CN203233595U - Base board before molding and base board after molding - Google Patents
Base board before molding and base board after molding Download PDFInfo
- Publication number
- CN203233595U CN203233595U CN 201320121291 CN201320121291U CN203233595U CN 203233595 U CN203233595 U CN 203233595U CN 201320121291 CN201320121291 CN 201320121291 CN 201320121291 U CN201320121291 U CN 201320121291U CN 203233595 U CN203233595 U CN 203233595U
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- moulding
- platelet
- area
- plate
- coverage
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Abstract
The utility model discloses a base board before molding and a base board after molding. An upper surface of the base board before molding is a device placing area, the base board before molding comprises at least one small board, an upper surface of each small board comprises a main small board area, a waste material area arranged at periphery of the main small board area and a metal covering area at periphery of the waste material area, and each metal covering area extends to each waste material area and realizes electrical insulation with each main small board area. A deformation degree of a base board before molding in a production process is meliorated, a high flatness of the base board after molding prepared by employing the base board before molding is guaranteed, so a product formed by employing the base board after molding is made to have excellent performance.
Description
Technical field
The utility model relates to technical field of integrated circuits, more particularly, relates to a kind of moulding prebasal plate and moulding metacoxal plate thereof.
Background technology
At present, common wiring board has FPC(Flexible Printed Circuit, soft board), PCB(Printed Circuit Board, printed circuit board (PCB)) and RF-PCB(Rigid and Flex PCB, Rigid Flex).
The FPC plate is owing to have advantages such as distribution density height, in light weight, thin thickness, in actual applications easy for installation, reliability is high, has very high application prospect.Pcb board has the wiring density height, volume is little, in light weight, is beneficial to characteristics such as automatic and mechanical production, nowadays is widely used.
The RF-PCB plate is combined by FPC plate and pcb board, and it possesses the characteristic of FPC plate and the characteristic of pcb board simultaneously, existing certain flexure region, the certain rigid zone is also arranged, to saving the product inner space, reduce finished-product volume, the good help of having enhanced product performance.
Though above-mentioned wiring board has obvious advantage, the problem that occurs in the wiring board production process is not allowed to ignore.The inventor finds that in process of production, for soft board and Rigid Flex, its whole evenness is not good.
The utility model content
In view of this, the utility model provides a kind of moulding prebasal plate and moulding metacoxal plate thereof, has improved the warping phenomenon of platelet main region, has improved the evenness of whole base plate.
For achieving the above object, the utility model provides following technical scheme:
A kind of moulding prebasal plate, the upper surface of this moulding prebasal plate is the device rest area, described moulding prebasal plate comprises at least one platelet, the upper surface of described platelet comprises the platelet main region, be positioned at the garbage area of described platelet main region periphery, and the metal area of coverage that is positioned at described garbage area periphery, the described metal area of coverage extends to described garbage area, and is electrically insulated with described platelet main region.
Preferably, the described metal area of coverage is the Copper Foil area of coverage.
Preferably, the outer peripheral spacing of the edge of the described metal area of coverage and described platelet main region is 0.1mm-0.5mm, comprises endpoint value.
Preferably, the outer peripheral spacing of the inward flange of the described metal area of coverage and described platelet main region is the required maximum allowance of described little sheet metal forming.
Preferably, the required maximum allowance of described little sheet metal forming is 0.2mm.
Preferably, described moulding prebasal plate is soft board or Rigid Flex.
A kind of moulding metacoxal plate, this moulding metacoxal plate adopts above-mentioned moulding prebasal plate to make, the upper surface of described moulding metacoxal plate is the device rest area, described moulding metacoxal plate comprises at least one platelet, described each platelet comprises the platelet main region, be positioned at the waste material vacancy section of described platelet main region periphery, and the metal area of coverage that is positioned at described waste material vacancy section periphery.
Preferably, the spacing of described waste material vacancy section is identical with the spacing of the garbage area of above-mentioned moulding prebasal plate.
Preferably, described moulding metacoxal plate is soft board or Rigid Flex.
Compared with prior art, technical scheme provided by the utility model has the following advantages:
Because the garbage area material is soft resin, garbage area and platelet main region mutual extrusion easily cause platelet main region generation deformation in process of production, and moulding prebasal plate provided by the utility model and moulding metacoxal plate thereof, the metal area of coverage of the platelet in the moulding prebasal plate is extended to garbage area, for single platelet, strengthened the rigidity intensity of garbage area, strengthen the restraining force to the platelet main region simultaneously, improved the deformation degree of the platelet main region that causes because of garbage area material reason.And the described metal area of coverage and platelet main region are electrically insulated, and when having avoided the gong limit, the gong cutter is to the damage of platelet main region.
