WO2017148072A1 - Imaging module and electronic device - Google Patents

Imaging module and electronic device Download PDF

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Publication number
WO2017148072A1
WO2017148072A1 PCT/CN2016/090053 CN2016090053W WO2017148072A1 WO 2017148072 A1 WO2017148072 A1 WO 2017148072A1 CN 2016090053 W CN2016090053 W CN 2016090053W WO 2017148072 A1 WO2017148072 A1 WO 2017148072A1
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WO
WIPO (PCT)
Prior art keywords
imaging module
hole
circuit board
camera modules
module according
Prior art date
Application number
PCT/CN2016/090053
Other languages
French (fr)
Chinese (zh)
Inventor
申成哲
王昕�
Original Assignee
深圳欧菲光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201620163056.3U external-priority patent/CN205545568U/en
Priority claimed from CN201610120830.7A external-priority patent/CN107155039A/en
Priority claimed from CN201610120911.7A external-priority patent/CN107155046A/en
Priority claimed from CN201610120752.0A external-priority patent/CN107155027A/en
Priority claimed from CN201620162763.0U external-priority patent/CN205545552U/en
Priority claimed from CN201620163058.2U external-priority patent/CN205545569U/en
Application filed by 深圳欧菲光科技股份有限公司 filed Critical 深圳欧菲光科技股份有限公司
Publication of WO2017148072A1 publication Critical patent/WO2017148072A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.
  • the imaging module of the embodiment of the present invention includes: a flexible circuit board; at least two camera modules, the at least two camera modules are disposed on the flexible circuit board, and the at least two camera modules are formed a first gap; a cover body, the cover body is disposed on the at least two camera modules, a second gap is formed between the cover body and the camera module, and the cover body is spaced apart a first glue hole and a second glue hole, wherein the first glue hole corresponds to the first gap, the second glue hole corresponds to the second gap; and the first gap is disposed And a colloid in the second gap, the colloid connecting the at least two camera modules and the cover.
  • the first dispensing hole corresponds to the first gap
  • the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first point during the assembly process.
  • the glue hole and the second glue hole are arranged to enable the glue to fill the gap, and at least two camera modules are firmly fixed on the cover body.
  • the number of camera modules is two.
  • the flexible circuit board includes two module mounting portions spaced apart and connects the two a connector mounting portion of the module mounting portion; each of the camera modules is disposed on the corresponding module mounting portion.
  • the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the connector mounting portion.
  • the flexible circuit board includes two module mounting portions spaced apart from each other and two connector mounting portions spaced apart, and each of the module mounting portions is connected to the corresponding connector mounting portion.
  • Each of the camera modules is disposed on a corresponding one of the module mounting portions.
  • the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connector mounting portion.
  • the flexible circuit board includes a module mounting portion and a connector mounting portion that connects the module mounting portion; and the two camera modules are disposed on the module mounting portion.
  • the flexible circuit board includes a connection portion that connects the module mounting portion and the connector mounting portion.
  • the first dispensing aperture is elongated.
  • the first dispensing aperture has a width of 0.5 ⁇ 0.1 mm and the first dispensing aperture has a length greater than or equal to 1.5 mm.
  • the first dispensing aperture has a width of 0.5 ⁇ 0.1 mm and the first dispensing aperture has a length of 8.4 ⁇ 0.1 mm.
  • the first dispensing aperture has a width of 0.5 mm and the first dispensing aperture has a length of 8.4 mm.
  • the distance of the first dispensing aperture to the long side sidewall of the cover is greater than 0.45 mm.
  • the first dispensing hole comprises an elongated hole and two end holes connected at opposite ends of the elongated hole, the end hole being along a width direction of the elongated hole
  • the size of the strip is larger than the width of the long strip hole; the strip hole corresponds to two side walls of the two camera modules; each of the end holes corresponds to two of the two camera modules Corner location.
  • the elongated holes have a width of 0.5 ⁇ 0.1 mm and the elongated holes have a length greater than or equal to 1.5 mm.
  • the elongated aperture has a width of 0.5 ⁇ 0.1 mm and the elongated aperture has a length of 8.4 ⁇ 0.1 mm.
  • the elongated aperture has a width of 0.5 mm and the elongated aperture has a length of 8.4 mm.
