CN104917944B - Camera module bracket and camera module with it - Google Patents

Camera module bracket and camera module with it Download PDF

Info

Publication number
CN104917944B
CN104917944B CN201510250071.1A CN201510250071A CN104917944B CN 104917944 B CN104917944 B CN 104917944B CN 201510250071 A CN201510250071 A CN 201510250071A CN 104917944 B CN104917944 B CN 104917944B
Authority
CN
China
Prior art keywords
side wall
installation space
camera module
outside
sidewall portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510250071.1A
Other languages
Chinese (zh)
Other versions
CN104917944A (en
Inventor
李巍
于立新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Optoelectronics Technology Co Ltd
OFilm Group Co Ltd
Jiangxi Jinghao Optical Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Optoelectronics Technology Co Ltd
Shenzhen OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Nanchang OFilm Optoelectronics Technology Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201510250071.1A priority Critical patent/CN104917944B/en
Publication of CN104917944A publication Critical patent/CN104917944A/en
Application granted granted Critical
Publication of CN104917944B publication Critical patent/CN104917944B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention discloses a kind of camera module bracket and with its camera module, camera module bracket includes: rack body, and rack body is equipped with the through-hole of the thickness direction perforation rack body along rack body;Sidewall portion, sidewall portion are located on rack body, and sidewall portion is annular and surround through-hole;Internal installation space and external installation space are wherein limited between rack body and sidewall portion, internal installation space is located at the inside of sidewall portion, internal installation space is connected to through-hole and for installing image sensing chip, and external installation space is located at the outside of sidewall portion and for installing electronic component.Camera module bracket according to the present invention has internal installation space and external installation space, image sensing chip is mounted in internal installation space, electronic component is mounted in external installation space, is thereby reduced since dust and clast enter the image sensing area of image sensing chip and the influence caused by imaging.