Simultaneously, for whole base plate, the increase of the metal area coverage on the moulding prebasal plate, strengthened the restraining force of the metal area of coverage to substrate, avoided because the harmomegathus coefficient difference of the material of composing base, internal stress distribution is uneven and cause the situation of moulding prebasal plate generation deformation to produce, and has finally guaranteed the evenness height of the moulding metacoxal plate made by this moulding prebasal plate.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the vertical view of the platelet before the RF-PCB sheet metal forming in the prior art;
Fig. 2 a is the vertical view of moulding prebasal plate among the utility model embodiment;
Fig. 2 b is the platelet vertical view in the moulding prebasal plate among the utility model embodiment;
Fig. 3 a is the vertical view of moulding metacoxal plate among the utility model embodiment;
Fig. 3 b is the vertical view of the platelet in the moulding metacoxal plate among the utility model embodiment.
Embodiment
Just as stated in the Background Art, warping phenomenon often appears in the platelet main region, influences the evenness of whole base plate.The inventor discovers, the one of the main reasons that causes this defective be the garbage area of platelet because material is soft relatively resin, deformation easily in process of production, and then extruding or shrink the platelet main region make the deformation of platelet main region.
Be illustrated in figure 1 as platelet upper surface vertical view in the moulding prebasal plate, comprising platelet main region 101, garbage area 102 and the metal area of coverage 103.Concrete, the inventor finds that in the production process for whole moulding prebasal plate, the variations in temperature and the humidity that have in various degree change, and the moulding prebasal plate is made up of various material, and the harmomegathus coefficient difference of unlike material.Therefore, under the influence of different temperatures and humidity, corresponding deformation takes place in different materials, makes moulding prebasal plate internal stress distribution inhomogeneous, thereby causes the moulding prebasal plate that corresponding deformation takes place.
Simultaneously, the inventor finds that the metal area of coverage of each platelet has stronger restraining force to the sheet material of its below in the moulding prebasal plate, so it is not high that the degree of deformation should the zone takes place.Main deformation region occurs in platelet main region and garbage area, the material of garbage area is soft relatively resin, deformation takes place easily, the deformation of garbage area is pushed the platelet main region or is shunk, make the platelet main region that deformation also take place, and then influence the evenness of the moulding metacoxal plate that the postorder manufacturing obtains.
Based on this, the utility model provides a kind of moulding prebasal plate, to overcome the problems referred to above that prior art exists, the upper surface of this moulding prebasal plate is the device rest area, and described moulding prebasal plate comprises at least one platelet, and the upper surface of described platelet comprises the platelet main region, be positioned at the garbage area of described platelet main region periphery, and the metal area of coverage that is positioned at described garbage area periphery, the described metal area of coverage extends to described garbage area, and is electrically insulated with described platelet main region.
The utility model also provides a kind of moulding metacoxal plate, this moulding metacoxal plate adopts above-mentioned moulding prebasal plate to make, the upper surface of described moulding metacoxal plate is the device rest area, described moulding metacoxal plate comprises at least one platelet, described each platelet comprises the platelet main region, be positioned at the waste material vacancy section of described platelet main region periphery, and the metal area of coverage that is positioned at described waste material vacancy section periphery.
Moulding prebasal plate provided by the utility model and moulding metacoxal plate thereof extend to garbage area with the metal area of coverage of the platelet in the moulding prebasal plate, have improved garbage area and the platelet main region deformation degree of platelet in the moulding prebasal plate.And scrap metal district and platelet main region are electrically insulated, and when having avoided the gong limit, the gong cutter is to the damage of platelet main region.
Simultaneously, concerning whole moulding prebasal plate, the area coverage of the metal area of coverage is big, strengthened the rigidity intensity of moulding prebasal plate, the metal area of coverage is strengthened the restraining force of substrate, avoided in process of production, the moulding prebasal plate is owing to form the harmomegathus coefficient difference of material, internal stress distribution is uneven and cause the situation of moulding prebasal plate generation deformation to produce, and makes the evenness height that adopts the moulding metacoxal plate that above-mentioned moulding prebasal plate is made.
More than be core concept of the present utility model, can become apparent more for making above-mentioned purpose of the present utility model, feature and advantage, below in conjunction with accompanying drawing embodiment of the present utility model is described in detail.
A lot of details have been set forth in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization under the situation of the utility model intension, so the utility model is not subjected to the restriction of following public specific embodiment.
