CN103945679A

CN103945679A - Novel foam

Info

Publication number: CN103945679A
Application number: CN201410095879.2A
Authority: CN
Inventors: 陈先锋
Original assignee: LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd
Current assignee: LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd
Priority date: 2014-03-14
Filing date: 2014-03-14
Publication date: 2014-07-23

Abstract

The invention discloses novel foam. The foam comprises a foam body and metal adhesive tape wrapping the foam body. The metal adhesive tape comprises a first wrapping layer, a second wrapping layer and a third wrapping layer, wherein the first wrapping layer is attached to the upper surface of the foam body, the second wrapping layer is attached to the lower surface of the foam body, and the third wrapping layer is attached to at least one side face of the foam body. The first wrapping layer, the second wrapping layer and the third wrapping layer are arranged in a phase current conduction mode. According to the novel foam, the foam is wrapped by the metal adhesive tape, compared with the fact that the surface of the foam is plated with a metal layern traditionally, bearing capacity of the foam is better, the size of the foam is smaller, the X axis, the Y axis and the Z axis are in conduction, the foam can be reused, no powdered scraps drop, the foam is easy and convenient to produce, and production cost is effectively reduced. The foam can be widely applied to ESD grounding and EMI shielding of devices or assemblies or shielded rooms, is suitable for application of occasions needing physical adhesion, electric conduction and heat dissipation, and can solve the electromagnetic wave interference problem, the heat dissipation problem and the quakeproof problem.

Description

A kind of novel foam

Technical field

the present invention relates to a kind of novel foam.

Background technology

along with the high speed development of electronic industry, modern society's electronic installation is more and more universal, as more and more in the function of the electronic devices and components such as PC, mobile phone, server, IPAD, GPS, shorter and shorter, thin, light, littleization of electronic installation, the electromagnetic wave between electronic devices and components internal electron module interferes with each other, heat radiation and shockproof problem are on the rise.Under such development trend, certainly will will have conductive shield material, heat sink material and packing in electronic devices and components, play a part to intercept or weaken Electromagnetic Interference, bear heat radiation and shockproof.

the conducting foam of tradition application in the market, is coated one deck conductive fabric on foam, through mould high-temperature shaping, then pastes one deck conductive adhesive film and forms, and can solve a part of Electromagnetic Interference problem.Shortcoming is that this conducting foam is that XY axle has conductivity, do not possess Z axis conducting and heat dispersion, be only applicable to the limited occasion of capacity and clossing pressure, and production process is comparatively loaded down with trivial details, and shape matching is single, and a lot of operations must manual work.Popular a kind of conducting foam also in the market, is sputter or electroplate layer of metal on foam, makes its XYZ tri-spindle guides logical, has solved the ever-increasing Problem of Electromagnetic Waves such as PC, mobile phone, server.Shortcoming is that density is little, too soft, can not be applied to the occasion of larger pressure, and production cost is higher, and in processing or use procedure, easily dry linting is considered to be worth doing, and application risk is higher.

Summary of the invention

the object of the invention is to: a kind of novel foam that can be applied to the larger occasion of pressure is provided, solves Electromagnetic Interference, heat radiation and shockproof problem that current electronic product is on the rise.

for achieving the above object, the technical solution used in the present invention is:

a kind of novel foam, comprise foam body, described novel foam also comprises the metal adhesive tape that wraps up described foam body, described metal adhesive tape comprise be fitted in described foam body upper surface the first integument, be fitted in described foam body lower surface the second integument, be fitted in the 3rd integument of at least one side of described foam body, described the first integument, described the second integument and described the 3rd integument phase current conducting ground arrange.

preferably, described metal adhesive tape comprises sheet metal layers, is coated on the first conductive adhesive layer of described sheet metal layers inner surface.

more preferably, described sheet metal layers is by nickel, copper, stainless steel, one or more are made.

more preferably, described the first conductive adhesive layer is made up of acrylate glue or silica gel.

more preferably, described novel foam comprises the second conductive adhesive layer, covers the release layer on described the second conductive adhesive layer outer surface, and described the second conductive adhesive layer is coated on the outer surface of described the first integument or described the second integument.

still more preferably, described the second conductive adhesive layer is made up of acrylate glue or silica gel.

preferably, described foam body is made up of one or more in polyurethane, chloroprene rubber, ethylene-vinyl acetate copolymer, rubber.

due to the use of such scheme, the present invention is compared with existing product in the market, there is following advantages: the novel foam of one disclosed by the invention, adopts metal adhesive tape parcel foam, with traditional to establish compared with metal level the bearing capacity of product at foam plated surface better, volume is little, XYZ tri-spindle guides are logical, can be repeatedly used, not dry linting bits, produce easyly, effectively reduce production costs.Can be widely used in: the ESD ground connection of equipment, assembly or shielded enclosure and EMI shielding, be applicable to need the application that physics is bonding and conduct and dispel the heat, solve Electromagnetic Interference, heat dissipation problem and shockproof three kinds of problems.

