CN104796588A - Camera module - Google Patents
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- CN104796588A CN104796588A CN201510104557.4A CN201510104557A CN104796588A CN 104796588 A CN104796588 A CN 104796588A CN 201510104557 A CN201510104557 A CN 201510104557A CN 104796588 A CN104796588 A CN 104796588A
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- imageing sensor
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Abstract
A camera module comprises a flexible printed circuit board, a ceramic substrate, electronic components, an image sensor, an optical filter and a lens module, wherein the ceramic substrate is provided with a top surface and a bottom surface which is arranged at the back of the top surface, a plurality of first grooves are arranged on the bottom surface at intervals, a second groove is arranged at the middle part of the top surface of the ceramic substrate, a through hole or a third groove is arranged at the bottom of the second groove, and the through hole or the third groove is surrounded by the first grooves. The electronic components are housed in the first grooves while the first grooves are arranged at the bottom surface of the ceramic substrate to house the electronic components so the camera module of the invention can be used for effectively preventing the electronic component from being collided by a plastic pin when adhesive is drawn on a production line so as to effectively avoid the generation of fragments and improve imaging quality of the camera module.
Description
Technical field
The present invention relates to camera technical field, particularly relate to a kind of camera module.
Background technology
In recent years, along with the development of multimedia technology, the range of application of camera module is more and more wider, is widely used in mobile phone, computer, the first-class electronic product of miniature video camera.
Camera module generally includes camera lens module, base, cutoff filter, imageing sensor (sensor), electronic component and circuit board, and wherein electronic component generally comprises electric capacity and resistance, mainly plays the auxiliary effect supplementing voltage.In traditional camera modular structure, imageing sensor and electronic component are all positioned on circuit board, and are contained in the inner chamber of base.When the size of imageing sensor is very large, the placing space of electronic component will be very little, and therefore the putting position of electronic component will near the periphery of circuit board, namely electronic component from the sidewall of base intracavity distance very close to.When drawing glue on a production line, plastic pin has the risk knocking electronic component, once bump against electronic component, then can produce a lot of chip, and this chip is difficult to eliminate, and can affect image quality time serious.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of striker phenomenon of can effectively avoiding to eliminate the camera module of chip.
A kind of camera module, comprising:
Flexible PCB, the back side that there is installed surface and be oppositely arranged with described installed surface;
Ceramic substrate, be arranged on described flexible PCB by anisotropic conductive film, described ceramic substrate has end face and the bottom surface with the opposing setting of end face, described bottom surface offers multiple the first spaced groove, the second groove is offered in the middle part of the end face of described ceramic substrate, the bottom of described second groove offers through hole or the 3rd groove, and described multiple first groove is around described through hole or the 3rd groove;
Electronic component, to be contained in described first groove and to be electrically connected with described flexible PCB;
Imageing sensor, be arranged in described through hole or the bottom of the 3rd groove, described imageing sensor is electrically connected with described flexible PCB;
Filter, is arranged at the bottom of described second groove; And
Camera lens module, is arranged on the end face of described ceramic substrate.
Wherein in an embodiment, when through hole is offered in the bottom of described second groove, described imageing sensor adheres to the installed surface of described flexible PCB by adhesive-layer back on the surface of photosurface.
Wherein in an embodiment, the sidewall of described through hole is formed with step, the non-photo-sensing district that the photosurface of described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, described step is provided with second weld pad corresponding with described first weld pad, be connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire and realize the electrical connection of described imageing sensor and described flexible PCB, the table top of described step flushes setting with the photosurface of described imageing sensor.
Wherein in an embodiment, when the 3rd groove is offered in the bottom of described second groove, described imageing sensor adheres to the bottom of described 3rd groove by adhesive-layer back on the surface of photosurface.
Wherein in an embodiment, the non-photo-sensing district that described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, the bottom of described 3rd groove is provided with second weld pad corresponding with described first weld pad around described imageing sensor, and being connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire realizes the electrical connection of described imageing sensor and described flexible PCB.
Wherein in an embodiment, described conductor wire is gold thread.
Wherein in an embodiment, described filter is cutoff filter.
Wherein in an embodiment, the elongated end that described flexible PCB comprises body and has the side of body to extend to form, described ceramic substrate is arranged on described body, and the elongated end of described flexible PCB is provided with connector.
Wherein in an embodiment, described camera lens module comprises camera lens support component and camera lens, and described lens assembling is in described camera lens support component.
