CN201986256U - Microwave high frequency metal base circuit board - Google Patents
Microwave high frequency metal base circuit board Download PDFInfo
- Publication number
- CN201986256U CN201986256U CN201120003111XU CN201120003111U CN201986256U CN 201986256 U CN201986256 U CN 201986256U CN 201120003111X U CN201120003111X U CN 201120003111XU CN 201120003111 U CN201120003111 U CN 201120003111U CN 201986256 U CN201986256 U CN 201986256U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- circuit board
- high frequency
- layer
- microwave high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a microwave high frequency metal base circuit board comprising a metal substrate (1), wherein a plurality of wiring holes (2) are formed on the metal substrate (1); a composite material layer (3) and a copper foil circuit layer (4) are sequentially arranged on one surface of the metal substrate (1), and a solder resist ink layer (5) is arranged on the copper foil circuit layer (4); and an insulating dielectric layer (6) is arranged on the other surface of the metal substrate (1), and the solder resist ink layer (5) is arranged on the insulating medium layer (6). The microwave high frequency metal base circuit board has the advantages of low dielectric loss, low dielectric constant, low thermal resistance, steady electromagnetic shielding effect, and higher conductive performance of shielding body material.
Description
Technical field
The utility model relates to a kind of microwave high frequency metal base circuit board.
Background technology
What at present use morely in the electronic product is the epoxide alloy base circuit board, and sort circuit plate loss ratio is bigger, and dielectric constant is higher, and reliability is poor, and electromagnetic wave shielding effect instability is difficult to satisfy the demand of communication product.
Summary of the invention
The utility model provides a kind of microwave high frequency metal base circuit board, and not only dielectric loss is low for it, and dielectric constant is low, and thermal resistance is little, electromagnetic wave shielding effect stability, the conduction Li Genggao of shield material.
The utility model has adopted following technical scheme: a kind of microwave high frequency metal base circuit board, and it comprises metal substrate, described metal substrate is provided with some wiring holes; One side at metal substrate is provided with composite layer, copper foil circuit layer successively, is provided with the welding resistance ink lay on the copper foil circuit layer; Another side at metal substrate is provided with insulating medium layer, and described insulating medium layer is provided with the welding resistance ink lay.
Described metal substrate is aluminium base; Described metal substrate is the copper base; Described metal substrate is the titanium base; Described metal substrate is a high-temperature alloy base.
The utlity model has following beneficial effect: be coated with insulating glass sealant on the metal substrate of the present utility model and form insulating medium layer, on insulating medium layer, apply solder mask, make wiring board not only have remarkable high-frequency low-consumption characteristic like this, lower dielectric constant, and electromagnetic wave shielding effect stability, the conduction Li Genggao of shield material satisfies the demand of telecommunications development to the high-performance metal base circuit board of high frequencyization, microwave technology.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Embodiment
In Fig. 1, the utility model is a kind of microwave high frequency metal base circuit board, and it comprises metal substrate 1, and described metal substrate 1 is provided with some wiring holes 2, and this metal substrate 1 can be aluminium base, copper base, titanium base, high-temperature alloy base etc.One side at metal substrate 1 is provided with composite layer 3, copper foil circuit layer 4 successively, is provided with welding resistance ink lay 5 on copper foil circuit layer 4; Another side at metal substrate 1 is an insulating medium layer 6, and described insulating medium layer 6 is coated in metal substrate 1 by insulating glass sealant and forms, and is provided with welding resistance ink lay 5 on insulating medium layer 6.
Claims (5)
1. a microwave high frequency metal base circuit board is characterized in that it comprises metal substrate (1), and described metal substrate (1) is provided with some wiring holes (2); One side at metal substrate (1) is provided with composite layer (3), copper foil circuit layer (4) successively, is provided with welding resistance ink lay (5) on copper foil circuit layer (4); Another side at metal substrate (1) is provided with insulating medium layer (6), and described insulating medium layer (6) is provided with welding resistance ink lay (5).
2. a kind of microwave high frequency metal base circuit board according to claim 1 is characterized in that described metal substrate (1) is aluminium base.
3. a kind of microwave high frequency metal base circuit board according to claim 1 is characterized in that described metal substrate (1) is the copper base.
4. a kind of microwave high frequency metal base circuit board according to claim 1 is characterized in that described metal substrate (1) is the titanium base.
5. a kind of microwave high frequency metal base circuit board according to claim 1 is characterized in that described metal substrate (1) is a high-temperature alloy base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120003111XU CN201986256U (en) | 2011-01-05 | 2011-01-05 | Microwave high frequency metal base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120003111XU CN201986256U (en) | 2011-01-05 | 2011-01-05 | Microwave high frequency metal base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201986256U true CN201986256U (en) | 2011-09-21 |
Family
ID=44613705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120003111XU Expired - Fee Related CN201986256U (en) | 2011-01-05 | 2011-01-05 | Microwave high frequency metal base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201986256U (en) |
-
2011
- 2011-01-05 CN CN201120003111XU patent/CN201986256U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: TAIZHOU BOTAI ELECTRONICS CO., LTD. Assignor: Ni Xinjun Contract record no.: 2014320000489 Denomination of utility model: Manufacturing method for microwave high frequency metal base circuit board Granted publication date: 20110921 License type: Exclusive License Record date: 20140610 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110921 Termination date: 20150105 |
|
| EXPY | Termination of patent right or utility model |