CN104796588B - Camera module - Google Patents
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- CN104796588B CN104796588B CN201510104557.4A CN201510104557A CN104796588B CN 104796588 B CN104796588 B CN 104796588B CN 201510104557 A CN201510104557 A CN 201510104557A CN 104796588 B CN104796588 B CN 104796588B
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Abstract
A kind of camera module includes flexible circuit board, ceramic substrate, electronic component, imaging sensor, optical filter and lens module.The bottom surface that ceramic substrate has top surface and is disposed opposite to each other with top surface, multiple the first grooves being spaced apart from each other are offered on bottom surface, offer the second groove in the middle part of the top surface of ceramic substrate, the bottom of the second groove offer through-hole perhaps multiple first grooves of third groove around through-hole or third groove.Electronic component is contained in the first groove, and the first groove is opened in the bottom surface of ceramic substrate to play receiving, it is knocked when producing line drawing glue by plastic pin so can effectively avoid electronic component, to effectively avoid generating clast, improves the image quality of camera module.
Description
Technical field
The present invention relates to camera technical fields, more particularly to a kind of camera module.
Background technique
In recent years, with the development of multimedia technology, will be used wider and wider for camera module is widely used
In mobile phone, computer, the first-class electronic product of miniature video camera.
Camera module generally includes lens module, pedestal, cutoff filter, imaging sensor (sensor), electricity
Subcomponent and circuit board, wherein electronic component generally comprises capacitor and resistance, primarily serves the effect of auxiliary supplement voltage.Tradition
Camera module structure in, imaging sensor and electronic component are placed on circuit board, and are contained in the inner cavity of pedestal.
When the size of imaging sensor is very big, the placing space of electronic component will very little, therefore the placement position of electronic component is just
Can be close to the periphery of circuit board, i.e. electronic component is close with a distance from the side wall of base intracavity.When drawing glue in the production line, plastic pin
The risk for knocking electronic component is had, once bumping against electronic component, then can generate many clasts, this clast is difficult to eliminate, sternly
It will affect image quality when weight.
Summary of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of it is possible to prevente effectively from striker phenomenon is to eliminate taking the photograph for clast
As head mould group.
A kind of camera module, including：
Flexible circuit board, with mounting surface and the back side being oppositely arranged with the mounting surface；
Ceramic substrate is set on the flexible circuit board by anisotropic conductive film, and the ceramic substrate has top
Face and the bottom surface being disposed opposite to each other with top surface, the bottom surface offer multiple the first grooves being spaced apart from each other, the ceramic substrate
Offering the second groove in the middle part of top surface, the bottom of second groove offers through-hole or third groove, and the multiple first
Groove is around the through-hole or third groove；
Electronic component is contained in first groove and is electrically connected with the flexible circuit board；
Imaging sensor, is set in the through-hole or the bottom of third groove, described image sensor with it is described soft
Property circuit board electrical connection；
Optical filter is set to the bottom of second groove；And
Lens module is set on the top surface of the ceramic substrate.
In one of the embodiments, when the bottom of second groove opens up through-hole, described image sensor is backwards
The mounting surface of the flexible circuit board is adhered to by adhesive-layer in the surface of photosurface.
Step, the photosurface of described image sensor are formed on the side wall of the through-hole in one of the embodiments,
Multiple spaced the are provided with including photosensitive area and around the non-photo-sensing area of photosensitive area setting, in the non-photo-sensing area
One weld pad is provided with the second weld pad corresponding with first weld pad on the step, by the both ends of conductor wire respectively with
First weld pad and the second weld pad, which are connected, realizes being electrically connected for described image sensor and the flexible circuit board, the step
Table top flush setting with the photosurface of described image sensor.
In one of the embodiments, when the bottom of second groove opens up third groove, described image sensor
The bottom of the third groove is adhered to by adhesive-layer back on the surface of photosurface.
Described image sensor includes photosensitive area and the non-sense around photosensitive area setting in one of the embodiments,
Light area, multiple spaced first weld pads are provided in the non-photo-sensing area, and the bottom of the third groove surrounds the figure
As sensor is provided with the second weld pad corresponding with first weld pad, by the both ends of conductor wire respectively with first weldering
Pad and the second weld pad, which are connected, realizes being electrically connected for described image sensor and the flexible circuit board.