  • the distance from the elongated aperture to the long side wall of the cover is greater than 0.45 mm.
  • the end holes are triangular in shape.
  • the second dispensing hole includes a plurality of cylindrical holes spaced apart at different set positions of the cover.
  • the cylindrical bore has a pore size of 1 ⁇ 0.1 mm.
  • the cylindrical bore has a pore size of 1 mm.
  • the cover includes a frame surrounding the at least two camera modules and a top cover connected to the frame, the top cover passes the gel and the at least two cameras The module is fixedly connected.
  • the first dispensing hole is a single dispensing hole
  • the second dispensing hole includes four cylindrical holes, and the four cylindrical holes are respectively distributed on the top of the top cover Corner location.
  • each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, the printed circuit board being disposed in the The flexible circuit board is electrically connected to the flexible circuit board, the imaging module includes an electrical connection pad, and the electrical connection pad is disposed between the flexible circuit board and the printed circuit board and electrically Connecting the flexible circuit board to the printed circuit board.
  • An electronic device includes the imaging module according to any of the above embodiments.
  • the first dispensing hole corresponds to the first gap
  • the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first dispensing hole and the second during the assembly process.
  • the glue holes are inserted so that the glue can fill the gap, and at least two camera modules are firmly fixed to the cover.
  • FIG. 1 is a perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 2 is a partially exploded perspective view of an imaging module in accordance with an embodiment of the present invention.
  • FIG. 3 is a schematic plan view of an imaging module according to an embodiment of the present invention.
  • FIG 4 is another perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of an imaging module according to an embodiment of the present invention.
  • Figure 7 is an enlarged schematic view of a portion VII of the imaging module of Figure 6.
  • Figure 8 is an enlarged schematic view of a portion VIII of the imaging module of Figure 6.
  • FIG. 9 is a schematic plan view of a cover of an imaging module according to an embodiment of the present invention.
  • FIG. 10 is a perspective view of a cover body of an imaging module according to an embodiment of the present invention.
  • FIG. 11 is a perspective view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • FIG. 12 is another perspective view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • FIG. 13 is another schematic plan view of a cover body of an imaging module according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • the imaging module 100 of the embodiment of the present invention includes a flexible circuit board 10 , at least two camera modules 20 , a cover 30 , and a colloid 40 .
  • At least two camera modules 20 are disposed on the flexible circuit board 10, and a first gap 50 is formed between the at least two camera modules 20.
  • the cover 30 is disposed on the at least two camera modules 20, and a second gap 51 is formed between the cover 30 and the camera module 20.
  • the cover 30 is provided with a first dispensing hole 32 and a second point.
  • the glue hole 33 has a first glue hole 32 corresponding to the first gap 50 and a second glue hole 33 corresponding to the second gap 51.
  • the colloid 40 is disposed in the first gap 50 and the second gap 51 , and the colloid 40 connects at least two camera modules 20 and the cover 30 .
  • the first dispensing hole 32 corresponds to the first gap 50
  • the second dispensing hole 33 corresponds to the second spacing 51, so that the imaging module 100 can be assembled during the assembly process.
  • the adhesive is spotted into the first dispensing hole 32 and the second dispensing opening 33 to enable the adhesive to fill the gap, thereby securing the at least two camera modules 20 to the cover 30 securely.
  • the number of the camera modules 20 is two.
  • the two camera modules 20 are respectively fixed to the flexible circuit board 10, and then one of the camera modules 20 can be clamped by a robot, and then the other is adjusted by the robot.
  • the position of the camera module 20 is such that the optical axes of the two camera modules 20 are parallel, and the two camera modules 20 face the same side.
  • the flexible circuit board 10 includes two module mounting portions 12 that are spaced apart from each other and a connector mounting portion 14 that connects the two module mounting portions 12.
  • Each camera module 20 is disposed on the corresponding module mounting portion 12 such that the two camera modules 20 are spaced apart.
  • the two camera modules 20 are spaced apart so that there is sufficient space between the two camera modules 20, and the optical axes of the two camera modules 20 can be conveniently adjusted to parallel positions to ensure the imaging of the imaging module 100. quality.
  • the flexible circuit board 10 includes two connecting portions 16 that are spaced apart, and each of the connecting portions 16 is connected to the corresponding module mounting portion 12 and the connector mounting portion 14.
