connected with the glue solution accommodating piece; the glue outlet assembly comprises a glue solution gun, a heating gun and a connecting plate, the connecting plate is respectively connected with the glue solution gun and the heating gun, the connecting plate is further connected with a glue solution accommodating piece, the glue solution gun is communicated with the accommodating cavity, and the heating gun is used for heating a colloidal solution to form a semi-gel-state glue column.
In this embodiment, the glue discharging control assembly in the glue discharging device comprises a mounting seat, a control member and a fixing member, wherein the piston member is slidably connected in the mounting seat, the control member is connected to the mounting seat, and the fixing member is fixedly connected to the mounting seat. The mounting is connected in the mount pad, can play the supporting role to the mount pad, makes piston spare and control piece in the motion process, can not lead to the fact pressure to the glue solution holding piece of connecting in play gluey control assembly below, and then influences the control of a volume of gluing. The glue solution accommodating piece is internally provided with an accommodating cavity, the piston piece is connected with the mounting seat in a sliding manner, and the piston piece is partially positioned in the accommodating cavity and is connected with the glue solution accommodating piece in a sliding manner, so that the glue solution in the accommodating cavity can be pushed to flow out through the piston piece.
Further, go out gluey subassembly and include glue solution rifle, heating rifle and connecting plate, the connecting plate is connected with glue solution rifle and heating rifle respectively, the connecting plate still is connected with glue solution holding piece, and the glue solution rifle communicates in the holding chamber, and the heating rifle is used for heating colloidal solution to form half gel state's glue post. The control piece controls the piston piece to move, colloidal solution in the accommodating cavity can be pushed, and the colloidal solution is injected into the metalized slotted hole through the colloidal solution gun. The glue liquid rifle passes through the connecting plate and is connected with the heating rifle, that is to say, after accomplishing the colloidal solution and pouring into, can carry out the thermal curing through the heating rifle of the connecting plate other end to the colloidal solution in the metallization slotted hole immediately and handle, make the colloidal solution become to have the half gel state of firm shape, and then conveniently take out the colloid from the metallization hole and clear up.
Example 1
And drilling the circuit board, and then sequentially performing copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot in the circuit board to obtain a metalized slot. And carrying out pattern electroplating operation on the circuit board after the metallization of the slot hole is finished to obtain an outer layer circuit of the circuit board. Injecting the silicon gel solution into the metallized groove hole in the circuit board through a glue solution gun to enable the silicon gel solution to completely fill the metallized groove hole, then carrying out curing treatment operation on the silicon gel solution filled in the metallized groove hole, and carrying out heating treatment on the silicon gel solution through a heating gun, wherein the heating temperature is 175 ℃, so that the silicon gel solution is cured and kept in a semi-gel state. The method comprises the following steps of carrying out milling operation on a metallized slot by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises primary V-shaped milling and secondary V-shaped milling, the feed direction of the primary V-shaped milling is opposite to that of the secondary V-shaped milling, the milling cutter of the primary V-shaped milling forms an included angle of 30 degrees with the diameter of two end points penetrating through the opening of the metallized slot, and the lower cutter position is a connection point of the opening end of the first metallized slot and a slot ring along the feed direction of the primary V-shaped milling. The milling cutter of the second V-shaped milling forms an included angle of 30 degrees with the diameter of two end points penetrating through the opening of the metallized slotted hole, and the lower cutter position of the second V-shaped milling is a connecting point of the opening end of the first metallized slotted hole and the slotted hole ring along the feed direction of the second V-shaped milling. And the row speed of the milling cutter of the first V-shaped milling is 0.4m/min, and the row speed of the milling cutter of the second V-shaped milling is 0.4 m/min. And cleaning the colloid in the metalized slotted hole after the milling operation is finished to obtain a metalized semi-slotted hole.