The conductor wire is gold thread in one of the embodiments,.
The optical filter is cutoff filter in one of the embodiments,.
The flexible circuit board includes ontology and the extension that has the side of ontology to extend to form in one of the embodiments,
End, the ceramic substrate are arranged on the body, and the elongated end of the flexible circuit board is provided with connector.
The lens module includes lens support element and camera lens in one of the embodiments, the lens assembling in
In the lens support element.
The lens support element is that a plastic mirror base, a voice coil motor or one are micro electronmechanical in one of the embodiments,
System.
Above-mentioned camera module has at least the following advantages：
Because electronic component is contained in the first groove, and the first groove is opened in the bottom surface of ceramic substrate and is made with playing receiving
With being knocked when producing line drawing glue by plastic pin so can effectively avoid electronic component, to effectively avoid generating clast, raising taken the photograph
As the image quality of head mould group.Simultaneously as above-mentioned camera module compared to traditional camera mould group for, eliminate bottom
Seat, and directly sinter ceramic substrate into structure with the first groove, the second groove and third groove or through-hole, image sensing
Device is set in through-hole or the bottom of third groove, and optical filter is set to the bottom of the second groove, therefore can effectively reduce and take the photograph
As the total height of head mould group.In addition, above-mentioned camera module can be directly by lens module after drawing glue on the top surface of ceramic substrate
It is assembled to the top surface of ceramic substrate, the primary process drawn and assembled after glue is eliminated, the flatness of camera module can be effectively improved.
Detailed description of the invention
Fig. 1 is the cross-sectional view of camera module in an embodiment；
Fig. 2 is the partial schematic diagram at another visual angle of camera module shown in Fig. 1；
Fig. 3 is the partial schematic diagram in another embodiment shown in Fig. 2；
Fig. 4 is the cross-sectional view of camera module in another embodiment.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Term as used herein "vertical", "horizontal", "left" and "right" and similar statement simply to illustrate that
Purpose, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Referring to Fig. 1, for the camera module 100 in an embodiment.The camera module 100 includes flexible circuit board
110, ceramic substrate 120, electronic component 130, imaging sensor 140, optical filter 150, lens module 160 and connector 170.
The back side 112 that flexible circuit board 110 has mounting surface 111 and is oppositely arranged with mounting surface 111.In present embodiment
In, ceramic substrate 120, electronic component 130, imaging sensor 140, optical filter 150, lens module 160 and all positions of connector 170
In the same side of mounting surface 111.Flexible circuit board 110 includes ontology and the elongated end extended to form from the side of ontology, ceramics
Substrate 120 is set on ontology, and connector 170 is set to elongated end.
Ceramic substrate 120 passes through (the Anisotropic Conductive Film of anisotropic conductive film 180；ACF) it is arranged
In on flexible circuit board 110.Referring to Figure 2 together, ceramic substrate 120 has top surface 120a and is disposed opposite to each other with top surface 120a
Bottom surface 120b, bottom surface 120b offer multiple the first grooves 121 being spaced apart from each other, and electronic component 130 is contained in the first groove 121
Interior, the lower surface of electronic component 130 directly passes through anisotropic conductive film 180 and is electrically connected with flexible circuit board 110.Electronic component
130 be mainly capacitor and resistance, and a capacitor or resistance are contained in first groove 121 of corresponding size.
The second groove 122 is offered in the middle part of the top surface 120a of ceramic substrate 120, the second groove 122 filters for accommodating
Piece 150.The bottom of second groove 122 offers through-hole 123, the size of the size of through-hole 123 less than the second groove 122.It is multiple
First groove 121 is around through-hole 123, and specific in present embodiment, multiple first grooves 121 are arranged around through-hole 123,
To which part is surrounded on the setting of through-hole 123.Referring to Fig. 3, in other embodiments, multiple first grooves 121 around
Through-hole 123 is arranged, to be surrounded on the setting of through-hole 123 entirely.
