CN204272479U - Epoxy glass fiber cloth base material I TO wiring board - Google Patents
Epoxy glass fiber cloth base material I TO wiring board Download PDFInfo
- Publication number
- CN204272479U CN204272479U CN201420597064.XU CN201420597064U CN204272479U CN 204272479 U CN204272479 U CN 204272479U CN 201420597064 U CN201420597064 U CN 201420597064U CN 204272479 U CN204272479 U CN 204272479U
- Authority
- CN
- China
- Prior art keywords
- glass fiber
- thin film
- base material
- film layer
- fiber cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Aerials (AREA)
Abstract
The utility model provides a kind of epoxy glass fiber cloth base material I TO wiring board, and comprising with epoxy glass fiber cloth is the substrate that base material is made and ITO (tin indium oxide) thin layer applied on the substrate; Described ito thin film layer be printed on circuitous pattern and direct sheet resistance figure be set with ITO material thereon.Adopt the technical solution of the utility model, greatly can strengthen the suction wave energy of antenna; Ito thin film layer directly arranges sheet resistance figure simultaneously, thus do not need welding kesistance element, ensure that consistency and the stability of sheet resistance, greatly promote the performance of antenna.
Description
Technical field
The utility model relates to printed circuit board technology field, and particularly relating to a kind of take epoxy glass fiber cloth as ITO (tin indium oxide) wiring board of base material.
Background technology
The large-scale printed circuit feeder panel that airborne radar device, phased array system, remote sensing satellite etc. are applied, microstrip antenna and antenna array etc., need part small printed circuit antenna, needs to use resistive element in these antenna circuit simultaneously.Prior art adopts traditional copper-clad plate mask-making technology usually, namely arranges one deck Copper Foil as conductive layer at epoxy glass-fiber-fabric substrate surface; And resistive element is ready-made or special resistance series products, be arranged on the circuit layer of copper-clad plate with welding manner.Due to prior art production cost, components and parts high expensive, be unfavorable for the batch of small size antenna.Simultaneously in prior art, the consistency of resistance series products and stability exist and cannot be guaranteed, thus greatly have impact on the performance of antenna.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Utility model content
In order to overcome the defect of above-mentioned prior art, the utility model provides a kind of epoxy glass fiber cloth base material I TO wiring board that directly can arrange sheet resistance in the circuit board, to solve the problem.
For solving prior art Problems existing, the technical solution of the utility model is:
A kind of epoxy glass fiber cloth base material I TO wiring board, comprises basic unit and ITO (tin indium oxide) thin layer, and described basic unit adopts epoxy glass fiber cloth to be the substrate that base material is made; Described ito thin film layer is coated in described basic unit, and described ito thin film layer is formed with circuitous pattern, and described ito thin film layer also in described circuitous pattern corresponding resistance pattern be formed with resistance.
Preferably, the material of described resistance is ITO material.
Preferably, the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by etch process.
Preferably, the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by sputtering technology.
Preferably, described ito thin film layer is formed in described basic unit by sputtering technology.
Compared with prior art, adopt such scheme of the present utility model, because ITO material has good shielding properties, greatly strengthen the suction wave energy of antenna; Ito thin film layer directly arranges sheet resistance figure simultaneously, thus do not need welding kesistance element, ensure that consistency and the stability of sheet resistance, greatly promote the performance of antenna.
Accompanying drawing explanation
Fig. 1 is the profile of the utility model epoxy glass fiber cloth base material I TO wiring board.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
On the contrary, the utility model is contained any by the substituting of making on marrow of the present utility model and scope of defining of claim, amendment, equivalent method and scheme.Further, in order to make the public have a better understanding to the utility model, in hereafter details of the present utility model being described, detailedly describe some specific detail sections.Do not have the description of these detail sections can understand the utility model completely for a person skilled in the art yet.
See Fig. 1, be depicted as the profile of the utility model epoxy glass fiber cloth base material I TO wiring board, comprise basic unit 1 and ITO (tin indium oxide) thin layer 2, described basic unit adopts epoxy glass fiber cloth to be the substrate that base material is made; Described ito thin film layer 2 is coated in described basic unit 1, and described ito thin film layer 2 is formed with circuitous pattern, and described ito thin film layer 2 also in described circuitous pattern corresponding resistance pattern be formed with resistance 3.