Example 2
And drilling the circuit board, and then sequentially performing copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot in the circuit board to obtain a metalized slot. And carrying out pattern electroplating operation on the circuit board after the metallization of the slot hole is finished to obtain an outer layer circuit of the circuit board. Injecting the silicon gel solution into the metalized slot in the circuit board through a glue gun to completely fill the metalized slot with the silicon gel solution, then carrying out curing treatment on the silicon gel solution filled in the metalized slot, and carrying out heating treatment on the silicon gel solution through a heating gun at the heating temperature of 185 ℃ to cure the silicon gel solution and keep the silicon gel solution in a semi-gel state. The method comprises the following steps of carrying out milling operation on a metallized slot by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises primary V-shaped milling and secondary V-shaped milling, the feed direction of the primary V-shaped milling is opposite to that of the secondary V-shaped milling, an included angle of 55 degrees is formed between a milling cutter of the primary V-shaped milling and the diameter of two end points penetrating through the opening of the metallized slot, and the lower cutter position is a connection point of the opening end of the first metallized slot and a slot ring along the feed direction of the primary V-shaped milling. The milling cutter of the second V-shaped milling forms an included angle of 55 degrees with the diameter of two end points penetrating through the opening of the metallized slotted hole, and the lower cutter position of the second V-shaped milling is a connecting point of the opening end of the first metallized slotted hole and the slotted hole ring along the feed direction of the second V-shaped milling. And the row speed of the milling cutter of the first V-shaped milling is 0.7m/min, and the row speed of the milling cutter of the second V-shaped milling is 0.7 m/min. And cleaning the colloid in the metalized slotted hole after the milling operation is finished to obtain a metalized semi-slotted hole.
Example 3
And drilling the circuit board, and then sequentially performing copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot in the circuit board to obtain a metalized slot. And carrying out pattern electroplating operation on the circuit board after the metallization of the slot hole is finished to obtain an outer layer circuit of the circuit board. Injecting the silicon gel solution into the metallized slot hole in the circuit board through a glue solution gun to enable the silicon gel solution to completely fill the metallized slot hole, then carrying out curing treatment operation on the silicon gel solution filled in the metallized slot hole, and carrying out heating treatment on the silicon gel solution through a heating gun, wherein the heating temperature is 180 ℃, so that the silicon gel solution is cured and kept in a semi-gel state. The method comprises the following steps of carrying out milling operation on a metallized slot by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises primary V-shaped milling and secondary V-shaped milling, the feed direction of the primary V-shaped milling is opposite to that of the secondary V-shaped milling, the milling cutter of the primary V-shaped milling forms an included angle of 40 degrees with the diameter of two end points penetrating through the opening of the metallized slot, and the lower cutter position is a connection point of the opening end of the first metallized slot and a slot ring along the feed direction of the primary V-shaped milling. The milling cutter of the second V-shaped milling forms an included angle of 40 degrees with the diameter of two end points penetrating through the opening of the metallized slotted hole, and the lower cutter position of the second V-shaped milling is a connecting point of the opening end of the first metallized slotted hole and the slotted hole ring along the feed direction of the second V-shaped milling. And the row speed of the milling cutter of the first V-shaped milling is 0.55m/min, and the row speed of the milling cutter of the second V-shaped milling is 0.55 m/min. And cleaning the colloid in the metalized slotted hole after the milling operation is finished to obtain a metalized semi-slotted hole.
Example 4
And drilling the circuit board, and then sequentially performing copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot in the circuit board to obtain a metalized slot. And carrying out pattern electroplating operation on the circuit board after the metallization of the slot hole is finished to obtain an outer layer circuit of the circuit board. Injecting the silicon gel solution into the metallized slot hole in the circuit board through a glue solution gun to enable the silicon gel solution to completely fill the metallized slot hole, then carrying out curing treatment operation on the silicon gel solution filled in the metallized slot hole, and carrying out heating treatment on the silicon gel solution through a heating gun, wherein the heating temperature is 182 ℃, so that the silicon gel solution is cured and kept in a semi-gel state. The method comprises the following steps of carrying out milling operation on a metallized slot by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises primary V-shaped milling and secondary V-shaped milling, the feed direction of the primary V-shaped milling is opposite to that of the secondary V-shaped milling, the milling cutter of the primary V-shaped milling forms a 43-degree included angle with the diameter of two end points penetrating through the opening of the metallized slot, and the lower cutter position is a connecting point of the opening end of the first metallized slot and a slot ring along the feed direction of the primary V-shaped milling. The milling cutter of the second V-shaped milling forms an included angle of 45 degrees with the diameter of two end points penetrating through the opening of the metallized slotted hole, and the lower cutter position of the second V-shaped milling is a connecting point of the opening end of the first metallized slotted hole and the slotted hole ring along the feed direction of the second V-shaped milling. And the row speed of the milling cutter of the first V-shaped milling is 0.6m/min, and the row speed of the milling cutter of the second V-shaped milling is 0.57 m/min. And cleaning the colloid in the metalized slotted hole after the milling operation is finished to obtain a metalized semi-slotted hole.
