CN106211595A - A kind of printed circuit board processing method - Google Patents
A kind of printed circuit board processing method Download PDFInfo
- Publication number
- CN106211595A CN106211595A CN201610789757.2A CN201610789757A CN106211595A CN 106211595 A CN106211595 A CN 106211595A CN 201610789757 A CN201610789757 A CN 201610789757A CN 106211595 A CN106211595 A CN 106211595A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- half bore
- processing method
- drill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a kind of printed circuit board processing method, including step: (1) machine drilling: get out required half bore or whole hole on a printed circuit board；Then and partly cover the position drill flute again in whole hole near bored half bore or whole hole, form groove and add half bore；Carry out again repairing burr；(2) heavy copper plating；(3) Etching is carried out: (4) use electrophoretic techniques that the printed circuit board after Etching is carried out surface-coated；(5) heat cure molding；(6) laser is used to remove excess surface coat；(7) thinning processes.The printed circuit board processing method of the present invention, the burr produced during energy clearing up and processing, improves the uniformity of printed circuit board surface-coated, reduces whole processing cost, and efficiency is high.
Description
Technical field
The present invention relates to circuit board technology field, especially relate to a kind of printed circuit board processing method.
Background technology
Printed circuit board refers on insulating substrate, forms interconnection circuit and printing unit from point to points according to predetermined design
Part, is the supplier of electronic devices and components electrical connection.Circuit board is the most common, little to mobile phone, USB flash disk, photograph
Machine, arrives greatly the high-end product such as space flight and aviation, high ferro motor-car.Along with electronics categories and the increase increasingly of quantity, electricity to be improved
The competitiveness of sub-product, the quality of circuit board of keeping under strict control is particularly important link.
In the existing printed circuit board course of processing, numerically controlled drill drill flute and boring during, the groove edge of institute's drill flute and
The peritreme holed can produce burr, can strengthen, affect outward appearance after burr is electroplated；And too many burr can cause electroplating not
Good, affect electrical property, and existing employing manual repair's burr efficiency is too low, cost of labor is higher.It addition, current coating processes
The main method using silk-screen or electrostatic spraying green oil and dirty oil carries out the coating of surface insulation layer, sprays during spraying
The ink thickness being coated with is uneven, is easily generated that ink is thin or defect piled up by ink, is easily generated stolen goods during ink coating processing
Thing, the requirement to environment is high, need to control temperature, humidity and cleannes, and this further results in the cost of whole coating processes.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, it is provided that a kind of printed circuit board processing method, can clear up and add
The burr produced during work, improves the uniformity of printed circuit board surface-coated, reduces whole processing cost, and efficiency
High.
To achieve these goals, the present invention adopts the following technical scheme that
A kind of printed circuit board processing method, comprises the following steps:
(1) machine drilling: get out required half bore or whole hole on a printed circuit board；Then in bored half bore or whole
The vicinity in hole part cover the position drill flute again in whole hole, form groove and add half bore；Getting out half bore or the original position in whole hole again
Place uses the drill bit again Drilling operation identical with this bore dia to carry out repairing burr；
(2) heavy copper plating, makes it metallize to carrying out heavy copper plating on the printed circuit board of be drilled with groove and half bore, is formed
Metallization groove adds half bore；
(3) printed circuit board through electric plating of whole board is carried out Etching:
(4) use electrophoretic techniques that the printed circuit board after Etching is carried out surface-coated；
(5) heat cure molding；
(6) laser is used to remove excess surface coat: first every with the printed circuit board identification module identification of laser drill
The dimension information of one piece of printed circuit board, and described dimension information is sent to the control module of laser drill；Then laser drilling
Described dimension information is compared by the control module of machine with the standard printed circuit board dimension information in integrated circuit memory module
Right, and according to comparison result, standard printed wiring board is zoomed in or out, make the size of described standard printed wiring board
Consistent with the dimension information of described printed wiring board, and by the side circuit of this standard printed wiring board zoomed in or out
Layout is stored in circuit processing module；The side circuit layout that last laser module stores according to described circuit processing module
It is processed, excess surface coat is ablated off；
(7) printed circuit board is carried out thinning process: mechanical lapping or chemical etching.