  • the two connecting portions 16 are spaced apart to further facilitate the deformation of the flexible circuit board 10, thereby facilitating adjustment of the positions of the two camera modules 20 such that the optical axes of the two camera modules 20 are parallel.
  • the flexible circuit board includes two module mounting portions 112 spaced apart from each other and two connector mounting portions 114 spaced apart, and each module mounting portion 112 is connected to a corresponding connector.
  • the mounting portion 114 is provided on each of the corresponding module mounting portions 112.
  • the two module mounting portions 112 and the two connector mounting portions 114 are provided at intervals, so that when the flexible circuit board is faulty, only one of the module mounting portions and/or the connector mounting portion needs to be repaired or replaced, which is reduced. Maintenance cost of the imaging module.
  • the flexible circuit board includes two connecting portions 116 spaced apart, and each connecting portion 116 is connected to the corresponding module mounting portion 112 and the corresponding connector mounting portion 114 .
  • each camera module corresponds to the independent module mounting portion 112, the connector mounting portion 114, and the connecting portion 116, so that the circuit connecting portions of the two camera modules are independent of each other, further reducing the maintenance cost of the imaging module.
  • the flexible circuit board includes a module mounting portion 212 and a connector mounting portion 214 that connects the module mounting portion 212 .
  • Two camera modules are disposed on the module mounting portion 212. Therefore, the two camera modules are disposed on the same module mounting portion 212, and the module mounting portion 212 does not need to be manufactured to a smaller size, thereby reducing the manufacturing cost of the module mounting portion.
  • the flexible circuit board includes a connecting portion 216 that connects the module mounting portion 212 and the connector mounting portion 214 . Therefore, the module mounting portion 212, the connector mounting portion 214, and the connecting portion 216 form a unitary single structure, which reduces the manufacturing cost of the flexible circuit board.
  • the first dispensing hole 32 is a single dispensing hole, which includes an elongated hole 34 and two end holes 36 connected to both ends of the elongated hole 34.
  • the dimension of the elongated hole 34 in the width direction is larger than the width of the elongated hole 34.
  • the elongated holes 34 correspond to the two side walls of the two camera modules 20 .
  • Each of the end holes 36 corresponds to two corner positions 20a, 20b of the two camera modules 20.
  • the colloid 40 enters the gap between the two camera modules 20 through the elongated holes 34, so that the colloid 40 connects the intermediate side walls of the two camera modules 30 and the cover 30;
  • the colloid 40 enters the gap between the two corner positions 20a, 20b of the two camera modules 20 and the cover 30 through the two end holes 36, so that the colloid 40 connects the corner side walls of the two camera modules 20 and the cover 30. .
  • the connection strength of the colloid 40 to fix the two camera modules 20 to the cover 30 is improved.
  • the dimension of the end hole 36 along the width direction of the elongated hole 34 is larger than the width of the elongated hole 34, so that the two camera modules 20 form a T-shaped colloidal connection portion with the cover 30 at the corner positions 20a, 20b.
  • the connection strength between the two camera modules 20 and the cover 30 is further improved.
  • the width W of the elongated hole 34 is 0.5 ⁇ 0.1 mm, preferably 0.5 mm.
  • the width of the elongated hole 34 is smaller than the above range, this is not easy to dispense and is easy to overflow; when the width of the elongated hole 34 is larger than the above range, this causes the strength of the cover 30 to be low; When the width of the hole 34 is 0.5 mm, the colloid 40 easily enters the first dispensing hole 32.
  • the length L of the elongated hole 34 is 8.4 ⁇ 0.1 mm, preferably 8.4 mm.
  • the length of the elongated hole 34 is less than the above range, this is not easy to dispense and is easy to overflow; when the length of the elongated hole 34 is larger than the above range, this causes the strength of the cover 30 to be low; When the length of the hole 34 is 8.4 mm, the colloid 40 does not easily overflow outside the first dispensing hole 32.
  • the elongated hole 34 has a width W of 0.5 ⁇ 0.1 mm and the elongated hole 34 has a length L greater than or equal to 1.5 mm.
  • the distance H between the elongated holes 34 and the long side walls of the cover 30 is greater than 0.45 mm.
  • the end hole 36 has a triangular shape.
