CN106937034A - Imaging modules and electronic installation - Google Patents
Imaging modules and electronic installation Download PDFInfo
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- CN106937034A CN106937034A CN201610120778.5A CN201610120778A CN106937034A CN 106937034 A CN106937034 A CN 106937034A CN 201610120778 A CN201610120778 A CN 201610120778A CN 106937034 A CN106937034 A CN 106937034A
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- imaging modules
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- 238000009434 installation Methods 0.000 title claims abstract description 68
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- 238000003466 welding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 17
- 230000003287 optical effect Effects 0.000 description 11
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
Abstract
The invention discloses a kind of imaging modules and electronic installation.Imaging modules include flexible PCB, at least two camera modules and cover body.Flexible PCB includes the connector installation portion of at least two module installation portions of at least two module installation portions and connection.At least two camera modules are separately positioned at least two module installation portions, at least two camera module interval settings.Cover body cover sets at least two camera modules and is fixedly connected with least two camera modules, and cover body includes the framework around at least two camera modules, and the distance between framework and camera module scope are 0.1-0.5 millimeters.The imaging modules of embodiment of the present invention can bond framework and camera module by colloid, because the distance between framework and camera module scope is 0.1-0.5 millimeters, framework can not only be connected firmly with camera module, can also reduce the volume of imaging modules, be conducive to imaging modules to minimize.
Description
Priority information
The application request on December 30th, 2015 submitted to China national Department of Intellectual Property, number of patent application be
201511025532.1st, 201521132821.7,201511024922.7 and 201521131513.2 patent application is excellent
First power and rights and interests, and by referring to being incorporated by herein.
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of imaging modules and a kind of electronic installation.
Background technology
As people improve to the quality requirement of shooting image, dual camera shooting technology arises at the historic moment.Usually, it is double to take the photograph
As head mould group includes that two optical axises are parallel and camera module that shot towards same side, how two cameras are being fixed
The volume for reducing dual camera module while module turns into problem demanding prompt solution.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention provides a kind of imaging
Module and a kind of electronic installation.
The imaging modules of embodiment of the present invention include flexible PCB, at least two camera modules and cover body.Flexible circuit
Plate includes the connector installation portion of at least two module installation portions of at least two module installation portions and connection.At least two shootings
Module is separately positioned at least two module installation portions, at least two camera module interval settings.Cover body cover sets at least two
Individual camera module and it is fixedly connected with least two camera modules.Cover body includes the framework around at least two camera modules,
The distance between framework and camera module scope are 0.1-0.5 millimeters.
The imaging modules of embodiment of the present invention can bond framework and camera module by colloid, due to framework and camera module
The distance between scope be 0.1-0.5 millimeters, framework can not only be connected firmly with camera module, can also reduce imaging
The volume of module, is conducive to imaging modules to minimize.
In some implementations, the quantity of the module installation portion and the quantity of the camera module are two.
In some embodiments, the distance between the top cover and described camera module scope are 0.15-0.3 millimeters.
In some embodiments, the framework is fixedly connected by colloid with the camera module.
In some embodiments, the outer cover includes the top cover being connected with the top of the framework, and the top cover passes through glue
Body is fixedly connected with two camera modules.
In some embodiments, two module installation portion interval settings, the flexible PCB includes interval setting
Two connecting portions, described two connecting portions connect two module installation portions and the connector installation portion respectively.
In some embodiments, each described camera module includes printed circuit board (PCB) and sets on the printed circuit board
And the imageing sensor being electrically connected with the printed circuit board (PCB), the printed circuit board (PCB) is arranged on the module installation portion
And be electrically connected with the module installation portion.
In some embodiments, the module installation portion include the first electric connection pad, the printed circuit board (PCB) include with
Second electric connection pad of the first electric connection pad correspondence connection, the printed circuit board (PCB) electrically connects by described second
Connection pad is electrically connected with the module installation portion with first electric connection pad.
In some embodiments, the camera module includes setting on the printed circuit board and is passed positioned at described image
Camera lens module above sensor.
In some embodiments, each described camera lens module includes camera lens and voice coil motor, and the camera lens is arranged on described
In voice coil motor, each described voice coil motor includes housing, two housing interval settings.
In some embodiments, the imaging modules include connector assembly, and the connector assembly includes substrate and sets
Put connector on the substrate, the substrate be arranged on the connector installation portion and with the connector installation portion
It is electrically connected with.
