CN202697030U - High-thermal-conductivity printed circuit board - Google Patents
High-thermal-conductivity printed circuit board Download PDFInfo
- Publication number
- CN202697030U CN202697030U CN 201220364201 CN201220364201U CN202697030U CN 202697030 U CN202697030 U CN 202697030U CN 201220364201 CN201220364201 CN 201220364201 CN 201220364201 U CN201220364201 U CN 201220364201U CN 202697030 U CN202697030 U CN 202697030U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- substrate
- thermal
- aluminum plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model aims to provide a high-thermal-conductivity printed circuit board, which is used for reducing heat accumulation on the printed circuit board and ensuring normal work of an electronic element on the printed circuit board. The high-thermal-conductivity printed circuit board comprises a substrate, wherein the top layer of the substrate is a signal layer. Key points are that: an aluminum plate of which the shape is consistent with that of the substrate is stuck to the bottom surface of the substrate. The aluminum plate is a plate with extremely high heat conducting performance, and the aluminum plate is tightly jointed with the substrate, so that heat dissipated by an element on the signal layer of the substrate can be rapidly conducted and diffused onto the entire aluminum plate, and is dissipated out through the aluminum plate. Due to the adoption of the high-thermal-conductivity printed circuit board provided by the utility model, the radiating effect can be improved, normal work of the electronic element on the printed circuit board is ensured, and very high practicability is achieved.
Description
Technical field
The utility model belongs to electronic technology field, specially refers to a kind of high heat conduction printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is as the carrier of each electronic component and signal path, extensive use in various electronic products.Development along with electronic technology, the frequency of signal is more and more higher, the caloric value of element is also increasing, and electronic component and cabling are intensive in the high heat conduction printed circuit board (PCB), temperature is very high when work, even can affect the normal operation of element, and therefore how printed circuit board (PCB) is carried out good heat radiation, become Electronics Engineer's urgent problem.
The utility model content
The purpose of this utility model is to propose a kind of high heat conduction printed circuit board (PCB), to reduce the accumulation of heat of printed circuit board (PCB), guarantees the electronic component normal operation on it.
High heat conduction printed circuit board (PCB) of the present utility model comprises substrate, and the top layer of described substrate is signals layer, and key is that the bottom surface of described substrate is pasted with a block-shaped aluminium sheet consistent with substrate.
Aluminium sheet is the fabulous sheet material of heat conductivility, and aluminium sheet and substrate are fitted tightly, and the heat that just element on the substrate signal layer can be given out conducts rapidly and diffuses to the monoblock aluminium sheet, and distributes via aluminium sheet.
Further, described substrate is provided with the polylith hollow-out parts, so that the heat of aluminium sheet can distribute rapidly via hollow-out parts.
For improving further the speed of dissipation of heat, described aluminium sheet is fixed with fin in the position of counterpart substrate hollow-out parts.
High heat conduction printed circuit board (PCB) of the present utility model can improve radiating effect, guarantees the electronic component normal operation on the printed circuit board (PCB), has good practicality.
Description of drawings
Fig. 1 is the cutaway view of high heat conduction printed circuit board (PCB) of the present utility model.
Embodiment
The below contrasts accompanying drawing, by the description to embodiment, the effect of the mutual alignment between the shape of embodiment of the present utility model such as related each member, structure, the each several part and annexation, each several part and operation principle etc. are described in further detail.
Embodiment 1:
As shown in Figure 1, the high heat conduction printed circuit board (PCB) of the present embodiment comprises substrate 1, and the top layer of substrate 1 is signals layer 2, and the bottom surface of substrate 1 is pasted with the consistent aluminium sheet 3 of block-shaped and a substrate 1.
Aluminium sheet 3 is the fabulous sheet material of heat conductivility, and aluminium sheet 3 and substrate 1 are fitted tightly, and the heat that just element on substrate 1 signals layer can be given out conducts rapidly and diffuses to monoblock aluminium sheet 3, and distributes via aluminium sheet 3.
Further, substrate 1 is provided with polylith hollow-out parts 4 in the position that is not provided with holding wire, so that the heat of aluminium sheet 3 can distribute rapidly via hollow-out parts 3.
For improving further the speed of dissipation of heat, aluminium sheet 3 is fixed with fin 5 in the position of counterpart substrate hollow-out parts 4.
Claims (3)
1. one kind high heat conduction printed circuit board (PCB) comprises substrate, and the top layer of described substrate is signals layer, it is characterized in that the bottom surface of described substrate is pasted with a block-shaped aluminium sheet consistent with substrate.
2. high heat conduction printed circuit board (PCB) according to claim 1 is characterized in that described substrate is provided with the polylith hollow-out parts.
3. high heat conduction printed circuit board (PCB) according to claim 2 is characterized in that described aluminium sheet is fixed with fin in the position of counterpart substrate hollow-out parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220364201 CN202697030U (en) | 2012-07-26 | 2012-07-26 | High-thermal-conductivity printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220364201 CN202697030U (en) | 2012-07-26 | 2012-07-26 | High-thermal-conductivity printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202697030U true CN202697030U (en) | 2013-01-23 |
Family
ID=47552579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220364201 Expired - Fee Related CN202697030U (en) | 2012-07-26 | 2012-07-26 | High-thermal-conductivity printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202697030U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
-
2012
- 2012-07-26 CN CN 201220364201 patent/CN202697030U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20130726 |