  • the triangular shaped end holes 36 facilitate the formation of the correspondingly shaped colloids 40 such that the connection of the two camera modules 20 to the cover 30 is stronger.
  • the first dispensing holes 130 are elongated. Further, the width W1 of the first dispensing hole 130 is 0.5 ⁇ 0.1 mm, preferably 0.5 mm, and the length L1 of the first dispensing hole 130 is 8.4 ⁇ 0.1 mm, preferably 8.4 mm.
  • the first dispensing aperture 130 has a width W1 of 0.5 ⁇ 0.1 mm and the first dispensing aperture has a length L1 greater than or equal to 1.5 mm.
  • the distance H1 of the first dispensing hole 130 to the long side wall of the cover is greater than 0.45 mm.
  • the second dispensing hole 33 includes a plurality of cylindrical holes 37, and the plurality of cylindrical holes 37 are spaced apart at different set positions of the cover 30.
  • the cover 30 has a substantially rectangular parallelepiped shape.
  • the cover 30 includes a frame 38 surrounding the two camera modules 20 and a top cover 39 connected to the frame 38.
  • the cover 39 is fixedly connected to the two camera modules 20 via the glue 40.
  • the number of the cylindrical holes 37 is four, and the four cylindrical holes 37 are respectively distributed at the four corner positions of the top cover 39. In this way, the distribution of the colloid 40 can be made more reasonable, and the connection strength of the colloid 40 to the camera module 20 and the cover 30 can be improved.
  • top cover 39 is provided with two light-passing holes 391, and the two camera modules 20 are respectively exposed through the two light-passing holes 391.
  • both of the light-passing holes 391 have a cylindrical shape.
  • the shape of the two light-passing holes can be determined specifically. Therefore, the shape of the light-passing hole of the present embodiment is not to be construed as limiting the invention.
  • the cylindrical hole 37 has a hole diameter of 1 ⁇ 0.1 mm, and preferably, the cylindrical hole 37 has a hole diameter of 1 mm.
  • the second gap 51 includes a side gap 53 and a top gap 55 formed by an inner surface of the frame 38 and an outer side surface of the camera module 20 , and the top gap 55 is formed by The inner surface of the top cover 39 is formed between the inner surface of the top cover 39 and the outer top surface of the camera module 20.
  • the side gap 53 connects the top gap 55 and communicates with the second glue hole 33 in common, for example, directly communicating with the second glue hole 33.
  • the colloid 40 when the colloid 40 enters the second interval 51 from the second dispensing hole 33, a part of the colloid 40 flows into the side gap 53, and another part of the colloid 40 flows into the top gap 55, so that the colloid 40 sticks the camera module 20 from different directions. Connected within the cover 30. After the colloid 40 is cured, the colloid 40 securely fixes the camera module 20 within the cover 30.
  • each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 .
  • the sensing faces of the two image sensors 22 are oriented on the same side.
  • the printed circuit board 21 is disposed on the flexible circuit board 10 and electrically connected to the flexible circuit board 10.
  • the image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.
  • the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10.
  • the image sensor 22 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor.
  • CMOS complementary metal oxide semiconductor
  • CCD charge-coupled device
  • the printed circuit board 21 is disposed on the module mounting portion 12 and electrically connected to the module mounting portion 12.
  • the imaging module 100 includes an electrical connection pad 52.
  • the electrical connection pad 52 is disposed between the flexible circuit board 10 and the printed circuit board 21 and electrically connected to the flexible circuit board 10 and the printed circuit. Board 21.
  • the electrical connection pads 52 electrically connect and communicate between the flexible circuit board 10 and the camera module 20.
  • the electrical connection pad 52 can be made of a conductive paste.
  • the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .
  • the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.
  • the lens module 23 includes a lens 231 and a voice coil motor 232.
  • the voice coil motor 232 includes a housing 2321.
  • the lens 231 is disposed in the housing 2321.
  • the first gap 50 is formed in two of the two camera modules. Between the housings 2321, a second gap is formed between the two housings and the cover.
  • the voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image.
  • a filter 24 is disposed between the lens 231 and the image sensor 22. The filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.
  • the filter 24 is an infrared cut filter.
  • the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22.
  • the light passes through the light-passing hole 391, the lens 231 and the filter 24 in sequence, and then reaches the image sensor 22, so that the image sensor 22 can collect an external image.
  • the lens module 23 further includes a base 233.
  • the base 233 defines a recess 2331.
  • the bottom surface of the recess 2331 defines a through hole 2332.
  • the filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.
  • the housing 2321 can be coupled to the base 233 by a first rubber ring 54.
  • the pedestal 233 can be attached to the printed circuit board 21 via a second rubber ring 56.
  • the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.
  • the imaging module 100 includes a connector 58 .
  • the connector 58 is disposed on the connector mounting portion 14 and electrically connected to the connector mounting portion 14 .
  • the connector 58 can quickly mount the imaging module 100 to the electronic device.
  • the light passing hole 391 is disposed coaxially with the optical axis of the lens 231.
  • the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 12 are fixed on the reinforcing plate 60.
  • the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.
  • the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70.
  • the anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image.
  • the electromagnetic wave preventing member 70 can be made of, for example, a metal material.
  • FIG. 3, FIG. 5 and FIG. 6 do not show the colloid 40 so as to clearly show the relationship between other elements.
  • FIGS. 3, 5 and 6 do not show the colloid 40 so as to clearly show the relationship between other elements.
  • FIGS. 1 and 2 show the positions of the colloid 40 in FIGS. 3, 5 and 6 by means of FIGS. 1 and 2 and corresponding textual descriptions.
  • part of the colloid 40 is also omitted in FIG. 2, for example, the colloid 40 located in the second dispensing hole 33 is omitted.
  • An electronic device includes the imaging module of any of the above embodiments.
  • Electronic device such as hand Machine, tablet, etc.
  • the first dispensing hole corresponds to the first gap
  • the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first dispensing hole during the assembly process.
  • the second point is in the glue hole so that the glue can fill the gap, and then at least two camera modules are firmly fixed on the cover body.

Abstract

Disclosed are an imaging module and an electronic device. The imaging module comprises: a flexible circuit board; at least two photographing modules provided on the flexible circuit board, wherein a first gap is formed between the at least two photographing modules; a hood covering the at least two photographing modules, wherein a second gap is formed between the hood and the photographing modules, the hood is provided with a first adhesive dispensing hole and a second adhesive dispensing hole that are spaced part from each other, the first adhesive dispensing hole corresponds to the first gap, and the second adhesive dispensing hole corresponds to the second gap; and adhesives provided in the first and second gaps and used for connecting the at least two photographing modules to the hood. In the imaging module, the first adhesive dispensing hole corresponds to the first gap, and the second adhesive dispensing hole corresponds to the second gap, and therefore, the adhesives can be dispensed into the first and second adhesive dispensing holes during assembly of the imaging module, so that the gaps can be filled with the adhesives, thereby firmly securing the at least two photographing modules to the hood.

Description

成像模组及电子装置Imaging module and electronic device
优先权信息Priority information
本申请请求在2016年03月03日向中国国家知识产权局提交的、专利申请号为201610120911.7、201620162763.0、201610120752.0、201620163058.2、201610120830.7及201620163056.3的专利申请的优先权和权益,并且通过参照将其全文并入此处。This application claims the priority and benefit of the patent applications filed on March 3, 2016, to the Chinese National Intellectual Property Office, the patent application numbers are 201610120911.7, 201620162763.0, 201610120752.0, 201620163058.2, 201610120830.7 and 201620163056.3, and the full text is incorporated by reference. Here.
技术领域Technical field
本发明涉及摄像技术领域,尤其涉及一种成像模组及一种电子装置。The present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.
背景技术Background technique
随着人们对拍摄图像的质量要求提高,双摄像头拍照技术应运而生。为了保证拍照质量,双摄像头模组的两个摄像模组的光轴平行设置。同时,为了加强双摄像头模组的强度及在双摄像头模组跌落时,防止摄像模组的光轴发生偏移,两个摄像模组一般通过罩体固定在一起。因此,如何利用罩体将两个摄像模组牢固地固定在一起成为亟待解决的问题。As people's quality requirements for captured images increase, dual camera photography technology came into being. In order to ensure the quality of the photograph, the optical axes of the two camera modules of the dual camera module are arranged in parallel. At the same time, in order to strengthen the strength of the dual camera module and prevent the optical axis of the camera module from shifting when the dual camera module is dropped, the two camera modules are generally fixed together by the cover. Therefore, how to securely fix the two camera modules together by using the cover body becomes a problem to be solved.
