CN210519207U - Electronic equipment and cover plate thereof - Google Patents
Electronic equipment and cover plate thereof Download PDFInfo
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- CN210519207U CN210519207U CN201921201729.XU CN201921201729U CN210519207U CN 210519207 U CN210519207 U CN 210519207U CN 201921201729 U CN201921201729 U CN 201921201729U CN 210519207 U CN210519207 U CN 210519207U
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Abstract
The utility model provides an electronic equipment and apron thereof. The cover plate of the electronic equipment is used for covering the electronic equipment body and comprises a cover plate body and an antenna structure, and the antenna structure is arranged on one side, far away from the electronic equipment body, of the cover plate body. Antenna structure locates the apron body is kept away from one side of electronic equipment body, antenna structure sets up in the apron promptly, and then avoids antenna structure can occupy electronic equipment's inside effective space, has solved because antenna structure occupies electronic equipment's inside effective space too big and lead to electronic equipment not to satisfy the technical problem of structural design requirement.
Description
Technical Field
The utility model relates to an electronic equipment technical field, in particular to electronic equipment and apron thereof.
Background
Currently, antennas of electronic products are designed based on flexible circuit boards. With the higher and higher screen occupation ratio of the full screen, the requirement of the arrival of 5G on the position and the area of the antenna is more and more, and the existing electronic equipment can not meet the structural design requirement due to the fact that the antenna structure occupies too large internal effective space of the electronic equipment.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic equipment's apron and electronic equipment to solve electronic equipment because the antenna structure occupies electronic equipment's inside effective space too big and make the not satisfied technical problem of structural design requirement of electronic equipment.
The utility model provides an electronic equipment's apron for the lid fits on the electronic equipment body, the apron is including apron body and antenna structure, antenna structure locates the apron body is kept away from one side of electronic equipment body. Antenna structure locates the apron body is kept away from one side of electronic equipment body, antenna structure sets up in the apron promptly, and then avoids antenna structure can occupy electronic equipment's inside effective space, has solved because antenna structure occupies electronic equipment's inside effective space too big and lead to electronic equipment not to satisfy the technical problem of structural design requirement.
The surface of the cover plate body, far away from the electronic equipment, is provided with a groove, the groove is communicated with the grid, the antenna structure is grid, and the antenna structure is arranged in the groove. The antenna structure is arranged in the groove of the cover plate body, the thickness of the cover plate body occupied by the antenna structure is omitted, and the electronic equipment is more compact and convenient to lighten and thin.
The cover plate further comprises a glue layer, and the glue layer is arranged on one side, far away from the electronic equipment body, of the cover plate body. The adhesive layer is used for accommodating the antenna structure and is used for bonding other film layers.
The surface of the glue layer, which is close to the cover plate body, is provided with the groove, the groove is communicated with the grid, the antenna structure is in the grid, and the antenna structure is arranged in the first accommodating groove. The antenna structure is arranged in the groove of the adhesive layer, the thickness of the adhesive layer occupied by the antenna structure is omitted, and the electronic equipment is more compact and convenient to lighten and thin.
The surface of the cover plate body is far away from the adhesive layer and is provided with a groove, the groove is communicated with the grid, the antenna structure is grid, and the antenna structure is arranged in the groove. The antenna structure is arranged in the groove of the adhesive layer, the thickness of the adhesive layer occupied by the antenna structure is omitted, and the electronic equipment is more compact and convenient to lighten and thin.
The cover plate further comprises a decorative film, and the decorative film is arranged on the surface, close to the electronic equipment body, of the cover plate body; or the decorative film is arranged on the surface of the cover plate body far away from the electronic equipment body.
The cover plate further comprises a decorative film, the decorative film is arranged on one side, far away from the electronic equipment, of the cover plate body, and the decorative film is arranged between the cover plate body and the adhesive layer, or the adhesive layer is arranged between the cover plate body and the decorative film; or the decorative film is arranged on one side of the cover plate body close to the electronic equipment body. The different positions of the decorative film meet more appearance requirements of users, and the user experience is improved.
The decorative film comprises a decorative adhesive layer, an NCVM (non-volatile memory) coating layer and an ink layer which are sequentially stacked, the decorative adhesive layer comprises a texture structure, and the decorative adhesive layer is fixed on the cover plate body. The decorative glue layer realizes the texture effect of the decorative film, the NCVM coating layer realizes the color effect of the decorative film, and the ink layer is used for shielding devices in a non-display area of the electronic equipment.
The decorative film further comprises a substrate layer and an optical adhesive layer, the substrate layer, the decorative adhesive layer, the NCVM coating layer and the ink layer are sequentially stacked, and the optical adhesive layer is used for pasting the substrate layer on the cover plate body. The substrate layer has realized the explosion-proof effect of decorating the membrane, and the optics glue film has realized fixing the substrate layer on the apron body.
The antenna structure is a conductive film formed on the surface of the cover plate body far away from the electronic equipment. The antenna structure has simple structure and is easy to manufacture.
The antenna structure is a conductive film formed on the surface of the cover plate body by a method of directly coating, evaporating, sputtering or electroplating a layer of transparent conductive material. The antenna structure has the advantages of simple manufacturing mode and higher efficiency.
The utility model provides an electronic equipment, including electronic equipment body and foretell apron, the apron lid closes on the electronic equipment body. Electronic equipment includes above-mentioned apron, and antenna structure sets up in the apron, has avoided antenna structure can occupy electronic equipment's inside effective space, has solved because antenna structure occupies electronic equipment's inside effective space too big and lead to electronic equipment not to satisfy the technical problem that structural design required. The structure of the cover plate will be described as follows.
To sum up, the utility model discloses a set up antenna layer inside the apron, and then avoid antenna structure can occupy electronic equipment's inside effective space, solved because antenna structure occupies electronic equipment's inside effective space too big and lead to the not satisfied technical problem of structural design requirement of electronic equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of a first structure of a first cover plate provided by the present invention.
Fig. 2 is a schematic diagram of a second structure of the first cover plate provided by the present invention.
Fig. 3 is a third schematic structural diagram of the first cover plate provided by the present invention.
Fig. 4a is a schematic diagram of a fourth structure of the first cover plate according to the present invention.
Fig. 4b is a schematic diagram of a fifth structure of the first cover plate according to the present invention.
Fig. 5 is a schematic diagram of a sixth structure of the first cover plate according to the present invention.
Fig. 6a is a schematic diagram of a seventh structure of the first cover plate according to the present invention.
Fig. 6b is an eighth structural schematic diagram of the first cover plate according to the present invention.
Fig. 6c is a schematic diagram of a ninth structure of the first cover plate according to the present invention.
Fig. 7 is a schematic structural diagram of the decoration film provided by the present invention.
Fig. 8a is a schematic structural diagram of a layered antenna structure provided by the present invention.
Fig. 8b is another schematic structural diagram of the layered antenna structure provided by the present invention.
Fig. 8c is a schematic diagram of the structure of the groove.
Fig. 9a is a schematic diagram of a first structure of a grid antenna structure according to the present invention.
Fig. 9b is a schematic diagram of a first structure of the mesh antenna structure provided by the present invention.
Fig. 9c is a schematic diagram of a first structure of the mesh antenna structure provided by the present invention.
Fig. 10 is a first structural schematic diagram of a grid unit of the grid antenna structure provided by the present invention.
Fig. 11 is a second schematic structural diagram of a grid unit of the grid antenna structure provided in the present invention.
Fig. 12a is a schematic structural diagram of the cover plate body fully covered by the grid antenna structure provided by the present invention.
Fig. 12b is a schematic structural diagram of the grid antenna structure partially filled with the cover plate body.
Fig. 13 is a schematic view of a first structure of a second glass cover plate according to the present invention.
Fig. 14 is a second structural schematic diagram of a second glass cover plate provided by the present invention.
Fig. 15 is a third schematic structural diagram of a second glass cover plate according to the present invention.
Fig. 16 is a schematic diagram of a fourth structure of a second glass cover plate according to the present invention.
Fig. 17 is a fifth schematic structural view of a second glass cover plate according to the present invention.
Fig. 18 is a schematic view of a sixth structure of a second glass cover plate according to the present invention.
Fig. 19 is a seventh structural schematic diagram of the second glass cover plate provided by the present invention.
Fig. 20 is an eighth structural schematic diagram of the second glass cover plate according to the present invention.
Fig. 21a is a schematic view of a ninth structure of a second glass cover plate according to the present invention.
Fig. 21b is a schematic view of a tenth structure of the second glass cover plate according to the present invention.
Fig. 22 is a schematic view of a first structure of a third glass cover plate according to the present invention.
Fig. 23 is a schematic view of a second structure of a third glass cover plate according to the present invention.
Fig. 24 is a third schematic structural view of a third glass cover plate according to the present invention.
Fig. 25 is a fourth schematic structural diagram of a third glass cover plate according to the present invention.
Fig. 26 is a fifth schematic structural view of a third glass cover plate according to the present invention.
Fig. 27 is a schematic view of a sixth structure of a third glass cover plate according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides an electronic equipment, include electronic equipment body 10 and locate apron 20 on electronic equipment body 10. The cover plate 20 includes, but is not limited to, the following three structures. The cover plate will be described in detail as follows.
Referring to fig. 1-3, the cover plate 20 includes a cover plate body 201 and an antenna structure 202. That is, the antenna structure 202 is provided inside the cover plate 20. The antenna structure 202 is made of one of nano-silver particles, indium tin oxide, alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes. The cover plate body 201 is made of one or more of acrylic Polycarbonate (PC), polymethyl methacrylate (PMMA), a composite material of PMMA and PC, and glass or PET. The shape of the antenna structure 202 includes two types: one is layered and the other is metal grid. Both the layered and metal mesh antenna structures 202 may be used as communication antennas. The formation process of the antenna structure 202 will be described later.
The utility model discloses in, through setting up antenna structure 202 in apron 20, and then avoid antenna structure 202 can occupy electronic equipment's inside effective space, solved because antenna structure 202 occupies electronic equipment's inside effective space too big and lead to the not satisfied technical problem of structural design requirement of electronic equipment. The structure of the cover plate 20 will be described as follows.
The first configuration of the cover plate 20 is as follows:
the antenna structure 202 is disposed on a side of the cover plate body 201 away from the electronic device body 10. The positional relationship between the antenna structure 202 and the cover plate body 201 in this manner includes, but is not limited to, the following three sub-manners.
The first sub-mode is as follows:
referring to fig. 1, a groove 201a is formed on a surface of the cover plate body 201 away from the electronic device body 10, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed by laser etching, chemical etching, or the like. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. That is, the groove 201a is formed on the side of the cover body 201 away from the electronic device body 10, and the antenna structure 202 formed in the groove 201a is also formed on the side of the cover body 201 away from the electronic device body 10.
The second sub-mode:
referring to fig. 2, the cover plate 20 further includes a glue layer 203, and the glue layer 203 is disposed on a side of the cover plate body 201 away from the electronic device body 10. In this embodiment, the adhesive layer 203 is a UV adhesive. The surface of the glue layer 203 close to the cover plate body 201 is provided with a groove 201a, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a by the material, so that the antenna structure 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. The groove 201a is formed on the side of the glue layer 203 close to the cover plate body 201, and the antenna structure 202 formed in the groove 201a is also formed on the side of the glue layer 203 close to the cover plate body 201.
The third sub-mode:
referring to fig. 3, a groove 201a is formed on the surface of the glue layer 203 away from the cover plate body 201, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. The groove 201a is formed on the side of the glue layer 203 far away from the cover plate body 201, and the antenna structure 202 formed in the groove 201a is also formed on the side of the glue layer 203 far away from the cover plate body 201.
In this embodiment, the grid-shaped antenna structure 202 is formed by filling one of nano-silver particles, indium tin oxide, an alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes in the grid-shaped groove 201 a.
The surface of the antenna structure 202 is covered with one or more of an Anti-fingerprint (AF) layer, a scratch-resistant Hardening (HC) layer, a Diamond-like carbon (DLC) layer, and a silicon nitride layer.
The cover plate 20 further comprises a decorative film 204, and the decorative film 204 is laminated on the cover plate body 201. The lamination positions of the decoration film 204, the cover plate body 201, and the adhesive layer 203 are as follows.
Referring to fig. 4a, the first method: the decoration film 204 is disposed on the surface of the cover plate body 201 close to the electronic device body 10, and the decoration film 204 is disposed between the cover plate body 201 and the electronic device body 10.
Please refer to fig. 4b, a second method: the decoration film 204 is disposed on the surface of the cover plate body 201 away from the electronic device body 10, and the cover plate body 201 is disposed between the decoration film 204 and the electronic device body 10.
Please refer to fig. 5, the third: the decoration film 204 is disposed on a side of the cover plate body 201 far away from the electronic device body 10, and the decoration film 204 is disposed between the glue layer 203 and the cover plate body 201.
Please refer to fig. 6a, the fourth: the decoration film 204 is disposed on a side of the cover plate body 201 away from the electronic device body 10, and the glue layer 203 is disposed between the cover plate body 201 and the decoration film 204.
Referring to fig. 6b, the decoration film 204 is disposed between the cover plate body 201 and the glue layer 203.
Referring to fig. 6c, the decoration film 204 is disposed on a side of the cover plate body 201 close to the electronic device body 10.
The different positions of the decorative film 204 meet more appearance requirements of users, and the user experience is improved.
Referring to fig. 7, the decoration film 204 includes a decoration glue layer 2041 and a coating layer 2042 of NCVM (discontinuous coating technique), and the decoration glue layer 2041 includes a texture structure, and the texture structure is formed on the surface of the decoration glue layer 2041 by a stamping process. The decorative glue layer 2041 is also UV glue.
The decoration film 204 further includes an INK layer of INK 2043; the laminating sequence of the film layers of the decoration film 204 is a decoration glue layer 2041, an NCVM coating layer 2042 and an INK INK layer 2043 in sequence.
The decorative film 204 further includes a substrate layer 2045 and an optical adhesive layer (OCA)2046, the lamination sequence of the film layer of the decorative film 204 is an optical adhesive layer (OCA)2046, a substrate layer 2045, a decorative adhesive layer 2041, an NCVM coating layer 2042, and an INK layer 2043 in sequence. The decorative film 204 layer is pasted on the cover plate body 201 through the OCA glue 2046 with the base material layer 2045.
The manner in which the antenna structure 202 is formed is described below. There are two ways to form the antenna structure 202.
The first method is as follows: referring to fig. 8 a-8 b, the antenna structure 202 may be formed by physical deposition or chemical deposition. After the antenna structure 202 is manufactured, the entire antenna structure 202 may be attached to the surface of the cover body 201, or may be attached to the surface of the cover body 201 close to the electronic device body 10 (fig. 8a), or attached to the surface of the cover body 201 far from the electronic device body 10 (fig. 8 b). The antenna structure 202 may be formed to cover the surface of the cover body 201, or to partially cover the surface of the cover body 201. The specific manufacturing method comprises the following steps: a layer of transparent conductive antenna structure 202 is formed by directly coating, evaporating, sputtering or plating a layer of transparent conductive material (e.g., indium tin oxide, alloy of indium tin oxide and silver, silver nanowire, carbon nanotube, etc.). Therefore, the manufactured antenna structure 202 is directly attached to the surface of the cover plate body 201, the space is saved, the manufacturing mode of the antenna structure 202 is simple, and the efficiency is higher.
The second method comprises the following steps: referring to fig. 8c, the antenna structure 202 may be formed by filling a conductive material in the nano-imprinted, laser-etched or chemically-etched groove 201a to form a grid-shaped antenna structure 202. The grooves 201a are on the micro-nanometer scale, as required by the design. The antenna structure 202 is in a grid shape. Specifically, a groove 201a may be formed on the cover plate 20 by laser etching or chemical etching, and the groove 201a may be filled with a conductive material to form the grid-shaped antenna structure 202. When the groove 201a is formed on the adhesive layer 203, the adhesive layer 203 may be formed by coating, then the groove 201a is formed by using a nano imprinting technique, after the adhesive layer 203 is cured, a conductive material is filled in the groove 201a, and then blackening treatment is performed to form the antenna structure 202. The conductive material is preferably a conductive metal material. Alternatively, the conductive antenna structure 202 may be obtained by evaporating, sputtering or plating a layer of conductive material (including all conductive metals and composite metals), etching, developing, laser direct writing, etc.
When the groove 201a is formed, the pattern of the groove 201a matches the pattern of the antenna structure 202. In one particular implementation, the pattern of the grooves 201a is a lattice-like trough that is interconnected so that the antenna structure 202 formed by the conductive material received into the grooves 201a is in a grid-like shape and can better match the grooves 201 a. The shape of the latticed groove body can be square, the bottom edge of the latticed groove body is arc-shaped, the lower bottom of the latticed groove body is longer than the upper bottom of the latticed groove body, the upper bottom of the latticed groove body is longer than the lower bottom of the latticed groove body, or other shapes such as irregular shapes.
Referring to fig. 9a to 9c, in some embodiments, the antenna structure 202 may be formed by a grid-shaped conductive line. The antenna structure 202 includes a plurality of grid cells. The grid cells may be square, diamond, or regular hexagon or other shapes such as irregular shapes. The grid cells being square means that each grid cell of the antenna structure 202 is square. Grid cells have a similar meaning for rhombuses or regular hexagons. The irregular shape of the grid cells means that the grid cells forming the antenna structure 202 may include a combination of two or more of a square, a diamond, a regular hexagon, a rectangle, and other random shapes. It is understood that the antenna structure 202 is in a grid shape to maintain a high light transmittance of the antenna structure 202.
In some embodiments, the antenna structure 202 formed integrally from a plurality of grid cells may be in the form of a strip, an i-shape, or a "C" shape. In the present application, the specific shape of the antenna structure 202 is not limited herein, and may be other shapes than the above shapes, which are determined according to specific practical situations.
In some embodiments, the grid unit is formed by solidifying the conductive material filled in the groove 201 a. The conductive material may be a metal material or Indium Tin Oxide (ITO). Preferably, the conductive material is a metal material selected from one of gold ((Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum ((Mo), aluminum (Al), and zinc (Zn), or an alloy of at least two of gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum ((Mo), aluminum ((Al), and zinc (Zn).
Compared with expensive Indium Tin Oxide (ITO), the price of gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum (Mo), aluminum ((Al) and zinc (Zn) is low, which is beneficial to reducing the price of the decoration film 204, and the conductivity of the metals can meet the conductivity requirement.
Referring to FIG. 10, in some embodiments, the line width d1 of the grid may be 0.5um to 35 um. It will be appreciated that the light transmission of the antenna structure 202 is related to the line width of the grid, and the smaller the line width of the grid, the better the light transmission of the cover plate 20. It will be appreciated that if the cover 20 does not require optical transparency, then the particular grid line width is set in a size that facilitates manufacture of the antenna.
In some embodiments, the grid spacing d2 may be 20um to 500 um. The mesh pitch may be set according to light transmittance, conductivity, cost, and the like.
Referring to fig. 11, in some embodiments, the aperture d3 of the mesh may be 20um to 500 um. It is understood that the aperture d3 of the mesh is provided in consideration of light transmittance, conductivity, cost, and the like. The aperture d3 of the mesh includes the distance between two sets of diagonal vertices.
In some embodiments, the grid lines are 0.5 um-20 um deep. It is understood that the depth of the grid lines is the thickness of the grid cells, the depth of the grid lines is related to the depth of the groove 201a, and the depth of the grid lines can be set according to the light transmittance, the electrical conductivity, the cost, and the like.
In some embodiments, the resistivity of the conductive material of the antenna structure 202 is low, and the sheet resistance of the antenna structure 202 may be 10 Ω/sq or less. Thus, the antenna structure 202 is conductive, and signal transmission is facilitated.
Referring to fig. 12 a-12 b, the antenna structure 202 is designed as a whole or as required. In actual manufacturing, the antenna structure 202 may be designed to be a whole-surface structure or a partial structure according to design requirements of the antenna structure 202.
The second structure of the cover plate 20 is as follows:
unlike the first cover plate 20: the cover plate body 201 includes an upper cover plate 2011 and a lower cover plate 2012, the upper cover plate 2011 is far away from the electronic device body 10, the lower cover plate 2012 is close to the electronic device body 10, and the antenna structure 202 is disposed between the upper cover plate 2011 and the lower cover plate 2012, or the antenna structure 202 is disposed in the upper cover plate 2011, or the antenna structure 202 is disposed in the lower cover plate 2012. The shape and formation process of the antenna structure 202 are described above and will not be described herein.
The material of the upper cover 2011 and the lower cover 2012 includes but is not limited to acrylic Polycarbonate (PC), polymethyl methacrylate (PMMA), a composite material of PMMA and PC, and glass or PET. In one embodiment, the upper plate 2011 may be made of polymethyl methacrylate (PMMA), and the lower plate 2012 may be made of Polycarbonate (PC).
The positional relationship between the antenna structure 202 and the upper cap 2011 and the lower cap 2012 includes, but is not limited to, the following 4 seed modes.
The first sub-mode is as follows:
referring to fig. 13, a groove 201a is formed on the surface of the upper cover 2011 close to the lower cover 2012, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed by laser etching, chemical etching, or the like. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. That is, the groove 201a is formed on the surface of the upper cap 2011 close to the lower cap 2012, and the antenna structure 202 formed in the groove 201a is also formed on the surface of the upper cap 2011 close to the lower cap 2012.
The second sub-mode:
referring to fig. 14, a groove 201a is formed on the surface of the lower cover plate 2012 close to the upper cover plate 2011, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed by laser etching, chemical etching, or the like. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. That is, the recess 201a is formed on the surface of the lower cap 2012 close to the upper cap 2011, and the antenna structure 202 formed in the recess 201a is also formed on the surface of the lower cap 2012 close to the upper cap 2011.
The third sub-mode:
referring to fig. 15, the cover plate 20 further includes a glue layer 203, the glue layer 203 is stacked between the upper cover plate 2011 and the lower cover plate 2012, and the antenna structure 202 is disposed on the glue layer 203. In this embodiment, the adhesive layer 203 is a UV adhesive. The surface of the adhesive layer 203 close to the upper cover 2011 is provided with a groove 201a, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a by using the material, so that the antenna structure 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. The recess 201a is formed on the side of the glue layer 203 close to the upper cover 2011, and the antenna structure 202 formed in the recess 201a is also formed on the side of the glue layer 203 close to the upper cover 2011.
The sub-mode four:
referring to fig. 16, a groove 201a is formed on the surface of the adhesive layer 203 close to the lower cover plate 2012, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. A groove 201a is formed on a side of the glue layer 203 near the lower cover plate 2012, and an antenna structure 202 formed in the groove 201a is also formed on a side of the glue layer 203 near the lower cover plate 2012.
In this embodiment, the grid-shaped antenna structure 202 is formed by filling one of nano-silver particles, indium tin oxide, an alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes in the grid-shaped groove 201 a.
The surface of the antenna structure 202 is covered with one or more of an Anti-fingerprint (AF) layer, a scratch-resistant Hardening (HC) layer, a Diamond-like carbon (DLC) layer, and a silicon nitride layer.
The cover plate 20 further comprises a decorative film 204, and the decorative film 204 is laminated on the cover plate body 201. The lamination positions of the decorative film 204, the upper cap 2011, the lower cap 2012 and the adhesive layer 203 are as follows.
Referring to fig. 17, the first method: the decoration film 204 is disposed between the upper cover 2011 and the adhesive layer 203.
Please refer to fig. 18, the second: the decoration film 204 is disposed between the lower cover plate 2012 and the glue layer 203.
Please refer to fig. 19, the third: the decoration film 204 is disposed on a side of the upper cap 2011 away from the lower cap 2012.
Please refer to fig. 20, fourth: the decoration film 204 is disposed on a side of the lower cover plate 2012 remote from the upper cover plate 2011.
When the adhesive layer 203 is not provided, the decorative film 204 is positioned as follows with respect to the upper and lower covers 2011 and 2012.
Please refer to fig. 21a, the fifth: the decoration film 204 is disposed on a side of the upper cap 2011 away from the lower cap 2012.
Please refer to fig. 21b, the sixth: the decoration film 204 is disposed on a side of the lower cover plate 2012 remote from the upper cover plate 2011.
Seventh, the method comprises: the decoration film 204 is disposed between the lower cover plate 2012 and the upper cover plate 2011.
The structure of the decoration film 204 is the same as that of the decoration film 204 of the first cover structure, and is not described in detail herein.
The different positions of the decorative film 204 meet more appearance requirements of users, and the user experience is improved.
The third structure of the cover plate 20 is as follows:
the antenna structure 202 is disposed on a side of the cover plate body 201 close to the electronic device body 10. The shape and formation process of the antenna structure 202 are described above and will not be described herein. The positional relationship between the antenna structure 202 and the cover plate body 201 in this manner includes, but is not limited to, the following three sub-manners.
The first sub-mode is as follows:
referring to fig. 22, a groove 201a is formed on the surface of the cover plate body 201 close to the electronic device body 10, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed by laser etching, chemical etching, or the like. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. That is, the groove 201a is formed on the side of the cover body 201 close to the electronic device body 10, and the antenna structure 202 formed in the groove 201a is also formed on the side of the cover body 201 close to the electronic device body 10.
The second sub-mode:
referring to fig. 23, the cover plate further includes a glue layer 203, and the glue layer 203 is disposed on a side of the cover plate body 201 close to the electronic device body 10. The glue layer 203 is a UV glue. The surface of the glue layer 203 close to the cover plate body 201 is provided with a groove 201a, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a by the material, so that the antenna structure 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. The groove 201a is formed on the side of the glue layer 203 close to the cover plate body 201, and the antenna structure 202 formed in the groove 201a is also formed on the side of the glue layer 203 close to the cover plate body 201.
The third sub-mode:
referring to fig. 24, a groove 201a is formed on the surface of the glue layer 203 away from the cover plate body 201, the groove 201a is in a connected grid shape, and the antenna structure 202 is formed in the groove 201a, so that the antenna structure 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The mesh-shaped antenna structure 202 is formed by filling a conductive material in the mesh-shaped grooves 201 a. The groove 201a is formed on the side of the glue layer 203 far away from the cover plate body 201, and the antenna structure 202 formed in the groove 201a is also formed on the side of the glue layer 203 close to the cover plate body 201.
In this embodiment, the grid-shaped antenna structure 202 is formed by filling one of nano-silver particles, indium tin oxide, an alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes in the grid-shaped groove 201 a.
The surface of the antenna structure 202 is covered with one or more of an Anti-fingerprint (AF) layer, a scratch-resistant Hardening (HC) layer, a Diamond-like carbon (DLC) layer, and a silicon nitride layer.
The cover plate 20 also includes a decorative film 204. The lamination positions of the decoration film 204, the cover plate body 201, and the adhesive layer 203 are as follows.
Referring to fig. 25, the first: the decoration film 204 is disposed on the surface of the cover plate body 201 far away from the electronic device body 10.
Please refer to fig. 26, the second: the decoration film 204 is disposed on one side of the cover plate body 201 close to the electronic device body 10, and the decoration film 204 is disposed between the cover plate body 201 and the glue layer 203.
Please refer to fig. 27, the third: the decoration film 204 is disposed on one side of the cover plate body 201 close to the electronic device body 10, and the glue layer 203 is disposed between the cover plate body 201 and the decoration film 204.
The structure of the decoration film 204 is the same as the structure of the decoration film 204 of the first cover plate structure and the second cover plate structure, and the description thereof is omitted.
The decoration film 204 will be described as follows. The decorative film 204 includes an antenna structure 202. The decorative film 204 is the decorative film 204 described above. The antenna structure 202 is the same as the antenna structure 202 described above. The antenna structure 202 is arranged between the substrate layer 2045 and the decorative glue layer 2041; or, the antenna structure 202 is disposed between the NCVM coating layer 2042 and the decorative glue layer 2041; alternatively, the antenna structure 202 is disposed between the NCVM coating layer 2042 and the ink layer 2043.
The decoration film 204 may further include a glue layer 203, and the antenna structure 202 is mounted on the glue layer 203. The manner of disposing the antenna structure 202 on the adhesive layer 203 is the same as that described above, a groove 201a may be disposed on two surfaces of the adhesive layer 203, and the antenna structure 202 is disposed in the groove 201a, which is not described herein again. The glue layer 203 may be disposed between the substrate layer 2045 and the decorative glue layer 2041, or between the NCVM coating layer 2042 and the ink layer 2043. The shape and formation of the antenna structure 202 are the same as described above.
In this way, by disposing the antenna structure 202 in the decoration film 204, the antenna structure 202 does not occupy the internal effective space of the electronic device, thereby solving the technical problem that the electronic product does not meet the structural design requirement due to the fact that the antenna structure 202 occupies too much internal effective space of the electronic device.
And when the decorative film 204 of this application was used and is covered after, the utility model discloses a transparent antenna structure 202 (metal grid antenna, transparent metal antenna, ITO transparent antenna) is integrated in decorative film 204, has the advantage of the integrative design such as the position is placed to high transparency, low impedance, antenna.