In some embodiments, the imaging modules include colloid, the colloid be arranged on two camera modules it
Between and be bonded two camera modules.
In some embodiments, the camera module includes the connecting side relative with camera module another described, two
The camera module is fixedly connected by welding the connecting side.
The electronic installation of embodiment of the present invention includes above-mentioned imaging modules.
In the electronic installation of this implementation implementation method, imaging modules can bond top cover and camera module by colloid, due to top
The distance between lid and camera module scope are 0-0.1 millimeters, and top cover can not only be connected firmly with camera module, may be used also
To reduce the thickness of imaging modules, group of electronic devices is conducive to minimize.Additional aspect of the invention and advantage will be below
Description middle part give out, partly will become apparent from the description below, or by it is of the invention practice recognize.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to implementation method is combined
Substantially and be readily appreciated that, wherein：
Fig. 1 is the structural representation of the imaging modules of embodiment of the present invention.
Fig. 2 is the schematic perspective view of the imaging modules of embodiment of the present invention.
Fig. 3 be imaging modules in Fig. 2 along III-III to generalized section.
Fig. 4 is the enlarged diagram of the IV parts of the imaging modules in Fig. 3.
Fig. 5 is the decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 6 is another decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 7 is the schematic perspective view of the cover body of the imaging modules of embodiment of the present invention.
Fig. 8 is the structural representation of the flexible PCB of the imaging modules of embodiment of the present invention.
Fig. 9 is the enlarged diagram of the IX parts of the imaging modules in Fig. 3.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the implementation method is shown in the drawings, wherein ad initio extremely
Same or similar label represents same or similar element or the element with same or like function eventually.Below by ginseng
The implementation method for examining Description of Drawings is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be only
Described with simplified for the ease of the description present invention, must be with specific rather than the device or element for indicating or imply meaning
Orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.Additionally, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply to indicate indicated skill
The quantity of art feature.Thus, define " first ", the feature of " second " can express or implicitly include one or
More described features.In the description of the invention, " multiple " is meant that two or more, unless otherwise clear and definite
It is specific to limit.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integratedly
Connection；Can mechanically connect, or electrically connect or can mutually communicate；Can be joined directly together, it is also possible to logical
Intermediary is crossed to be indirectly connected to, can be two element internals connection or two interaction relationships of element.For this
For the those of ordinary skill in field, above-mentioned term concrete meaning in the present invention can be as the case may be understood.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included, it is also possible to including the first and second features be not directly contact but pass through
Other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above "
Including fisrt feature directly over second feature and oblique upper, or to be merely representative of fisrt feature level height special higher than second
Levy.Fisrt feature second feature " under ", " lower section " and " below " just go up including fisrt feature in second feature
Side and oblique upper, or fisrt feature level height is merely representative of less than second feature.
Following disclosure provides many different implementation methods or example is used for realizing different structure of the invention.For letter
Change disclosure of the invention, hereinafter the part and setting to specific examples are described.Certainly, they are only merely illustrative,
And purpose does not lie in the limitation present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference word
Mother, this repetition is for purposes of simplicity and clarity, discussed various implementation methods itself not to be indicated and/or it is set
Between relation.Additionally, the invention provides various specific technique and material example, but ordinary skill
Personnel can be appreciated that the application of other techniques and/or the use of other materials.
Fig. 1 is the structural representation of the imaging modules of embodiment of the present invention.The cover body of imaging modules not shown in Fig. 1.
Please join Fig. 1-Fig. 3 and Fig. 7 in the lump, the imaging modules 100 of embodiment of the present invention include flexible PCB 10, two
Individual camera module 20 and cover body 50.
Flexible PCB 10 includes two module installation portions 11 and connector installation portion 12.Connector installation portion 12 is connected
Two module installation portions 11.
Two camera modules 20 are separately positioned on module installation portion 11, two interval settings of camera module 20.
The cover of cover body 50 sets two camera modules 20 and is fixedly connected with two camera modules 20.Cover body 50 includes framework 51,
Framework 51 is around two camera modules 50.The distance between framework 51 and camera module 20 D scopes be 0.1-0.5 in the least
Rice.
The imaging modules 100 of embodiment of the present invention can bond framework 51 and camera module 20 by colloid, due to framework
The distance between 51 and camera module 20 D scopes are 0.1-0.5 millimeters.Framework 51 and camera module 20 not only can be with
It is connected firmly, the volume of imaging modules 100 can also be reduced, is conducive to imaging modules 100 to minimize.