发明内容Summary of the invention
本发明旨在至少解决现有技术中存在的技术问题之一。为此,本发明提供一种成像模组及一种电子装置。The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.
本发明实施方式的成像模组,包括:柔性电路板;至少两个摄像模组,所述至少两个摄像模组设置在所述柔性电路板上,所述至少两个摄像模组之间形成有第一间隙;罩体,所述罩体罩设在所述至少两个摄像模组上,所述罩体与所述摄像模组之间形成有第二间隙,所述罩体开设有间隔设置的第一点胶孔及第二点胶孔,所述第一点胶孔对应于所述第一间隙,所述第二点胶孔对应所述第二间隙;设置在所述第一间隙及所述第二间隙中的胶体,所述胶体连接所述至少两个摄像模组及所述罩体。The imaging module of the embodiment of the present invention includes: a flexible circuit board; at least two camera modules, the at least two camera modules are disposed on the flexible circuit board, and the at least two camera modules are formed a first gap; a cover body, the cover body is disposed on the at least two camera modules, a second gap is formed between the cover body and the camera module, and the cover body is spaced apart a first glue hole and a second glue hole, wherein the first glue hole corresponds to the first gap, the second glue hole corresponds to the second gap; and the first gap is disposed And a colloid in the second gap, the colloid connecting the at least two camera modules and the cover.
本发明实施方式的成像模组中,第一点胶孔对应于第一间隙,第二点胶孔对应于第二间隔,使得成像模组在组装过程中,能够将粘胶点到第一点胶孔及第二点胶孔中以使粘胶能填充间隙,进而将至少两个摄像模组牢固地固定在罩体上。In the imaging module of the embodiment of the invention, the first dispensing hole corresponds to the first gap, and the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first point during the assembly process. The glue hole and the second glue hole are arranged to enable the glue to fill the gap, and at least two camera modules are firmly fixed on the cover body.
在某些实施方式中,所述摄像模组的数量为两个。In some embodiments, the number of camera modules is two.
在某些实施方式中,所述柔性电路板包括间隔设置的两个模组安装部及连接所述两 个模组安装部的连接器安装部;每个所述摄像模组设置在对应的所述模组安装部上。In some embodiments, the flexible circuit board includes two module mounting portions spaced apart and connects the two a connector mounting portion of the module mounting portion; each of the camera modules is disposed on the corresponding module mounting portion.
在某些实施方式中,所述柔性电路板包括间隔设置的两个连接部,每个所述连接部连接对应的所述模组安装部及所述连接器安装部。In some embodiments, the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the connector mounting portion.
在某些实施方式中,所述柔性电路板包括间隔设置的两个模组安装部及间隔设置的两个连接器安装部,每个所述模组安装部连接对应的所述连接器安装部;每个所述摄像模组设置在对应的所述模组安装部上。In some embodiments, the flexible circuit board includes two module mounting portions spaced apart from each other and two connector mounting portions spaced apart, and each of the module mounting portions is connected to the corresponding connector mounting portion. Each of the camera modules is disposed on a corresponding one of the module mounting portions.
在某些实施方式中,所述柔性电路板包括间隔设置的两个连接部,每个所述连接部连接对应的所述模组安装部及对应的所述连接器安装部。In some embodiments, the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connector mounting portion.
在某些实施方式中,所述柔性电路板包括模组安装部及连接所述模组安装部的连接器安装部;两个所述摄像模组设置在所述模组安装部上。In some embodiments, the flexible circuit board includes a module mounting portion and a connector mounting portion that connects the module mounting portion; and the two camera modules are disposed on the module mounting portion.
在某些实施方式中,所述柔性电路板包括连接部,所述连接部连接所述模组安装部及所述连接器安装部。In some embodiments, the flexible circuit board includes a connection portion that connects the module mounting portion and the connector mounting portion.
在某些实施方式中,所述第一点胶孔呈长条状。In some embodiments, the first dispensing aperture is elongated.
在某些实施方式中,所述第一点胶孔的宽度为0.5±0.1mm,所述第一点胶孔的长度大于或等于1.5mm。In some embodiments, the first dispensing aperture has a width of 0.5 ± 0.1 mm and the first dispensing aperture has a length greater than or equal to 1.5 mm.