In a preferred embodiment, the resistance 3 that corresponding resistance pattern is formed directly is formed by the material ITO material of thin layer.
The resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance 3 by etching or sputtering technology.
ITO (tin indium oxide) has electricity conduction and optically transparent characteristic, has good shielding properties simultaneously, and the transparent conductive plated film as EMI shielding is widely used.With sputtering technology coating ITO (tin indium oxide) thin layer 2 on the substrate 1 of epoxy glass fiber cloth base material, relative to traditional copper-clad plate (epoxy glass fiber cloth being arranged one deck Copper Foil), possesses more excellent shielding properties, use epoxy glass fiber cloth base material I TO wiring board of the present utility model in antennas, greatly can increase the suction wave energy of antenna.
Ito thin film layer 2 is as conductive layer, and its effect is similar to copper foil layer of the prior art.By photoresist mask etch technique, circuitous pattern is printed on ito thin film layer 2.Because the resistivity of ITO material is much larger than metals such as copper, therefore sheet resistance 3 can be directly set on ito thin film layer 2.Namely in the resistive element position of line pattern, deposit the sheet resistance figure corresponding with its resistance in the preparation according to the size of its resistance, actual sheet resistance figure can calculate according to the resistivity of ITO material.Ito thin film layer 2 directly forms sheet resistance 3, greatly improves consistency and the stability of sheet resistance, do not need welding kesistance element simultaneously, greatly promote the performance of antenna.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. an epoxy glass fiber cloth base material I TO wiring board, is characterized in that: comprise basic unit and ito thin film layer, and wherein, described ito thin film layer is made up of indium tin oxide material, and described basic unit adopts epoxy glass fiber cloth to be the substrate that base material is made; Described ito thin film layer is coated in described basic unit, and described ito thin film layer is formed with circuitous pattern, and described ito thin film layer also in described circuitous pattern corresponding resistance pattern be formed with resistance.
2. epoxy glass fiber cloth base material I TO wiring board as claimed in claim 1, is characterized in that: the material of described resistance is ITO material.
3. epoxy glass fiber cloth base material I TO wiring board as claimed in claim 2, is characterized in that: the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by etch process.
4. epoxy glass fiber cloth base material I TO wiring board as claimed in claim 2, is characterized in that: the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by sputtering technology.
5. epoxy glass fiber cloth base material I TO wiring board as claimed in claim 1, is characterized in that: described ito thin film layer is formed in described basic unit by sputtering technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420597064.XU CN204272479U (en) | 2014-10-16 | 2014-10-16 | Epoxy glass fiber cloth base material I TO wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420597064.XU CN204272479U (en) | 2014-10-16 | 2014-10-16 | Epoxy glass fiber cloth base material I TO wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272479U true CN204272479U (en) | 2015-04-15 |
Family
ID=52807323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420597064.XU Expired - Fee Related CN204272479U (en) | 2014-10-16 | 2014-10-16 | Epoxy glass fiber cloth base material I TO wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204272479U (en) |
-
2014
- 2014-10-16 CN CN201420597064.XU patent/CN204272479U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: ITO (indium tin oxide) circuit board with epoxy glass fiber cloth material Effective date of registration: 20180412 Granted publication date: 20150415 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Jiashan county subbranch Pledgor: Zhejiang Jiutong Electronic and Technology Ltd. Registration number: 2018330000080 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191115 Granted publication date: 20150415 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Jiashan county subbranch Pledgor: Zhejiang Jiutong Electronic and Technology Ltd. Registration number: 2018330000080 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: ITO (indium tin oxide) circuit board with epoxy glass fiber cloth material Effective date of registration: 20191118 Granted publication date: 20150415 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Jiashan county subbranch Pledgor: Zhejiang Jiutong Electronic and Technology Ltd. Registration number: Y2019330000193 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20201016 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220601 Granted publication date: 20150415 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiashan county subbranch Pledgor: ZHEJIANG JIUTONG ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2019330000193 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |