CN114641152A - Method for half-hole fabrication - Google Patents
Method for half-hole fabrication Download PDFInfo
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- CN114641152A CN114641152A CN202210150717.9A CN202210150717A CN114641152A CN 114641152 A CN114641152 A CN 114641152A CN 202210150717 A CN202210150717 A CN 202210150717A CN 114641152 A CN114641152 A CN 114641152A
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000003801 milling Methods 0.000 claims abstract description 62
- 238000005520 cutting process Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 5
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 230000002441 reversible effect Effects 0.000 claims description 15
- 238000005491 wire drawing Methods 0.000 abstract description 5
- 238000009966 trimming Methods 0.000 abstract 4
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
Abstract
The invention discloses a method for manufacturing a half-hole, which comprises the following steps: drilling through holes in a PCB, wherein the through holes are arranged in the PCB in an array manner; plating copper on the surface of the hole wall of the through hole; manufacturing an outer layer circuit on the surface of the PCB board; forming a coarse routing groove along the arrangement direction of the through holes by using a coarse milling cutter, wherein the coarse routing groove penetrates through the through holes, so that the through holes are formed into metallized half holes; defining a connecting plate between the two half holes, and cutting the side edges of the connecting plate along a first direction by using a first finishing tool; respectively cutting the side edges of the connecting plates along a second direction by using a second finishing cutter; and the first fine trimming knife and the second fine trimming knife are overlapped at the position of the connecting plate, and a finished product groove is formed on the PCB board through the cutting of the first fine trimming knife and the second fine trimming knife. The method effectively improves the phenomenon of wire drawing in the half-hole processing.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a half-hole.
Background
The mode of reserving the metal half-hole is widely applied to the design of a circuit board, particularly common on a daughter board of a core mainboard, and the design can bring great processing difficulty to the subsequent forming process; and the wire drawing at the half hole can cause the problems of electroplating plug holes in the subsequent process and the like. The existing processing mode can not avoid the problem of wire drawing well basically, and the wire drawing can be removed only by adding manual checking and cleaning links, so that the processing efficiency is reduced, and the processing cost is increased. The novel processing method matched with the combined cutter and the processing program can effectively inhibit the wire drawing phenomenon in the half-hole processing, and improve the processing quality and the production efficiency.
Disclosure of Invention
In order to solve the technical problem, the invention provides a method for manufacturing half holes, which can be used for forming the half holes at one time, so that the burr problem of the metal half holes can be avoided.
The technical scheme of the invention is as follows: a method for half-hole fabrication, comprising:
drilling through holes on a PCB board, wherein the through holes are arranged on the PCB board in an array manner;
plating copper on the surface of the hole wall of the through hole;
manufacturing an outer layer circuit on the surface of the PCB board;
forming a coarse routing groove along the arrangement direction of the through holes by using a coarse milling cutter, wherein the coarse routing groove penetrates through the through holes, so that the through holes are formed into metallized half holes;
defining a connecting plate between the two half holes, and cutting the side edges of the connecting plate along a first direction by using a first finishing tool; respectively cutting the side edges of the connecting plates along a second direction by using a second finishing cutter; and the first finishing knife and the second finishing knife are overlapped at the position of the connecting plate, and a finished product groove is formed on the PCB board by cutting of the first finishing knife and the second finishing knife.
Further, the diameter of the rough routing groove is equal to the diameter of the rough milling cutter.
Further, the diameter of the coarse routing groove is smaller than that of the finished product groove.
Further, in the process of cutting the side edge of the connecting plate by using a first finishing cutter, the first finishing cutter is a milling cutter with the blade diameter of 0.8mm, and the milling cutter performs cutting along the side wall of the connecting plate in the clockwise direction towards the direction of the half hole.
Further, the distance from the center of the milling cutter to the centers of the hole walls of the two half holes is more than or equal to 0; and the distance from the center of the milling cutter to the hole wall of the half hole is more than or equal to 0.1 mm.
Further, the central position of the milling cutter exceeds the central position of the connecting plate.
