CN103402048A - Camera module, dust prevention and fixing method and installation method of camera module - Google Patents
Camera module, dust prevention and fixing method and installation method of camera module Download PDFInfo
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- CN103402048A CN103402048A CN2013103251793A CN201310325179A CN103402048A CN 103402048 A CN103402048 A CN 103402048A CN 2013103251793 A CN2013103251793 A CN 2013103251793A CN 201310325179 A CN201310325179 A CN 201310325179A CN 103402048 A CN103402048 A CN 103402048A
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- camera module
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Abstract
The invention relates to a camera module, a dust prevention and fixing method and an installation method of the camera module, wherein the camera module comprises a circuit board, a plurality of passive elements and adhesive layers, wherein the passive elements are fixedly arranged on the circuit board; the adhesive layers cover the surfaces of the passive elements; the adhesive layers are filled in gaps among the passive elements. The dust prevention and fixing method comprises the following steps: dispensing adhesive on the surfaces of the passive elements of the camera module to form the adhesive layers; filling the gaps among the passive elements with the adhesive layers. The installation method of the camera module comprises the following steps: after applying gold threads, before mounting a bracket, dispensing adhesive on a circuit board area attached below the bracket and the surfaces of the passive elements of the camera module to form the adhesive layers; filling the gaps among the passive elements with the adhesive layers. The camera module, the dust prevention and fixing method and the installation method of the camera module can solve the problem that foreign matters are easily hidden among passive elements and easily fall down during vibration.
Description
Technical field
The present invention relates to the technical field of Image Communication, particularly relate to a kind of dustproof firmware method of camera module, camera module, and the installation method of camera module.
Background technology
The camera module of general mobile phone, panel computer etc., wrapped the components and parts such as camera lens, voice coil motor, filter, transducer, passive device, circuit board and formed.Passive device is placed on circuit board mostly, between passive device, has gap, easily keeps the foreign matters such as dust scruff, can cause the bad hidden danger of image to module like this.And in the vibrations process, there is the risk that comes off in passive device.
Summary of the invention
Based on this, be necessary to hold caducous problem between passive device, easily keeping in foreign matter and vibration, a kind of camera module is provided.
Simultaneously, between passive device, easily keeping in foreign matter and vibration, hold caducous problem, a kind of firmware method of camera module is provided.
And hold caducous problem between passive device, easily keeping in foreign matter and vibration, a kind of installation method of camera module is provided.
A kind of camera module comprises circuit board, a plurality of passive device and glue-line;
Described a plurality of passive device is fixed on described circuit board, with described circuit board, is electrically connected to;
Described glue-line covers the surface of described a plurality of passive devices, and described glue-line is filled the space between described a plurality of passive devices.
In embodiment, described passive device is one or more combinations in capacity cell, resistive element and components of drive circuit therein.
In embodiment, described glue-line is the adhesive made of synthetic resin layer therein.
In embodiment, described glue-line is LHA glue-line or UV reinforcement glue-line therein.
In embodiment, the thickness of described glue-line is 0.1mm-0.3mm therein.
In embodiment, described camera module also comprises camera lens, voice coil motor, filter, support and transducer therein;
Described camera lens is arranged in described voice coil motor; Described voice coil motor is arranged on described support; Described filter is arranged in described support; Described installation of sensors is on described circuit board; Described support is arranged on described circuit board, and described support covers on the top of described transducer.
Therein in embodiment, described passive device on described circuit board near the position of described transducer, described passive device and described transducer apart from greater than 0.1mm.
In embodiment, described support comprises component cavity section therein, and described component cavity section is positioned at the side of described support; Described component cavity section and described circuit board surround the element cavity; Described passive device is arranged in described element cavity, and the distance of described passive device and described component cavity section inwall is greater than 0.1mm.
A kind of dustproof firmware method of camera module, comprise the surface point glue of step to a plurality of passive devices of camera module, generates glue-line, and described glue-line is filled the space between described a plurality of passive devices.
A kind of installation method of camera module, after beating gold thread, before mounting support, comprise the surface point glue of step to the circuit board of fitting under support zone and a plurality of passive original papers, generates glue-line, and described glue-line is filled the space between described a plurality of passive devices.
Above-mentioned camera module has glue-line in the surface coverage of passive device, can solve between passive device easily to keep in foreign matter and vibration to hold caducous problem.
The firmware method of above-mentioned camera module, at the surface point glue of passive device, can solve between passive device easily to keep in foreign matter and vibration and hold caducous problem.
The installation method of above-mentioned camera module, at the surface point glue of passive device, can solve between passive device easily to keep in foreign matter and vibration and hold caducous problem in its installation process.