Compared with the prior art, the invention has at least the following advantages:
1. the processing method of the metallized semi-hole of the circuit board adopts a double-V-shaped direction-dividing milling mode to mill the metallized slot hole, the double-V-shaped direction-dividing milling mode comprises first V-shaped milling and second V-shaped milling, the feed direction of the first V-shaped milling is opposite to the feed direction of the second V-shaped milling, and the two ends of the opening of the metallized slot hole and the connection points of the metallized slot hole ring are respectively milled off through the two times of V-shaped milling, so that the problems of copper skin inward turning, burrs and copper skin falling caused by one-time milling are solved. And because the milling cutter and the diameter of the two end points penetrating through the openings of the metallized slotted holes form a preset included angle, the metalized slotted holes with larger hole diameters can be milled, and the metalized slotted holes with smaller hole diameters can also be milled by adjusting the size of the included angle.
2. In the processing method of the metallized semi-hole of the circuit board, the colloid solution is injected into the metallized groove hole, and then the colloid solution is heated and cured to fill the colloid into the metallized groove hole. Because the colloid of filling in the metallization slotted hole has certain hardness after the solidification, can make on the one hand and mill the in-process and not have burr or copper skin and impress in the metallization slotted hole, on the other hand for special printing ink, the colloid clears up more easily, and can not cause the influence to the soldermask in the clearance process.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A processing method of a metallized half hole of a circuit board is characterized by comprising the following steps:
drilling a circuit board to machine a slot on the circuit board;
sequentially carrying out copper deposition operation and full-board electroplating operation on the circuit board to metalize the slot of the circuit board to obtain a metalized slot;
carrying out pattern electroplating operation on the circuit board subjected to full-board electroplating to obtain an outer layer circuit of the circuit board;
injecting a colloid solution into the metallized slotted hole, and performing heating and curing operation to fill the colloid into the metallized slotted hole;
milling the metallized slotted hole by adopting a double-V-shaped directional milling mode, wherein the double-V-shaped directional milling mode comprises a first V-shaped milling and a second V-shaped milling, the feed direction of the first V-shaped milling is opposite to that of the second V-shaped milling, the milling cutter of the first V-shaped milling forms a first preset included angle with the diameter of two end points passing through the opening of the metallized slotted hole, and the milling cutter of the second V-shaped milling forms a second preset included angle with the diameter of two end points passing through the opening of the metallized slotted hole;
and cleaning the colloid in the metallized slotted hole to obtain the metallized semi-slotted hole.
2. The method of claim 1, wherein the colloidal solution is a silicone gel solution.
3. The method of claim 2, wherein the silicone gel solution is cured by heating at a temperature of 175-185 ℃.
4. The method of claim 1, wherein the first predetermined angle is between 30 degrees and 55 degrees.
5. The method of claim 1, wherein the second predetermined angle is between 30 degrees and 55 degrees.
6. The method of claim 1, wherein the lower cutting location of the first V-shaped milling is a connection point of the opening end of the first metalized slot along the feeding direction of the first V-shaped milling and a diameter passing through an end point of the opening end of the first metalized slot.
7. The method of claim 1, wherein the lower cutting location of the second V-shaped milling is a connection point of an open end of the second metalized slot along the feeding direction of the second V-shaped milling and a diameter passing through an end point of the open end of the second metalized slot.
8. The method for processing the metallized half hole of the circuit board as claimed in claim 1, wherein the feed speed of the first V-shaped milling is 0.4-0.7 m/min.