Description

Camera module bracket and camera module with it
Technical field
The present invention relates to technical field of imaging, in particular to a kind of camera module bracket and the camera mould with it Group.
Background technique
Image sensing chip and electronic component in traditional camera module, which are all set on circuit board and are contained in, to be taken the photograph As head module bracket inner cavity in, since the surrounding of image sensing chip is arranged in electronic component, thus draw glue in the production line When, plastic pin has the risk for knocking electronic component, once bumping against electronic component, then can generate many clasts, this clast is difficult to It eliminates, will affect image quality when serious.Moreover, being easy particle of hiding between capacitor conductive piece on electronic component and circuit board Impurity, when camera is shaken, granulometric impurity is possible to drop to the image sensing area of image sensing chip and serious shadow Ring imaging effect.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention One purpose is to propose a kind of camera module bracket, which has internal installation space and external installation Space, image sensing chip are mounted in internal installation space, and electronic component is mounted in external installation space, are thereby reduced Since dust and clast enter the image sensing area of image sensing chip and the influence caused by imaging.
Another object of the present invention is that proposing the camera module with above-mentioned camera module bracket.
Camera module bracket according to the present invention, comprising: rack body, the rack body are equipped with along the bracket The thickness direction of ontology penetrates through the through-hole of the rack body;Sidewall portion, the sidewall portion is located on the rack body, described Sidewall portion is annular and surround the through-hole;Internal installation space is wherein limited between the rack body and the sidewall portion With external installation space, the internal installation space is located at the inside of the sidewall portion, and the internal installation space leads to described Hole is connected to and for installing image sensing chip, and the external installation space is located at the outside of the sidewall portion and for installing electricity Subcomponent.
Camera module bracket according to the present invention, by the way that image sensing chip and electronic component to be placed in different installations In space, i.e., image sensing chip is arranged in internal installation space, and electronic component is arranged in external installation space, thus hidden The granulometric impurity between capacitor conductive piece ensconced on electronic component and circuit board cannot enter image from external installation space In inside installation space where sensor chip, thereby reduce since above-mentioned granulometric impurity falls to image sensing chip Image sensing area and influenced caused by the image quality of camera.
In addition, camera module bracket according to the present invention can also have the following additional technical features:
According to one embodiment of present invention, the rack body include: main part on the inside of the sidewall portion and Extension on the outside of at least partly described sidewall portion limits the internal peace between the main part and the sidewall portion Space is filled, the external installation space is limited between the extension and the sidewall portion.
According to one embodiment of present invention, the sidewall portion includes the first side wall being sequentially connected, second sidewall, third Side wall and the 4th side wall, the first side wall and the third side wall are oppositely arranged and the second sidewall and the 4th side wall It is oppositely arranged, wherein being located at the institute of the first side wall, the second sidewall, the third side wall and the 4th inside sidewalls It states rack body part and constitutes the main part;The extension includes: the first extension, and first extending part is in described The outside of second sidewall;The external installation space includes: the first outside installation space, and first outside installation space is by institute The a part for stating the first extension, the second sidewall, a part of the first side wall and the third side wall surrounds.
According to one embodiment of present invention, the extension further include: the second extension and third extension, described Two extending parts are in the outside of the 4th side wall, and the third extending part is in the outside of the first side wall;The side wall Portion further include: the 5th side wall, the 5th side wall are arranged on the third extension and are spaced apart with the first side wall.
According to one embodiment of present invention, the external installation space further include: the second outside installation space, described the Two outside installation spaces are by second extension, the 4th side wall, a part of the 5th side wall and the third side A part of wall surrounds.
According to one embodiment of present invention, the sidewall portion further include: the 6th side wall, the 6th side wall are arranged in institute It states the edge of the first extension and is connected to the one of the neighbouring second sidewall of the first side wall and the 5th side wall Between end;The external installation space further include: installation space outside third, third outside installation space is by the third Extension, the first side wall, the 6th side wall, a part of the 5th side wall and a part of the 4th side wall are enclosed At.
According to one embodiment of present invention, multiple first reinforcing ribs are provided on the medial surface of the third side wall, In be provided with the escape hole through the rack body between adjacent two first reinforcing ribs;Outside the second sidewall The second reinforcing rib is provided on side.
According to one embodiment of present invention, it is provided between the first side wall and the 5th side wall described in being accommodated in Third reinforcing rib outside third in installation space.
