CN103780805A - Camera module group support and camera module group - Google Patents
Camera module group support and camera module group Download PDFInfo
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- CN103780805A CN103780805A CN201210417348.1A CN201210417348A CN103780805A CN 103780805 A CN103780805 A CN 103780805A CN 201210417348 A CN201210417348 A CN 201210417348A CN 103780805 A CN103780805 A CN 103780805A
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- sensing chip
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Abstract
The invention relates to a camera module group support comprising a base body which is provided with an image sensing chip accommodating zone, a capacitance components accommodating zone, and a partition wall for isolating the image sensing chip accommodating zone and the capacitance components accommodating zone. The partition wall of the camera module group support isolates the image sensing chip accommodating zone and the capacitance components accommodating zone, thereby preventing dust on the capacitance components from entering into sensing zone of image sensing chips. Furthermore, a camera module group is provided.
Description
Technical field
The present invention relates to technical field of imaging, particularly relate to a kind of camera module support and camera module.
Background technology
Traditional mobile phone camera module adopts chip on board encapsulation (COB processing procedure, Chip On Board) technology conventionally: automatically complete the step of assembling image sensing chip, capacitance component on a substrate by board.Then cover camera module support, then voice coil motor and camera lens module are installed on camera module support.After camera module support generally applies glue, be bonded on substrate, camera module support offers cavity in order to hold image sensing chip, capacitance component.For example, in a kind of traditional camera module support 910 and camera module 900 of Fig. 1 and Fig. 2 announcement, the through hole 914 that camera module support 910 is provided with cavity 912 and is communicated with cavity 912, through hole 914 is in order to install camera lens module, substrate 920 covers to form a closed space by the cavity 912 of camera module support 910, and capacitance component 930, image sensing chip 940 are all positioned at above-mentioned closed space.
The defect of the camera module support of conventional art and the camera module being assembled into is: image sensing chip, capacitance component are in the space of same sealing, the granulometric impurity of easily hiding between electric capacity conducting strip on capacitance component and substrate, in the time that mobile phone camera is given a shock, aforementioned granulometric impurity just likely drops to the image sensing district of image sensing chip and affects image effect.The image sensing district of image sensing chip is a highstrung region, it is likely all failed having the effect that some granulometric impurities are taken out, all that input cost is large because the reason of granulometric impurity causes yield very low therefore do the mobile phone camera major part of COB processing procedure.
Summary of the invention
Based on this, be necessary easily to pollute for the granulometric impurity of hiding between capacitance component and electric capacity conducting strip the problem of image sensing chip, while proposing a kind of use, can prevent that the granulometric impurity of hiding between capacitance component and electric capacity conducting strip from dropping to the camera module support on image sensing chip.
A kind of camera module support, comprises matrix, and described matrix is provided with that image sensing chip holds district, capacitance component holds district, and described image sensing chip is held to district and capacitance component holds the divider wall that district is isolated from each other.
In an embodiment, described matrix comprises diapire and the sidewall from diapire extension therein.
In an embodiment, described sidewall and diapire jointly surround described image sensing chip and hold district therein, and it is breach or the groove being opened on sidewall that described capacitance component holds district.
In an embodiment, described sidewall has four therein, wherein on two sidewalls that face mutually, offers respectively described capacitance component and holds district.
In an embodiment, described sidewall and diapire surround accommodating cavity jointly therein, and described divider wall is arranged in described accommodating cavity and described accommodating cavity is divided into described image sensing chip holds district and described capacitance component holds district.
In an embodiment, described sidewall has four therein, and described divider wall connects wherein two sidewalls that are oppositely arranged.
In an embodiment, the corresponding described image sensing chip of described diapire holds district and offers through hole therein.
In addition, a kind of camera module is also proposed, comprise the camera module support of aforementioned any one, and be provided with the substrate of image sensing chip and capacitance component, described substrate covers at described image sensing chip and holds district and capacitance component holds in district, it is characterized in that, described image sensing chip is arranged in described image sensing chip and holds district, described capacitance component is arranged in capacitance component and holds district, and between described divider wall and substrate, sealing arranges.
In an embodiment, described camera module support is bonded on described substrate therein.
In an embodiment, between described divider wall and substrate, connect by glue sealing therein.
In above-mentioned camera module support and camera module, by divider wall, image sensing chip is held to district and capacitance component and hold district and be isolated from each other, thereby can prevent that the dust at capacitance component place from entering the sensing area of image sensing chip.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the camera module support of conventional art;
Fig. 2 is the cross-sectional schematic of the camera module of conventional art;
Fig. 3 is the schematic diagram of the camera module support of execution mode one;
Fig. 4 is the schematic diagram of the camera module support of execution mode two;
Fig. 5 is the schematic diagram of the camera module support of execution mode three;
Fig. 6 is the cross-sectional schematic of the camera module of present embodiment.
Embodiment
The design of the camera module support of following execution mode is: divider wall is set and image sensing chip is held to district and capacitance component holds district and be isolated from each other, thereby prevent that the dust at capacitance component place from dropping to the image sensing district of image sensing chip.
Please refer to Fig. 3, the camera module support 100 of execution mode one comprises a matrix, four sidewalls 120 that this matrix comprises diapire 110 and extends from diapire 110.Four sidewalls 120 and diapire 110 surround image sensing chip and hold district 130.On two adjacent sidewalls, offer respectively capacitance component and hold district 122.In present embodiment, it is breach that capacitance component holds district 122, and makes capacitance component hold district 122 and image sensing chip to hold and between district 130, form divider wall 140.Divider wall 140 holds district 122 by capacitance component and holds district 130 with image sensing chip and be isolated from each other.On diapire 110, corresponding image sensing chip holds district 130 and is provided with through hole 112, to camera lens module is installed.