9. The method for processing the metallized half hole of the circuit board as claimed in claim 1, wherein the feed speed of the second V-shaped milling is 0.4-0.7 m/min.
10. The method of claim 1, wherein the milling cutter diameters of the first and second V-mills are smaller than the diameter of the metallized slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011187612.8A CN112312680B (en) | 2020-10-29 | 2020-10-29 | Method for processing metallized half hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011187612.8A CN112312680B (en) | 2020-10-29 | 2020-10-29 | Method for processing metallized half hole of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112312680A true CN112312680A (en) | 2021-02-02 |
| CN112312680B CN112312680B (en) | 2022-02-22 |
Family
ID=74332478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011187612.8A Active CN112312680B (en) | 2020-10-29 | 2020-10-29 | Method for processing metallized half hole of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112312680B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112996258A (en) * | 2021-02-21 | 2021-06-18 | 四川英创力电子科技股份有限公司 | One-step forming processing method of half-hole plate and printed circuit board |
| CN114641152A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Method for half-hole fabrication |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283104A (en) * | 1991-03-20 | 1994-02-01 | International Business Machines Corporation | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| US20070089292A1 (en) * | 2005-10-25 | 2007-04-26 | Tourne Joseph A | Circuit board having a backdrilled multi-signal via |
| CN103391684A (en) * | 2013-08-05 | 2013-11-13 | 深圳华祥荣正电子有限公司 | Manufacturing method of half-hole PCB (printed circuit board) |
| CN104507194A (en) * | 2014-12-10 | 2015-04-08 | 上海洞舟实业有限公司 | Fabrication method of third-dimensional (3D) electroluminescent device |
| CN204578881U (en) * | 2015-03-13 | 2015-08-19 | 广州金鹏源康精密电路股份有限公司 | Heat radiation type flexible circuit board |
| CN105057973A (en) * | 2015-08-03 | 2015-11-18 | 山东大学 | Method for carrying out surface coating of PMMA to avoid burrs in superfine cutting machining process |
| CN105934097A (en) * | 2016-05-23 | 2016-09-07 | 广州杰赛科技股份有限公司 | Method for processing semi-hole plate |
| CN107454218A (en) * | 2017-08-25 | 2017-12-08 | 南通通州湾新材料科技有限公司 | High-fracture toughness glass mobile phone backboard and preparation method thereof |
| CN107770973A (en) * | 2017-10-17 | 2018-03-06 | 珠海杰赛科技有限公司 | The processing method of printed circuit board |
| CN108696997A (en) * | 2018-07-13 | 2018-10-23 | 四川普瑞森电子有限公司 | A kind of half bore method of manufacturing circuit board |
| CN108882559A (en) * | 2018-07-06 | 2018-11-23 | 江苏本川智能电路科技股份有限公司 | A kind of manufacture craft of metallized semi-pore |
| CN110446348A (en) * | 2019-07-26 | 2019-11-12 | 重庆伟鼎电子科技有限公司 | A kind of half hole forming production technology of metal |
| CN111556668A (en) * | 2020-05-12 | 2020-08-18 | 深圳市丰达兴线路板制造有限公司 | Forming method of PCB edge metal half-hole |
-
2020
- 2020-10-29 CN CN202011187612.8A patent/CN112312680B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283104A (en) * | 1991-03-20 | 1994-02-01 | International Business Machines Corporation | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| US20070089292A1 (en) * | 2005-10-25 | 2007-04-26 | Tourne Joseph A | Circuit board having a backdrilled multi-signal via |
| CN103391684A (en) * | 2013-08-05 | 2013-11-13 | 深圳华祥荣正电子有限公司 | Manufacturing method of half-hole PCB (printed circuit board) |
| CN104507194A (en) * | 2014-12-10 | 2015-04-08 | 上海洞舟实业有限公司 | Fabrication method of third-dimensional (3D) electroluminescent device |
| CN204578881U (en) * | 2015-03-13 | 2015-08-19 | 广州金鹏源康精密电路股份有限公司 | Heat radiation type flexible circuit board |
| CN105057973A (en) * | 2015-08-03 | 2015-11-18 | 山东大学 | Method for carrying out surface coating of PMMA to avoid burrs in superfine cutting machining process |
| CN105934097A (en) * | 2016-05-23 | 2016-09-07 | 广州杰赛科技股份有限公司 | Method for processing semi-hole plate |