According to one embodiment of present invention, first is provided on the third reinforcing rib and escapes air drain, be located at described first Second, which is provided with, on the 4th side wall between side wall and the 5th side wall escapes air drain.
Camera module according to the present invention, including above-mentioned camera module bracket;Circuit board, the circuit board are sticked On the camera module bracket;Image sensing chip, the image sensing chip and the circuit board electrical connection and setting In the internal installation space, the image sensing chip is opposite with the through-hole;Electronic component, the electronic component and institute It states circuit board electrical connection and setting is in the external installation space;Optical filter, the optical filter are arranged in the camera mould The through hole of pack support;Lens assembly, the lens assembly are arranged on the camera module bracket and including camera lens And lens support.
Camera module according to the present invention can effectively obstruct dust, contaminant particles enter image sensing core The image sensing area of piece plays the role of protecting image sensing chip, ensure that the quality of imaging.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures Obviously and it is readily appreciated that, in which:
Fig. 1 is the schematic diagram of camera module according to an embodiment of the present invention;
Fig. 2 is the schematic diagram of camera module bracket assembly according to an embodiment of the present invention on circuit boards;
Fig. 3 is the schematic diagram of camera module according to an embodiment of the present invention;
Fig. 4 is the schematic diagram in a direction of camera module bracket according to an embodiment of the present invention;
Fig. 5 is the schematic diagram in another direction of camera module bracket according to an embodiment of the present invention;
Fig. 6 is the main view of camera module bracket according to an embodiment of the present invention;
Fig. 7 is cross-sectional view of the Fig. 6 along the direction A-A;
Fig. 8 is cross-sectional view of the Fig. 6 along the direction B-B.
Appended drawing reference:
Camera module 1000,
Camera module bracket 100,
Rack body 110, main part 111, internal installation space 101, through-hole 103, escape hole 104,
External installation space 102, the first outside installation space 102a, the second outside installation space 102b, third outside peace Space 102c is filled, first escapes air drain 105, and second escapes air drain 106,
Extension 112, the first extension 112a, the second extension 112b, third extension 112c,
Sidewall portion 120, the first side wall 121, second sidewall 122, the 4th side wall 124, the 5th side wall 125, the 6th side wall 126, the first reinforcing rib 127, the second reinforcing rib 128, third reinforcing rib 129,
Third side wall 123, straight portion 123a, bending coupling part 123b,
Adhesive-spill-preventing boss 140, plummer 150,
Circuit board 200, image sensing chip 300, electronic component 400, optical filter 500,
Lens assembly 600, camera lens 610, lens support 620.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc. Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary The interaction relationship of the connection in portion or two elements, unless otherwise restricted clearly.For those of ordinary skill in the art For, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below " One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Camera module 1000 according to an embodiment of the present invention is described in detail below with reference to Fig. 1 and Fig. 2, the camera shooting Head mould group 1000 can be applied to mobile phone, camera etc. on the equipment of camera function.
Camera module 1000 according to an embodiment of the present invention may include camera module bracket 100, circuit board 200, Image sensing chip 300, electronic component 400, optical filter 500 and lens assembly 600.
Wherein, (specific structure about camera module bracket 100 will be as shown in Fig. 2, camera module bracket 100 Specifically described below with reference to embodiment) limit internal installation space 101 and external installation space 102, internal installation space 101 It is not connected to external installation space 102, the dust or clast in external installation space 102 cannot enter internal installation space In 101.
Internal installation space 101 is connected to the through-hole 103 on camera module bracket 100, and circuit board 200, which is sticked, to image In head module bracket 100, optionally, adhesive layer, camera mould are provided between camera module bracket 100 and circuit board 200 Pack support 100 is bonded on circuit board 200.
Image sensing chip 300 is electrically connected with circuit board 200 and is arranged in internal installation space 101, image sensing core Piece 300 and the opposite light to incude outside of through-hole 103.
Electronic component 400 is electrically connected with circuit board 200 and is arranged in external installation space 102, and electronic component 400 includes Capacitor, resistance etc., in specific example of the invention, electronic component 400 further includes driving chip.
That is, electronic component 400 and image sensing chip 300 are located in different two spaces, electronics member The dust between capacitor conductive piece on part 400 and circuit board 200 will not enter image sensing core when mobile phone is vibrated Inner space where piece 300 has effectively obstructed dust, contaminant particles enter the image sensing of image sensing chip 300 Area plays the role of protecting image sensing chip 300, ensure that the quality of imaging.
Optical filter 500 is arranged at the through-hole 103 of camera module bracket 100, extraneous light pass through optical filter 500 into Enter internal installation space 101, is then perceived by image sensing chip 300.Preferably, optical filter 500 is IR cut filter Piece.
Lens assembly 600 is arranged on camera module bracket 100 and including camera lens 610 and lens support 620.Camera lens Component 600 can be mounted on camera module bracket 100 by way of bonding.Specific in present embodiment, camera lens branch Support member 620 is voice coil motor, has the quill with internal screw thread (not shown), the external screw thread (not shown) with camera lens 610 Match assembling.