Wherein in an embodiment, described camera lens support component is a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module at least has the following advantages:
Because electronic component is contained in the first groove, and the first groove is opened in the bottom surface of ceramic substrate to play collecting effect, so can effectively avoid electronic component to be knocked by plastic pin when production line drawing glue, thus effectively avoid producing chip, improve the image quality of camera module.Simultaneously, because above-mentioned camera module is compared to traditional camera module, eliminate base, and directly ceramic substrate is sintered into the structure with the first groove, the second groove and the 3rd groove or through hole, imageing sensor is arranged in through hole or the bottom of the 3rd groove, filter is arranged at the bottom of the second groove, therefore effectively can reduce the total height of camera module.In addition, after above-mentioned camera module draws glue on the end face of ceramic substrate can directly by lens module group assembling to the end face of ceramic substrate, eliminate the process of assembling after once drawing glue, effectively can improve the evenness of camera module.
Accompanying drawing explanation
Fig. 1 is the cutaway view of camera module in an execution mode;
Fig. 2 is the partial schematic diagram at another visual angle of the module of camera shown in Fig. 1;
Fig. 3 is the partial schematic diagram in another execution mode shown in Fig. 2;
Fig. 4 is the cutaway view of camera module in another execution mode.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public concrete enforcement.
Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Referring to Fig. 1, is the camera module 100 in an execution mode.This camera module 100 comprises flexible PCB 110, ceramic substrate 120, electronic component 130, imageing sensor 140, filter 150, camera lens module 160 and connector 170.
The back side 112 that flexible PCB 110 has installed surface 111 and is oppositely arranged with installed surface 111.In the present embodiment, ceramic substrate 120, electronic component 130, imageing sensor 140, filter 150, camera lens module 160 and connector 170 are all positioned at the same side of installed surface 111.The elongated end that flexible PCB 110 comprises body and extends to form from the side of body, ceramic substrate 120 is arranged on body, and connector 170 is arranged at elongated end.
Ceramic substrate 120 is by anisotropic conductive film 180 (Anisotropic Conductive Film; ACF) be arranged on flexible PCB 110.See also Fig. 2, ceramic substrate 120 has end face 120a and the bottom surface 120b with the opposing setting of end face 120a, bottom surface 120b offers multiple the first spaced groove 121, electronic component 130 is contained in the first groove 121, and the lower surface of electronic component 130 is directly electrically connected with flexible PCB 110 by anisotropic conductive film 180.Electronic component 130 is electric capacity and resistance mainly, and an electric capacity or resistance are contained in the first groove 121 of a corresponding size.
The middle part of the end face 120a of ceramic substrate 120 offers the second groove 122, second groove 122 for accommodating filter 150.The bottom of the second groove 122 offers through hole 123, and the size of through hole 123 is less than the size of the second groove 122.Multiple first groove 121 is around through hole 123, and specific in present embodiment, multiple first groove 121 is arranged around through hole 123, thus part is surrounded on through hole 123 and arranges.Refer to Fig. 3, in other embodiments, multiple first groove 121 is arranged around through hole 123, thus is entirely surrounded on through hole 123 and arranges.
Imageing sensor 140 is arranged in through hole 123, and imageing sensor 140 is electrically connected with flexible PCB 110.Specific in present embodiment, imageing sensor 140 adheres to the installed surface 111 of flexible PCB 110 by adhesive-layer 190 back on the surface of photosurface.The photosurface of imageing sensor 140 comprises photosensitive area and the non-photo-sensing district around photosensitive area setting, non-photo-sensing district is provided with multiple spaced first weld pad.
The sidewall of through hole 123 is formed with step 1231, the height of step 1231 can be equal with the thickness of imageing sensor 140.Step 1231 is provided with second weld pad corresponding with the first weld pad, being connected with the first weld pad and the second weld pad respectively by the two ends of conductor wire 124 realizes the electrical connection of imageing sensor 140 and flexible PCB 110.Particularly, conductor wire 124 can be gold thread.Certainly, also can be the good metal wire of other electric conductivity.Preferably, the table top of step 1231 flushes setting with the photosurface of imageing sensor 140, reduces the distance of beating conductor wire, reduces costs.
Please again consult Fig. 1, filter 150 is arranged at the bottom of the second groove 122.Because the size of the second groove 122 is greater than the size of through hole 123, when therefore filter 150 is arranged at the bottom of the second groove 122, filter 150 covers through hole 123.Filter 150 can be cutoff filter particularly.