Further, an arc-shaped plate is remained after the connecting plate is cut, one end of the arc-shaped plate is connected to the hole wall of the half hole, and the other end of the arc-shaped plate is far away from the hole wall of the other half hole; and the arc-shaped plate is cut by a second finishing cutter, so that a finished product groove is formed on the surface of the PCB.
Further, in the process of cutting the side edge of the arc-shaped plate by using a second finishing cutter, the second finishing cutter is a reverse-rotating cutter with the blade diameter of 0.8mm, and the reverse-rotating cutter cuts along the side wall of the arc-shaped plate in the direction of the half hole in the counterclockwise direction.
Further, the distance from the center of the reverse rotating knife to the centers of the wall of the two half holes is more than or equal to 0; and the distance from the center of the reverse rotating cutter to the hole wall of the half hole is more than or equal to 0.1 mm.
Further, the center position of the reverse rotating knife exceeds the center position of the connecting plate.
The beneficial technical effects of the invention are as follows:
1. and the milling cutter is fed from right to left, the center of the milling cutter needs to exceed the center of the connecting plate, otherwise, the milling cutter and the reverse-rotation cutter cannot be completely cut after cutting.
2. The distance from the center of the milling cutter to the center of the connecting plate is more than or equal to 0, so that the milling cutter and the reverse-rotation cutter are overlapped, and the condition of incomplete cutting is prevented.
3. The distance from the center of the milling cutter to the hole wall is more than or equal to 0.1mm, so that an arc-shaped plate can be formed when the milling cutter cuts the connecting plate, meanwhile, the reverse-rotation cutter and the milling cutter are overlapped and refined again, and the condition that the milling cutter is not cut completely can be avoided.
4. The distance from the center of the reverse-rotation cutter to the center of the connecting plate is larger than or equal to 0, so that the milling cutter and the reverse-rotation cutter are overlapped, and the condition of incomplete cutting is prevented.
5. The distance from the center of the reverse-rotation cutter to the hole wall is more than or equal to 0.1mm, so that the arc-shaped plate can be conveniently cut, and the condition that the reverse-rotation cutter cannot be uncut after cutting is finished is ensured.
The foregoing is a summary of the present invention, and in order to provide a clear understanding of the technical means of the present invention and to be implemented in accordance with the present specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a half-hole copper skin residue in an embodiment of the present invention;
FIG. 2 is a schematic diagram of an abnormal shape of a half-hole according to an embodiment of the present invention;
FIG. 3 is a schematic view of a plate edge unevenness according to an embodiment of the present invention;
FIG. 4 is a schematic view illustrating the copper sheet being lifted or pulled according to an embodiment of the present invention;
FIG. 5 is an appearance schematic diagram of a rough fishing of the milling cutter in the embodiment of the invention;
FIG. 6 is a schematic exterior view of a milling cutter finishing in an embodiment of the present invention;
FIG. 7 is a schematic view of the finishing of the reverse rotation tool in an embodiment of the present invention;
FIG. 8 is a schematic view of a roughing operation of the milling cutter in an embodiment of the present invention;
FIG. 9 is a schematic illustration of a milling cutter truing in an embodiment of the present invention;
FIG. 10 is a schematic illustration of a reverse rotation tool finishing in an embodiment of the present invention;
the reference signs are:
1. an arc-shaped plate; 2. a connecting plate; 3. a hole wall; d1, diameter of the roughing mill; h1, diameter of finished tank; h2, the diameter of the coarse routing groove; l, the center distance between the two half holes; l1, distance between the walls of the two half holes; l2, distance from the center of the knife to the center of the wall of the two half holes; l3, distance from the center of the knife to the wall of the half-hole; A. the center of the knife.