The decoration film 204 may be attached on the display surface of the display screen, if the ink layer 2043 is opaque, the ink layer 2043 and the antenna structure 202 may be disposed in a non-display area of the electronic device, the decoration film 204 has a transparent display window (not shown), and the ink layer 2043 and the antenna structure 202 are located on one side of the display window. The display surface of the display screen is arranged corresponding to the display window. The display screen may be a touch display screen. The panel may be a transparent panel, such as a glass panel or a sapphire panel.
In other embodiments, the decorative film 204 may be attached to a non-display type touch panel of an electronic device to protect the touch panel.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (12)
1. The cover plate of the electronic equipment is used for covering the electronic equipment body and is characterized by comprising a cover plate body and an antenna structure, wherein the antenna structure is arranged on one side, far away from the electronic equipment body, of the cover plate body.
2. The cover plate according to claim 1, wherein a surface of the cover plate body away from the electronic device is provided with a groove, the groove is in a connected grid shape, the antenna structure is in a grid shape, and the antenna structure is disposed in the groove.
3. The cover plate according to claim 1, further comprising a glue layer disposed on a side of the cover plate body away from the electronic device body.
4. The cover plate according to claim 3, wherein a groove is formed in the surface of the adhesive layer, which is close to the cover plate body, the groove is in a connected grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove.
5. The cover plate according to claim 3, wherein a groove is formed in a surface of the adhesive layer away from the cover plate body, the groove is in a connected grid shape, the antenna structure is in a grid shape, and the antenna structure is arranged in the groove.
6. The cover plate according to claim 1, further comprising a decorative film disposed on a surface of the cover plate body adjacent to the electronic device body;
or the decorative film is arranged on the surface of the cover plate body far away from the electronic equipment body.
7. The cover plate according to claim 3, further comprising a decorative film disposed on a side of the cover plate body away from the electronic device, wherein the decorative film is disposed between the cover plate body and the adhesive layer, or the adhesive layer is disposed between the cover plate body and the decorative film;
or the decorative film is arranged on one side of the cover plate body close to the electronic equipment body.
8. The cover plate according to claim 6 or 7, wherein the decorative film comprises a decorative adhesive layer, an NCVM coating layer and an ink layer which are sequentially stacked, the decorative adhesive layer comprises a texture structure, and the decorative adhesive layer fixes the decorative film on the cover plate body.
9. The cover plate of claim 8, wherein the decorative film further comprises a substrate layer and an optical adhesive layer, the substrate layer, the decorative adhesive layer, the NCVM coating layer and the ink layer are sequentially stacked, and the optical adhesive layer attaches the substrate layer to the cover plate body.
10. The cover sheet according to claim 1, wherein the antenna structure is a conductive film formed on a surface of the cover sheet body away from the electronic device.
11. The cover plate according to claim 10, wherein the antenna structure is a conductive film formed on the surface of the cover plate body by directly coating, evaporating, sputtering or plating a layer of transparent conductive material.
12. An electronic device, comprising an electronic device body and the cover plate according to any one of claims 1 to 11, wherein the cover plate covers the electronic device body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921201729.XU CN210519207U (en) | 2019-07-27 | 2019-07-27 | Electronic equipment and cover plate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921201729.XU CN210519207U (en) | 2019-07-27 | 2019-07-27 | Electronic equipment and cover plate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210519207U true CN210519207U (en) | 2020-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921201729.XU Active CN210519207U (en) | 2019-07-27 | 2019-07-27 | Electronic equipment and cover plate thereof |
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| CN (1) | CN210519207U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519954A (en) * | 2019-07-27 | 2019-11-29 | 南昌欧菲光科技有限公司 | Electronic equipment and its cover board |
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2019
- 2019-07-27 CN CN201921201729.XU patent/CN210519207U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519954A (en) * | 2019-07-27 | 2019-11-29 | 南昌欧菲光科技有限公司 | Electronic equipment and its cover board |
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| TR01 | Transfer of patent right |
Effective date of registration: 20210416 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330013 Jiangxi city of Nanchang province Huangjiahu Changbei Economic Development Zone West o-film Technology Park Patentee before: Nanchang OFilm Tech. Co.,Ltd. |
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