| CN107454218A (en) * | 2017-08-25 | 2017-12-08 | 南通通州湾新材料科技有限公司 | High-fracture toughness glass mobile phone backboard and preparation method thereof |
| CN107770973A (en) * | 2017-10-17 | 2018-03-06 | 珠海杰赛科技有限公司 | The processing method of printed circuit board |
| CN108882559A (en) * | 2018-07-06 | 2018-11-23 | 江苏本川智能电路科技股份有限公司 | A kind of manufacture craft of metallized semi-pore |
| CN108696997A (en) * | 2018-07-13 | 2018-10-23 | 四川普瑞森电子有限公司 | A kind of half bore method of manufacturing circuit board |
| CN110446348A (en) * | 2019-07-26 | 2019-11-12 | 重庆伟鼎电子科技有限公司 | A kind of half hole forming production technology of metal |
| CN111556668A (en) * | 2020-05-12 | 2020-08-18 | 深圳市丰达兴线路板制造有限公司 | Forming method of PCB edge metal half-hole |
Non-Patent Citations (1)
| Title |
|---|
| 韩明等: "金属化半孔制作工艺研究", 《印制电路信息》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112996258A (en) * | 2021-02-21 | 2021-06-18 | 四川英创力电子科技股份有限公司 | One-step forming processing method of half-hole plate and printed circuit board |
| CN112996258B (en) * | 2021-02-21 | 2021-09-21 | 四川英创力电子科技股份有限公司 | One-step forming processing method of half-hole plate and printed circuit board |
| CN114641152A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Method for half-hole fabrication |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112312680B (en) | 2022-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112312680B (en) | Method for processing metallized half hole of circuit board | |
| CN106863770B (en) | The production method of structural circuit unitary member based on fusion sediment forming technique | |
| JP2017224835A (en) | Appearance simultaneous removal of surface material for electronic device | |
| JPH07506218A (en) | High-density conductor network, its manufacturing method and manufacturing equipment | |
| CN101624715A (en) | Process flow for selective thick-gold electroplating without gold plated lead | |
| CN104105353B (en) | A kind of manufacture method of high-precision ceramic circuit board | |
| CN109121301A (en) | Wiring board and its selective resin jack designs method | |
| Li et al. | Multi-objective optimization of laser cutting for flash memory modules with special shapes using grey relational analysis | |
| CN102143656A (en) | Manufacturing method of circuit board made of high-dielectric composite material | |
| CN104244588B (en) | The preparation method and modified laser sintered powder material of stereo circuit | |
| CN103447646A (en) | Method for realizing welding between soft base chip circuit board and metal base body without special tool | |
| KR101448256B1 (en) | Methods for manufacturing a antenna | |
| CN112543550A (en) | Multilayer circuit board, board body and processing method thereof | |
| CN106211595A (en) | A kind of printed circuit board processing method | |
| Heininger et al. | Manufacturing of molded interconnect devices from prototyping to mass production with laser direct structuring | |
| CN109746580A (en) | A kind of accurate cutting method of rubber diaphragm | |
| CN115460773A (en) | Method, software and equipment for manufacturing circuit board by laser manufacturing opening transfer material | |
| JPH1112747A (en) | Production of shaped parts and device therefor | |
| JP4061873B2 (en) | Molded circuit board cutting method and molded circuit board cutting apparatus | |
| JP2007196315A (en) | Method of manufacturing die-sinking electric discharge machining electrode | |
| CN100368141C (en) | Manufacturing method of male die | |
| US3187606A (en) | Fabricating tool and technique | |
| WO2021049624A1 (en) | Molded circuit component and electronic device | |
| RU2604721C1 (en) | Manufacturing method of textured printed-circuit board | |
| KR100632597B1 (en) | Method for manufacturing board on chip ball grid array board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Applicant after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: Baihua town Taiyang Ao jinpaishan, Huidong County, Huizhou City, Guangdong Province Applicant before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |