CN204272480U - Glass honeycomb interlayer ITO wiring board - Google Patents
Glass honeycomb interlayer ITO wiring board Download PDFInfo
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- CN204272480U CN204272480U CN201420597173.1U CN201420597173U CN204272480U CN 204272480 U CN204272480 U CN 204272480U CN 201420597173 U CN201420597173 U CN 201420597173U CN 204272480 U CN204272480 U CN 204272480U
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- ito
- wiring board
- glass honeycomb
- glass
- thin film
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Abstract
The utility model provides a kind of glass honeycomb interlayer ITO wiring board, and comprising with glass honeycomb core plate is the substrate that base material is made and ITO (tin indium oxide) thin layer applied on the substrate; Described glass honeycomb core plate is three-decker, upper strata and the lower floor insulating barrier all for being made up of epoxy glass fiber cloth, and intermediate layer is the alveolate texture be made up of epoxy glass fiber material; Described ito thin film layer is coated in the upper-layer insulation film of glass honeycomb core plate, it is printed on circuitous pattern and directly arranges sheet resistance figure with ITO material.Adopt the technical solution of the utility model, glass honeycomb interlayer ITO wiring board compares with epoxy glass-fiber-fabric circuit board, weight saving 80%, and have very high specific strength, specific stiffness, evenness is good, not yielding, and structure is simply, easy for installation; And described glass honeycomb interlayer printed circuit board can meet the demand of large-scale printed circuit feeder panel, microstrip antenna and the large-scale remote sensing antenna array that airborne radar device, phased array system, remote sensing satellite etc. use.
Description
Technical field
The utility model relates to printed circuit board technology field, particularly relates to a kind of ITO (tin indium oxide) wiring board being base material with glass honeycomb interlayer.
Background technology
The large-scale printed circuit feeder panel that airborne radar device, phased array system, remote sensing satellite etc. are applied, microstrip antenna and antenna array etc., need printed board area very large, often there are several square metres, tens square metres even, need to use a large amount of resistive element in these antenna circuit simultaneously.Prior art adopts traditional copper-clad plate usually, namely arranges one deck Copper Foil as conductive layer at epoxy glass-fiber-fabric substrate surface; And resistive element is ready-made or special resistance series products, be arranged on the circuit layer of copper-clad plate with welding manner.Because the copper-clad plate shielding properties of prior art is poor, the application of microstrip antenna and high frequency antenna is very restricted.Simultaneously in prior art, the consistency of resistance series products and stability exist and cannot be guaranteed, thus greatly have impact on the performance of antenna.
The epoxy glass-fiber-fabric substrate of prior art is adopted in above-mentioned application, easy distortion, quality usually reaches up to a hundred kilograms, need to reinforce, the plate of tens square metres square metres, ruggedized construction is complicated, inconvenience is installed, cost is very high, the lightness research and development of the products such as large-scale printed circuit feeder panel, microstrip antenna and antenna array, is the important topic that hyundai electronics equips small-sized lightness, high reliability is development.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Utility model content
In order to overcome the defect of above-mentioned prior art, the utility model provides a kind of glass honeycomb interlayer ITO wiring board of light-duty cellular structure, to solve the problem.
For solving prior art Problems existing, the technical solution of the utility model is:
A kind of glass honeycomb interlayer ITO wiring board, comprise basic unit and ITO (tin indium oxide) thin layer, wherein, described basic unit comprises insulating barrier, lower insulating barrier and the intermediate layer on described between insulating barrier and described lower insulating barrier, and described intermediate layer is alveolate texture; Described ito thin film layer is coated on described upper insulating barrier, and described ito thin film layer is formed with circuitous pattern, and described ito thin film layer also in described circuitous pattern corresponding resistance pattern be formed with resistance.
Preferably, the material of described resistance is ITO material.
Preferably, the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by etch process.
Preferably, the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by sputtering technology.
Preferably, described upper insulating barrier and the plate-like structure of described lower insulating barrier all for being made up of epoxy glass fiber cloth.
Preferably, the material in described intermediate layer is epoxy glass fiber material.
Preferably, described ito thin film layer is formed on described upper insulating barrier by sputtering technology.
Compared with prior art, adopt such scheme of the present utility model, glass honeycomb interlayer ITO wiring board compares with epoxy glass-fiber-fabric circuit board, weight saving 80%, have very high specific strength, specific stiffness, evenness is good, not yielding, structure is simple, easy for installation; And described glass honeycomb interlayer printed circuit board can meet the demand of large-scale printed circuit feeder panel, microstrip antenna and the large-scale remote sensing antenna array that airborne radar device, phased array system, remote sensing satellite etc. use.Simultaneously because ITO material has good shielding properties, greatly strengthen the suction wave energy of antenna; Ito thin film layer directly arranges sheet resistance figure simultaneously, thus do not need welding kesistance element, ensure that consistency and the stability of sheet resistance, greatly promote the performance of antenna.
Accompanying drawing explanation
Fig. 1 is the profile of the utility model glass honeycomb interlayer ITO wiring board;
Fig. 2 is the cutaway view of the utility model intermediate layer glass honeycomb interlayer 5.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
On the contrary, the utility model is contained any by the substituting of making on marrow of the present utility model and scope of defining of claim, amendment, equivalent method and scheme.Further, in order to make the public have a better understanding to the utility model, in hereafter details of the present utility model being described, detailedly describe some specific detail sections.Do not have the description of these detail sections can understand the utility model completely for a person skilled in the art yet.
See Fig. 1, be depicted as the profile of the utility model glass honeycomb interlayer ITO wiring board, comprise basic unit and ITO (tin indium oxide) thin layer.The ITO (tin indium oxide) that thin layer adopts has electricity conduction and optically transparent characteristic, has good shielding properties simultaneously, and the transparent conductive plated film as EMI shielding is widely used.Glass honeycomb interlayer has higher strength and stiffness, has the advantage of light material simultaneously, is widely used in the fields such as space flight and aviation.
With sputtering technology coating ITO (tin indium oxide) thin layer 2 on the substrate 1 of glass honeycomb interlayer base material, substrate 1 is three-decker, is respectively upper-layer insulation film 4, intermediate layer glass honeycomb interlayer 5 and underlying insulating layer 6.Wherein, upper-layer insulation film 4 and the insulating barrier of underlying insulating layer 6 all for being made up of epoxy glass fiber cloth, intermediate layer glass honeycomb interlayer 5 is the alveolate texture be made up of epoxy glass fiber material.The process of profile pattern frictioning is carried out to described upper-layer insulation film 4; Carrying out surface coarsening process to described upper-layer insulation film 4 surface through frictioning process, ito thin film layer is coated on described upper insulating barrier 4, and applies ito thin film layer 2 with sputtering or etching technics at upper-layer insulation film 4.
Described ito thin film layer is formed with circuitous pattern, and circuitous pattern comprises resistance pattern, and described ito thin film layer also in described circuitous pattern corresponding resistance pattern be formed with resistance 3.
In a preferred embodiment, the resistance 3 that corresponding resistance pattern is formed directly is formed by the material ITO material of thin layer.
The resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance 3 by etching or sputtering technology.
Preferably, described upper insulating barrier and the plate-like structure of described lower insulating barrier all for being made up of epoxy glass fiber cloth.
See Fig. 2, be depicted as the cutaway view of intermediate layer glass honeycomb interlayer 5, glass honeycomb interlayer 5 makes a series of hexagon by epoxy glass fiber material, and the hole lattice of quadrangle and other shapes are combined closely formation, form very macroporous alveolate texture.This glass honeycomb sandwich construction has higher strength and stiffness and quality is lighter, compares with epoxy glass-fiber-fabric circuit board, weight saving 80%, and have very high specific strength, specific stiffness, evenness is good, not yielding, structure is simple, easy for installation; Simultaneously because ITO material has good shielding properties, it is relative to traditional copper-clad plate (epoxy glass fiber cloth being arranged one deck Copper Foil), possesses more excellent shielding properties, use pi foam substrate ITO wiring board of the present utility model in antennas, greatly can increase the suction wave energy of antenna.