When step (1) re-works with drill bit, described drill bit from top to bottom or from the bottom up vertically into institute's drill flute,
The situ in hole.
In step (4), the electrophoretic coating using electrophoretic techniques to carry out surface-coated use is that thermosetting polymer electrophoresis is coated with
Material.
Step (4) concretely comprises the following steps: first remove oxide and the oils and fats on printed circuit board surface, then by printed circuit board
It is placed in saline solution and carries out electrophoresis coating；Again the printed circuit board completing electrophoresis coating is toasted, to solidify electrophoresis plating
Layer；Finally wash the electrophoresis residual liquid on printed circuit board.
Compared with the prior art, beneficial effects of the present invention is as follows:
The printed circuit board processing method of the present invention, the burr produced during energy clearing up and processing, improves printed circuit board
The uniformity of surface-coated, reduces whole processing cost, and efficiency is high；By in got out half bore or the situ in whole hole
Use the drill bit again Drilling operation identical with this bore dia, it is thus possible to bore disconnected by the burr being involved in boring procedure in hole or squeeze
To the position tangent with holes；And use drill bit to be cut off by the burr of tangency location at holes tangency location；So just may be used
Quickly burr is pared off, it is to avoid too much produce the situation of poor plating due to burr, and adopt this method repairing hair
Thorn, efficiency is high, and cost of labor is low, solves groove, problem that burr that Kong Tai little produces cannot be repaired；By using electrophoretic techniques
Printed circuit board surface is coated, on printed circuit board surface, coats a layer insulating by the method for electrophoresis, due to
Electrophoretic coating is that coating ion moves under the effect of electrode, so that whole coating coating layer thickness during coating is equal
Even, and electrophoresis process equipment is simple, relative to prior art uses expensive special silk-screen or electrostatic coating equipment, this
The electrophoretic techniques of bright employing is coated, and reduces cost, avoids the printed circuit board quality that manual operation brings simultaneously and asks
Topic.Meanwhile, use thermosetting electrophoresis material, direct heat cure molding after coating, and the present invention is not by exposure technology, directly makes
With high-precision laser, unnecessary solder mask is removed, improve the machining accuracy that solder mask removes, abandoned the UV of costliness
Light exposure sources, process simplification, with low cost, overcome traditional handicraft mediella and there is bigger precision with object to be exposed
The defect of error.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1:
A kind of printed circuit board processing method, comprises the following steps:
(1) machine drilling: get out required half bore or whole hole on a printed circuit board；Then in bored half bore or whole
The vicinity in hole part cover the position drill flute again in whole hole, form groove and add half bore；Getting out half bore or the original position in whole hole again
Place uses the drill bit again Drilling operation identical with this bore dia to carry out repairing burr；
(2) heavy copper plating, makes it metallize to carrying out heavy copper plating on the printed circuit board of be drilled with groove and half bore, is formed
Metallization groove adds half bore；
(3) printed circuit board through electric plating of whole board is carried out Etching:
(4) use electrophoretic techniques that the printed circuit board after Etching is carried out surface-coated；
(5) heat cure molding；
(6) laser is used to remove excess surface coat: first every with the printed circuit board identification module identification of laser drill
The dimension information of one piece of printed circuit board, and described dimension information is sent to the control module of laser drill；Then laser drilling
Described dimension information is compared by the control module of machine with the standard printed circuit board dimension information in integrated circuit memory module
Right, and according to comparison result, standard printed wiring board is zoomed in or out, make the size of described standard printed wiring board
Consistent with the dimension information of described printed wiring board, and by the side circuit of this standard printed wiring board zoomed in or out
Layout is stored in circuit processing module；The side circuit layout that last laser module stores according to described circuit processing module
It is processed, excess surface coat is ablated off；
(7) printed circuit board is carried out thinning process: mechanical lapping or chemical etching.
When step (1) re-works with drill bit, described drill bit from top to bottom or from the bottom up vertically into institute's drill flute,
The situ in hole.