Be appreciated that it can be also the groove being opened on sidewall that capacitance component holds district.As shown in Figure 4, the camera module support 200 of execution mode two comprises a matrix, four sidewalls 220 that this matrix comprises diapire 210 and extends from diapire 210.Four sidewalls 220 and diapire 210 surround image sensing chip and hold district 230.On sidewall, offer capacitance component and hold district 222.In present embodiment, it is grooves that capacitance component holds district 222, makes capacitance component hold district 222 and image sensing chip and holds and between district 230, form divider wall 240.Divider wall 240 holds district 222 by capacitance component and holds district 230 with image sensing chip and be isolated from each other.On diapire 210, corresponding image sensing chip holds district 230 and is provided with through hole 212, to camera lens module is installed.
Please refer to Fig. 5, the camera module support 300 of execution mode three comprises a matrix, four sidewalls 320 that this matrix comprises diapire 310 and extends from diapire 310.Four sidewalls 320 and diapire 310 surround an accommodating cavity.In aforementioned accommodating cavity, be provided with divider wall 340.Divider wall 340 connects a pair of relative sidewall, and thus, aforementioned accommodating cavity is divided into two parts by divider wall 340, is respectively that image sensing chip holds district 330 and capacitance component holds district 350.On diapire 310, corresponding image sensing chip holds district 330 and is provided with through hole 312, to camera lens module is installed.
The element such as camera module support and image sensing chip of above-mentioned three kinds of execution modes is assembled into after camera module, and divider wall can prevent that the dust at capacitance component place from entering the sensing area of image sensing chip.Take camera module support 100 as example, the structure of the camera module being assembled into is described below.
Please refer to Fig. 6, the substrate 600 that is provided with image sensing chip 400 and capacitance component 500 is bonded together by glue with camera module support 100.Substrate 600 covers at image sensing chip and holds district 130 and capacitance component holds in district 122.Image sensing chip 400 is arranged in image sensing chip and holds district 130.Capacitance component 500 is contained in capacitance component to be held in district 122.Between divider wall 140 and substrate 600, sealing arranges.Particularly, divider wall 140 can abut on substrate 600, and glue sealing is passed through in both sides.The top that can be also divider wall 140 applies glue, and then bonds on substrate 600, plays equally the object of sealing.Thus, divider wall 140 can prevent that the dust at capacitance component place from entering the sensing area of image sensing chip.
In the camera module support 100 of execution mode one, it is breach that capacitance component holds district 122, and therefore, after substrate 600 and camera module support 100 combine, capacitance component holds district 122 and still communicates with the external world, now can use glue sealing.If the camera module support of execution mode two and execution mode three and substrate 600 combine, capacitance component holds district 122 and is sealed by substrate 600.
To sum up, the camera module support of above-mentioned execution mode can prevent that the dust at capacitance component place from entering the sensing area of image sensing chip in use.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a camera module support, is characterized in that, comprises matrix, and described matrix is provided with that image sensing chip holds district, capacitance component holds district, and described image sensing chip is held to district and capacitance component holds the divider wall that district is isolated from each other.
2. camera module support according to claim 1, is characterized in that, the sidewall that described matrix comprises diapire and extends from diapire.
3. camera module support according to claim 2, is characterized in that, described sidewall and diapire jointly surround described image sensing chip and hold district, and it is breach or the groove being opened on sidewall that described capacitance component holds district.
4. camera module support according to claim 3, is characterized in that, described sidewall has four, wherein on two sidewalls that face mutually, offers respectively described capacitance component and holds district.
5. camera module support according to claim 2, it is characterized in that, described sidewall and diapire surround accommodating cavity jointly, and described divider wall is arranged in described accommodating cavity and described accommodating cavity is divided into described image sensing chip holds district and described capacitance component holds district.
6. camera module support according to claim 5, is characterized in that, described sidewall has four, and described divider wall connects wherein two sidewalls that are oppositely arranged.
7. according to the camera module support described in arbitrary claim in claim 3 to 6, it is characterized in that, the corresponding described image sensing chip of described diapire holds district and offers through hole.
8. a camera module, comprise the camera module support as described in arbitrary claim in claim 1 to 7, and be provided with the substrate of image sensing chip and capacitance component, described substrate covers at described image sensing chip and holds district and capacitance component holds in district, it is characterized in that, described image sensing chip is arranged in described image sensing chip and holds district, and described capacitance component is arranged in capacitance component and holds district, and between described divider wall and substrate, sealing arranges.
9. camera module according to claim 8, is characterized in that, described camera module support is bonded on described substrate.
10. camera module according to claim 8, is characterized in that, between described divider wall and substrate, connects by glue sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210417348.1A CN103780805A (en) | 2012-10-26 | 2012-10-26 | Camera module group support and camera module group |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210417348.1A CN103780805A (en) | 2012-10-26 | 2012-10-26 | Camera module group support and camera module group |
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| CN103780805A true CN103780805A (en) | 2014-05-07 |
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| CN201210417348.1A Pending CN103780805A (en) | 2012-10-26 | 2012-10-26 | Camera module group support and camera module group |
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| CN104796588A (en) * | 2015-03-10 | 2015-07-22 | 南昌欧菲光电技术有限公司 | Camera module |
| CN104902158A (en) * | 2015-06-17 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module support and camera module with camera module support |
| CN104917944A (en) * | 2015-05-15 | 2015-09-16 | 南昌欧菲光电技术有限公司 | Camera module set support and camera module set with same |
| CN105278069A (en) * | 2014-06-20 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Shooting module and manufacture method thereof |
| US11665815B2 (en) | 2021-03-17 | 2023-05-30 | Triple Win Technology(Shenzhen) Co. Ltd. | Lens module of reduced size and electronic device |
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