CN102368889A - High frequency microwave circuit board base material - Google Patents
High frequency microwave circuit board base material Download PDFInfo
- Publication number
- CN102368889A CN102368889A CN2011102862625A CN201110286262A CN102368889A CN 102368889 A CN102368889 A CN 102368889A CN 2011102862625 A CN2011102862625 A CN 2011102862625A CN 201110286262 A CN201110286262 A CN 201110286262A CN 102368889 A CN102368889 A CN 102368889A
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- Prior art keywords
- copper foil
- foil layer
- frequency microwave
- dielectric layer
- layer
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Abstract
The invention discloses a high frequency microwave circuit board base material which comprises a dielectric layer (1), and two surfaces of the dielectric layer (1) are coated with a copper foil layer I (2) and a copper foil layer II (3) respectively. According to the invention, loss of medium is reduced, a dielectric constant scope is enlarged, surface resistance and volume resistance are increased, hole metalizing difficulty is decreased, and usage performance of a sheet material is enhanced.
Description
Technical field
The invention provides a kind of high-frequency microwave board substrate.
Background technology
The dielectric constant range of the dielectric layer of copper foil clad plate of polytetrafluoroethylglass glass cloth is little at present; Sheet resistance, volume resistance value are little; Use is prone to grounding phenomenon, and hole empty metallization difficulty is big, greatly reduces the serviceability of sheet material; A kind of microfibre of external employing strengthens, but its price is high.
Summary of the invention
The invention provides a kind of high-frequency microwave board substrate, it not only can reduce the loss of medium, enlarges dielectric constant range, and can increase sheet resistance and volume resistance, and the hole metallization difficulty reduces, thereby strengthens the serviceability of sheet material.
The present invention has adopted following technical scheme: a kind of high-frequency microwave board substrate, it comprises dielectric layer, is covered with copper foil layer I and copper foil layer II respectively on dielectric layer two surfaces.
Described dielectric layer is the mica synthetic glass cloth that is coated with polytetrafluoroethylene.Described copper foil layer I is at least one deck.Described copper foil layer II is at least one deck.The mass ratio 2:8 of described copper foil layer I and copper foil layer II and dielectric layer.
The present invention has following beneficial effect: the present invention adopts dielectric layer, copper foil layer I and copper foil layer II; Dielectric layer is the mica synthetic glass cloth that is coated with the polytetrafluoroethylene dipping; Described copper foil layer I and copper foil layer II be one deck at least; Copper foil layer I and copper foil layer II and dielectric layer enlarge dielectric constant range than the such loss that not only can reduce medium of 2:8, and dielectric constant range is: 2.2,2.7,3.0,3.5,4.0; And increase sheet resistance, volume resistance, hole metallization difficulty and reduce, strengthen the serviceability of sheet material.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
In Fig. 1, the invention provides a kind of high-frequency microwave board substrate, it comprises dielectric layer 1; Be covered with copper foil layer I 2 and copper foil layer II 3 respectively on dielectric layer two surfaces, dielectric layer 1 is for being coated with the mica synthetic glass cloth of polytetrafluoroethylene, and copper foil layer I 2 is at least one deck; Present embodiment is set to one deck; Copper foil layer II 3 is at least one deck, and present embodiment is set to one deck, copper foil layer I 2 and the mass ratio 2:8 of copper foil layer II 3 with dielectric layer.
Claims (5)
1. a high-frequency microwave board substrate is characterized in that it comprises dielectric layer (1), is covered with copper foil layer I (2) and copper foil layer II (3) respectively on dielectric layer two surfaces.
2. high-frequency microwave board substrate according to claim 1 is characterized in that described dielectric layer (1) is for being coated with the mica synthetic glass cloth of polytetrafluoroethylene.
3. high-frequency microwave board substrate according to claim 1 is characterized in that described copper foil layer I (2) is at least one deck.
4. high-frequency microwave board substrate according to claim 1 is characterized in that described copper foil layer II (3) is at least one deck.
5. high-frequency microwave board substrate according to claim 1 is characterized in that the mass ratio 2:8 of described copper foil layer I (2) and copper foil layer II (3) and dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102862625A CN102368889A (en) | 2011-09-25 | 2011-09-25 | High frequency microwave circuit board base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102862625A CN102368889A (en) | 2011-09-25 | 2011-09-25 | High frequency microwave circuit board base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102368889A true CN102368889A (en) | 2012-03-07 |
Family
ID=45761435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102862625A Pending CN102368889A (en) | 2011-09-25 | 2011-09-25 | High frequency microwave circuit board base material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102368889A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799830A (en) * | 2005-12-30 | 2006-07-12 | 顾根山 | Wide-dielectric constant polytetrafluoroethylene glass cloth coated copper foil plate |
| CN101295556A (en) * | 2008-06-13 | 2008-10-29 | 顾根山 | Copper foil clad plate of polytetrafluoroethylene glass cloth with wide dielectric constant |
| CN101934610A (en) * | 2010-07-21 | 2011-01-05 | 顾根山 | Wide-dielectric-coefficient Ccopper foil plate covered with wide-dielectric-coefficient polyfluortetraethylene glass cloth and preparation method thereof |
| CN202262043U (en) * | 2011-09-25 | 2012-05-30 | 顾根山 | Substrate of high-frequency microwave circuit board |
-
2011
- 2011-09-25 CN CN2011102862625A patent/CN102368889A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799830A (en) * | 2005-12-30 | 2006-07-12 | 顾根山 | Wide-dielectric constant polytetrafluoroethylene glass cloth coated copper foil plate |
| CN101295556A (en) * | 2008-06-13 | 2008-10-29 | 顾根山 | Copper foil clad plate of polytetrafluoroethylene glass cloth with wide dielectric constant |
| CN101934610A (en) * | 2010-07-21 | 2011-01-05 | 顾根山 | Wide-dielectric-coefficient Ccopper foil plate covered with wide-dielectric-coefficient polyfluortetraethylene glass cloth and preparation method thereof |
| CN202262043U (en) * | 2011-09-25 | 2012-05-30 | 顾根山 | Substrate of high-frequency microwave circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Wangling Insulating Material Plant, Taizhou Assignor: Gu Genshan Contract record no.: 2012320000793 Denomination of invention: Manufacturing method of high frequency microwave circuit board base material License type: Exclusive License Open date: 20120307 Record date: 20120615 |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120307 |