Camera lens module 160 is arranged on the end face 120a of ceramic substrate 120.Particularly, the mode can drawing glue by plastic pin draws glue on the end face 120a of ceramic substrate 120, then camera lens module 160 is attached at this and can completes assembling on the surface.Camera lens module 160 comprises camera lens support component 161 and camera lens 162, and camera lens 162 is assembled in camera lens support component 161.Particularly, camera lens support component 161 can be a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module 100 at least has the following advantages:
Because electronic component 130 is contained in the first groove 121, and the first groove 121 is opened in the bottom surface 120b of ceramic substrate 120 to play collecting effect, so can effectively avoid electronic component 130 to be knocked by plastic pin when production line drawing glue, thus effectively avoid producing chip, improve the image quality of camera module 100.Simultaneously, because above-mentioned camera module 100 is compared to traditional camera module 100, eliminate base, and directly ceramic substrate 120 is sintered into the structure with the first groove 121, second groove 122 and through hole 123, imageing sensor 140 is arranged in through hole 123, filter 150 is arranged at the bottom of the second groove 122, therefore effectively can reduce the total height of camera module 100.In addition, can directly camera lens module 160 be assembled on the end face 120a of ceramic substrate 120 after above-mentioned camera module 100 draws glue on the end face 120a of ceramic substrate 120, eliminate the process of assembling after once drawing glue, effectively can improve the evenness of camera module 100.
Referring to Fig. 4, is the camera module 200 in another execution mode.In this embodiment, camera module 200 comprises flexible PCB 210, ceramic substrate 220, electronic component 230, imageing sensor 240, filter 250, camera lens module 260 and connector 270.
The back side 212 that flexible PCB 210 has installed surface 211 and is oppositely arranged with installed surface 211.In the present embodiment, ceramic substrate 220, electronic component 230, imageing sensor 240, filter 250, camera lens module 260 and connector 270 are all positioned at the same side of installed surface 211.The elongated end that flexible PCB 210 comprises body and extends to form from the side of body, ceramic substrate 220 is arranged on body, and connector 270 is arranged at elongated end.
Ceramic substrate 220 is arranged on flexible PCB 210 by anisotropic conductive film 280.Ceramic substrate 220 has end face 220a and the bottom surface 220b with the opposing setting of end face 220a, bottom surface 220b offers multiple the first spaced groove 221, electronic component 230 is contained in the first groove 221, and the lower surface of electronic component 230 is directly electrically connected with flexible PCB 210 by anisotropic conductive film 280.Electronic component 230 is electric capacity and resistance mainly, and an electric capacity or resistance are contained in the first groove 221 of a corresponding size.
The middle part of the end face 220a of ceramic substrate 220 offers the second groove 222, second groove 222 for accommodating filter 250.The size that the bottom of the second groove 222 offers the 3rd groove the 223, three groove 223 is less than the size of the second groove 222.Multiple first groove 221 is around the 3rd groove 223, and specific in present embodiment, multiple first groove 221 is arranged around the 3rd groove 223, thus part is surrounded on the 3rd groove 223 and arranges.In other embodiments, multiple first groove 221 is arranged around the 3rd groove 223, thus is entirely surrounded on the 3rd groove 223 and arranges.
Imageing sensor 240 is arranged at the bottom of the 3rd groove 223, and imageing sensor 240 is electrically connected with flexible PCB 210.Specific in present embodiment, imageing sensor 240 adheres to the bottom of the 3rd groove 223 by adhesive-layer 290 back on the surface of photosurface.The photosurface of imageing sensor 240 comprises photosensitive area and the non-photo-sensing district around photosensitive area setting, non-photo-sensing district is provided with multiple spaced first weld pad.
The bottom of the 3rd groove 223 is provided with second weld pad corresponding with the first weld pad around imageing sensor 240, and being connected with the first weld pad and the second weld pad respectively by the two ends of conductor wire 224 realizes the electrical connection of imageing sensor 240 and flexible PCB 210.Particularly, conductor wire 224 can be gold thread.Certainly, also can be the good metal wire of other electric conductivity.
Filter 250 is arranged at the bottom of the second groove 222.Because the size of the second groove 222 is greater than the size of through hole, when therefore filter 250 is arranged at the bottom of the second groove 222, filter 250 covers through hole.Filter 250 can be cutoff filter particularly.