Camera module bracket 100 according to an embodiment of the present invention is described in detail below with reference to Fig. 2 to Fig. 8.
Camera module bracket 100 according to an embodiment of the present invention may include rack body 110 and sidewall portion 120.
Wherein, as shown in Fig. 2, Fig. 4 to Fig. 8, rack body 110, which is equipped with, penetrates through branch along 110 thickness direction of rack body The through-hole 103 of frame ontology 110.Sidewall portion 120 is located on rack body 110, and sidewall portion 120 is annular and surround through-hole 103.
Internal installation space 101 and external installation space 102 are limited between rack body 110 and sidewall portion 120, it is internal Installation space 101 is located at the inside of sidewall portion 120, and internal installation space 101 is connected to through-hole 103 and for installing image sensing Chip 300, external installation space 102 are located at the outside of sidewall portion 120 and for installing electronic component 400.
In other words, internal installation space 101 and external installation space 102 are kept apart by sidewall portion 120, internal installation space 101 are not connected to external installation space 102, and the dust in external installation space 102 cannot enter internal installation space 101 It is interior, and then the image sensing chip 300 of internal installation space 101 can work under stable environment.
Specifically, rack body 110 includes positioned at the main part 111 of 120 inside of sidewall portion and positioned at least partly side wall The extension 112 in 120 outside of portion.That is, the outside that can be a part of sidewall portion 120 is equipped with extension 112, it can also be with It is the outside of whole sidewall portions 120 equipped with extension 112.In specific example of the invention, extension 112 is located at a part The outside of sidewall portion 120.
Limit internal installation space 101 between main part 111 and sidewall portion 120, extension 112 and sidewall portion 120 it Between limit external installation space 102.
More specifically, sidewall portion 120 includes the first side wall 121 being sequentially connected, second side as shown in Fig. 3, Fig. 4 and Fig. 6 Wall 122, third side wall 123 and the 4th side wall 124, the first side wall 121 and third side wall 123 are oppositely arranged and second sidewall 122 It is oppositely arranged with the 4th side wall 124, wherein being located at the first side wall 121, second sidewall 122, third side wall 123 and the 4th side wall The main part 111 that 110 part of rack body of 124 insides is constituted.And the first side wall 121, second sidewall 122 and the 4th side wall 124 outside is provided with extension 112.
It should be noted that "inner" described in the embodiment of the present invention is referred to towards 100 center of camera module bracket Direction, the "outside" refers to the direction far from 100 center of camera module bracket.
As shown in fig. 6, extension 112 includes that the first extension 112a, the first extension 112a is located at second sidewall 122 Outside.As shown in figure 3, external installation space 102 includes the first outside installation space 102a, the first outside installation space 102a by First extension 112a, second sidewall 122, a part of a part of the first side wall 121 and third side wall 123 surround.
Second sidewall 122 keeps apart the first outside installation space 102a and internal installation space 101, effectively obstructs Dust, contaminant particles in first outside installation space 102a enter the inside installation space where image sensing chip 300 In 101, play the role of protecting image sensing chip 300.
Further, as shown in fig. 6, extension 112 can also include the second extension 112b and third extension 112c, Second extension 112b is located at the outside of the 4th side wall 124, and third extension 112c is located at the outside of the first side wall 121.Side wall Portion 120 further includes the 5th side wall 125, the 5th side wall 125 be arranged on the edge of third extension 112c and with the first side wall 121 It is spaced apart.
That is, extension 112 includes the first extension 112a in 122 outside of second sidewall, 124 outside of the 4th side wall The second extension 112b and the outside of the first side wall 121 third extension 112c, extension 112 is located at a part of sidewall portion The outside of 120 (second sidewall 122, the 4th side wall 124 and the first side walls 121).
As shown in figure 3, external installation space 102 can also include the second outside installation space 102b, the second outside installation Space 102b is by the second extension 112b, the 4th side wall 124, a part of the 5th side wall 125 and a part of third side wall 123 It surrounds.Second outside installation space 102b is used for accommodating electric element 400.In a specific embodiment of the present invention, outside second Electronic component 400 in installation space 102b includes capacitor, resistance and driving chip.
4th side wall 124 keeps apart the second outside installation space 102b and internal installation space 101, effectively obstructs Dust, contaminant particles in second outside installation space 102b enter the inside installation space where image sensing chip 300 101, play the role of protecting image sensing chip 300.
Further, as shown in Fig. 3, Fig. 4 and Fig. 6, sidewall portion 120 further includes the 6th side wall 126, the 6th side wall 126 The edge of first extension 112a is set and is connected to the neighbouring second sidewall 122 of the first side wall 121 and the 5th side wall 125 Between one end.
The first side wall 121 and the 5th side wall 125 are spaced apart, and the 6th side wall 126 is by the first side wall 121 and the 5th side wall 125 Ipsilateral one end of close second sidewall 122 connect, a part of the 4th side wall 124 is by the first side wall 121 and the 5th The ipsilateral other end close to the 4th side wall 124 of side wall 125 connects.