Imaging sensor 140 is set in through-hole 123, and imaging sensor 140 is electrically connected with flexible circuit board 110.Tool
For body into present embodiment, imaging sensor 140 is adhered to flexible circuit board by adhesive-layer 190 back on the surface of photosurface
110 mounting surface 111.The photosurface of imaging sensor 140 include photosensitive area and around photosensitive area setting non-photo-sensing area, non-sense
Multiple spaced first weld pads are provided in light area.
Step 1231 is formed on the side wall of through-hole 123, the height of step 1231 can be with the thickness of imaging sensor 140
It is equal.The second weld pad corresponding with the first weld pad is provided on step 1231, by the both ends of conductor wire 124 respectively with first
Weld pad and the second weld pad, which are connected, realizes being electrically connected for imaging sensor 140 and flexible circuit board 110.Specifically, conductor wire 124 can
Think gold thread.It is of course also possible to be the preferable metal wire of other electric conductivities.Preferably, the table top of step 1231 and image pass
The photosurface of sensor 140 flushes setting, reduces the distance for beating conductor wire, reduces cost.
Referring to Fig. 1, optical filter 150 is set to the bottom of the second groove 122.Because of the size of the second groove 122
Greater than the size of through-hole 123, therefore when optical filter 150 is set to the bottom of the second groove 122, optical filter 150 covers through-hole
123.Optical filter 150 specifically can be cutoff filter.
Lens module 160 is set on the top surface 120a of ceramic substrate 120.Specifically, the side of glue can be drawn by plastic pin
Formula draws glue on the top surface 120a of ceramic substrate 120, and then lens module 160, which is attached on the surface, can be completed assembling.
Lens module 160 includes lens support element 161 and camera lens 162, and camera lens 162 is assembled in lens support element 161.Specifically
Ground, lens support element 161 can be a plastic mirror base, a voice coil motor or a MEMS.
Above-mentioned camera module 100 has at least the following advantages：
Because electronic component 130 is contained in the first groove 121, and the first groove 121 is opened in the bottom of ceramic substrate 120
Face 120b is knocked when producing line drawing glue by plastic pin, thus effectively with playing receiving so can effectively avoid electronic component 130
It avoids generating clast, improves the image quality of camera module 100.Simultaneously as above-mentioned camera module 100 is compared to tradition
For camera module 100, pedestal is eliminated, and is directly sintered ceramic substrate 120 into recessed with the first groove 121, second
The structure of slot 122 and through-hole 123, imaging sensor 140 are set in through-hole 123, and optical filter 150 is set to the second groove 122
Bottom, therefore can effectively reduce the total height of camera module 100.In addition, above-mentioned camera module 100 is in ceramic substrate
Directly lens module 160 can be assembled on the top surface 120a of ceramic substrate 120 after picture glue on 120 top surface 120a, eliminated
It is primary to draw the process assembled after glue, the flatness of camera module 100 can be effectively improved.
Referring to Fig. 4, for the camera module 200 in another embodiment.In this embodiment, camera module
200 include flexible circuit board 210, ceramic substrate 220, electronic component 230, imaging sensor 240, optical filter 250, lens module
260 and connector 270.
The back side 212 that flexible circuit board 210 has mounting surface 211 and is oppositely arranged with mounting surface 211.In present embodiment
In, ceramic substrate 220, electronic component 230, imaging sensor 240, optical filter 250, lens module 260 and all positions of connector 270
In the same side of mounting surface 211.Flexible circuit board 210 includes ontology and the elongated end extended to form from the side of ontology, ceramics
Substrate 220 is set on ontology, and connector 270 is set to elongated end.
Ceramic substrate 220 is set on flexible circuit board 210 by anisotropic conductive film 280.Ceramic substrate 220 has
Top surface 220a and the bottom surface 220b being disposed opposite to each other with top surface 220a, bottom surface 220b offer multiple the first grooves being spaced apart from each other
221, electronic component 230 is contained in the first groove 221, and the lower surface of electronic component 230 directly passes through anisotropic conductive film
280 are electrically connected with flexible circuit board 210.Electronic component 230 is mainly capacitor and resistance, and a capacitor or resistance are contained in one
In a first groove 221 of corresponding size.
