CN205040098U - Porous polymer solid material substrate metal coating dielectric plate - Google Patents
Porous polymer solid material substrate metal coating dielectric plate Download PDFInfo
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- CN205040098U CN205040098U CN201520794672.4U CN201520794672U CN205040098U CN 205040098 U CN205040098 U CN 205040098U CN 201520794672 U CN201520794672 U CN 201520794672U CN 205040098 U CN205040098 U CN 205040098U
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- porous polymer
- film layer
- solid material
- substrate
- polymer solid
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Abstract
The utility model discloses a porous polymer solid material substrate metal coating dielectric plate, the dielectric plate comprises base plate and metal thin film layer, metal thin film layer directly sputters or coats on the side of base plate, and metal thin film layer can pass through mask or cross cutting, at the sputter or the in -process that coats, acquires design circuit, also can through etching or machining's method, process out design circuit after sputtering or coat, and perhaps the dual mode mutually combines. The utility model discloses simple structure has good dielectric properties, has promoted the performance of antenna greatly to possess characteristics such as low dielectric constant, low -loss, low cost and lightweight, and then provide new selection for high performance radio frequency system designs.
Description
Technical field
The utility model relates to a kind of dielectric-slab, is specifically related to a kind of porous polymer solid material substrate metal coating media plate.
Background technology
The large-scale printed circuit feeder panel that airborne radar device, phased array system, remote sensing satellite etc. are applied, microstrip antenna and antenna array etc., need printed board area very large, often there are several square metres, tens square metres even, need to use a large amount of circuit element in these antenna circuit simultaneously.Prior art adopts traditional copper-clad plate usually, namely arranges one deck Copper Foil as conductive layer at epoxy glass-fiber-fabric substrate surface: its circuit element is ready-made or special circuit series products, is arranged on the circuit layer of copper-clad plate with welding manner.Because the copper-clad plate joint behavior of prior art is poor, the application of microstrip antenna and high frequency antenna is very restricted.Simultaneously in prior art, the consistency of circuit series products and stability exist and cannot be guaranteed, thus greatly have impact on the performance of antenna.
Temperature stability and the absorbing property of conventional epoxy glass-fiber-fabric substrate are not good, make it be very limited in the application in the fields such as radar, aviation, satellite.
Utility model content
The utility model in order to solve the problem, thus provides a kind of porous polymer solid material substrate metal coating media plate with good dielectric property.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of porous polymer solid material substrate metal coating media plate, described dielectric-slab is made up of substrate and metal film layer, and described metal film layer is coated on the side of substrate side, and described metal film layer is provided with circuitous pattern.
In a preferred embodiment of the present utility model, described substrate is that base material is made by polymethacrylimide foam or polystyrene foam or polyimide foam or linear and crosslinked polyvinyl chloride foam or polyurethane foam or polyethylene porous polymer material.
In a preferred embodiment of the present utility model, described substrate is plane or 3D shape.
In a preferred embodiment of the present utility model, foam process corresponding matching in described substrate and expandable particles mould.
In a preferred embodiment of the present utility model, described metal film layer is formed directly on substrate by sputtering technology.
In a preferred embodiment of the present utility model, described metal film layer is be made up of the alloy of copper or copper.
In a preferred embodiment of the present utility model, described circuitous pattern is formed with circuit by etch process or sputtering technology.
In a preferred embodiment of the present utility model, the side of described substrate opposite side is also coated with metal film layer.
The beneficial effects of the utility model are:
The utility model structure is simple, has good dielectric property, greatly improves the performance of antenna, and possess the features such as low-k, low-loss, low cost and lightweight, and then provides new selection for high-performance radio-frequency system.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is profile of the present utility model;
Fig. 2 is the profile of the utility model both sides metallizing thin layer.
Embodiment
The technological means realized to make the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the utility model further.
See Fig. 1, the porous polymer solid material substrate metal coating media plate that the utility model provides, it comprises a substrate 100.
Substrate 100, it is plane or 3D shape, as during 3D shape specifically by machining, thermoforming or can foaming and or being formed by the mutual combination between above-mentioned three kinds in expanded polymer particles mould.
Substrate 100 is specifically that base material is made by polymethacrylimide foam or polystyrene foam or polyimide foam or linear and crosslinked polyvinyl chloride foam or polyurethane foam or polyethylene porous polymer material, such substrate 100 inside is porosu solid, foaming can change the density of substrate 100 in expanded polymer particles mould by what add varying number.
In addition, because substrate 100 adopts above-mentioned material to make, make substrate 100 not only high temperature resistant but also low temperature resistant.