Specifically, in one example, it is first that two camera modules 20 are solid respectively when imaging modules 100 are assembled
Calmly to module installation portion 11, then robotic arm grips one of camera module 20, and by mechanical hand adjustment
The position of whole another camera module 20 so that the optical axis of two camera modules 20 is parallel, then by two camera modules 20
It is bonded or is welded and fixed by colloid.Afterwards, colloid can be coated in framework 51, by colloid can by framework 51 with take the photograph
As module 20 is fixedly connected.
It should be noted that framework 51 includes first surface 51a, camera module 20 includes the first surface 51a with 51
Opposite second surface 20a.The distance between top cover 51 and camera module 20 D are first surface 51a and second surface 20a
Between minimum range.
It is appreciated that in other embodiments, the quantity of module installation portion and camera module can be more than three, three
Camera module interval setting more than individual.The module installation portion interval setting of more than three.The camera module of more than three point
It is not arranged on the module installation portion of more than three.
For convenience of explanation, the implementation method for being hereafter two with the quantity of the quantity of module installation portion and camera module is made
Further illustrate, but be not considered as limiting the invention.
In present embodiment, it is preferred that the distance between top cover 52 and camera module 20 D scopes are 0.15-0.3 millimeters.
In present embodiment, framework 51 is fixedly connected by colloid with camera module 20.In this way, the framework of cover body 50
51 are connected by colloid with two camera modules 20, easily realize that cover body 50 is fixedly connected with two camera modules 20,
The cost of imaging modules 100 can be reduced.
In present embodiment, outer cover 50 includes the top cover 52 being connected with the top of framework 51 with top cover 52, and top cover 52 passes through
Colloid is fixedly connected with two camera modules 20.
In this way, top cover 52 can increase the connection area of cover body 50 and two camera modules 20, be further conducive to cover body
50 are connected firmly with two camera modules 20.
Specifically, top cover 52 offers two light holes 251, and two camera modules 20 pass through two light holes 251 respectively
Exposure, so that two camera modules 20 can gather external image.
It should be noted that in present embodiment, two equal cylindrical forms of light hole 251.In other embodiments,
Depending on two shapes of light hole can be distinguished specifically.Therefore, the light hole 251 of present embodiment shape it is not intended that
Limitation of the present invention.
In present embodiment, it is preferred that light hole 251 is set with the light shaft coaxle of camera module 20.
Incorporated by reference to Fig. 8, in present embodiment, two interval settings of module installation portion 11.Between flexible PCB 10 includes
Every two connecting portions 13 for setting, two connecting portions 13 connect two module installation portions 11 and connector installation portion respectively
12。
Two interval settings of connecting portion 13 can further be conducive to flexible PCB 10 to deform, so as to be conducive to adjustment two
The position of camera module 20 is so that the optical axis of two camera modules 20 is parallel.
Incorporated by reference to Fig. 4, in present embodiment, each camera module 20 includes (the Printed Circuit of printed circuit board (PCB) 21
Board, PCB) and imageing sensor 22.The sensing face of two imageing sensors 22 is parallel or coplanar and towards together
Side.Printed circuit board (PCB) 21 is arranged on module installation portion 11 and is electrically connected with module installation portion 11.Image sensing
Device 22 is arranged on printed circuit board (PCB) 21 and is electrically connected with printed circuit board (PCB) 21.
In this way, imageing sensor 22 can obtain the image of object, and image is passed through into printed circuit board (PCB) 21 and flexible circuit
Plate 10 reaches external device (ED).
Specifically, imageing sensor 22 can use complementary metal oxide semiconductors (CMOS) (Complementary Metal Oxide
Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device, CCD) shadow
As sensor.
In present embodiment, module installation portion 11 includes the first electric connection pad 111, and printed circuit board (PCB) 21 includes and the
Second electric connection pad 211 of the correspondence connection of one electric connection pad 111, printed circuit board (PCB) 21 passes through the second electric connection pad
211 and the first electric connection pad 111 be electrically connected with module installation portion 11.
In this way, the first electric connection pad 111 and the second electric connection pad 211 realize flexible PCB 10 and camera module
It is electrically connected between 20 and is communicated.For example, the first electric connection pad 111 and the second electric connection pad 211 are using conduction
Glue.
In present embodiment, each printed circuit board (PCB) 21 is corresponding with the shape and size of corresponding module installation portion 11.
