Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to propose a kind of camera module bracket, which has internal installation space and external installation
Space, image sensing chip are mounted in internal installation space, and electronic component is mounted in external installation space, are thereby reduced
Since dust and clast enter the image sensing area of image sensing chip and the influence caused by imaging.
Another object of the present invention is that proposing the camera module with above-mentioned camera module bracket.
Camera module bracket according to the present invention, comprising: rack body, the rack body are equipped with along the bracket
The thickness direction of ontology penetrates through the through-hole of the rack body;Sidewall portion, the sidewall portion is located on the rack body, described
Sidewall portion is annular and surround the through-hole;Internal installation space is wherein limited between the rack body and the sidewall portion
With external installation space, the internal installation space is located at the inside of the sidewall portion, and the internal installation space leads to described
Hole is connected to and for installing image sensing chip, and the external installation space is located at the outside of the sidewall portion and for installing electricity
Subcomponent.
Camera module bracket according to the present invention, by the way that image sensing chip and electronic component to be placed in different installations
In space, i.e., image sensing chip is arranged in internal installation space, and electronic component is arranged in external installation space, thus hidden
The granulometric impurity between capacitor conductive piece ensconced on electronic component and circuit board cannot enter image from external installation space
In inside installation space where sensor chip, thereby reduce since above-mentioned granulometric impurity falls to image sensing chip
Image sensing area and influenced caused by the image quality of camera.
In addition, camera module bracket according to the present invention can also have the following additional technical features:
According to one embodiment of present invention, the rack body include: main part on the inside of the sidewall portion and
Extension on the outside of at least partly described sidewall portion limits the internal peace between the main part and the sidewall portion
Space is filled, the external installation space is limited between the extension and the sidewall portion.
According to one embodiment of present invention, the sidewall portion includes the first side wall being sequentially connected, second sidewall, third
Side wall and the 4th side wall, the first side wall and the third side wall are oppositely arranged and the second sidewall and the 4th side wall
It is oppositely arranged, wherein being located at the institute of the first side wall, the second sidewall, the third side wall and the 4th inside sidewalls
It states rack body part and constitutes the main part;The extension includes: the first extension, and first extending part is in described
The outside of second sidewall;The external installation space includes: the first outside installation space, and first outside installation space is by institute
The a part for stating the first extension, the second sidewall, a part of the first side wall and the third side wall surrounds.
According to one embodiment of present invention, the extension further include: the second extension and third extension, described
Two extending parts are in the outside of the 4th side wall, and the third extending part is in the outside of the first side wall;The side wall
Portion further include: the 5th side wall, the 5th side wall are arranged on the third extension and are spaced apart with the first side wall.
According to one embodiment of present invention, the external installation space further include: the second outside installation space, described the
Two outside installation spaces are by second extension, the 4th side wall, a part of the 5th side wall and the third side
A part of wall surrounds.
According to one embodiment of present invention, the sidewall portion further include: the 6th side wall, the 6th side wall are arranged in institute
It states the edge of the first extension and is connected to the one of the neighbouring second sidewall of the first side wall and the 5th side wall
Between end;The external installation space further include: installation space outside third, third outside installation space is by the third
Extension, the first side wall, the 6th side wall, a part of the 5th side wall and a part of the 4th side wall are enclosed
At.
According to one embodiment of present invention, multiple first reinforcing ribs are provided on the medial surface of the third side wall,
In be provided with the escape hole through the rack body between adjacent two first reinforcing ribs;Outside the second sidewall
The second reinforcing rib is provided on side.
According to one embodiment of present invention, it is provided between the first side wall and the 5th side wall described in being accommodated in
Third reinforcing rib outside third in installation space.
According to one embodiment of present invention, first is provided on the third reinforcing rib and escapes air drain, be located at described first
Second, which is provided with, on the 4th side wall between side wall and the 5th side wall escapes air drain.
Camera module according to the present invention, including above-mentioned camera module bracket;Circuit board, the circuit board are sticked
On the camera module bracket;Image sensing chip, the image sensing chip and the circuit board electrical connection and setting
In the internal installation space, the image sensing chip is opposite with the through-hole;Electronic component, the electronic component and institute
It states circuit board electrical connection and setting is in the external installation space;Optical filter, the optical filter are arranged in the camera mould
The through hole of pack support;Lens assembly, the lens assembly are arranged on the camera module bracket and including camera lens
And lens support.
Camera module according to the present invention can effectively obstruct dust, contaminant particles enter image sensing core
The image sensing area of piece plays the role of protecting image sensing chip, ensure that the quality of imaging.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the schematic diagram of camera module according to an embodiment of the present invention;
Fig. 2 is the schematic diagram of camera module bracket assembly according to an embodiment of the present invention on circuit boards;
Fig. 3 is the schematic diagram of camera module according to an embodiment of the present invention;
Fig. 4 is the schematic diagram in a direction of camera module bracket according to an embodiment of the present invention;
Fig. 5 is the schematic diagram in another direction of camera module bracket according to an embodiment of the present invention;
Fig. 6 is the main view of camera module bracket according to an embodiment of the present invention;
Fig. 7 is cross-sectional view of the Fig. 6 along the direction A-A;
Fig. 8 is cross-sectional view of the Fig. 6 along the direction B-B.
Appended drawing reference:
Camera module 1000,
Camera module bracket 100,
Rack body 110, main part 111, internal installation space 101, through-hole 103, escape hole 104,
External installation space 102, the first outside installation space 102a, the second outside installation space 102b, third outside peace
Space 102c is filled, first escapes air drain 105, and second escapes air drain 106,
Extension 112, the first extension 112a, the second extension 112b, third extension 112c,
Sidewall portion 120, the first side wall 121, second sidewall 122, the 4th side wall 124, the 5th side wall 125, the 6th side wall
126, the first reinforcing rib 127, the second reinforcing rib 128, third reinforcing rib 129,
Third side wall 123, straight portion 123a, bending coupling part 123b,
Adhesive-spill-preventing boss 140, plummer 150,
Circuit board 200, image sensing chip 300, electronic component 400, optical filter 500,
Lens assembly 600, camera lens 610, lens support 620.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements, unless otherwise restricted clearly.For those of ordinary skill in the art
For, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Camera module 1000 according to an embodiment of the present invention is described in detail below with reference to Fig. 1 and Fig. 2, the camera shooting
Head mould group 1000 can be applied to mobile phone, camera etc. on the equipment of camera function.
Camera module 1000 according to an embodiment of the present invention may include camera module bracket 100, circuit board 200,
Image sensing chip 300, electronic component 400, optical filter 500 and lens assembly 600.
Wherein, (specific structure about camera module bracket 100 will be as shown in Fig. 2, camera module bracket 100
Specifically described below with reference to embodiment) limit internal installation space 101 and external installation space 102, internal installation space 101
It is not connected to external installation space 102, the dust or clast in external installation space 102 cannot enter internal installation space
In 101.
Internal installation space 101 is connected to the through-hole 103 on camera module bracket 100, and circuit board 200, which is sticked, to image
In head module bracket 100, optionally, adhesive layer, camera mould are provided between camera module bracket 100 and circuit board 200
Pack support 100 is bonded on circuit board 200.
Image sensing chip 300 is electrically connected with circuit board 200 and is arranged in internal installation space 101, image sensing core
Piece 300 and the opposite light to incude outside of through-hole 103.
Electronic component 400 is electrically connected with circuit board 200 and is arranged in external installation space 102, and electronic component 400 includes
Capacitor, resistance etc., in specific example of the invention, electronic component 400 further includes driving chip.
That is, electronic component 400 and image sensing chip 300 are located in different two spaces, electronics member
The dust between capacitor conductive piece on part 400 and circuit board 200 will not enter image sensing core when mobile phone is vibrated
Inner space where piece 300 has effectively obstructed dust, contaminant particles enter the image sensing of image sensing chip 300
Area plays the role of protecting image sensing chip 300, ensure that the quality of imaging.
Optical filter 500 is arranged at the through-hole 103 of camera module bracket 100, extraneous light pass through optical filter 500 into
Enter internal installation space 101, is then perceived by image sensing chip 300.Preferably, optical filter 500 is IR cut filter
Piece.
Lens assembly 600 is arranged on camera module bracket 100 and including camera lens 610 and lens support 620.Camera lens
Component 600 can be mounted on camera module bracket 100 by way of bonding.Specific in present embodiment, camera lens branch
Support member 620 is voice coil motor, has the quill with internal screw thread (not shown), the external screw thread (not shown) with camera lens 610
Match assembling.
Camera module bracket 100 according to an embodiment of the present invention is described in detail below with reference to Fig. 2 to Fig. 8.
Camera module bracket 100 according to an embodiment of the present invention may include rack body 110 and sidewall portion 120.
Wherein, as shown in Fig. 2, Fig. 4 to Fig. 8, rack body 110, which is equipped with, penetrates through branch along 110 thickness direction of rack body
The through-hole 103 of frame ontology 110.Sidewall portion 120 is located on rack body 110, and sidewall portion 120 is annular and surround through-hole 103.
Internal installation space 101 and external installation space 102 are limited between rack body 110 and sidewall portion 120, it is internal
Installation space 101 is located at the inside of sidewall portion 120, and internal installation space 101 is connected to through-hole 103 and for installing image sensing
Chip 300, external installation space 102 are located at the outside of sidewall portion 120 and for installing electronic component 400.
In other words, internal installation space 101 and external installation space 102 are kept apart by sidewall portion 120, internal installation space
101 are not connected to external installation space 102, and the dust in external installation space 102 cannot enter internal installation space 101
It is interior, and then the image sensing chip 300 of internal installation space 101 can work under stable environment.
Specifically, rack body 110 includes positioned at the main part 111 of 120 inside of sidewall portion and positioned at least partly side wall
The extension 112 in 120 outside of portion.That is, the outside that can be a part of sidewall portion 120 is equipped with extension 112, it can also be with
It is the outside of whole sidewall portions 120 equipped with extension 112.In specific example of the invention, extension 112 is located at a part
The outside of sidewall portion 120.
Limit internal installation space 101 between main part 111 and sidewall portion 120, extension 112 and sidewall portion 120 it
Between limit external installation space 102.
More specifically, sidewall portion 120 includes the first side wall 121 being sequentially connected, second side as shown in Fig. 3, Fig. 4 and Fig. 6
Wall 122, third side wall 123 and the 4th side wall 124, the first side wall 121 and third side wall 123 are oppositely arranged and second sidewall 122
It is oppositely arranged with the 4th side wall 124, wherein being located at the first side wall 121, second sidewall 122, third side wall 123 and the 4th side wall
The main part 111 that 110 part of rack body of 124 insides is constituted.And the first side wall 121, second sidewall 122 and the 4th side wall
124 outside is provided with extension 112.
It should be noted that "inner" described in the embodiment of the present invention is referred to towards 100 center of camera module bracket
Direction, the "outside" refers to the direction far from 100 center of camera module bracket.
As shown in fig. 6, extension 112 includes that the first extension 112a, the first extension 112a is located at second sidewall 122
Outside.As shown in figure 3, external installation space 102 includes the first outside installation space 102a, the first outside installation space 102a by
First extension 112a, second sidewall 122, a part of a part of the first side wall 121 and third side wall 123 surround.
Second sidewall 122 keeps apart the first outside installation space 102a and internal installation space 101, effectively obstructs
Dust, contaminant particles in first outside installation space 102a enter the inside installation space where image sensing chip 300
In 101, play the role of protecting image sensing chip 300.
Further, as shown in fig. 6, extension 112 can also include the second extension 112b and third extension 112c,
Second extension 112b is located at the outside of the 4th side wall 124, and third extension 112c is located at the outside of the first side wall 121.Side wall
Portion 120 further includes the 5th side wall 125, the 5th side wall 125 be arranged on the edge of third extension 112c and with the first side wall 121
It is spaced apart.
That is, extension 112 includes the first extension 112a in 122 outside of second sidewall, 124 outside of the 4th side wall
The second extension 112b and the outside of the first side wall 121 third extension 112c, extension 112 is located at a part of sidewall portion
The outside of 120 (second sidewall 122, the 4th side wall 124 and the first side walls 121).
As shown in figure 3, external installation space 102 can also include the second outside installation space 102b, the second outside installation
Space 102b is by the second extension 112b, the 4th side wall 124, a part of the 5th side wall 125 and a part of third side wall 123
It surrounds.Second outside installation space 102b is used for accommodating electric element 400.In a specific embodiment of the present invention, outside second
Electronic component 400 in installation space 102b includes capacitor, resistance and driving chip.
4th side wall 124 keeps apart the second outside installation space 102b and internal installation space 101, effectively obstructs
Dust, contaminant particles in second outside installation space 102b enter the inside installation space where image sensing chip 300
101, play the role of protecting image sensing chip 300.
Further, as shown in Fig. 3, Fig. 4 and Fig. 6, sidewall portion 120 further includes the 6th side wall 126, the 6th side wall 126
The edge of first extension 112a is set and is connected to the neighbouring second sidewall 122 of the first side wall 121 and the 5th side wall 125
Between one end.
The first side wall 121 and the 5th side wall 125 are spaced apart, and the 6th side wall 126 is by the first side wall 121 and the 5th side wall 125
Ipsilateral one end of close second sidewall 122 connect, a part of the 4th side wall 124 is by the first side wall 121 and the 5th
The ipsilateral other end close to the 4th side wall 124 of side wall 125 connects.
As shown in figure 3, external installation space 102 further includes installation space 102c outside third, installation space outside third
102c by third extension 112c, the first side wall 121, the 6th side wall 126, the 5th side wall 125 a part and the 4th side wall 124
A part surround.
The first side wall 121 keeps apart installation space 102c outside third and internal installation space 101, effectively obstructs
Dust, contaminant particles outside third in installation space 102c enter the inside installation space where image sensing chip 300
101, play the role of protecting image sensing chip 300.