Camera lens module 260 is arranged on the end face 220a of ceramic substrate 220.Particularly, the mode can drawing glue by plastic pin draws glue on the end face 220a of ceramic substrate 220, then camera lens module 260 is attached at this and can completes assembling on the surface.Camera lens module 260 comprises camera lens support component 261 and camera lens 262, and camera lens 262 is assembled in camera lens support component 261.Particularly, camera lens support component 261 can be a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module 200 at least has the following advantages:
Because electronic component 230 is contained in the first groove 221, and the first groove 221 is opened in the bottom surface 220b of ceramic substrate 220 to play collecting effect, so can effectively avoid electronic component 230 to be knocked by plastic pin when production line drawing glue, thus effectively avoid producing chip, improve the image quality of camera module 200.Simultaneously, because above-mentioned camera module 200 is compared to traditional camera module 200, eliminate base, and directly ceramic substrate 220 is sintered into the structure with the first groove 221, second groove 222 and third through-hole 223, imageing sensor 240 is arranged at the bottom of the 3rd groove 223, filter 250 is arranged at the bottom of the second groove, therefore effectively can reduce the total height of camera module 200.In addition, can directly camera lens module 260 be assembled on the end face 220a of ceramic substrate 220 after above-mentioned camera module 200 draws glue on the end face 220a of ceramic substrate 220, eliminate the process of assembling after once drawing glue, effectively can improve the evenness of camera module 200.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a camera module, is characterized in that, comprising:
Flexible PCB, the back side that there is installed surface and be oppositely arranged with described installed surface;
Ceramic substrate, be arranged on described flexible PCB by anisotropic conductive film, described ceramic substrate has end face and the bottom surface with the opposing setting of end face, described bottom surface offers multiple the first spaced groove, the second groove is offered in the middle part of the end face of described ceramic substrate, the bottom of described second groove offers through hole or the 3rd groove, and described multiple first groove is around described through hole or the 3rd groove;
Electronic component, to be contained in described first groove and to be electrically connected with described flexible PCB;
Imageing sensor, be arranged in described through hole or the bottom of the 3rd groove, described imageing sensor is electrically connected with described flexible PCB;
Filter, is arranged at the bottom of described second groove; And
Camera lens module, is arranged on the end face of described ceramic substrate.
2. camera module according to claim 1, is characterized in that, when through hole is offered in the bottom of described second groove, described imageing sensor adheres to the installed surface of described flexible PCB by adhesive-layer back on the surface of photosurface.
3. camera module according to claim 2, it is characterized in that, the sidewall of described through hole is formed with step, the non-photo-sensing district that the photosurface of described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, described step is provided with second weld pad corresponding with described first weld pad, be connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire and realize the electrical connection of described imageing sensor and described flexible PCB, the table top of described step flushes setting with the photosurface of described imageing sensor.
4. camera module according to claim 1, is characterized in that, when the 3rd groove is offered in the bottom of described second groove, described imageing sensor adheres to the bottom of described 3rd groove by adhesive-layer back on the surface of photosurface.
5. camera module according to claim 4, it is characterized in that, the non-photo-sensing district that described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, the bottom of described 3rd groove is provided with second weld pad corresponding with described first weld pad around described imageing sensor, and being connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire realizes the electrical connection of described imageing sensor and described flexible PCB.
6. the camera module according to claim 3 or 5, is characterized in that, described conductor wire is gold thread.
7. camera module according to claim 1, is characterized in that, described filter is cutoff filter.
8. camera module according to claim 1, it is characterized in that, the elongated end that described flexible PCB comprises body and has the side of body to extend to form, described ceramic substrate is arranged on described body, and the elongated end of described flexible PCB is provided with connector.
9. camera module according to claim 1, is characterized in that, described camera lens module comprises camera lens support component and camera lens, and described lens assembling is in described camera lens support component.