Can so make the structure of imaging modules 100 compacter, be conducive to reducing the volume of imaging modules 100.Imaging mould
When group 100 is applied to electronic installation, can further reduce the volume of electronic installation.
In present embodiment, as an example, each printed circuit board (PCB) 21 and the shape with corresponding module installation portion 11
Shape is in tabular and size is identical.And in other embodiments, each printed circuit board (PCB) and with corresponding module installation portion
Shape can set according to the actual requirements and specifically.Size between printed circuit board (PCB) and corresponding module installation portion can be with root
It is adjusted according to needs.
Incorporated by reference to Fig. 5 and Fig. 6, in present embodiment, camera module 20 includes being arranged on printed circuit board (PCB) 21 and position
In the camera lens module 23 of the top of imageing sensor 22.
In this way, camera lens module 23 can make imageing sensor 22 obtain quality preferably image, so as to imaging modules can be improved
100 shooting quality.
In present embodiment, each camera lens module 23 includes camera lens 231 and voice coil motor 232, and camera lens 231 is arranged on sound
In coil motor 232, each voice coil motor 232 includes housing 2321, two interval settings of housing 2321.
Voice coil motor 232 can drive camera lens 231 along the optical axis direction movement of camera lens 231 to adjust camera lens 231 and image
The distance between sensor 22, and then the auto-focusing of imaging modules 100 is realized, imaging modules 100 is obtained quality
Preferably image.
Further, optical filter 24 is provided between camera lens 231 and imageing sensor 22.Optical filter 24 can filter pre-
If the light of frequency so that imageing sensor 22 forms preferably image according to the light after filtering.
It is preferred that optical filter 24 is cutoff filter.In this way, cutoff filter can filter infrared ray, keep away
Exempt from the image fault of imageing sensor 22.
Specifically, camera lens module 23 also includes pedestal 233, and pedestal 233 opens up fluted 2331, the bottom of groove 2331
Face offers through hole 2332.Optical filter 24 is arranged in groove 2331 and is supported on the bottom surface of groove 2331, passes through
The light of the filtering of optical filter 24 can reach imageing sensor 22 by through hole 2332.
Take for convenience optical filter 24, link slot 2333, the communication groove 2331 of link slot 2333 are offered on pedestal 233.
In present embodiment, imaging modules 100 include connector assembly 30, and connector assembly 30 includes substrate 31 and sets
Put connector 32 on the substrate 31.Substrate 31 be arranged on connector installation portion 12 and with connector installation portion 12
It is electrically connected with.
In this way, can be quickly installed imaging modules 100 on electronic equipment by connector 32.
It is preferred that substrate 31 is consistent with the shape and size of connector installation portion 12.Connector 32 can so be made with flexibility
The structure of circuit board 10 is compacter.
In present embodiment, imaging modules 100 include colloid 40, and colloid 40 is arranged between two camera modules 20 simultaneously
Two camera modules 20 of bonding.
After being adjusted to be parallel to each other by the optical axis of two camera modules 20, colloid 40 is clicked and entered between two camera modules 20.
Colloid 40 can ensure that two camera modules 20 are relatively fixed, colloid and can increase by two camera modules 20 connection it is strong
Degree, it is possible to decrease two probability of the light shaft offset of camera module 20.
It should be noted that in present embodiment, as shown in the orientation in Fig. 3, colloid 40 is located at two camera modules
The bottom in the gap between 20.And in other embodiments, the gap that colloid can be filled up between two camera modules.
Colloid 40 for example can be the colloids with stickiness such as UV glue (Ultraviolet Glue).
In some embodiments, camera module includes the connecting side relative with another camera module, two camera modules
It is fixedly connected by being welded to connect side.
In this way, two camera modules will can be rigidly secured together by welding.For example, the connection of each camera module
Side can be welded by laser spot welding or tin cream or solder and is fixedly connected with another camera module.
Further, imaging modules 100 also include reinforcing plate 60, and two module installation portions 11 are fixed in reinforcing plate 60.
In this way, reinforcing plate 60 can further fix two positions of camera module 20, the anti-impact of imaging modules 100 is improved
The ability hit, and then improve shooting quality.
In present embodiment, imaging modules 100 also include anti-electromagnetic interference part 70, and reinforcing plate 60 is arranged on anti-electromagnetism and does
Disturb on part 70.
Anti- electromagnetic interference part 70 can prevent imaging modules 100 from being disturbed by electromagnetic wave, it is ensured that imaging modules 100 obtain product
Matter preferably image.Anti electromagnetic wave disruption member 70 can be for example made of metal material.