In some embodiments of the invention, it as shown in Fig. 3, Fig. 4 and Fig. 6, is provided on the medial surface of third side wall 123
Multiple first reinforcing ribs 127 are played a supporting role, to enhance the stress intensity of camera module bracket 100 of the invention
In specific example, 127 quantity of the first reinforcing rib is three, the size all the same of the first reinforcing rib 127 and is parallel to each other and is spaced and set
It sets.
The escape hole 104 through rack body 110, side wall are wherein provided between two adjacent the first reinforcing ribs 127
The side of the separate rack body 110 in portion 120 and image sensing chip 300 are fixed on circuit board in such a way that colloid bonds
On 200, the colloid in internal installation space 101 solidifies the gas generated can be discharged into the external environment by escape hole 104,
In order to avoid collapsing out image sensing chip 300 since gas cannot be discharged from internal installation space 101.The specific embodiment party of the present invention
In formula, escape hole 104 is formed as round.
In some embodiments of the invention, as shown in Fig. 3, Fig. 4 and Fig. 6, third side wall 123 includes straight portion 123a
With bending coupling part 123b, dogleg section is arranged in the both ends of straight portion 123a and is used for and second sidewall 122 and the 4th
Side wall 124 is connected, and is provided with multiple first reinforcing ribs on the inner wall towards internal installation space 101 of straight portion 123a
127, and multiple first reinforcing ribs 127 are spaced apart along the length direction of straight portion 123a.
The second reinforcing rib 128 is provided on the lateral surface of second sidewall 122, thus, it is possible to increase rack body 110 by
Power intensity plays the role of supporting support ontology 110, improves the stability of camera work.
In some embodiments of the invention, as shown in Fig. 3, Fig. 4 and Fig. 6, the first side wall 121 and the 5th side wall 125 it
Between be provided with the third reinforcing rib 129 being accommodated in outside third in installation space 102c.Third reinforcing rib 129 and the first side wall
121, the 5th side wall 125 and third extension 112c are connected, and then can increase the stress intensity of rack body 110, play
The effect of supporting support ontology 110 improves the stability of camera work.
Advantageously, first is provided on third reinforcing rib 129 and escapes air drain 105, the first side wall 121 and the 5th side wall 125 it
Between the 4th side wall 124 on be provided with second and escape air drain 106.Electronic component 400 passes through glue in installation space 102c outside third
The mode of body bonding is fixed on circuit board 200, and the gas that colloid solidifies generation can escape air drain 105 and second by first and escape
Air drain 106 is discharged into the external environment, in order to avoid electricity is collapsed out since gas cannot be discharged out of third outside installation space 102c
Subcomponent 400.
As shown in Fig. 2, Fig. 5, Fig. 7 and Fig. 8, it is convex that rack body 110 is formed with adhesive-spill-preventing on the side of sidewall portion 120
Platform 140, glue is flowed into the surface of optical filter 500 when preventing from being assembled with lens assembly 600 by viscose glue, influences into
The quality of picture.
A part of first through hole 103 is protruded to the center line of first through hole 103 to form plummer 150, to carry
Optical filter 500.Thus, it is possible to guarantee that optical filter 500 can be more firmly mounted on rack body 110, and can be one
Determine that optical filter 500 is protected not to be scratched in degree.Preferably, specific in present embodiment, optical filter 500 is infrared cutoff filter
Mating plate.
When above-mentioned camera module 1000 is assembled, the image sensing chip 300 and electronic component 400 are first passed through
Chip on board technique (Chip On Board, COB) is assembled on the circuit board 200, to being equipped with optical filter 500 in advance
After the bottom of the divider wall of camera module bracket 100 is coated viscose glue, by the installation of camera module bracket 100 to circuit board
On 200, finally it is heating and curing.In this heat curing process, escape hole 104 for being discharged in internal installation space in time
The gas generated in 101.First escapes air drain 105 and second escapes air drain 106 for being discharged third outside installation space 102c in time
The gas of interior generation, in order to avoid collapse out electronic component 400.Finally, after carrying out filler solidification to escape hole 104, by lens assembly 600
It is mounted on by viscose glue on the edge of the mounting surface of camera module bracket 100, completes the assembling of entire camera module 1000
Process.
Above-mentioned camera module 1000 includes at least following advantages:
Camera module 1000 in the present invention is kept apart main part 111 and extension 112 using sidewall portion 120.
Image sensing chip 300 is contained in internal installation space 101, and electronic component 400 is contained in external installation space 102, outside
Portion's installation space 102 includes installation outside the first outside installation space 102a, the second outside installation space 102b and third
Space 102c.To which sidewall portion 120 keeps apart image sensing chip 300 and electronic component 400, has effectively obstructed dirt
Angstrom, contaminant particles enter the image sensing area of image sensing chip 300, play the role of protecting image sensing chip 300,
It ensure that the quality of imaging.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.