Secondly, the utility model is described in detail in conjunction with schematic diagram, when the utility model embodiment is described in detail in detail; for ease of explanation; the profile of expression device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of the utility model protection at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
Embodiment one
Present embodiment provides a kind of moulding prebasal plate, the upper surface of this moulding prebasal plate is the device rest area, described moulding prebasal plate comprises at least one platelet, the upper surface of described platelet comprises the platelet main region, be positioned at the garbage area of described platelet main region periphery, and the metal area of coverage that is positioned at described garbage area periphery, the described metal area of coverage extends to described garbage area, and is electrically insulated with described platelet main region.
Specifically in conjunction with shown in Fig. 2 a and Fig. 2 b, comprise at least one platelet 22 shown in Fig. 2 a in the moulding prebasal plate 21, Fig. 2 b is platelet 22 vertical views, its upper surface comprises platelet main region 201, garbage area 202 and the metal area of coverage 203, and the metal area of coverage 203 extends to garbage area 202, and with 201 insulation of platelet main region, the group black line partly is the metal area of coverage 203 and extends to garbage area 202 parts among Fig. 2 b.The preferable alloy area of coverage is the Copper Foil area of coverage in the present embodiment.
In the present embodiment, the outer peripheral spacing of the inward flange of the metal area of coverage 203 and platelet main region 201 is 0.1mm-0.5mm, comprises endpoint value.
Further, the outer peripheral spacing of the inward flange of the metal area of coverage 203 and platelet main region 201 is the required maximum allowance of described little sheet metal forming.The gong edge forming is the final step operation of making the moulding metacoxal plate, the maximum of used gong cutter and platelet main region 201 outward flange variable in distance when the required maximum allowance of above-mentioned little sheet metal forming is the gong limit, preferred this maximum is 0.2mm, and the required maximum allowance of namely little sheet metal forming is 0.2mm.
The moulding prebasal plate that present embodiment provides is preferably soft board or Rigid Flex.
Need to prove, remove in the present embodiment outside the metal area of coverage part of platelet 22, whole moulding prebasal plate 21 remainders are covered by metal level equally, and the part of can be as required in actual production the moulding prebasal plate being removed platelet 22 covers metal level.And the arrangement mode of the platelet in the present embodiment in the moulding prebasal plate is arrayed, but the utility model is not limited to the arrayed mode, in actual production, can adjust the arrangement mode of platelet as required.
Moulding prebasal plate provided by the utility model, the metal area of coverage of the platelet in the moulding prebasal plate is extended to garbage area, concerning platelet, the metal area of coverage is strong to the restraining force of garbage area, improved garbage area deformation degree, and then improved because garbage area deformation, extruding takes place or the situation of shrinking and the deformation degree of the platelet main region that causes.And be electrically insulated with the platelet main region, the gong cutter is to the damage of platelet main region when having avoided the gong limit.
Simultaneously, concerning whole moulding prebasal plate, metal area of coverage area on the moulding prebasal plate is big, the rigidity intensity of substrate is strong, the metal area of coverage is strong to the restraining force of substrate, avoided in process of production, the moulding prebasal plate is owing to form the harmomegathus coefficient difference of material, and internal stress distribution is uneven and cause the situation of moulding prebasal plate generation deformation to produce.
Embodiment two
Present embodiment provides a kind of moulding metacoxal plate, this moulding metacoxal plate adopts the moulding prebasal plate that provides among the embodiment one to make, the upper surface of described moulding metacoxal plate is the device rest area, described moulding metacoxal plate comprises at least one platelet, described each platelet comprises the platelet main region, be positioned at the waste material vacancy section of described platelet main region periphery, and the metal area of coverage that is positioned at described waste material vacancy section periphery.
Shown in Fig. 3 a and Fig. 3 b, Fig. 3 a is the vertical view of moulding metacoxal plate 31, comprises at least one platelet 32, and Fig. 3 b is depicted as the vertical view of platelet 32, and platelet 32 upper surfaces comprise platelet main region 301, waste material vacancy section 302 and the metal area of coverage 303.
Wherein, the spacing of waste material vacancy section 302 is identical with the spacing of the garbage area of moulding prebasal plate described in above-described embodiment one.
The preferred moulding metacoxal plate of present embodiment is soft board or Rigid Flex.
Need to prove, the arrangement mode of interior at least one platelet of moulding metacoxal plate is arrayed among present embodiment Fig. 3 a, but the utility model is not limited to the mode of arrayed, in actual production, is as required the arrangement mode of platelet to be adjusted.