Detailed Description
In order to make the technical means of the present invention clearer and to make the technical means of the present invention capable of being implemented according to the content of the specification, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples, which are provided for illustrating the present invention and are not intended to limit the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship described based on the embodiments and shown in the drawings, or the orientation or positional relationship that the products of the present invention are usually placed when used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to be referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
According to the size of the metal half-hole and the width of the forming groove, the appropriate cutter diameter combination and the processing program are matched for setting, so that the metal half-hole processing and the conventional forming processing are combined into one, the extra process and the plate reversing action are not required to be added, and the hole edge quality and the processing efficiency of the metal half-hole are ensured. The premise of the processing method is that the molding device SPI NDLE (main shaft) must have a reverse rotation function and can be switched between clockwise and counterclockwise by a program setting.
The invention relates to a method for manufacturing a half-hole, which comprises the following steps:
drilling through holes in a PCB, wherein the through holes are arranged in the PCB in an array manner;
plating copper on the surface of the hole wall 3 of the through hole;
manufacturing an outer layer circuit on the surface of the PCB board;
as shown in fig. 8, a rough milling cutter is used to open rough milling grooves along the arrangement direction of the through holes, and the rough milling grooves penetrate through the through holes, so that the through holes are formed into metallized half holes;
defining a connecting plate 2 between the two half holes, and cutting the side edges of the connecting plate 2 along a first direction by using a first finishing cutter; cutting the side edges of the connecting plates 2 along a second direction by using a second finishing cutter respectively; and the first finishing tool and the second finishing tool are overlapped at the position of the connecting plate 2, and a finished product groove is formed on the PCB board by cutting of the first finishing tool and the second finishing tool.
Wherein the first direction is to feed from right to left, and the second direction is to feed from left to right.
It should be noted that the rough milling cutter is provided with a rough routing groove on the PCB, the through hole is penetrated through by the rough milling cutter to form a half hole, and then the edges of the half hole are cut by the first and second finishing knives, respectively, so as to achieve the production of the half hole.
Furthermore, the diameter H2 of the rough routing groove is equal to the diameter D1 of the rough milling cutter, and the diameter H2 of the rough routing groove is smaller than the diameter H1 of the finished product groove.
The milling cutter with a larger specification is used for roughing, the loss of the milling cutter with a slotting specification is reduced, and meanwhile, the diameter D1 of the roughing milling cutter and the diameter H2 of the roughing milling cutter are set to be the same, so that a half hole can be conveniently damaged. Similarly, the diameter H1 of the finished product groove is larger than the diameter H2 of the rough routing groove, so that the first finishing cutter and the second finishing cutter have enough finishing allowance.
Further, the radius of finished product groove subtracts the radius more than or equal to 0.2mm of thick gong groove, has guaranteed that first finish repair sword and second finish repair sword have sufficient finish repair allowance to thick gong groove, has avoided first finish repair sword and second finish repair sword when cutting half-hole, causes unable reversible damage to half-hole.
In this embodiment, milling cutters of different specifications are selected for different apertures of the half holes, and the following is a milling cutter parameter table:
as shown in fig. 9, in the process of cutting the side edge of the web 2 using a first finishing cutter, the first finishing cutter is a milling cutter having a cutting edge diameter of 0.8mm, and the milling cutter cuts in a clockwise direction along the side wall of the web 2 in the direction of the half hole.
Cutting is carried out along the side wall of the connecting plate 2 through a milling cutter, so that the copper sheet of the half-hole wall 3 is prevented from being damaged, and the copper sheet is prevented from being remained, tilted or pulled.
The milling cutter and the reverse-rotation cutter can be overlapped in a passing route, but dead angles can be left in the overlapping process, so that uncut plates are left after the milling cutter and the reverse-rotation cutter are cut, and the plate edges are not flat.
Wherein, it should be noted that, the center distance between the two half holes is L, the distance between the hole walls of the two half holes is L1, L2 is equal to the distance between the center of the knife and the center of the hole walls of the two half holes, and L3 is the distance between the center of the knife and the hole walls of the two half holes.
The distance L2 from the center A of the milling cutter to the centers of the hole walls of the two half holes is more than or equal to 0; and the distance L3 between the center A of the milling cutter and the hole wall of the half hole is more than or equal to 0.1mm, so that the milling cutter and the reverse rotation cutter can be overlapped, and the condition that the milling cutter is not completely cut is avoided.