As shown in figure 3, external installation space 102 further includes installation space 102c outside third, installation space outside third 102c by third extension 112c, the first side wall 121, the 6th side wall 126, the 5th side wall 125 a part and the 4th side wall 124 A part surround.
The first side wall 121 keeps apart installation space 102c outside third and internal installation space 101, effectively obstructs Dust, contaminant particles outside third in installation space 102c enter the inside installation space where image sensing chip 300 101, play the role of protecting image sensing chip 300.
In some embodiments of the invention, it as shown in Fig. 3, Fig. 4 and Fig. 6, is provided on the medial surface of third side wall 123 Multiple first reinforcing ribs 127 are played a supporting role, to enhance the stress intensity of camera module bracket 100 of the invention In specific example, 127 quantity of the first reinforcing rib is three, the size all the same of the first reinforcing rib 127 and is parallel to each other and is spaced and set It sets.
The escape hole 104 through rack body 110, side wall are wherein provided between two adjacent the first reinforcing ribs 127 The side of the separate rack body 110 in portion 120 and image sensing chip 300 are fixed on circuit board in such a way that colloid bonds On 200, the colloid in internal installation space 101 solidifies the gas generated can be discharged into the external environment by escape hole 104, In order to avoid collapsing out image sensing chip 300 since gas cannot be discharged from internal installation space 101.The specific embodiment party of the present invention In formula, escape hole 104 is formed as round.
In some embodiments of the invention, as shown in Fig. 3, Fig. 4 and Fig. 6, third side wall 123 includes straight portion 123a With bending coupling part 123b, dogleg section is arranged in the both ends of straight portion 123a and is used for and second sidewall 122 and the 4th Side wall 124 is connected, and is provided with multiple first reinforcing ribs on the inner wall towards internal installation space 101 of straight portion 123a 127, and multiple first reinforcing ribs 127 are spaced apart along the length direction of straight portion 123a.
The second reinforcing rib 128 is provided on the lateral surface of second sidewall 122, thus, it is possible to increase rack body 110 by Power intensity plays the role of supporting support ontology 110, improves the stability of camera work.
In some embodiments of the invention, as shown in Fig. 3, Fig. 4 and Fig. 6, the first side wall 121 and the 5th side wall 125 it Between be provided with the third reinforcing rib 129 being accommodated in outside third in installation space 102c.Third reinforcing rib 129 and the first side wall 121, the 5th side wall 125 and third extension 112c are connected, and then can increase the stress intensity of rack body 110, play The effect of supporting support ontology 110 improves the stability of camera work.
Advantageously, first is provided on third reinforcing rib 129 and escapes air drain 105, the first side wall 121 and the 5th side wall 125 it Between the 4th side wall 124 on be provided with second and escape air drain 106.Electronic component 400 passes through glue in installation space 102c outside third The mode of body bonding is fixed on circuit board 200, and the gas that colloid solidifies generation can escape air drain 105 and second by first and escape Air drain 106 is discharged into the external environment, in order to avoid electricity is collapsed out since gas cannot be discharged out of third outside installation space 102c Subcomponent 400.
As shown in Fig. 2, Fig. 5, Fig. 7 and Fig. 8, it is convex that rack body 110 is formed with adhesive-spill-preventing on the side of sidewall portion 120 Platform 140, glue is flowed into the surface of optical filter 500 when preventing from being assembled with lens assembly 600 by viscose glue, influences into The quality of picture.
A part of first through hole 103 is protruded to the center line of first through hole 103 to form plummer 150, to carry Optical filter 500.Thus, it is possible to guarantee that optical filter 500 can be more firmly mounted on rack body 110, and can be one Determine that optical filter 500 is protected not to be scratched in degree.Preferably, specific in present embodiment, optical filter 500 is infrared cutoff filter Mating plate.
When above-mentioned camera module 1000 is assembled, the image sensing chip 300 and electronic component 400 are first passed through Chip on board technique (Chip On Board, COB) is assembled on the circuit board 200, to being equipped with optical filter 500 in advance After the bottom of the divider wall of camera module bracket 100 is coated viscose glue, by the installation of camera module bracket 100 to circuit board On 200, finally it is heating and curing.In this heat curing process, escape hole 104 for being discharged in internal installation space in time The gas generated in 101.First escapes air drain 105 and second escapes air drain 106 for being discharged third outside installation space 102c in time The gas of interior generation, in order to avoid collapse out electronic component 400.Finally, after carrying out filler solidification to escape hole 104, by lens assembly 600 It is mounted on by viscose glue on the edge of the mounting surface of camera module bracket 100, completes the assembling of entire camera module 1000 Process.
Above-mentioned camera module 1000 includes at least following advantages:
Camera module 1000 in the present invention is kept apart main part 111 and extension 112 using sidewall portion 120. Image sensing chip 300 is contained in internal installation space 101, and electronic component 400 is contained in external installation space 102, outside Portion's installation space 102 includes installation outside the first outside installation space 102a, the second outside installation space 102b and third Space 102c.To which sidewall portion 120 keeps apart image sensing chip 300 and electronic component 400, has effectively obstructed dirt Angstrom, contaminant particles enter the image sensing area of image sensing chip 300, play the role of protecting image sensing chip 300, It ensure that the quality of imaging.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned Embodiment is changed, modifies, replacement and variant.