The moulding metacoxal plate is widely used, for example, be applied to the module of making a video recording, sensitive chip and the supporter of shooting module all are fixedly connected on this moulding metacoxal plate, if the evenness of substrate is not high, there is differential seat angle between the sensitive chip on the substrate and the substrate, light is passed through has optical path difference after camera lens arrives sensitive chip, cause the imaging of shooting module inhomogeneous, when serious module can't be focused.
The moulding metacoxal plate that the utility model provides, the moulding prebasal plate that adopts above-described embodiment one to provide, extend to the part of garbage area through etching away the metal area of coverage on the platelet, then the garbage area with platelet passes through the die-cut aftershaping in gong limit, because the part garbage area of the platelet of the moulding prebasal plate that provides in above-described embodiment one is coated with metal, improved garbage area deformation degree, and then improved the deformation degree of platelet main region, make the moulding prebasal plate in process of production, the evenness height of platelet main region, thereby the evenness height of the moulding metacoxal plate of making, adopt the stable performance of the various devices of this moulding metacoxal plate, production qualification rate simultaneously improves, and has improved economic benefit.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments herein.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. moulding prebasal plate, it is characterized in that, the upper surface of this moulding prebasal plate is the device rest area, described moulding prebasal plate comprises at least one platelet, the upper surface of described platelet comprises the platelet main region, is positioned at the garbage area of described platelet main region periphery, and the metal area of coverage that is positioned at described garbage area periphery, the described metal area of coverage extends to described garbage area, and is electrically insulated with described platelet main region.
2. according to the described moulding prebasal plate of claim 1, it is characterized in that the described metal area of coverage is the Copper Foil area of coverage.
3. according to the described moulding prebasal plate of claim 1, it is characterized in that the outer peripheral spacing of the edge of the described metal area of coverage and described platelet main region is 0.1mm-0.5mm, comprises endpoint value.
4. according to the described moulding prebasal plate of claim 3, it is characterized in that the outer peripheral spacing of the inward flange of the described metal area of coverage and described platelet main region is the required maximum allowance of described little sheet metal forming.
5. according to the described moulding prebasal plate of claim 4, it is characterized in that the required maximum allowance of described little sheet metal forming is 0.2mm.
6. according to any described moulding prebasal plate of claim 1-5, it is characterized in that described moulding prebasal plate is soft board or Rigid Flex.
7. moulding metacoxal plate, it is characterized in that, this moulding metacoxal plate adopts the described moulding prebasal plate of claim 1 to make, the upper surface of described moulding metacoxal plate is the device rest area, described moulding metacoxal plate comprises at least one platelet, described each platelet comprises the platelet main region, is positioned at the waste material vacancy section of described platelet main region periphery, and the metal area of coverage that is positioned at described waste material vacancy section periphery.
8. according to the described moulding metacoxal plate of claim 7, it is characterized in that the spacing of described waste material vacancy section is identical with the spacing of the garbage area of the described moulding prebasal plate of claim 1.
9. according to claim 7 or 8 described moulding metacoxal plates, it is characterized in that described moulding metacoxal plate is soft board or Rigid Flex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320121291 CN203233595U (en) | 2013-03-15 | 2013-03-15 | Base board before molding and base board after molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320121291 CN203233595U (en) | 2013-03-15 | 2013-03-15 | Base board before molding and base board after molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203233595U true CN203233595U (en) | 2013-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320121291 Expired - Lifetime CN203233595U (en) | 2013-03-15 | 2013-03-15 | Base board before molding and base board after molding |
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| Country | Link |
|---|---|
| CN (1) | CN203233595U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012430A (en) * | 2017-12-28 | 2018-05-08 | 信利光电股份有限公司 | A kind of stain ameliorative way of camera module |
| CN112243319A (en) * | 2020-10-28 | 2021-01-19 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN117320322A (en) * | 2023-11-30 | 2023-12-29 | 圆周率半导体(南通)有限公司 | Processing method for improving flatness of multilayer organic substrate by step-by-step molding |
-
2013
- 2013-03-15 CN CN 201320121291 patent/CN203233595U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012430A (en) * | 2017-12-28 | 2018-05-08 | 信利光电股份有限公司 | A kind of stain ameliorative way of camera module |
| CN112243319A (en) * | 2020-10-28 | 2021-01-19 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN112243319B (en) * | 2020-10-28 | 2022-03-01 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN117320322A (en) * | 2023-11-30 | 2023-12-29 | 圆周率半导体(南通)有限公司 | Processing method for improving flatness of multilayer organic substrate by step-by-step molding |
| CN117320322B (en) * | 2023-11-30 | 2024-04-05 | 圆周率半导体(南通)有限公司 | Processing method for improving flatness of multilayer organic substrate by step-by-step molding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131009 |