The center A of the milling cutter exceeds the center of the connecting plate, so that the condition that the milling cutter and the reverse-rotation cutter are not completely cut after cutting is further ensured.
An arc-shaped plate 1 is remained after the connecting plate 2 is cut, one end of the arc-shaped plate 1 is connected to the hole wall 3 of the half hole, and the other end of the arc-shaped plate 1 is far away from the hole wall 3 of the other half hole; and the arc-shaped plate 1 finishes cutting through a second finishing cutter, so that a finished product groove is formed on the surface of the PCB.
It should be noted that, after the milling cutter cuts the connecting plate 2, an arc-shaped plate 1 remains, one end of the arc-shaped plate 1 remains on the side wall of the connecting plate 2, the other end of the arc-shaped plate 1 is a half-hole wall 3, and the other end of the arc-shaped plate 1 is in an arc shape cut by the milling cutter. And cutting the arc-shaped plate 1 again by using a reverse-rotation cutter to complete the manufacture of the half-hole.
As shown in fig. 10, in the process of cutting the side edge of the arc plate 1 by using a second finishing cutter, the second finishing cutter is a reverse-rotation cutter with a blade diameter of 0.8mm, and the reverse-rotation cutter cuts along the side wall of the arc plate 1 in the direction of the half hole in the counterclockwise direction.
The distance L2 from the center A of the reverse rotating knife to the centers of the hole walls of the two half holes is more than or equal to 0; and the distance L3 between the center A of the reverse rotating cutter and the hole wall of the half hole is more than or equal to 0.1mm, so that the milling cutter and the reverse rotating cutter can be overlapped, and the condition that the milling cutter is not completely cut is avoided.
The position of the center A of the reverse rotating cutter exceeds the position of the center of the connecting plate, and the condition that the milling cutter and the reverse rotating cutter are not completely cut after cutting is further ensured.
The detailed description is carried out again for the actual operation case in reality;
| item | Width of groove | Half hole diameter | Half hole pitch |
| Parameter(s) | 1.4mm | 0.6mm | 0.5 |
The following problems arise according to the conventional operation method:
1. as shown in fig. 1, copper scale remains near the half hole, and the cutting is not clean, requiring secondary processing.
2. As shown in fig. 2, the milling cutter causes an abnormality in the shape of the half hole during cutting, and secondary processing is required.
3. As shown in fig. 3, the milling cutter causes unevenness of the plate edge at the time of cutting, and secondary processing is required.
4. As shown in fig. 4, the milling cutter causes the copper sheet of the hole wall to lift or pull during cutting.
In conclusion, half holes are produced according to a conventional operation method, so that the number of defective products is increased, and the defective products can be removed only by adding manual inspection and cleaning links, thereby greatly increasing the production cost.
According to the processing method of the embodiment and matching with the corresponding cutter:
wherein S is the cutting speed and F is the passing speed.
According to the method of the embodiment, the main shaft of the machine table can be turned over at the same time, and half-hole machining is carried out on the through hole of the PCB;
1. as shown in fig. 5 and 8, the rough milling cutter forms a rough routing groove on the surface of the PCB board and penetrates through the through hole, so as to achieve the effect of breaking the half hole.
2. As shown in fig. 6 and 9, the milling cutter rotates clockwise, and is fed from right to left to perform the first finishing cutting on the half-hole, and an arc-shaped plate 1 remains after the cutting.
3. As shown in fig. 7 and 10, the reverse rotation cutter rotates counterclockwise, and is fed from left to right and performs a second finishing cutting on the arc plate 1, so that the connecting plate 2 is cut flat to complete the machining of the half-hole.
In conclusion, the method of the embodiment can be used for one-step forming, so that the problem of metal half-hole burrs can be avoided; compared with the conventional metal half-hole processing, 4 processes of tin plating, one-step forming, acid washing, alkali washing and the like can be omitted, the processing cost is greatly saved, and compared with burr removal through a later process, the surface quality is better through one-step processing. Meanwhile, the upper plate is prevented from being turned over for the second time in molding, the precision is higher, and the consistency is better.
Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein.
Claims (10)
1. A method for half-hole fabrication, comprising:
drilling through holes on a PCB board, wherein the through holes are arranged on the PCB board in an array manner;
plating copper on the surface of the hole wall (3) of the through hole;
manufacturing an outer layer circuit on the surface of the PCB board;
forming a coarse routing groove along the arrangement direction of the through holes by using a coarse milling cutter, wherein the coarse routing groove penetrates through the through holes, so that the through holes are formed into metallized half holes;
defining a connecting plate (2) between the two half holes, and cutting the side edges of the connecting plate along a first direction by using a first finishing tool; respectively cutting the side edges of the connecting plates along a second direction by using a second finishing cutter; and the first finishing knife and the second finishing knife are overlapped at the position of the connecting plate, and a finished product groove is formed on the PCB board by cutting of the first finishing knife and the second finishing knife.
2. The method for half-hole manufacturing of claim 1, wherein the diameter H2 of the rough routing is equal to the diameter D1 of the rough milling cutter.
3. The method for half-hole manufacturing of claim 2, wherein the diameter H2 of the rough routing groove is smaller than the diameter H1 of the finished groove.
4. The method for half-hole manufacturing according to claim 1, wherein in cutting the side edge of the web (2) using a first truing tool, the first truing tool is a milling tool with a blade diameter of 0.8mm, and the milling tool cuts in a clockwise direction along the side wall of the web in the direction of the half-hole.
5. The method for half-hole manufacturing according to claim 4, wherein a distance L2 from a center A of the milling cutter to a center of the wall of the both half-holes is 0 or more; and the distance L3 from the center A of the milling cutter to the hole wall of the half hole is more than or equal to 0.1 mm.
6. Method for half-hole manufacturing according to claim 5, characterized in that the central A position of the milling cutter exceeds the central position of the connection plate (2).
7. A method for half-hole manufacturing according to any of claims 4-6, characterised in that the web (2) is cut leaving an arc (1) with one end connected to the wall (3) of the half-hole and the other end remote from the wall of the other half-hole; and the arc-shaped plate is cut by a second finishing cutter, so that a finished product groove is formed on the surface of the PCB.
8. Method for half-hole manufacturing according to claim 7, characterized in that in the cutting of the side of the arc plate (3) with a second finishing cutter, the second finishing cutter is a reverse-rotation cutter with a blade diameter of 0.8mm, which cuts in a counterclockwise direction along the side wall of the arc plate in the direction of the half-hole.
9. The method for half-hole manufacturing according to claim 8, wherein a distance L2 from the center a of the reverse-rotation tool to the center of the wall of the half-hole is 0 or more; and the distance L3 from the center A of the reverse rotating knife to the hole wall of the half hole is more than or equal to 0.1 mm.
10. The method for half-hole manufacturing of claim 9, wherein a center a position of the reverse-rotation cutter exceeds a center position of the connection plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210150717.9A CN114641152A (en) | 2022-02-18 | 2022-02-18 | Method for half-hole fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210150717.9A CN114641152A (en) | 2022-02-18 | 2022-02-18 | Method for half-hole fabrication |
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| CN114641152A true CN114641152A (en) | 2022-06-17 |
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| CN202210150717.9A Pending CN114641152A (en) | 2022-02-18 | 2022-02-18 | Method for half-hole fabrication |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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| KR20160121291A (en) * | 2015-04-10 | 2016-10-19 | (주)영진프로텍 | Half hole of pcb machining method and the pcb manufactured from the same |
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| CN110972396A (en) * | 2019-11-22 | 2020-04-07 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
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2022
- 2022-02-18 CN CN202210150717.9A patent/CN114641152A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160121291A (en) * | 2015-04-10 | 2016-10-19 | (주)영진프로텍 | Half hole of pcb machining method and the pcb manufactured from the same |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN110972396A (en) * | 2019-11-22 | 2020-04-07 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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Application publication date: 20220617 |