Claims (10)

1. a kind of camera module bracket characterized by comprising
Rack body, the rack body penetrate through the logical of the rack body equipped with the thickness direction along the rack body Hole;
Sidewall portion, the sidewall portion are located on the rack body, and the sidewall portion is annular and surround the through-hole;
The inside installation space for installing image sensing chip is wherein limited between the rack body and the sidewall portion With the external installation space for installing electronic component, the internal installation space is located at the inside of the sidewall portion;And
Reinforcing rib, the reinforcing rib is connected with the sidewall portion and will be divided into multiple chambers between the external installation space, described Electronic component can be distributed in the multiple chamber,
The external installation space includes installation space outside the second outside installation space and third, and second outside installation is empty Between be nicked form, installation space is by being divided into multiple chambers outside the third between the reinforcing rib, on the reinforcing rib Escape air drain equipped with first, the third outside installation space is escaped air drain by second with second outside installation space and is connected to.
2. camera module bracket according to claim 1, which is characterized in that the rack body includes: positioned at described Main part on the inside of sidewall portion and the extension on the outside of at least partly described sidewall portion, the main part and the sidewall portion Between limit the internal installation space, the external installation space is limited between the extension and the sidewall portion.
3. the camera module bracket stated according to claim 2, which is characterized in that the sidewall portion includes first be sequentially connected Side wall, second sidewall, third side wall and the 4th side wall, the first side wall and the third side wall are oppositely arranged and described second Side wall is oppositely arranged with the 4th side wall, wherein being located at the first side wall, the second sidewall, the third side wall and institute The rack body part for stating the 4th inside sidewalls constitutes the main part;
The extension includes: the first extension, and first extending part is in the outside of the second sidewall;
The external installation space includes: the first outside installation space, and first outside installation space is extended by described first Portion, the second sidewall, a part of a part of the first side wall and the third side wall surround.
4. camera module bracket according to claim 3, which is characterized in that
The extension further include: the second extension and third extension, second extending part is in the 4th side wall Outside, the third extending part is in the outside of the first side wall;
The sidewall portion further include: the 5th side wall, the 5th side wall are arranged on the third extension and with described first Sidewall spacers are opened.
5. camera module bracket according to claim 4, it is characterised in that second outside installation space is by described Second extension, the 4th side wall, a part of the 5th side wall and a part of the third side wall surround.
6. camera module bracket according to claim 4, which is characterized in that the sidewall portion further include: the 6th side wall, 6th side wall is arranged in the edge of first extension and is connected to the first side wall and the 5th side wall Between one end of the neighbouring second sidewall;
Installation space is by the third extension, the first side wall, the 6th side wall, the 5th side outside the third A part of wall and a part of the 4th side wall surround.
7. the camera module bracket stated according to claim 3, which is characterized in that be provided on the medial surface of the third side wall Multiple first reinforcing ribs escape gas through the rack body wherein being provided between two adjacent first reinforcing ribs Hole;The second reinforcing rib is provided on the lateral surface of the second sidewall.
8. camera module bracket according to claim 6, which is characterized in that the first side wall and the 5th side wall Between be provided with the third reinforcing rib being accommodated in outside the third in installation space.
9. the camera module bracket stated according to claim 8, which is characterized in that be provided with described on the third reinforcing rib One escapes air drain, and described first, which escapes air drain, is connected to the two chambers adjacent with the third reinforcing rib, and described first escapes air drain from institute It states third reinforcing rib top surface to extend to bottom surface, be arranged on the 4th side wall between the first side wall and the 5th side wall There is described second to escape air drain, described second, which escapes air drain, is connected to the two chambers adjacent with the 4th side wall, and described second escapes gas Slot extends from the 4th side wall top surface to bottom surface.
10. a kind of camera module characterized by comprising
Camera module bracket, the camera module bracket are according to camera mould of any of claims 1-9 Pack support;
Circuit board, the circuit board are sticked on the camera module bracket;
Image sensing chip, the image sensing chip is with the circuit board electrical connection and setting is in the internal installation space Interior, the image sensing chip is opposite with the through-hole;
Electronic component, the electronic component is with the circuit board electrical connection and setting is in the multiple chamber;
The through hole of the camera module bracket is arranged in optical filter, the optical filter;
Lens assembly, the lens assembly are arranged on the camera module bracket and including camera lens and lens support.
CN201510250071.1A 2015-05-15 2015-05-15 Camera module bracket and camera module with it Active CN104917944B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510250071.1A CN104917944B (en) 2015-05-15 2015-05-15 Camera module bracket and camera module with it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510250071.1A CN104917944B (en) 2015-05-15 2015-05-15 Camera module bracket and camera module with it

Publications (2)

Publication Number Publication Date
CN104917944A CN104917944A (en) 2015-09-16
CN104917944B true CN104917944B (en) 2019-05-28

Family

ID=54086612

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510250071.1A Active CN104917944B (en) 2015-05-15 2015-05-15 Camera module bracket and camera module with it

Country Status (1)

Country Link
CN (1) CN104917944B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105635535B (en) * 2015-12-26 2019-03-01 魅族科技(中国)有限公司 A kind of CCD camera assembly and terminal
CN107799544A (en) * 2017-11-29 2018-03-13 苏州昀冢电子科技有限公司 Camera module encapsulation base plate and camera module
CN107888729A (en) * 2017-11-30 2018-04-06 广东欧珀移动通信有限公司 Bracket component, camera and electronic equipment
CN108184042B (en) * 2017-12-11 2020-02-14 Oppo广东移动通信有限公司 Camera assembly and mobile terminal
CN108055442A (en) * 2017-12-29 2018-05-18 信利光电股份有限公司 A kind of video camera and its camera and its camera module pedestal
WO2020043127A1 (en) * 2018-08-28 2020-03-05 南昌欧菲光电技术有限公司 Photosensitive assembly, camera module, and mobile terminal
CN111123457B (en) * 2018-10-31 2022-06-24 三赢科技(深圳)有限公司 Base and camera module
CN113890963A (en) * 2020-07-03 2022-01-04 晋城三赢精密电子有限公司 Camera module and electronic device with same
CN111970421B (en) * 2020-08-17 2022-03-22 Oppo广东移动通信有限公司 Camera motor, camera module and electronic device
CN114827389A (en) 2021-01-18 2022-07-29 三赢科技(深圳)有限公司 Camera module and electronic equipment
TWI793505B (en) * 2021-01-18 2023-02-21 新煒科技有限公司 Camera module and electronic device
CN115118839A (en) 2021-03-17 2022-09-27 晋城三赢精密电子有限公司 Camera module and electronic device
CN115134502A (en) * 2022-07-28 2022-09-30 Oppo广东移动通信有限公司 Support, light filtering assembly, camera and electronic device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103345109A (en) * 2013-07-02 2013-10-09 南昌欧菲光电技术有限公司 Support structure and camera module provided with same
CN103402048A (en) * 2013-07-30 2013-11-20 南昌欧菲光电技术有限公司 Camera module, dust prevention and fixing method and installation method of camera module
CN103780805A (en) * 2012-10-26 2014-05-07 深圳欧菲光科技股份有限公司 Camera module group support and camera module group
CN103913933A (en) * 2014-04-25 2014-07-09 昆山凯尔光电科技有限公司 Dust-proof support and camera module with same
CN204721433U (en) * 2015-05-15 2015-10-21 南昌欧菲光电技术有限公司 Camera module bracket and there is its camera module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI314666B (en) * 2006-01-10 2009-09-11 Lite On Technology Corp Camera module and method for forming the camera module
US20080099866A1 (en) * 2006-10-25 2008-05-01 Impac Technology Co., Ltd. Image sensing module and method for packaging the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103780805A (en) * 2012-10-26 2014-05-07 深圳欧菲光科技股份有限公司 Camera module group support and camera module group
CN103345109A (en) * 2013-07-02 2013-10-09 南昌欧菲光电技术有限公司 Support structure and camera module provided with same
CN103402048A (en) * 2013-07-30 2013-11-20 南昌欧菲光电技术有限公司 Camera module, dust prevention and fixing method and installation method of camera module
CN103913933A (en) * 2014-04-25 2014-07-09 昆山凯尔光电科技有限公司 Dust-proof support and camera module with same
CN204721433U (en) * 2015-05-15 2015-10-21 南昌欧菲光电技术有限公司 Camera module bracket and there is its camera module