The accompanying drawing explanation
Fig. 1 is the schematic diagram of camera module in an embodiment;
Fig. 2 is another schematic diagram of camera module shown in Figure 1;
Fig. 3 is the another schematic diagram of camera module shown in Figure 1;
Fig. 4 is the another schematic diagram of camera module shown in Figure 1;
Fig. 5 is the schematic diagram of the dustproof firmware method of an embodiment camera module;
Fig. 6 is the schematic diagram of the installation method of an embodiment camera module.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, camera module and dustproof firmware method thereof and installation method thereof are described more fully.In accompanying drawing, provided the first-selected embodiment of camera module and dustproof firmware method and installation method thereof.But camera module and dustproof firmware method thereof and installation method thereof can be realized in many different forms, are not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the disclosure of camera module and dustproof firmware method and installation method thereof more comprehensively thorough.
Unless otherwise defined, all technology of using of this paper and scientific terminology are with to belong to the implication that those skilled in the art of the present invention understand usually identical.The term that uses in the specification of camera module and dustproof firmware method and installation method thereof herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
As shown in Figures 1 to 4, the camera module 100 of an execution mode comprises camera lens 110, voice coil motor 120, filter 130, support 140, transducer 150, circuit board 160, a plurality of passive device 170 and glue-line 180.See for convenience passive device clearly, Fig. 3, Fig. 4 be not for showing the schematic diagram of glue-line 180.
A plurality of passive devices 170 wherein 5 be capacity cell or resistive element, another 1 is components of drive circuit, is fixed on side by side on circuit board 160, with circuit board 160, is electrically connected to, near transducer 150.Preferably, the distance of passive device 170 and transducer 150 is greater than 0.1mm.If less than 0.1mm, passive device 170, by interference sensor 150, causes affecting image effect.Glue-line 180 covers the surface of a plurality of passive devices 170, and the space between a plurality of passive devices 170 of glue-line 180 filling.Preferably, the thickness of glue-line 180 is 0.1mm-0.3mm.More excellent, the thickness of glue-line 180 is 0.1mm-0.15mm.Thickness is unfavorable for filling the space between a plurality of passive devices 170 less than 0.1mm.Simultaneously, limited because of the cavity volume of receiving element, glue-line 180 also can not be blocked up, generally needs thickness less than 0.3mm.
After space is filled, can solve the problem that easily keeps foreign matter between passive device 170.Simultaneously, because the adhesivity of glue-line 180, passive device 170, by firm sticking on circuit board 160, has solved passive device 170 in vibration and has held caducous problem.
Wherein, when passive device 170 referred to work, its inside was without any the electronic devices and components of the power supply of form.In other embodiments, passive device 170 can also be inductance element or transformer element.
In embodiment, support 140 comprises component cavity section 141 therein, and component cavity section 141 is positioned at the side of support 140.Component cavity section 141 surrounds the element cavity with circuit board 160.Passive device 170 is arranged in the element cavity, and the distance of passive device 170 and component cavity section 141 inwalls is greater than 0.1mm.If less than 0.1mm, passive device 170 is too small with the inwall distance, and unfavorable installation, increased installation risk.
Glue-line 180 is the adhesive made of synthetic resin layer.In embodiment, glue-line 180 is LHA glue-line 180 therein.Preferred happy safe 3220 type LHA glue.In embodiment, glue-line 180 is UV reinforcement glue-line 180 therein.UV is the abbreviation of English Ultraviolet Rays.UV reinforcement glue is a kind of one-component, by daylight or UV action of ultraviolet light, causes the quick-setting UV of glue without shadow glue.
The dustproof firmware method of the camera module 100 of one execution mode, comprise the surface point glue of step to a plurality of passive devices 170 of camera module 100, generates glue-line 180, the space that glue-line 180 is filled between a plurality of passive devices 170.
After space is filled, can solve the problem that easily keeps foreign matter between passive device 170.Simultaneously, because the adhesivity of glue-line 180, passive device 170, by firm sticking on circuit board 160, has solved passive device 170 in vibration and has held caducous problem.
As shown in Figure 5, concrete steps are as follows:
S310, point gum machine is aimed at passive device 170.
S320, draw glue.
S330, dry solidification forms glue-line 180.
In the present embodiment, adopt the LHA automatic dispensing machine to carry out a glue.To draw the thickness of glue speed and plastic pin diameter control glue-line 180.The thickness of glue-line 180 is 0.1mm-0.3mm.More excellent, the thickness of glue-line 180 is 0.1mm-0.15mm.Thickness is unfavorable for filling the space between a plurality of passive devices 170 less than 0.1mm.Simultaneously, limited because of the component cavity body bulk, glue-line 180 also can not be blocked up, generally needs thickness less than 0.3mm.