The side of substrate 100 side is also coated with metal film layer 200, and metal film layer 200 is specially a conductive layer, and it is formed directly on substrate 100 especially by sputtering technology.
Metal film layer 200 is specifically made up of the alloy of copper or copper, and the alloy of nickel or nickel or the copper of nickel plating or nickel alloy also can be adopted to become.
Metal film layer 200 is provided with circuitous pattern, and circuitous pattern can be printed on metal film layer 200 especially by photoresist mask etch technique by circuitous pattern, and circuitous pattern is for the formation of circuit 300.
Circuitous pattern is formed with circuit 300 especially by etch process or sputtering technology.
In addition, metal film layer 200 specifically can pass through mask or cross cutting, in sputtering or coating procedure, form circuit 300, also can after sputtering or coating, by etching or the method for machining, process circuit 300, or be combined with each other by above-mentioned two kinds of modes.
Such circuit 300 conducts electricity by metal film layer 200, and metal film layer 200 directly applies on the substrate 100, because substrate 100 can coordinate the density changing self with particle mould, the density like this by changing substrate 100 can change dielectric property of the present utility model.
See Fig. 2, according to the actual requirements, the utility model also can also be coated with metal film layer 200 on the side of substrate 100 opposite side, and metal film layer 200 also can arrange circuit 300.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (8)
1. a porous polymer solid material substrate metal coating media plate, is characterized in that, described dielectric-slab is made up of substrate and metal film layer, and described metal film layer is coated on the side of substrate side, and described metal film layer is provided with circuitous pattern.
2. a kind of porous polymer solid material substrate metal coating media plate according to claim 1, it is characterized in that, described substrate is that base material is made by polymethacrylimide foam or polystyrene foam or polyimide foam or linear and crosslinked polyvinyl chloride foam or polyurethane foam or polyethylene porous polymer material.
3. a kind of porous polymer solid material substrate metal coating media plate according to claim 1, it is characterized in that, described substrate is plane or 3D shape.
4. a kind of porous polymer solid material substrate metal coating media plate according to claim 2, is characterized in that, foam process corresponding matching in described substrate and expandable particles mould.
5. a kind of porous polymer solid material substrate metal coating media plate according to claim 1, it is characterized in that, described metal film layer is formed directly on substrate by sputtering technology.
6. a kind of porous polymer solid material substrate metal coating media plate according to claim 1, it is characterized in that, described metal film layer is be made up of the alloy of copper or copper.
7. a kind of porous polymer solid material substrate metal coating media plate according to claim 1, it is characterized in that, described circuitous pattern is formed with circuit by etch process or sputtering technology.
8. a kind of porous polymer solid material substrate metal coating media plate according to claim 1, is characterized in that, the side of described substrate opposite side is also coated with metal film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520794672.4U CN205040098U (en) | 2015-10-14 | 2015-10-14 | Porous polymer solid material substrate metal coating dielectric plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520794672.4U CN205040098U (en) | 2015-10-14 | 2015-10-14 | Porous polymer solid material substrate metal coating dielectric plate |
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| Publication Number | Publication Date |
|---|---|
| CN205040098U true CN205040098U (en) | 2016-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520794672.4U Active CN205040098U (en) | 2015-10-14 | 2015-10-14 | Porous polymer solid material substrate metal coating dielectric plate |
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| CN (1) | CN205040098U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106448826A (en) * | 2016-11-03 | 2017-02-22 | 上海安费诺永亿通讯电子有限公司 | Electronic element, antenna and transmission line |
| CN110622628A (en) * | 2017-03-15 | 2019-12-27 | 香港物流及供应链管理应用技术研发中心 | Radio frequency communication guiding device |
| CN114552198A (en) * | 2022-04-25 | 2022-05-27 | 中国电子科技集团公司第二十九研究所 | Precise preparation method of light high-performance circuit |
-
2015
- 2015-10-14 CN CN201520794672.4U patent/CN205040098U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106448826A (en) * | 2016-11-03 | 2017-02-22 | 上海安费诺永亿通讯电子有限公司 | Electronic element, antenna and transmission line |
| CN110622628A (en) * | 2017-03-15 | 2019-12-27 | 香港物流及供应链管理应用技术研发中心 | Radio frequency communication guiding device |
| CN114552198A (en) * | 2022-04-25 | 2022-05-27 | 中国电子科技集团公司第二十九研究所 | Precise preparation method of light high-performance circuit |
| CN114552198B (en) * | 2022-04-25 | 2022-07-08 | 中国电子科技集团公司第二十九研究所 | Precise preparation method of light high-performance circuit |
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