In step (4), the electrophoretic coating using electrophoretic techniques to carry out surface-coated use is that thermosetting polymer electrophoresis is coated with
Material.
Step (4) concretely comprises the following steps: first remove oxide and the oils and fats on printed circuit board surface, then by printed circuit board
It is placed in saline solution and carries out electrophoresis coating；Again the printed circuit board completing electrophoresis coating is toasted, to solidify electrophoresis plating
Layer；Finally wash the electrophoresis residual liquid on printed circuit board.
The printed circuit board processing method of the present invention, the burr produced during energy clearing up and processing, improves printed circuit board
The uniformity of surface-coated, reduces whole processing cost, and efficiency is high；By in got out half bore or the situ in whole hole
Use the drill bit again Drilling operation identical with this bore dia, it is thus possible to bore disconnected by the burr being involved in boring procedure in hole or squeeze
To the position tangent with holes；And use drill bit to be cut off by the burr of tangency location at holes tangency location；So just may be used
Quickly burr is pared off, it is to avoid too much produce the situation of poor plating due to burr, and adopt this method repairing hair
Thorn, efficiency is high, and cost of labor is low, solves groove, problem that burr that Kong Tai little produces cannot be repaired；By using electrophoretic techniques
Printed circuit board surface is coated, on printed circuit board surface, coats a layer insulating by the method for electrophoresis, due to
Electrophoretic coating is that coating ion moves under the effect of electrode, so that whole coating coating layer thickness during coating is equal
Even, and electrophoresis process equipment is simple, relative to prior art uses expensive special silk-screen or electrostatic coating equipment, this
The electrophoretic techniques of bright employing is coated, and reduces cost, avoids the printed circuit board quality that manual operation brings simultaneously and asks
Topic.Meanwhile, use thermosetting electrophoresis material, direct heat cure molding after coating, and the present invention is not by exposure technology, directly makes
With high-precision laser, unnecessary solder mask is removed, improve the machining accuracy that solder mask removes, abandoned the UV of costliness
Light exposure sources, process simplification, with low cost, overcome traditional handicraft mediella and there is bigger precision with object to be exposed
The defect of error.
The ultimate principle of the present invention, principal character and advantages of the present invention have more than been shown and described.The technology of the industry
Personnel, it should be appreciated that the present invention is not restricted to the described embodiments, simply illustrating this described in above-described embodiment and description
The principle of invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, and these become
Change and improvement both falls within scope of the claimed invention.Claimed scope by appending claims and
Equivalent defines.
Claims (4)
1. a printed circuit board processing method, it is characterised in that: comprise the following steps:
(1) machine drilling: get out required half bore or whole hole on a printed circuit board；Then in bored half bore or whole hole
Neighbouring and part covers the position drill flute again in whole hole, forms groove and adds half bore；Adopt in the situ getting out half bore or whole hole again
Carry out repairing burr with the drill bit identical with this bore dia again Drilling operation；
(2) heavy copper plating, makes it metallize to carrying out heavy copper plating on the printed circuit board of be drilled with groove and half bore, forms metal
Change groove and add half bore；
(3) printed circuit board through electric plating of whole board is carried out Etching:
(4) use electrophoretic techniques that the printed circuit board after Etching is carried out surface-coated；
(5) heat cure molding；
(6) laser is used to remove excess surface coat: first with each piece of the printed circuit board identification module identification of laser drill
The dimension information of printed circuit board, and described dimension information is sent to the control module of laser drill；Then laser drill
Described dimension information is compared by control module with the standard printed circuit board dimension information in integrated circuit memory module, and
According to comparison result, standard printed wiring board is zoomed in or out, make the size of described standard printed wiring board with described
The dimension information of printed wiring board is consistent, and by the side circuit layout of this standard printed wiring board zoomed in or out
It is stored in circuit processing module；The side circuit layout that last laser module stores according to described circuit processing module adds
Work, is ablated off excess surface coat；
(7) printed circuit board is carried out thinning process: mechanical lapping or chemical etching.