The second groove 222 is offered in the middle part of the top surface 220a of ceramic substrate 220, the second groove 222 filters for accommodating
Piece 250.The bottom of second groove 222 offers third groove 223, the ruler of the size of third groove 223 less than the second groove 222
It is very little.Multiple first grooves 221 are around third groove 223, specific in present embodiment, multiple first grooves 221 around
Third groove 223 is arranged, so that part is surrounded on the setting of third groove 223.In other embodiments, multiple first grooves
221 are arranged around third groove 223, to be surrounded on the setting of third groove 223 entirely.
Imaging sensor 240 is set to the bottom of third groove 223, and 210 electricity of imaging sensor 240 and flexible circuit board
Connection.Specific in present embodiment, imaging sensor 240 is adhered to the by adhesive-layer 290 back on the surface of photosurface
The bottom of three grooves 223.The photosurface of imaging sensor 240 include photosensitive area and around photosensitive area setting non-photo-sensing area, it is non-
Multiple spaced first weld pads are provided on photosensitive area.
The bottom of third groove 223 is provided with the second weld pad corresponding with the first weld pad around imaging sensor 240, leads to
The both ends for crossing conductor wire 224 are connected with the first weld pad and the second weld pad respectively realizes imaging sensor 240 and flexible circuit board 210
Electrical connection.Specifically, conductor wire 224 can be gold thread.It is of course also possible to be the preferable metal wire of other electric conductivities.
Optical filter 250 is set to the bottom of the second groove 222.Because the size of the second groove 222 is greater than the size of through-hole,
Therefore when optical filter 250 is set to the bottom of the second groove 222, optical filter 250 covers through-hole.Optical filter 250 specifically may be used
Think cutoff filter.
Lens module 260 is set on the top surface 220a of ceramic substrate 220.Specifically, the side of glue can be drawn by plastic pin
Formula draws glue on the top surface 220a of ceramic substrate 220, and then lens module 260, which is attached on the surface, can be completed assembling.
Lens module 260 includes lens support element 261 and camera lens 262, and camera lens 262 is assembled in lens support element 261.Specifically
Ground, lens support element 261 can be a plastic mirror base, a voice coil motor or a MEMS.
Above-mentioned camera module 200 has at least the following advantages：
Because electronic component 230 is contained in the first groove 221, and the first groove 221 is opened in the bottom of ceramic substrate 220
Face 220b is knocked when producing line drawing glue by plastic pin, thus effectively with playing receiving so can effectively avoid electronic component 230
It avoids generating clast, improves the image quality of camera module 200.Simultaneously as above-mentioned camera module 200 is compared to tradition
For camera module 200, pedestal is eliminated, and is directly sintered ceramic substrate 220 into recessed with the first groove 221, second
The structure of slot 222 and third through-hole 223, imaging sensor 240 are set to the bottom of third groove 223, and optical filter 250 is set to
The bottom of second groove, therefore can effectively reduce the total height of camera module 200.In addition, above-mentioned camera module 200 is being made pottery
Directly lens module 260 can be assembled on the top surface 220a of ceramic substrate 220 after picture glue on the top surface 220a of porcelain substrate 220,
The primary process drawn and assembled after glue is eliminated, the flatness of camera module 200 can be effectively improved.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of camera module, which is characterized in that including：
Flexible circuit board, with mounting surface and the back side being oppositely arranged with the mounting surface；
Ceramic substrate is set on the flexible circuit board by anisotropic conductive film, the ceramic substrate have top surface and
The bottom surface being disposed opposite to each other with top surface, the bottom surface offer multiple the first grooves being spaced apart from each other, the top surface of the ceramic substrate
Middle part offers the second groove, and the bottom of second groove offers through-hole or third groove, the multiple first groove
Around the through-hole or third groove, first groove does not connect mutually with second groove, through-hole and third groove
It is logical；
Electronic component is contained in first groove and is electrically connected with the flexible circuit board, the following table of the electronic component
Face directly passes through the anisotropic conductive film and is electrically connected with the flexible circuit board, and an electronic component is contained in described in one
In first groove；
Imaging sensor, is set in the through-hole or the bottom of third groove, described image sensor and the flexible electrical
The electrical connection of road plate；
Optical filter is set to the bottom of second groove；And
Lens module is set on the top surface of the ceramic substrate.