10. camera module according to claim 9, is characterized in that, described camera lens support component is a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510104557.4A CN104796588B (en) | 2015-03-10 | 2015-03-10 | Camera module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510104557.4A CN104796588B (en) | 2015-03-10 | 2015-03-10 | Camera module |
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| CN104796588A true CN104796588A (en) | 2015-07-22 |
| CN104796588B CN104796588B (en) | 2018-11-27 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106843389A (en) * | 2017-01-09 | 2017-06-13 | 广东欧珀移动通信有限公司 | Electronic installation |
| CN107147826A (en) * | 2017-05-17 | 2017-09-08 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107277336A (en) * | 2017-08-07 | 2017-10-20 | 宁波舜宇光电信息有限公司 | Camera module and preparation method thereof and corresponding intelligent terminal |
| CN107301392A (en) * | 2017-06-20 | 2017-10-27 | 华天科技（昆山）电子有限公司 | Wafer level image harvester |
| CN107395938A (en) * | 2017-08-28 | 2017-11-24 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, there is its camera module and preparation method |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN110876002A (en) * | 2018-08-31 | 2020-03-10 | 三赢科技（深圳）有限公司 | Image pickup apparatus |
| CN112526653A (en) * | 2015-07-31 | 2021-03-19 | 索尼半导体解决方案公司 | Lens substrate |
| WO2021218115A1 (en) * | 2020-04-30 | 2021-11-04 | 荣耀终端有限公司 | Camera module and electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011084900A1 (en) * | 2010-01-11 | 2011-07-14 | Flextronics Ap Llc | Camera module with molded tape flip chip imager mount and method of manufacture |
| US20110261253A1 (en) * | 2010-04-26 | 2011-10-27 | Hon Hai Precision Industry Co., Ltd. | Camera module |
| CN102377950A (en) * | 2010-08-23 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Image sensing module and camera module |
| CN103780805A (en) * | 2012-10-26 | 2014-05-07 | 深圳欧菲光科技股份有限公司 | Camera module group support and camera module group |
| CN103904040A (en) * | 2012-12-29 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Image sensor module and image capture module |
| CN203912063U (en) * | 2014-05-29 | 2014-10-29 | 南昌欧菲光电技术有限公司 | Camera module and support thereof |
| CN204465696U (en) * | 2015-03-10 | 2015-07-08 | 南昌欧菲光电技术有限公司 | Camera module |
-
2015
- 2015-03-10 CN CN201510104557.4A patent/CN104796588B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011084900A1 (en) * | 2010-01-11 | 2011-07-14 | Flextronics Ap Llc | Camera module with molded tape flip chip imager mount and method of manufacture |
| US20110261253A1 (en) * | 2010-04-26 | 2011-10-27 | Hon Hai Precision Industry Co., Ltd. | Camera module |
| CN102377950A (en) * | 2010-08-23 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Image sensing module and camera module |
| CN103780805A (en) * | 2012-10-26 | 2014-05-07 | 深圳欧菲光科技股份有限公司 | Camera module group support and camera module group |
| CN103904040A (en) * | 2012-12-29 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Image sensor module and image capture module |
| CN203912063U (en) * | 2014-05-29 | 2014-10-29 | 南昌欧菲光电技术有限公司 | Camera module and support thereof |
| CN204465696U (en) * | 2015-03-10 | 2015-07-08 | 南昌欧菲光电技术有限公司 | Camera module |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112526653A (en) * | 2015-07-31 | 2021-03-19 | 索尼半导体解决方案公司 | Lens substrate |
| CN106843389A (en) * | 2017-01-09 | 2017-06-13 | 广东欧珀移动通信有限公司 | Electronic installation |
| CN107147826A (en) * | 2017-05-17 | 2017-09-08 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107147826B (en) * | 2017-05-17 | 2023-01-20 | 深圳市欢太科技有限公司 | Imaging device assembly and electronic device |
| CN107301392A (en) * | 2017-06-20 | 2017-10-27 | 华天科技（昆山）电子有限公司 | Wafer level image harvester |
| CN107277336A (en) * | 2017-08-07 | 2017-10-20 | 宁波舜宇光电信息有限公司 | Camera module and preparation method thereof and corresponding intelligent terminal |
| CN107395938A (en) * | 2017-08-28 | 2017-11-24 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, there is its camera module and preparation method |
| CN110876002A (en) * | 2018-08-31 | 2020-03-10 | 三赢科技（深圳）有限公司 | Image pickup apparatus |
| CN110876002B (en) * | 2018-08-31 | 2021-07-20 | 三赢科技（深圳）有限公司 | Image pickup apparatus |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| WO2021218115A1 (en) * | 2020-04-30 | 2021-11-04 | 荣耀终端有限公司 | Camera module and electronic device |
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| CN104796588B (en) | 2018-11-27 |
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Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee after: OFilm Tech Co.,Ltd. Co-patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20190326 Address after: 330200 East of College Sixth Road and South of Tianxiang Avenue, Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OUFEI PRECISION OPTICAL PRODUCT Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jingchao optics Co.,Ltd. Address before: 330200 East of College Sixth Road and South of Tianxiang Avenue, Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OUFEI PRECISION OPTICAL PRODUCT Co.,Ltd. |
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