WO2021017202A1

WO2021017202A1 - Electronic device and cover plate thereof

Info

Publication number: WO2021017202A1
Application number: PCT/CN2019/112803
Authority: WO
Inventors: 唐根初; 周天宝; 简建明
Original assignee: 南昌欧菲光科技有限公司
Priority date: 2019-07-27
Filing date: 2019-10-23
Publication date: 2021-02-04
Also published as: CN110519953A

Abstract

The present application provides a cover plate of an electronic device. The cover plate is used for covering an electronic device body; the cover plate comprises a cover plate body and an antenna structure; the cover plate body comprises an upper cover plate and a lower cover plate that is provided opposite to the upper cover plate; the lower cover plate is close to the electronic device body; the upper cover plate is distant from the electronic device body; the antenna structure is provided between the upper cover plate and the lower cover plate, or the antenna structure is provided in the upper cover plate, or the antenna structure is provided in the lower cover plate, or the antenna structure is provided at the side of the cover plate body distant from the electronic device body. The antenna structure is provided in the cover plate, thereby avoiding the antenna structure from occupying the internal available space of the electronic device, and solving the technical problem that the electronic device does not meet a structural design requirement because the antenna structure occupies too large internal available space of the electronic device. The structure of the cover plate is introduced as follows.

Description

Electronic equipment and its cover

This application claims the priority of an earlier application with the application number 201910686465.X filed on July 27, 2019 named "Electronic Equipment and Cover", and the content of the foregoing earlier application is incorporated into this text by way of introduction .

Technical field

This application relates to the technical field of electronic devices, and in particular to an electronic device and its cover.

Background technique

Currently, the antennas of electronic products are designed based on flexible circuit boards. With the increasing proportion of full-screen screens, the arrival of 5G has more and more requirements for the location and area of the antenna. Existing electronic devices do not meet the requirements of the electronic devices because the antenna structure occupies too much effective space inside the electronic device Structural design requirements.

Application content

The purpose of this application is to provide a cover plate and an electronic device for an electronic device to solve the technical problem that the electronic device does not meet the structural design requirements because the antenna structure occupies too much effective space inside the electronic device.

The present application provides a cover plate of an electronic device for covering an electronic device body. The cover plate includes a cover plate body and an antenna structure. The cover plate body includes an upper cover plate and is opposite to the upper cover plate. The lower cover plate is arranged, the lower cover plate is close to the electronic device body, the upper cover plate is away from the electronic device body, and the antenna structure is arranged between the upper cover plate and the lower cover plate, Or the antenna structure is provided in the upper cover plate, or the antenna structure is provided in the lower cover plate; or, the antenna structure is provided on a side of the cover body away from the electronic device body . The antenna structure is arranged in the cover plate, thereby preventing the antenna structure from occupying the effective internal space of the electronic device, and solving the technical problem that the electronic device does not meet the structural design requirements because the antenna structure occupies too much internal effective space of the electronic device. The structure of the cover will be described as follows.

Wherein, the upper cover plate is provided with grooves on the surface close to the lower cover plate, the grooves are connected in a grid shape, the antenna structure is a grid shape, and the antenna structure is arranged in the groove . The method in which the antenna structure is arranged in the groove of the upper cover plate eliminates the need for the antenna structure to occupy the thickness of the upper cover plate, and the electronic device is more compact, which is convenient for light and thin.

Wherein, the lower cover plate is provided with grooves on the surface close to the upper cover plate, the grooves are connected in a grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove . The method in which the antenna structure is arranged in the groove of the lower cover plate eliminates the need for the antenna structure to occupy the thickness of the lower cover plate, and the electronic equipment is more compact and easy to be thinner.

Wherein, the cover plate further includes an adhesive layer, the adhesive layer is laminated between the upper cover plate and the lower cover plate, and the antenna structure is provided on the adhesive layer. The arrangement of the adhesive layer fixes and adheres the upper cover plate and the lower cover plate, which improves the stability of the electronic device, and the adhesive layer is used to accommodate the antenna structure.

Wherein, the adhesive layer is provided with grooves on the surface close to the upper cover plate, the grooves are connected in a grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove. The method in which the antenna structure is arranged in the groove of the adhesive layer eliminates the need for the antenna structure to occupy the thickness of the adhesive layer, and the electronic device is more compact, which is convenient for light and thin.

Wherein, the adhesive layer is provided with grooves on the surface close to the lower cover plate, the grooves are connected in a grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove. The method in which the antenna structure is arranged in the groove of the adhesive layer eliminates the need for the antenna structure to occupy the thickness of the adhesive layer, and the electronic device is more compact, which is convenient for light and thin.

Wherein, the cover plate further includes a decorative film, the decorative film is provided on the side of the lower cover plate close to the electronic device body; or, the decorative film is provided on the side of the upper cover plate away from the electronic device body Or, the decorative film is provided between the upper cover and the lower cover.

Wherein, the cover plate further includes a decorative film, which is arranged between the upper cover plate and the glue layer; or, the decorative film is arranged between the lower cover plate and the glue layer Or, the decorative film is provided on the side of the lower cover plate close to the electronic device body; or, the decorative film is provided on the side of the upper cover plate away from the electronic device body. The different positions of the decorative film meet more appearance needs of users and enhance the user experience.

The surface of the cover body away from the electronic device is provided with a groove, the groove is in a grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove. The method in which the antenna structure is arranged in the groove of the cover body eliminates the need for the antenna structure to occupy the thickness of the cover body, and the electronic equipment is more compact and easy to be light and thin.

Wherein, the cover plate further includes an adhesive layer, and the adhesive layer is provided on a side of the cover plate body away from the electronic device body. The glue layer is used to house the antenna structure and to bond other film layers.

Wherein, the surface of the adhesive layer close to the cover body is provided with the groove, the groove is in a grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove Inside. The method in which the antenna structure is arranged in the groove of the adhesive layer eliminates the need for the antenna structure to occupy the thickness of the adhesive layer, and the electronic device is more compact, which is convenient for light and thin.

Wherein, the surface of the adhesive layer away from the cover body is provided with a groove, the groove is in a grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove. The method in which the antenna structure is arranged in the groove of the adhesive layer eliminates the need for the antenna structure to occupy the thickness of the adhesive layer, and the electronic device is more compact, which is convenient for light and thin.

Wherein, the cover plate further includes a decorative film, the decorative film is provided on the surface of the cover body close to the electronic device body; or the decorative film is provided on the cover body away from the electronic device body on the surface.

Wherein, the cover plate further includes a decorative film, the decorative film is provided on a side of the cover body away from the electronic device, and the decorative film is provided between the cover body and the adhesive layer, Or the glue layer is arranged between the cover body and the decoration film; or the decoration film is arranged on the side of the cover body close to the electronic device body. The different positions of the decorative film meet more appearance needs of users and enhance the user experience.

Wherein, the decorative film includes a decorative adhesive layer, an NCVM coating layer, and an ink layer stacked in sequence, the decorative adhesive layer includes a texture structure, and the decorative adhesive layer fixes the decorative film on the cover body . The decorative glue layer achieves the texture effect of the decorative film, the NCVM coating layer achieves the color effect of the decorative film, and the ink layer is used to shield the non-display area of the electronic device.

Wherein, the decorative film further includes a substrate layer and an optical adhesive layer, the optical adhesive layer, the substrate layer, the decorative adhesive layer, the NCVM coating layer, and the ink layer are stacked in sequence, and the The optical adhesive layer sticks the substrate layer to the cover body. The base material layer realizes the explosion-proof effect of the decorative film, and the optical adhesive layer realizes the fixing of the base material layer to the cover body.

Wherein, the antenna structure is formed on the surface of the upper cover plate close to the lower cover plate, or the surface of the lower cover plate close to the upper cover plate, and the cover plate body is away from the surface of the electronic device Conductive film. The structure of the antenna structure in this manner is simple and easy to manufacture.

Wherein, the antenna structure is a conductive film formed on the upper cover, the lower cover, or the surface of the cover body by direct coating, evaporation, sputtering, or electroplating a layer of transparent conductive material . The manufacturing method of this antenna structure is simpler and more efficient.

The present application provides an electronic device, including an electronic device body and the above-mentioned cover plate, and the cover plate is covered on the electronic device body. The electronic device includes the above-mentioned cover plate, and the antenna structure is arranged in the cover plate, which prevents the antenna structure from occupying the effective internal space of the electronic device, and solves the problem that the electronic device does not meet the structural design due to the antenna structure occupying too much internal effective space of the electronic device The technical question requested.

In summary, the present application prevents the antenna structure from occupying the internal effective space of the electronic device by arranging the antenna layer inside the cover plate, and solves the problem that the electronic device is not satisfied because the antenna structure occupies too much internal effective space of the electronic device. Technical issues required by structural design.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

Fig. 1 is a schematic diagram of the first structure of the first cover provided by the present application.

Fig. 2 is a schematic diagram of a second structure of the first cover provided by the present application.

Fig. 3 is a schematic diagram of a third structure of the first type of cover provided by the present application.

Fig. 4a is a schematic diagram of a fourth structure of the first cover provided by the present application.

Fig. 4b is a schematic diagram of a fifth structure of the first cover provided in the present application.

FIG. 5 is a schematic diagram of the sixth structure of the first type of cover provided by the present application.

Fig. 6a is a schematic diagram of the seventh structure of the first cover provided by the present application.

Fig. 6b is a schematic diagram of the eighth structure of the first cover provided by the present application.

Fig. 6c is a schematic diagram of the ninth structure of the first type of cover provided by the present application.

FIG. 7 is a schematic diagram of the structure of the decorative film provided by the present application.

Fig. 8a is a schematic structural diagram of a layered antenna structure provided by the present application.

FIG. 8b is a schematic diagram of another structure of the layered antenna structure provided by the present application.

Figure 8c is a schematic diagram of the structure of the groove.

Fig. 9a is a schematic diagram of the first structure of the grid antenna structure provided by the present application.

FIG. 9b is a schematic diagram of the second structure of the grid antenna structure provided by the present application.

FIG. 9c is a schematic diagram of the third structure of the grid antenna structure provided by the present application.

FIG. 10 is a schematic diagram of the first structure of the grid unit of the grid antenna structure provided by the present application.

FIG. 11 is a schematic diagram of the second structure of the grid unit of the grid antenna structure provided by the present application.

Fig. 12a is a schematic structural diagram of the grid antenna structure provided by the present application covering the cover body.

Fig. 12b is a schematic structural diagram of the grid antenna structure provided by the present application partially covering the cover body.

FIG. 13 is a schematic diagram of the first structure of the second type of glass cover provided by the present application.

FIG. 14 is a schematic diagram of the second structure of the second type of glass cover provided by the present application.

FIG. 15 is a schematic diagram of a third structure of the second type of glass cover provided by the present application.

FIG. 16 is a schematic diagram of the fourth structure of the second type of glass cover provided by the present application.

Fig. 17 is a fifth structural schematic diagram of the second glass cover provided by the present application.

FIG. 18 is a schematic diagram of the sixth structure of the second type of glass cover provided by the present application.

Fig. 19 is a schematic diagram of the seventh structure of the second glass cover provided by the present application.

FIG. 20 is a schematic diagram of the eighth structure of the second glass cover provided by the present application.

FIG. 21a is a schematic diagram of the ninth structure of the second type of glass cover provided by the present application.

FIG. 21b is a schematic diagram of the tenth structure of the second type of glass cover provided by the present application.

FIG. 22 is a schematic diagram of the first structure of the third glass cover provided by the present application.

FIG. 23 is a schematic diagram of the second structure of the third glass cover provided by this application.

FIG. 24 is a schematic diagram of the third structure of the third glass cover provided by the present application.

FIG. 25 is a schematic diagram of the fourth structure of the third glass cover provided by the present application.

FIG. 26 is a schematic diagram of a fifth structure of the third glass cover provided by the present application.

FIG. 27 is a schematic diagram of the sixth structure of the third glass cover provided by the present application.

Detailed ways

The present application provides an electronic device, which includes an electronic device body 10 and a cover plate 20 provided on the electronic device body 10. The cover 20 includes but is not limited to the following three structures. The cover plate will be described in detail as follows.

Please refer to FIGS. 1 to 3, the cover 20 includes a cover body 201 and an antenna structure 202. That is, the antenna structure 202 is provided inside the cover 20. The material of the antenna structure 202 is one of nano silver particles, indium tin oxide, an alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes. The material of the cover body 201 is one or more of acrylic polycarbonate (PC), polymethyl methacrylate (PMMA), a composite material of PMMA and PC, glass or PET. The antenna structure 202 has two shapes: one is layered, and the other is metal mesh. Both layered and metal meshed antenna structures 202 can be used as communication antennas. The formation process of the antenna structure 202 will be introduced later.

In this application, by arranging the antenna structure 202 in the cover plate 20, the antenna structure 202 is prevented from occupying the effective internal space of the electronic device, which solves the problem that the antenna structure 202 occupies too much internal effective space of the electronic device. Technical issues to meet structural design requirements. The structure of the cover plate 20 will be described as follows.

The first structure of the cover 20 is as follows:

The antenna structure 202 is arranged on a side of the cover body 201 away from the electronic device body 10. The positional relationship between the antenna structure 202 and the cover body 201 in this manner includes but is not limited to the following three sub-modes.

Sub-method 1:

1, the surface of the cover body 201 away from the electronic device body 10 is provided with a groove 201a. The groove 201a is in a grid shape. The material of the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is formed in a grid shape. The groove 201a is formed by laser etching or chemical etching. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. In other words, the groove 201 a is formed on the side of the cover body 201 away from the electronic device body 10, and the antenna structure 202 formed in the groove 201 a is also formed on the side of the cover body 201 away from the electronic device body 10.

Sub-mode two:

Referring to FIG. 2, the cover plate 20 further includes an adhesive layer 203, and the adhesive layer 203 is disposed on a side of the cover plate body 201 away from the electronic device body 10. In this embodiment, the glue layer 203 is UV glue. The adhesive layer 203 is provided with grooves 201a on the surface close to the cover body 201, and the grooves 201a are connected grids. The material of the antenna structure 202 is formed in the grooves 201a, so that the antenna structure 202 is formed as a mesh. Lattice-like. The groove 201a is formed on the adhesive layer 203 by nanoimprinting and other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. The groove 201a is formed on the side of the glue layer 203 close to the cover body 201, and the antenna structure 202 formed in the groove 201a is also formed on the side of the glue layer 203 close to the cover body 201.

Sub-mode three:

3, the surface of the adhesive layer 203 away from the cover body 201 is provided with a groove 201a, the groove 201a is in a grid shape, and the material of the antenna structure 202 is formed in the groove 201a, so that the antenna The structure 202 is formed in a grid shape. The groove 201a is formed on the adhesive layer 203 by nanoimprinting and other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. The groove 201a is formed on the side of the adhesive layer 203 away from the cover body 201, and the antenna structure 202 formed in the groove 201a is also formed on the side of the adhesive layer 203 away from the cover body 201.

In this embodiment, the grid-shaped antenna structure 202 fills the grid-shaped groove 201a with one of nano silver particles, indium tin oxide, indium tin oxide and silver alloy, silver nanowires, and carbon nanotubes. To form.

The surface of the antenna structure 202 is covered with one of an anti-fingerprint (AF) layer, a scratch-resistant hard coating (HC) layer, a diamond-like coating (DLC) layer, and a silicon nitride layer Or several of them.

The cover 20 further includes a decorative film 204 which is laminated on the cover body 201. The stacking positions of the decorative film 204, the cover body 201, and the adhesive layer 203 are as follows.

Please refer to FIG. 4 a, the first type: the decorative film 204 is disposed on the surface of the cover body 201 close to the electronic device body 10, and the decorative film 204 is disposed between the cover body 201 and the electronic device body 10.

Please refer to FIG. 4 b, the second type: the decorative film 204 is disposed on the surface of the cover body 201 away from the electronic device body 10, and the cover body 201 is disposed between the decorative film 204 and the electronic device body 10.

Please refer to FIG. 5, the third type: the decorative film 204 is provided on the side of the cover body 201 away from the electronic device body 10, and the decorative film 204 is provided on the adhesive layer 203 and the cover plate Between the body 201.

Please refer to Figure 6a, the fourth type: the decorative film 204 is provided on the side of the cover body 201 away from the electronic device body 10, and the adhesive layer 203 is provided on the cover body 201 and the decorative Between the membrane 204.

Please refer to FIG. 6b, the decorative film 204 is disposed between the cover body 201 and the adhesive layer 203.

Referring to FIG. 6c, the decorative film 204 is provided on a side of the cover body 201 close to the electronic device body 10.

The different positions of the above-mentioned decorative film 204 satisfy more appearance requirements of users and improve user experience.

Referring to FIG. 7, the decorative film 204 includes a decorative adhesive layer 2041 and a NCVM (discontinuous coating technology) coating layer 2042. The decorative adhesive layer 2041 includes a texture structure formed on the decorative adhesive layer 2041 by an embossing process. On the surface. The decorative glue layer 2041 is also UV glue.

The decoration film 204 also includes an INK ink layer 2043; the stacking sequence of the film layers of the decoration film 204 is the decoration glue layer 2041, the NCVM coating layer 2042, and the INK ink layer 2043.

The decorative film 204 also includes a substrate layer 2045 and an optical adhesive layer (OCA) 2046. The stacking order of the film layers of the decorative film 204 is an optical adhesive layer (OCA) 2046, a substrate layer 2045, a decorative adhesive layer 2041, and NCVM. Coating layer 2042, INK ink layer 2043. The decorative film 204 layer is pasted on the cover body 201 with the substrate layer 2045 through the OCA glue 2046.

The method of forming the antenna structure 202 is described as follows. There are two ways to form the antenna structure 202.

Method 1: Referring to FIGS. 8a-8b, the antenna structure 202 can be formed by physical deposition or chemical deposition. After the antenna structure 202 is fabricated, the antenna structure 202 is attached to the surface of the cover body 201 as a whole. It can be attached to the surface of the cover body 201 near the electronic device body 10 (Figure 8a), or attached to the cover body 201 is away from the surface of the electronic device body 10 (FIG. 8b). The antenna structure 202 can cover the surface of the cover body 201 or partially cover the surface of the cover body 201. The specific production method is: forming a layer of transparent conductive material (such as indium tin oxide, indium tin oxide and silver alloy, silver nanowire, carbon nanotube, etc.) by direct coating, evaporation, sputtering or electroplating The entire surface is transparent conductive antenna structure 202. In this way, the manufactured antenna structure 202 is directly attached to the surface of the cover body 201, while saving space, the manufacturing method of the antenna structure 202 is simpler and more efficient.

Manner 2: Referring to FIG. 8c, the antenna structure 202 can be formed by filling a conductive material in the groove 201a of nanoimprinting, laser etching or chemical etching to form a grid-like antenna structure 202. According to design requirements, the groove 201a is of micro-nano level. The antenna structure 202 is grid-shaped. Specifically, a groove 201a can be formed on the cover plate 20 by laser etching or chemical etching, and a conductive material is filled in the groove 201a to form a grid-shaped antenna structure 202. When the groove 201a is formed on the glue layer 203, the glue layer 203 can be formed by coating, and then the groove 201a is formed by nanoimprint technology. After the glue layer 203 is cured, the conductive material is filled into the groove 201a. Then, a blackening process is performed to form the antenna structure 202. The conductive material is preferably a conductive metal material. Alternatively, a layer of conductive material (including all conductive metals and synthetic metals) can be obtained by evaporation, sputtering, or electroplating, and a grid-shaped conductive antenna structure 202 can be obtained through processes such as etching, development, and laser direct writing.

When the groove 201a is formed, the pattern of the groove 201a matches the pattern of the antenna structure 202. In a specific realization of waterproofing, the pattern of the groove 201a is a lattice-shaped groove body connected to each other, so that the antenna structure 202 formed by the conductive material accommodated in the groove 201a is grid-shaped and can be connected to the groove 201a. 201a matches well. The shape of the trough body may be a square, a square with an arc bottom, a trapezoid with a lower bottom longer than an upper bottom, a trapezoid with an upper bottom longer than a lower bottom, or other shapes such as irregular shapes.

Referring to FIGS. 9a to 9c, in some embodiments, the antenna structure 202 may be formed of grid-like conductive wires. The antenna structure 202 includes a plurality of grid units. The grid cells can be square, rhombus or regular hexagon or other shapes such as irregular shapes. A square grid unit means that each grid unit of the antenna structure 202 is square. The grid unit is rhombus or regular hexagon with similar meaning. The irregular shape of the grid unit means that the grid unit constituting the antenna structure 202 may include two or more combinations of square, rhombus, regular hexagon, rectangle and other random shapes. It can be understood that the antenna structure 202 is grid-shaped to keep the antenna structure 202 having high light transmittance.

In some embodiments, the antenna structure 202 integrally formed by a plurality of grid units may have a strip shape, an I-shape or a "C" shape. In the present application, the specific shape of the antenna structure 202 is not limited here, and may also be other shapes than the above-mentioned shapes, which are determined based on specific actual conditions.

In some embodiments, the grid unit is formed by curing the conductive material filled in the groove 201a. The conductive material may be a metal material or indium tin oxide (ITO). Preferably, the conductive material is a metal material, and the metal material is selected from gold ((Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum ((Mo)), aluminum (Al)) and zinc (Zn) One or an alloy formed of at least two of gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum ((Mo), aluminum ((Al)) and zinc (Zn).

Compared with expensive indium tin oxide (ITO), the price of gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum (Mo), aluminum (Al) and zinc (Zn) It is lower, which is conducive to reducing the price of the decorative film 204, and the conductivity of these metals can meet the requirements of conductivity. Moreover, the metal wire has better toughness and is not prone to cracking, which makes the antenna structure 202 conductive Relatively stable.

Please refer to FIG. 10, in some embodiments, the line width d1 of the grid may be 0.5um-35um. It can be understood that the light transmittance of the antenna structure 202 is related to the line width of the grid. The smaller the line width of the grid, the better the light transmittance of the cover 20. It can be understood that if the cover plate 20 does not require light transmittance, then a specific grid line width can be set to facilitate the size of the antenna to be manufactured.

In some embodiments, the grid spacing d2 may be 20um-500um. The grid spacing can be set according to light transmittance, conductivity, and cost.

Referring to FIG. 11, in some embodiments, the aperture d3 of the grid may be 20um-500um. It can be understood that the aperture d3 of the mesh is set according to light transmittance, conductivity, cost, and so on. The aperture d3 of the mesh includes the distance between the two sets of diagonal vertices.

In some embodiments, the grid lines are 0.5um-20um deep. It can be understood that the depth of the grid line is the thickness of the grid unit, and the depth of the grid line is related to the depth of the groove 201a, and the depth of the grid line can be set according to light transmittance, conductivity, cost, etc.

In some embodiments, the resistivity of the conductive material of the antenna structure 202 is low, and the sheet resistance of the antenna structure 202 may be less than or equal to 10 Ω/sq. In this way, it is beneficial to ensure the conductivity of the antenna structure 202 and is beneficial to signal transmission.

Please refer to FIG. 12a to FIG. 12b, the antenna structure 202 is a whole surface structure or a partial design according to requirements. In actual production, the antenna structure 202 can be designed as a whole structure or a partial structure according to the design requirements of the antenna structure 202.

The second structure of the cover 20 is as follows:

The difference from the first type of cover 20 is: the cover body 201 includes an upper cover 2011 and a lower cover 2012, the upper cover 2011 is far from the electronic device body 10, the lower cover 2012 is close to the electronic device body 10, and the antenna structure 202 is provided Between the upper cover plate 2011 and the lower cover plate 2012, either the antenna structure 202 is provided in the upper cover plate 2011, or the antenna structure 202 is provided in the lower cover plate 2012. The shape and forming process of the antenna structure 202 have been introduced above, and will not be repeated here.

The materials of the upper cover 2011 and the lower cover 2012 include but are not limited to acrylic polycarbonate (PC), polymethyl methacrylate (PMMA), a composite of PMMA and PC, glass or PET. In one of the embodiments, the material of the upper cover 2011 may be acrylic polymethylmethacrylate (PMMA), and the material of the lower cover 2012 may be acrylic polycarbonate (PC).

The positional relationship between the antenna structure 202 and the upper cover 2011 and the lower cover 2012 includes but is not limited to the following four modes.

Sub-method 1:

Referring to FIG. 13, the upper cover plate 2011 is provided with a groove 201a on the surface close to the lower cover plate 2012. The groove 201a is in a grid shape, and the material of the antenna structure 202 is formed in the groove 201a, so that The antenna structure 202 is formed in a grid shape. The groove 201a is formed by laser etching or chemical etching. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. In other words, the groove 201a is formed on the surface of the upper cover plate 2011 close to the lower cover plate 2012, and the antenna structure 202 formed in the groove 201a is also formed on the surface of the upper cover plate 2011 close to the lower cover plate 2012.

Sub-mode two:

Referring to FIG. 14, the lower cover plate 2012 is provided with a groove 201a on the surface close to the upper cover plate 2011. The groove 201a is in the shape of a connected grid, and the material of the antenna structure 202 is formed in the groove 201a, so that The antenna structure 202 is formed in a grid shape. The groove 201a is formed by laser etching, chemical etching or other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. In other words, the groove 201a is formed on the surface of the lower cover plate 2012 close to the upper cover plate 2011, and the antenna structure 202 formed in the groove 201a is also formed on the surface of the lower cover plate 2012 close to the upper cover plate 2011.

Sub-mode three:

Referring to FIG. 15, the cover plate 20 further includes an adhesive layer 203, the adhesive layer 203 is laminated between the upper cover plate 2011 and the lower cover plate 2012, and the antenna structure 202 is disposed on the adhesive layer 203 on. In this embodiment, the glue layer 203 is UV glue. The adhesive layer 203 is provided with grooves 201a on the surface close to the upper cover 2011. The grooves 201a are in a grid shape. The material of the antenna structure 202 is formed in the grooves 201a, so that the antenna structure 202 is formed as a mesh Lattice-like. The groove 201a is formed on the adhesive layer 203 by nanoimprinting and other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. The groove 201a is formed on the side of the glue layer 203 close to the upper cover 2011, and the antenna structure 202 formed in the groove 201a is also formed on the side of the glue layer 203 close to the upper cover 2011.

Sub-mode four:

Referring to FIG. 16, the adhesive layer 203 is provided with a groove 201a on the surface close to the lower cover plate 2012. The groove 201a is in a grid shape, and the material of the antenna structure 202 is formed in the groove 201a, so that the antenna The structure 202 is formed in a grid shape. The groove 201a is formed on the adhesive layer 203 by nanoimprinting and other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conduction. The groove 201 a is formed on the side of the adhesive layer 203 close to the lower cover 2012, and the antenna structure 202 formed in the groove 201 a is also formed on the side of the adhesive layer 203 close to the lower cover 2012.

The cover 20 further includes a decorative film 204 which is laminated on the cover body 201. The stacking positions of the decorative film 204, the upper cover 2011, the lower cover 2012, and the adhesive layer 203 are as follows.

Please refer to FIG. 17, the first type: the decorative film 204 is disposed between the upper cover 2011 and the adhesive layer 203.

Please refer to FIG. 18, the second type: the decorative film 204 is disposed between the lower cover 2012 and the adhesive layer 203.

Please refer to FIG. 19, the third type: the decorative film 204 is provided on the side of the upper cover plate 2011 away from the lower cover plate 2012.

Please refer to FIG. 20, the fourth type: the decorative film 204 is provided on the side of the lower cover plate 2012 away from the upper cover plate 2011.

When there is no glue layer 203, the positional relationship between the decorative film 204 and the upper cover 2011 and the lower cover 2012 is as follows.

Please refer to FIG. 21a, the fifth type: the decorative film 204 is provided on the side of the upper cover 2011 away from the lower cover 2012.

Please refer to FIG. 21 b, the sixth type: the decorative film 204 is provided on the side of the lower cover plate 2012 away from the upper cover plate 2011.

The seventh type: the decorative film 204 is provided between the lower cover plate 2012 and the upper cover plate 2011.

The structure of the decorative film 204 is the same as the structure of the decorative film 204 of the first cover structure, which will not be repeated here.

The third structure of the cover 20 is as follows:

The antenna structure 202 is arranged on a side of the cover body 201 close to the electronic device body 10. The shape and forming process of the antenna structure 202 have been introduced above, and will not be repeated here. The positional relationship between the antenna structure 202 and the cover body 201 in this manner includes but is not limited to the following three sub-modes.

Sub-method 1:

Referring to FIG. 22, the cover body 201 is provided with a groove 201a on the surface close to the electronic device body 10. The groove 201a is in a grid shape, and the material of the antenna structure 202 is formed in the groove 201a, so that The antenna structure 202 is formed in a grid shape. The groove 201a is formed by laser etching, chemical etching or other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. In other words, the groove 201 a is formed on the side of the cover body 201 close to the electronic device body 10, and the antenna structure 202 formed in the groove 201 a is also formed on the side of the cover body 201 close to the electronic device body 10.

Sub-mode two:

Please refer to FIG. 23, the cover plate further includes an adhesive layer 203, and the adhesive layer 203 is disposed on a side of the cover plate body 201 close to the electronic device body 10. The glue layer 203 is UV glue. The adhesive layer 203 is provided with grooves 201a on the surface close to the cover body 201, and the grooves 201a are connected grids. The material of the antenna structure 202 is formed in the grooves 201a, so that the antenna structure 202 is formed as a mesh. Lattice-like. The groove 201a is formed on the adhesive layer 203 by nanoimprinting and other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. The groove 201 a is formed on the side of the glue layer 203 close to the cover body 201, and the antenna structure 202 formed in the groove 201 a is also formed on the side of the glue layer 203 close to the cover body 201.

Sub-mode three:

Referring to FIG. 24, the surface of the adhesive layer 203 away from the cover body 201 is provided with a groove 201a. The groove 201a is in a grid shape, and the material of the antenna structure 202 is formed in the groove 201a, so that the antenna The structure 202 is formed in a grid shape. The groove 201a is formed on the adhesive layer 203 by nanoimprinting and other methods. The grid-shaped antenna structure 202 is formed by filling the grid-shaped groove 201a with conductive material. The groove 201 a is formed on the side of the glue layer 203 away from the cover body 201, and the antenna structure 202 formed in the groove 201 a is also formed on the side of the glue layer 203 close to the cover body 201.

The cover plate 20 also includes a decorative film 204. The stacking positions of the decorative film 204, the cover body 201, and the adhesive layer 203 are as follows.

Please refer to FIG. 25, the first type: the decorative film 204 is disposed on the surface of the cover body 201 away from the electronic device body 10.

Please refer to FIG. 26, the second type: the decorative film 204 is provided on the side of the cover body 201 close to the electronic device body 10, and the decorative film 204 is provided on the cover body 201 and the glue Between layers 203.

Please refer to FIG. 27, the third type: the decorative film 204 is provided on the side of the cover body 201 close to the electronic device body 10, and the adhesive layer 203 is provided on the cover body 201 and the decorative Between the membrane 204.

The structure of the decorative film 204 is the same as the structure of the decorative film 204 of the first type of cover structure and the second type of cover structure, and will not be repeated here.

The decorative film 204 will be described as follows. The decoration film 204 includes an antenna structure 202. The decorative film 204 is the above-mentioned decorative film 204. The antenna structure 202 is the same as the antenna structure 202 described above. The antenna structure 202 is provided between the substrate layer 2045 and the decorative adhesive layer 2041; or, the antenna structure 202 is provided between the NCVM coating layer 2042 and the decorative adhesive layer 2041; or, the antenna structure 202 is provided between the NCVM coating layer 2042 and the ink layer Between 2043.

The decoration film 204 may further include a glue layer 203, and the antenna structure 202 is installed on the glue layer 203. The manner of disposing the antenna structure 202 on the adhesive layer 203 is the same as the above. The two surfaces of the adhesive layer 203 can be provided with grooves 201a, and the antenna structure 202 is arranged in the groove 201a, which will not be repeated here. The glue layer 203 can be disposed between the substrate layer 2045 and the decorative glue layer 2041, or between the NCVM coating layer 2042 and the decoration glue layer 2041, or between the NCVM coating layer 2042 and the ink layer 2043. The shape and formation of the antenna structure 202 are the same as above.

In this way, by arranging the antenna structure 202 in the decorative film 204, the antenna structure 202 will not occupy the internal effective space of the electronic device, which solves the problem that the antenna structure 202 occupies too much internal effective space of the electronic device. Technical issues required by structural design.

And when the decorative film 204 of the present application is applied to the back cover, the transparent antenna structure 202 (metal mesh antenna, transparent metal antenna, ITO transparent antenna) of the present application is integrated in the decorative film 204, which has high transparency and low impedance. , Antenna placement location is optional, and other advantages of integrated design.

The decoration film 204 can be attached to the display surface of the display screen. If the ink layer 2043 is opaque, the ink layer 2043 and the antenna structure 202 can be arranged in the non-display area of the electronic device. The decoration film 204 has a transparent display window (not shown) ), the ink layer 2043 and the antenna structure 202 are located on one side of the display window. The display surface of the display screen is set corresponding to the display window. The display screen may be a touch screen. The panel can be a transparent panel, such as a glass panel or a sapphire panel.

In other embodiments, the decorative film 204 may be attached to a non-display touch panel of the electronic device to protect the touch panel.

The above-disclosed are only the preferred embodiments of the application, and of course the scope of rights of the application cannot be limited by this. Those of ordinary skill in the art can understand all or part of the process for realizing the above-mentioned embodiments and follow the claims of the application. The equivalent change of is still within the scope of the application.

Claims

A cover plate of an electronic device is used to cover an electronic device body, wherein the cover plate includes a cover plate body and an antenna structure, and the cover plate body includes an upper cover plate and an upper cover plate. Oppositely arranged lower cover, the lower cover is close to the electronic device body, the upper cover is far from the electronic device body; the antenna structure is arranged between the upper cover and the lower cover , Or the antenna structure is arranged in the upper cover plate, or the antenna structure is arranged in the lower cover plate;

Alternatively, the antenna structure is provided on a side of the cover body away from the electronic device body.
The cover plate according to claim 1, wherein the surface of the upper cover plate close to the lower cover plate is provided with grooves, the grooves are connected in a grid shape, and the antenna structure is a grid shape , The antenna structure is arranged in the groove.
The cover plate according to claim 1, wherein the surface of the lower cover plate close to the upper cover plate is provided with grooves, the grooves are connected in a grid shape, and the antenna structure is a grid shape , The antenna structure is arranged in the groove.
The cover plate according to claim 1, wherein the cover plate further comprises an adhesive layer, the adhesive layer is laminated between the upper cover plate and the lower cover plate, and the antenna structure is arranged on the Mentioned on the glue layer.
The cover plate according to claim 4, wherein the surface of the adhesive layer close to the upper cover plate is provided with grooves, the grooves are connected in a grid shape, and the antenna structure is in a grid shape, The antenna structure is arranged in the groove.
The cover plate according to claim 4, wherein the surface of the adhesive layer close to the lower cover plate is provided with grooves, the grooves are connected in a grid shape, and the antenna structure is in a grid shape, The antenna structure is arranged in the groove.
The cover plate according to claim 1, wherein the cover plate further comprises a decorative film,

The decorative film is arranged on the side of the lower cover plate close to the main body of the electronic device;

Or, the decorative film is provided on a side of the upper cover plate away from the main body of the electronic device;

Or, the decorative film is arranged between the upper cover plate and the lower cover plate.
The cover plate according to claim 4, wherein the cover plate further comprises a decorative film,

The decorative film is arranged between the upper cover plate and the glue layer;

Or, the decorative film is provided between the lower cover plate and the adhesive layer;

Or, the decorative film is arranged on the side of the lower cover close to the main body of the electronic device;

Or, the decorative film is arranged on a side of the upper cover plate away from the main body of the electronic device.
The cover according to claim 1, wherein the surface of the cover body away from the electronic device is provided with grooves, the grooves are connected in a grid shape, and the antenna structure is in a grid shape, The antenna structure is arranged in the groove.
The cover plate according to claim 1, wherein the cover plate further comprises an adhesive layer, and the adhesive layer is provided on a side of the cover body away from the electronic device body.
The cover according to claim 10, wherein the surface of the adhesive layer close to the cover body is provided with the grooves, the grooves are connected in a grid shape, and the antenna structure is a grid The antenna structure is arranged in the groove.
The cover plate according to claim 10, wherein the surface of the adhesive layer away from the cover plate body is provided with grooves, the grooves are connected in a grid shape, and the antenna structure is in a grid shape, The antenna structure is arranged in the groove.
The cover plate according to claim 1, wherein the cover plate further comprises a decorative film, and the decorative film is provided on a surface of the cover body close to the electronic device body; or the decorative film is provided On the surface of the cover body away from the electronic device body.
The cover according to claim 10, wherein the cover further comprises a decorative film, the decorative film is arranged on the side of the cover body away from the electronic device, and the decorative film is arranged on the Between the cover body and the glue layer, or the glue layer is provided between the cover body and the decorative film;

Or the decorative film is arranged on the side of the cover body close to the electronic device body.
The cover plate according to claim 8 or 14, wherein the decorative film includes a decorative adhesive layer, an NCVM coating layer, and an ink layer stacked in sequence, the decorative adhesive layer includes a texture structure, and the decorative adhesive The layer fixes the decorative film on the cover body.
The cover plate according to claim 15, wherein the decorative film further comprises a substrate layer and an optical adhesive layer, the optical adhesive layer, the substrate layer, the decorative adhesive layer, and the NCVM coating The layer and the ink layer are stacked in sequence, and the optical adhesive layer adheres the substrate layer to the cover body.
The cover plate according to claim 1, wherein the antenna structure is formed on a surface of the upper cover plate close to the lower cover plate, or a surface of the lower cover plate close to the upper cover plate, so The cover body is away from the conductive film on the surface of the electronic device.
The cover plate according to claim 17, wherein the antenna structure is formed on the upper cover plate or the lower cover plate by direct coating, evaporation, sputtering or electroplating a layer of transparent conductive material. , Or the conductive film on the surface of the cover body.
An electronic device, characterized by comprising an electronic device body and the cover plate according to any one of claims 1-18, and the cover plate is covered on the electronic device body.