Also Published As

Publication number Publication date
CN104917944A (en) 2015-09-16

Similar Documents

Publication Publication Date Title
CN104917944B (en) Camera module bracket and camera module with it
CN104902158B (en) Camera module bracket and camera module with it
JP2022043103A (en) Device for fixing camera module circuit board and camera module
US8773867B2 (en) Camera module for shielding EMI
CN204721433U (en) Camera module bracket and there is its camera module
JP4652149B2 (en) The camera module
CN104333687A (en) Dual-camera device and terminal equipment thereof
CN104796588B (en) Camera module
JP6125985B2 (en) Bus bar
CN104425925B (en) The connection structure of module and module and butt connector
JP2019180603A (en) Imaging unit
CN107819903B (en) Photomoduel and mobile terminal
CN207488678U (en) Lens driving mechanism
JP2011159081A (en) Electronic device
JP6722515B2 (en) motor
IT201900015992A1 (en) DEVICE FOR THE ELECTRICAL CONNECTION OF ONE OR MORE ELECTRICAL CONNECTORS TO A PRINTED CIRCUIT BOARD
JP5345871B2 (en) Electrical junction box
CN207908773U (en) Lens barrel and camera lens module comprising the lens barrel
WO2018100852A1 (en) Capacitor
CN107911578B (en) Photomoduel and mobile terminal
JP6983430B2 (en) Insulation frame for load test equipment and load test equipment
JP5083270B2 (en) Electronics
CN215300731U (en) Circuit board assembly, camera module and electronic equipment
CN218100573U (en) Frame assembly and display device
EP2693263A1 (en) Display device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province

Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd.

Patentee after: Nanchang OFilm Tech. Co.,Ltd.

Patentee after: Ophiguang Group Co.,Ltd.

Patentee after: SUZHOU OFILM TECH Co.,Ltd.

Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province

Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: OFilm Tech Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

Address after: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province

Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd.

Patentee after: Nanchang OFilm Tech. Co.,Ltd.

Patentee after: OFilm Tech Co.,Ltd.

Patentee after: SUZHOU OFILM TECH Co.,Ltd.

Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province

Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: Shenzhen OFilm Tech Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20211009

Address after: 330096 No. 1404, Tianxiang North Avenue, Nanchang high tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi Jinghao optics Co.,Ltd.

Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province

Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: Ophiguang Group Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.