The electronic installation of embodiment of the present invention includes above-mentioned imaging modules 100.Electronic installation can be mobile phone or flat board
Computer etc..
In the electronic installation of this implementation implementation method, imaging modules 100 can bond top cover 52 and camera module by colloid
20, because the distance between top cover 52 and camera module 20 scope is 0-0.1 millimeter, top cover 52 and camera module 20
Can not only be connected firmly, the thickness of imaging modules 100 can also be reduced, be conducive to electronic device miniaturization.
In the description of this specification, reference term " implementation method ", " some implementation methods ", " schematic embodiment party
The description of formula ", " example ", " specific example " or " some examples " etc. means to combine the implementation method or example describes
Specific features, structure, material or feature are contained at least one implementation method of the invention or example.In this explanation
In book, the schematic representation to above-mentioned term is not necessarily referring to identical implementation method or example.And, the tool of description
Body characteristicses, structure, material or feature can be in one or more any implementation methods or example in an appropriate manner
With reference to.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：Not
These implementation methods can be carried out with various changes, modification, replacement in the case of departing from principle of the invention and objective and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (14)
1. a kind of imaging modules, it is characterised in that including：
Flexible PCB, the flexible PCB includes at least two module installation portions and connects at least two modules peace
The connector installation portion in dress portion；
At least two camera modules, at least two camera module is separately positioned at least two modules installation portion
On, at least two camera modules interval setting；And
Cover body, the cover body cover sets at least two camera module and is fixedly connected with least two camera module,
The cover body includes the distance between the framework around at least two camera module, the framework and described camera module
Scope is 0.1-0.5 millimeters.
2. imaging modules as claimed in claim 1, it is characterised in that the quantity of the module installation portion and the shooting
The quantity of module is two.
3. imaging modules as claimed in claim 2, it is characterised in that between the top cover and the camera module away from
It it is 0.15-0.3 millimeters from scope.
4. imaging modules as claimed in claim 2, it is characterised in that the framework passes through colloid and the camera module
It is fixedly connected.
5. imaging modules as claimed in claim 2, it is characterised in that the outer cover includes connecting with the top of the framework
The top cover for connecing, the top cover is fixedly connected by colloid with two camera modules.
6. imaging modules as claimed in claim 2, it is characterised in that two module installation portion interval settings, institute
Stating flexible PCB includes spaced two connecting portions, and described two connecting portions connect two modules and install respectively
Portion and the connector installation portion.
7. imaging modules as claimed in claim 2, it is characterised in that each described camera module includes printed circuit board (PCB)
And the imageing sensor being electrically connected with the printed circuit board and with the printed circuit board (PCB), the printed circuit are set
Plate is arranged on the module installation portion and is electrically connected with the module installation portion.
8. imaging modules as claimed in claim 7, it is characterised in that the module installation portion includes that first is electrically connected with
Pad, the printed circuit board (PCB) includes the second electric connection pad of connection corresponding with first electric connection pad, the printing
Circuit board is electrically connected with the module installation portion by second electric connection pad with first electric connection pad.
9. imaging modules as claimed in claim 7, it is characterised in that the camera module includes being arranged on the printing
Camera lens module on circuit board and above described image sensor.
10. imaging modules as claimed in claim 9, it is characterised in that each described camera lens module includes camera lens and sound
Coil motor, the camera lens is arranged in the voice coil motor, and each described voice coil motor includes housing, two housings
Interval setting.
11. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include connector assembly,
The connector assembly includes substrate and setting connector on the substrate, and the substrate is arranged on the connector peace
It is electrically connected with dress portion and with the connector installation portion.
12. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include colloid, the glue
Body is arranged between two camera modules and is bonded two camera modules.
13. imaging modules as claimed in claim 2, it is characterised in that the camera module include with described in another
The relative connecting side of camera module, two camera modules are fixedly connected by welding the connecting side.