在某些实施方式中,所述第一点胶孔的宽度为0.5±0.1mm,所述第一点胶孔的长度为8.4±0.1mm。In some embodiments, the first dispensing aperture has a width of 0.5 ± 0.1 mm and the first dispensing aperture has a length of 8.4 ± 0.1 mm.
在某些实施方式中,所述第一点胶孔的宽度为0.5mm,所述第一点胶孔的长度为8.4mm。In some embodiments, the first dispensing aperture has a width of 0.5 mm and the first dispensing aperture has a length of 8.4 mm.
在某些实施方式中,所述第一点胶孔到所述罩体的长边侧壁的距离大于0.45mm。In some embodiments, the distance of the first dispensing aperture to the long side sidewall of the cover is greater than 0.45 mm.
在某些实施方式中,所述第一点胶孔包括长条状孔及连接在所述长条状孔的两端的两个端孔,所述端孔沿所述长条状孔的宽度方向的尺寸大于所述长条状孔的宽度;所述长条状孔对应于所述两个摄像模组的两个侧壁;每个所述端孔对应于所述两个摄像模组的两个角落位置。In some embodiments, the first dispensing hole comprises an elongated hole and two end holes connected at opposite ends of the elongated hole, the end hole being along a width direction of the elongated hole The size of the strip is larger than the width of the long strip hole; the strip hole corresponds to two side walls of the two camera modules; each of the end holes corresponds to two of the two camera modules Corner location.
在某些实施方式中,所述长条状孔的宽度为0.5±0.1mm,所述长条状孔的长度大于或等于1.5mm。In some embodiments, the elongated holes have a width of 0.5 ± 0.1 mm and the elongated holes have a length greater than or equal to 1.5 mm.
在某些实施方式中,所述长条状孔的宽度为0.5±0.1mm,所述长条状孔的长度为8.4±0.1mm。In some embodiments, the elongated aperture has a width of 0.5 ± 0.1 mm and the elongated aperture has a length of 8.4 ± 0.1 mm.
在某些实施方式中,所述长条状孔的宽度为0.5mm,所述长条状孔的长度为8.4mm。In some embodiments, the elongated aperture has a width of 0.5 mm and the elongated aperture has a length of 8.4 mm.
在某些实施方式中,所述长条状孔到所述罩体的长边侧壁的距离大于0.45mm。In some embodiments, the distance from the elongated aperture to the long side wall of the cover is greater than 0.45 mm.
在某些实施方式中,所述端孔呈三角形状。 In some embodiments, the end holes are triangular in shape.
在某些实施方式中,所述第二点胶孔包括多个圆柱状孔,所述多个圆柱状孔间隔分布在所述罩体的不同设定位置。In some embodiments, the second dispensing hole includes a plurality of cylindrical holes spaced apart at different set positions of the cover.
在某些实施方式中,,所述圆柱状孔的孔径为1±0.1mm。In certain embodiments, the cylindrical bore has a pore size of 1 ± 0.1 mm.
在某些实施方式中,所述圆柱状孔的孔径为1mm。In certain embodiments, the cylindrical bore has a pore size of 1 mm.
在某些实施方式中,所述罩体包括围绕所述至少两个摄像模组的框体及与所述框体连接的顶盖,所述顶盖通过所述胶体与所述至少两个摄像模组固定连接。In some embodiments, the cover includes a frame surrounding the at least two camera modules and a top cover connected to the frame, the top cover passes the gel and the at least two cameras The module is fixedly connected.
在某些实施方式中,所述第一点胶孔为单个点胶孔,所述第二点胶孔包括四个圆柱状孔,所述四个圆柱状孔分别分布在所述顶盖的四个角落位置。In some embodiments, the first dispensing hole is a single dispensing hole, and the second dispensing hole includes four cylindrical holes, and the four cylindrical holes are respectively distributed on the top of the top cover Corner location.