Printed circuit board processing method the most according to claim 1, it is characterised in that: step adds again with drill bit in (1)
In man-hour, described drill bit is from top to bottom or from the bottom up vertically into institute's drill flute, the situ in hole.
Printed circuit board processing method the most according to claim 1, it is characterised in that: state in step (4), use electrophoresis skill
It is thermosetting polymer electrophoretic coating that art carries out the electrophoretic coating of surface-coated use.
Printed circuit board processing method the most according to claim 1, it is characterised in that step (4) concretely comprises the following steps: the most clear
Except oxide and the oils and fats on printed circuit board surface, then printed circuit board is placed in saline solution and carries out electrophoresis coating；Again
The printed circuit board completing electrophoresis coating is toasted, to solidify electrophoresis coating；Finally wash the electricity on printed circuit board
Swimming residual liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610789757.2A CN106211595A (en) | 2016-08-30 | 2016-08-30 | A kind of printed circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610789757.2A CN106211595A (en) | 2016-08-30 | 2016-08-30 | A kind of printed circuit board processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211595A true CN106211595A (en) | 2016-12-07 |
Family
ID=58085847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610789757.2A Pending CN106211595A (en) | 2016-08-30 | 2016-08-30 | A kind of printed circuit board processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211595A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108941930A (en) * | 2018-08-09 | 2018-12-07 | 苏州千层茧农业科技有限公司 | A kind of conductive film and preparation method thereof |
| CN111970856A (en) * | 2020-08-05 | 2020-11-20 | 惠州市金百泽电路科技有限公司 | Machining method for preventing burrs of metallized half holes |
| CN115025949A (en) * | 2022-05-23 | 2022-09-09 | 中国电子科技集团公司第十研究所 | Local spraying method of printed circuit assembly silicone conformal coating |
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| CN201893988U (en) * | 2010-10-22 | 2011-07-06 | 春焱电子科技（苏州）有限公司 | Printed circuit board (PCB) |
| CN102291943A (en) * | 2011-06-14 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing printed circuit board |
| CN102510671A (en) * | 2011-10-19 | 2012-06-20 | 天津市德中技术开发有限公司 | Method for producing anti-corrosion pattern in production of printed circuit board |
| CN102970834A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Method for fabricating circuit board metallized half hole |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
| CN103369846A (en) * | 2013-06-28 | 2013-10-23 | 昆山元茂电子科技有限公司 | Special-shaped hole deburring method |
-
2016
- 2016-08-30 CN CN201610789757.2A patent/CN106211595A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720173A (en) * | 2009-11-20 | 2010-06-02 | 深南电路有限公司 | Method for processing PCB |
| CN201893988U (en) * | 2010-10-22 | 2011-07-06 | 春焱电子科技（苏州）有限公司 | Printed circuit board (PCB) |
| CN102291943A (en) * | 2011-06-14 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing printed circuit board |
| CN102970834A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Method for fabricating circuit board metallized half hole |
| CN102510671A (en) * | 2011-10-19 | 2012-06-20 | 天津市德中技术开发有限公司 | Method for producing anti-corrosion pattern in production of printed circuit board |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
| CN103369846A (en) * | 2013-06-28 | 2013-10-23 | 昆山元茂电子科技有限公司 | Special-shaped hole deburring method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108941930A (en) * | 2018-08-09 | 2018-12-07 | 苏州千层茧农业科技有限公司 | A kind of conductive film and preparation method thereof |
| WO2021258510A1 (en) * | 2020-06-24 | 2021-12-30 | 惠州市金百泽电路科技有限公司 | Machining method capable of preventing burrs of metallized half-hole |
| CN111970856A (en) * | 2020-08-05 | 2020-11-20 | 惠州市金百泽电路科技有限公司 | Machining method for preventing burrs of metallized half holes |
| CN115025949A (en) * | 2022-05-23 | 2022-09-09 | 中国电子科技集团公司第十研究所 | Local spraying method of printed circuit assembly silicone conformal coating |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |
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| RJ01 | Rejection of invention patent application after publication |