2. camera module according to claim 1, which is characterized in that when the bottom of second groove opens up through-hole
When, described image sensor is adhered to the mounting surface of the flexible circuit board back on the surface of photosurface by adhesive-layer.
3. camera module according to claim 2, which is characterized in that be formed with step, institute on the side wall of the through-hole
The photosurface for stating imaging sensor includes photosensitive area and sets in the non-photo-sensing area of photosensitive area setting, the non-photo-sensing area
Multiple spaced first weld pads are equipped with, the second weld pad corresponding with first weld pad is provided on the step, are led to
The both ends for crossing conductor wire are connected with first weld pad and the second weld pad respectively realizes described image sensor and the flexible electrical
The electrical connection of road plate, the table top of the step flush setting with the photosurface of described image sensor.
4. camera module according to claim 1, which is characterized in that when to open up third recessed for the bottom of second groove
When slot, described image sensor is adhered to the bottom of the third groove back on the surface of photosurface by adhesive-layer.
5. camera module according to claim 4, which is characterized in that described image sensor includes photosensitive area and surrounds
The non-photo-sensing area of photosensitive area setting is provided with multiple spaced first weld pads, the third in the non-photo-sensing area
The bottom of groove is provided with the second weld pad corresponding with first weld pad around described image sensor, passes through conductor wire
Both ends are connected with first weld pad and the second weld pad respectively realizes being electrically connected for described image sensor and the flexible circuit board
It connects.
6. the camera module according to claim 3 or 5, which is characterized in that the conductor wire is gold thread.
7. camera module according to claim 1, which is characterized in that the optical filter is cutoff filter.
8. camera module according to claim 1, which is characterized in that the flexible circuit board includes ontology and has an ontology
The elongated end that extends to form of side, the ceramic substrate is arranged on the body, and the elongated end of the flexible circuit board is set
It is equipped with connector.
9. camera module according to claim 1, which is characterized in that the lens module include lens support element and
Camera lens, the lens assembling is in the lens support element.
10. camera module according to claim 9, which is characterized in that the lens support element be a plastic mirror base,
One voice coil motor or a MEMS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510104557.4A CN104796588B (en) | 2015-03-10 | 2015-03-10 | Camera module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510104557.4A CN104796588B (en) | 2015-03-10 | 2015-03-10 | Camera module |
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| CN104796588A CN104796588A (en) | 2015-07-22 |
| CN104796588B true CN104796588B (en) | 2018-11-27 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6967830B2 (en) * | 2015-07-31 | 2021-11-17 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor devices, lens modules and their manufacturing methods, and electronic devices |
| CN106843389B (en) * | 2017-01-09 | 2022-08-05 | Oppo广东移动通信有限公司 | Electronic device |
| CN107147826B (en) * | 2017-05-17 | 2023-01-20 | 深圳市欢太科技有限公司 | Imaging device assembly and electronic device |
| CN107301392B (en) * | 2017-06-20 | 2020-12-04 | 华天科技（昆山）电子有限公司 | Wafer-level image acquisition device |
| CN107277336B (en) * | 2017-08-07 | 2023-03-24 | 宁波舜宇光电信息有限公司 | Camera module, manufacturing method thereof and corresponding intelligent terminal |
| CN107395938A (en) * | 2017-08-28 | 2017-11-24 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, there is its camera module and preparation method |
| CN110876002B (en) * | 2018-08-31 | 2021-07-20 | 三赢科技（深圳）有限公司 | Image pickup apparatus |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN212211129U (en) * | 2020-04-30 | 2020-12-22 | 华为技术有限公司 | Camera module and electronic equipment |
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Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee after: OFilm Tech Co.,Ltd. Co-patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190326 Address after: 330200 East of College Sixth Road and South of Tianxiang Avenue, Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OUFEI PRECISION OPTICAL PRODUCT Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jingchao optics Co.,Ltd. Address before: 330200 East of College Sixth Road and South of Tianxiang Avenue, Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OUFEI PRECISION OPTICAL PRODUCT Co.,Ltd. |