Ito thin film layer 2 is as conductive layer, and its effect is similar to copper foil layer of the prior art.Circuitous pattern can be printed on ito thin film layer 2 by photoresist mask etch technique.Because the resistivity of ITO material is much larger than metals such as copper, therefore sheet resistance 3 can be directly set on ito thin film layer 2.Namely in the resistive element position of line pattern, deposit the sheet resistance figure corresponding with its resistance in the preparation according to the size of its resistance, actual sheet resistance figure can calculate according to the resistivity of ITO material.Ito thin film layer 2 directly forms sheet resistance 3, greatly improves consistency and the stability of sheet resistance, do not need welding kesistance element simultaneously, greatly promote the performance of antenna.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (7)
1. a glass honeycomb interlayer ITO wiring board, it is characterized in that: comprise basic unit and ito thin film layer, wherein, described ito thin film layer is made up of indium tin oxide material, described basic unit comprises insulating barrier, lower insulating barrier and the intermediate layer on described between insulating barrier and described lower insulating barrier, and described intermediate layer is alveolate texture; Described ito thin film layer is coated on described upper insulating barrier, and described ito thin film layer is formed with circuitous pattern, and described ito thin film layer also in described circuitous pattern corresponding resistance pattern be formed with resistance.
2. glass honeycomb interlayer ITO wiring board as claimed in claim 1, is characterized in that: the material of described resistance is ITO material.
3. glass honeycomb interlayer ITO wiring board as claimed in claim 2, is characterized in that: the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by etch process.
4. glass honeycomb interlayer ITO wiring board as claimed in claim 2, is characterized in that: the resistance pattern that described ito thin film layer is corresponding in described circuitous pattern forms described resistance by sputtering technology.
5. glass honeycomb interlayer ITO wiring board as claimed in claim 1, is characterized in that: described upper insulating barrier and the plate-like structure of described lower insulating barrier all for being made up of epoxy glass fiber cloth.
6. glass honeycomb interlayer ITO wiring board as claimed in claim 1, is characterized in that: the material in described intermediate layer is epoxy glass fiber material.
7. glass honeycomb interlayer ITO wiring board as claimed in claim 1, is characterized in that: described ito thin film layer is formed on described upper insulating barrier by sputtering technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420597173.1U CN204272480U (en) | 2014-10-16 | 2014-10-16 | Glass honeycomb interlayer ITO wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420597173.1U CN204272480U (en) | 2014-10-16 | 2014-10-16 | Glass honeycomb interlayer ITO wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272480U true CN204272480U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420597173.1U Expired - Fee Related CN204272480U (en) | 2014-10-16 | 2014-10-16 | Glass honeycomb interlayer ITO wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204272480U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115224468A (en) * | 2022-09-20 | 2022-10-21 | 珠海翔翼航空技术有限公司 | Wing conformal transparent microstrip antenna, preparation method and spacecraft |
-
2014
- 2014-10-16 CN CN201420597173.1U patent/CN204272480U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115224468A (en) * | 2022-09-20 | 2022-10-21 | 珠海翔翼航空技术有限公司 | Wing conformal transparent microstrip antenna, preparation method and spacecraft |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: ITO (indium tin oxide) circuit board with glass fiber honeycomb interlayer Effective date of registration: 20180412 Granted publication date: 20150415 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Jiashan county subbranch Pledgor: Zhejiang Jiutong Electronic and Technology Ltd. Registration number: 2018330000080 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191115 Granted publication date: 20150415 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Jiashan county subbranch Pledgor: Zhejiang Jiutong Electronic and Technology Ltd. Registration number: 2018330000080 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: ITO (indium tin oxide) circuit board with glass fiber honeycomb interlayer Effective date of registration: 20191118 Granted publication date: 20150415 Pledgee: Agricultural Bank of China, Limited by Share Ltd, Jiashan county subbranch Pledgor: Zhejiang Jiutong Electronic and Technology Ltd. Registration number: Y2019330000193 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20201016 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220601 Granted publication date: 20150415 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiashan county subbranch Pledgor: ZHEJIANG JIUTONG ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2019330000193 |