Preferably, during point glue, the temperature of glue is 80 degrees centigrade.Before carrying out a glue, glue need to carry out baking in 2 hours in 80 degrees centigrade of constant temperature roasters.The preferred LHA glue of glue and UV reinforcement glue.
The installation method of the camera module 100 of one execution mode, after step is beaten gold thread, before step mounts support 140, comprise that step is to circuit board 160 zones of 140 times laminatings of support and the surface point glue of a plurality of passive original papers.The space that glue-line 180 is filled between a plurality of passive devices 170.
After space is filled, can solve the problem that easily keeps foreign matter between passive device 170.Simultaneously, because the adhesivity of glue-line 180, passive device 170, by firm sticking on circuit board 160, has solved passive device 170 in vibration and has held caducous problem.
As shown in Figure 6, concrete steps are as follows:
S100, paste passive device 170 on circuit board 160.
S200, beat gold thread.
S300,170 adhesive curings of passive device.Concrete, comprise S310, S320 and S330.
S400, paste support 140 on circuit board 160 by glue.
In the present embodiment, adopt the LHA automatic dispensing machine to carry out a glue.To draw the thickness of glue speed and plastic pin diameter control glue-line 180.The thickness of glue-line 180 is 0.1mm-0.3mm.
Preferably, during point glue, the temperature of glue is 80 degrees centigrade.Before carrying out a glue, glue need to carry out baking in 2 hours in 80 degrees centigrade of constant temperature roasters.The preferred LHA glue of glue and UV reinforcement glue.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a camera module, is characterized in that, comprises circuit board, a plurality of passive device and glue-line;
Described a plurality of passive device is fixed on described circuit board, with described circuit board, is electrically connected to;
Described glue-line covers the surface of described a plurality of passive devices, and described glue-line is filled the space between described a plurality of passive devices.
2. camera module according to claim 1, is characterized in that, described passive device is one or more combinations in capacity cell, resistive element and components of drive circuit.
3. camera module according to claim 2, is characterized in that, described glue-line is the adhesive made of synthetic resin layer.
4. camera module according to claim 2, is characterized in that, described glue-line is LHA glue-line or UV reinforcement glue-line.
5. camera module according to claim 1, is characterized in that, the thickness of described glue-line is 0.1mm-0.3mm.
6. camera module according to claim 1, is characterized in that, also comprises camera lens, voice coil motor, filter, support and transducer;
Described camera lens is arranged in described voice coil motor; Described voice coil motor is arranged on described support; Described filter is arranged in described support; Described installation of sensors is on described circuit board; Described support is arranged on described circuit board, and described support covers on the top of described transducer.
7. camera module according to claim 6, is characterized in that, described passive device is near the position of described transducer on described circuit board, and the distance of described passive device and described transducer is greater than 0.1mm.
8. camera module according to claim 6, is characterized in that, described support comprises component cavity section, and described component cavity section is positioned at the side of described support; Described component cavity section and described circuit board surround the element cavity; Described passive device is arranged in described element cavity, and the distance of described passive device and described component cavity section inwall is greater than 0.1mm.
9. the dustproof firmware method of a camera module, is characterized in that, comprises the surface point glue of step to a plurality of passive devices of camera module, generates glue-line, and described glue-line is filled the space between described a plurality of passive devices.
10. the installation method of a camera module, is characterized in that, after beating gold thread, before mounting support, comprise the surface point glue of step to the circuit board of fitting under support zone and a plurality of passive original papers, generate glue-line, described glue-line is filled the space between described a plurality of passive devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013103251793A CN103402048A (en) | 2013-07-30 | 2013-07-30 | Camera module, dust prevention and fixing method and installation method of camera module |
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| CN2013103251793A CN103402048A (en) | 2013-07-30 | 2013-07-30 | Camera module, dust prevention and fixing method and installation method of camera module |
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| CN104023170A (en) * | 2014-05-29 | 2014-09-03 | 南昌欧菲光电技术有限公司 | Camera module and support thereof |
| CN104023171A (en) * | 2014-05-29 | 2014-09-03 | 南昌欧菲光电技术有限公司 | Camera module and support thereof |
| CN104902158A (en) * | 2015-06-17 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module support and camera module with camera module support |
| CN104917944A (en) * | 2015-05-15 | 2015-09-16 | 南昌欧菲光电技术有限公司 | Camera module set support and camera module set with same |
| CN105915776A (en) * | 2016-06-30 | 2016-08-31 | 江西盛泰光学有限公司 | DAC controlled focusing camera module |
| CN106937035A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Imaging modules and electronic installation |
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| CN104902158A (en) * | 2015-06-17 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module support and camera module with camera module support |
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| CN105915776A (en) * | 2016-06-30 | 2016-08-31 | 江西盛泰光学有限公司 | DAC controlled focusing camera module |
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Application publication date: 20131120 |