14. a kind of electronic installations, it is characterised in that including the imaging modules as described in claim any one of 1-13.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/090062 WO2017113751A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
| PCT/CN2016/090056 WO2017113746A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090061 WO2017113750A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090059 WO2017113748A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090057 WO2017113747A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
| PCT/CN2016/090064 WO2017113752A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090060 WO2017113749A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025532 | 2015-12-30 | ||
| CN201511024922 | 2015-12-30 | ||
| CN2015211315132 | 2015-12-30 | ||
| CN2015211328217 | 2015-12-30 | ||
| CN2015110249227 | 2015-12-30 | ||
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| CN108270949B (en) * | 2016-12-31 | 2022-05-27 | 宁波舜宇光电信息有限公司 | Split type array camera module and manufacturing method thereof |
| WO2018084584A1 (en) | 2016-11-01 | 2018-05-11 | 엘지이노텍 주식회사 | Camera module, dual camera module, optical device, and method for manufacturing dual camera module |
| CN106488101A (en) * | 2016-11-15 | 2017-03-08 | 信利光电股份有限公司 | Dual camera module and dual camera module preparation method |
| CN108234691A (en) * | 2016-12-15 | 2018-06-29 | 北京小米移动软件有限公司 | CCD camera assembly and preparation method thereof, mobile terminal |
| CN109565539B (en) * | 2016-12-15 | 2021-04-27 | 松下知识产权经营株式会社 | Imaging device and imaging method |
| CN106686963B (en) * | 2016-12-20 | 2019-05-24 | Oppo广东移动通信有限公司 | Function element and terminal device |
| CN106713540B (en) * | 2016-12-20 | 2019-12-06 | Oppo广东移动通信有限公司 | Double-camera module and mobile terminal |
| US11102384B2 (en) | 2016-12-27 | 2021-08-24 | Huawei Technologies Co., Ltd. | Camera substrate assembly, camera module, and terminal device |
| WO2018121793A1 (en) * | 2016-12-31 | 2018-07-05 | 宁波舜宇光电信息有限公司 | Separable photographic array module and manufacturing method thereof |
| CN106791330B (en) | 2017-01-11 | 2019-08-13 | Oppo广东移动通信有限公司 | Camera module and terminal |
| CN108462816B (en) * | 2017-02-20 | 2021-01-01 | 北京小米移动软件有限公司 | Camera module and electronic equipment |
| CN106851066A (en) * | 2017-03-10 | 2017-06-13 | 信利光电股份有限公司 | A kind of many camera modules and its engine mounting support |
| CN107181900A (en) * | 2017-06-05 | 2017-09-19 | 信利光电股份有限公司 | It is a kind of double to take the photograph module bracket, double take the photograph module and mobile terminal |
| CN107241539B (en) * | 2017-06-30 | 2021-02-02 | Oppo广东移动通信有限公司 | Imaging device assembly and electronic device |
| KR102371009B1 (en) * | 2017-08-22 | 2022-03-07 | 삼성전자 주식회사 | Camera module including reinforcement members for supporting printed circuit board on which a plurality of image sensors are disposed and electronic device including the same |
| CN109756655A (en) * | 2017-11-08 | 2019-05-14 | 深圳市凯木金科技有限公司 | A kind of PLCC encapsulation adds the cobasis plate dual camera of CSP encapsulation |
| US11048307B2 (en) * | 2018-06-01 | 2021-06-29 | Samsung Electro-Mechanics Co., Ltd. | Dual camera module and portable electronic device |
| TWI771472B (en) * | 2018-08-16 | 2022-07-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| WO2021017746A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, image capture module, and fabrication method therefor |
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- 2016-03-03 CN CN201620163180.XU patent/CN205545576U/en not_active Ceased
- 2016-03-03 CN CN201620163035.1U patent/CN205545565U/en not_active Expired - Fee Related
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- 2016-03-03 CN CN201620163163.6U patent/CN205647690U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120775.1A patent/CN106937033A/en active Pending
- 2016-03-03 CN CN201620163152.8U patent/CN205545574U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120713.0A patent/CN106937030A/en active Pending
- 2016-03-03 CN CN201620162943.9U patent/CN205545559U/en not_active Expired - Fee Related
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- 2016-03-03 CN CN201610120781.7A patent/CN106937035A/en active Pending
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Also Published As
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| CN106937033A (en) | 2017-07-07 |
| CN205545558U (en) | 2016-08-31 |
| CN205545565U (en) | 2016-08-31 |
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| CN106937032A (en) | 2017-07-07 |
| CN106937030A (en) | 2017-07-07 |
| CN205545575U (en) | 2016-08-31 |
| CN205545576U (en) | 2016-08-31 |
| CN106937031A (en) | 2017-07-07 |
| CN205647690U (en) | 2016-10-12 |
| CN205545574U (en) | 2016-08-31 |
| CN205545559U (en) | 2016-08-31 |
| CN106937035A (en) | 2017-07-07 |
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