Brief description of the drawings

accompanying drawing 1 is the metal adhesive tape die drawing of the embodiment of the present invention one;

accompanying drawing 2 is the foam die drawing of the embodiment of the present invention one;

accompanying drawing 3 is the finished product vertical view of the embodiment of the present invention one;

accompanying drawing 4 is the profile along A-A line in accompanying drawing 3.

wherein: 1, foam body; 2, metal adhesive tape; 21, sheet metal layers; 22, the first conductive adhesive layer; 3, the second conductive adhesive layer; 4, release layer.

Embodiment

below in conjunction with accompanying drawing and specific embodiment, technical scheme of the present invention is further elaborated.

referring to shown in Fig. 2 to Fig. 3: a kind of novel foam, comprise foam body 1, foam body 1 is made up of one or more in polyurethane (PU), chloroprene rubber (CR), ethylene-vinyl acetate copolymer (EVA), rubber (RUBBER).Novel foam also comprises the metal adhesive tape 2 that wraps up described foam body, metal adhesive tape 2 comprises sheet metal layers 21, is coated on the first conductive adhesive layer 22 of sheet metal layers 21 inner surfaces, sheet metal layers 21 is by nickel, copper, stainless steel, one or more are made, and the first conductive adhesive layer 22 is made up of acrylate glue or silica gel.Metal adhesive tape 2 comprise be fitted in foam body 1 upper surface the first integument, be fitted in foam body 1 lower surface the second integument, be fitted in the 3rd integument of foam body 1 at least one side, the first integument, the second integument and the 3rd integument phase current conducting ground connect.

the sheet metal layers outer surface of the first integument or the second integument is coated with and on the second conductive adhesive layer 3, the second conductive adhesive layer 3 outer surfaces, is coated with release layer 4, the second conductive adhesive layers 3 and is made up of acrylate glue or silica gel.

the production method of above-described embodiment one is as follows:

metal adhesive tape 2, foam are cut into respectively to specification product, first according to shown in Fig. 2, metal adhesive tape 2 being thrust along half elliptic arc-shaped side, does not thrust on one side of indentation line, then according to shown in Fig. 3, foam being thrust along half elliptic periphery, the one side of the foam after die-cut is fitted on the first conductive adhesive layer 22 of metal adhesive tape 2, makes the half elliptic on foam corresponding one by one with the half elliptic on metal adhesive tape 2.Then with moulding fixture, the half elliptic metal adhesive tape 2 being washed from is pressure bonded to the another side of foam along indentation line upset, on the face of finally fitting at foam and half elliptic metal adhesive tape 2, is coated with the second conductive adhesive layer 3 and covers release liners on the second conductive adhesive layer 3 another sides.So just, obtained the logical novel foam of one of XYZ tri-spindle guides.

this novel foam adopts the structure of metal adhesive tape parcel, and with traditional to establish compared with metal level the bearing capacity of product at foam plated surface better, volume is little, and XYZ tri-spindle guides are logical, can be repeatedly used, and not dry linting bits, produce easyly, effectively reduce production costs.Can be widely used in: the ESD ground connection of equipment, assembly or shielded enclosure and EMI shielding, be applicable to need the application that physics is bonding and conduct and dispel the heat, solve Electromagnetic Interference, heat dissipation problem and shockproof three kinds of problems.

above-described embodiment is only explanation technical conceive of the present invention and feature; its object is to allow person skilled in the art can understand content of the present invention and be implemented; can not limit the scope of the invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.

Claims

1. a novel foam, comprise foam body (1), it is characterized in that: described novel foam also comprises the metal adhesive tape (2) that wraps up described foam body, described metal adhesive tape comprise be fitted in described foam body upper surface the first integument, be fitted in described foam body lower surface the second integument, be fitted in the 3rd integument of at least one side of described foam body, described the first integument, described the second integument and described the 3rd integument phase current conducting ground arrange.

2. the novel foam of one according to claim 1, is characterized in that: described metal adhesive tape comprises sheet metal layers (21), is coated on first conductive adhesive layer (22) of described sheet metal layers inner surface.

3. the novel foam of one according to claim 2, is characterized in that: described sheet metal layers is by nickel, copper, stainless steel, one or more are made.

4. the novel foam of one according to claim 2, is characterized in that: described the first conductive adhesive layer is made up of acrylate glue or silica gel.

5. the novel foam of one according to claim 2, it is characterized in that: described novel foam comprises the second conductive adhesive layer (3), covers the release layer (4) on described the second conductive adhesive layer outer surface, and described the second conductive adhesive layer is coated on the outer surface of described the first integument or described the second integument.

6. the novel foam of one according to claim 5, is characterized in that: described the second conductive adhesive layer is made up of acrylate glue or silica gel.

7. the novel foam of one according to claim 1, is characterized in that: described foam body is made up of one or more in polyurethane, chloroprene rubber, ethylene-vinyl acetate copolymer, rubber.