在某些实施方式中,每个所述摄像模组包括印刷电路板及设置在所述印刷电路板上且与所述印刷电路板电性连接的图像传感器,所述印刷电路板设置在所述柔性电路板上且与所述柔性电路板电性连接,所述成像模组包括电性连接垫,所述电性连接垫设置在所述柔性电路板与所述印刷电路板之间且电性连接所述柔性电路板与所述印刷电路板。In some embodiments, each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, the printed circuit board being disposed in the The flexible circuit board is electrically connected to the flexible circuit board, the imaging module includes an electrical connection pad, and the electrical connection pad is disposed between the flexible circuit board and the printed circuit board and electrically Connecting the flexible circuit board to the printed circuit board.
本发明实施方式的电子装置,包括如上任一实施方式所述的成像模组。An electronic device according to an embodiment of the present invention includes the imaging module according to any of the above embodiments.
上述电子装置中,第一点胶孔对应于第一间隙,第二点胶孔对应于第二间隔,使得成像模组在组装过程中,能够将粘胶点到第一点胶孔及第二点胶孔中以使粘胶能填充间隙,进而将至少两个摄像模组牢固地固定在罩体上。In the above electronic device, the first dispensing hole corresponds to the first gap, and the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first dispensing hole and the second during the assembly process. The glue holes are inserted so that the glue can fill the gap, and at least two camera modules are firmly fixed to the cover.
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。The additional aspects and advantages of the invention will be set forth in part in the description which follows.
附图说明DRAWINGS
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图1是本发明实施方式的成像模组的立体示意图。1 is a perspective view of an imaging module according to an embodiment of the present invention.
图2是本发明实施方式的成像模组的部分分解示意图。2 is a partially exploded perspective view of an imaging module in accordance with an embodiment of the present invention.
图3是本发明实施方式的成像模组的平面示意图。3 is a schematic plan view of an imaging module according to an embodiment of the present invention.
图4是本发明实施方式的成像模组的另一立体示意图。4 is another perspective view of an imaging module according to an embodiment of the present invention.
图5是本发明实施方式的成像模组的分解示意图。FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.
图6是本发明实施方式的成像模组的剖面示意图。6 is a schematic cross-sectional view of an imaging module according to an embodiment of the present invention.
图7是图6中的成像模组的VII部分的放大示意图。Figure 7 is an enlarged schematic view of a portion VII of the imaging module of Figure 6.
图8是图6中的成像模组的VIII部分的放大示意图。Figure 8 is an enlarged schematic view of a portion VIII of the imaging module of Figure 6.
图9是本发明实施方式的成像模组的罩体的平面示意图。 9 is a schematic plan view of a cover of an imaging module according to an embodiment of the present invention.
图10是本发明实施方式的成像模组的罩体的立体示意图。FIG. 10 is a perspective view of a cover body of an imaging module according to an embodiment of the present invention.
图11是本发明实施方式的成像模组的柔性电路板的立体示意图。11 is a perspective view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
图12是本发明实施方式的成像模组的柔性电路板的另一立体示意图。12 is another perspective view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
图13是本发明实施方式的成像模组的罩体的另一平面示意图。FIG. 13 is another schematic plan view of a cover body of an imaging module according to an embodiment of the present invention.
具体实施方式detailed description
下面详细描述本发明的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例, 并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are just examples. And the purpose is not to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.
请参图1、图2及图3,本发明实施方式的成像模组100包括柔性电路板10、至少两个摄像模组20、罩体30及胶体40。Referring to FIG. 1 , FIG. 2 and FIG. 3 , the imaging module 100 of the embodiment of the present invention includes a flexible circuit board 10 , at least two camera modules 20 , a cover 30 , and a colloid 40 .
至少两个摄像模组20设置在柔性电路板10上,至少两个摄像模组20之间形成有第一间隙50。At least two camera modules 20 are disposed on the flexible circuit board 10, and a first gap 50 is formed between the at least two camera modules 20.
罩体30罩设在至少两个摄像模组20上,罩体30与摄像模组20之间形成有第二间隙51,罩体30开设有间隔设置的第一点胶孔32及第二点胶孔33,第一点胶孔32对应于第一间隙50,第二点胶孔33对应第二间隙51。The cover 30 is disposed on the at least two camera modules 20, and a second gap 51 is formed between the cover 30 and the camera module 20. The cover 30 is provided with a first dispensing hole 32 and a second point. The glue hole 33 has a first glue hole 32 corresponding to the first gap 50 and a second glue hole 33 corresponding to the second gap 51.
胶体40设置在第一间隙50及第二间隙51中,胶体40连接至少两个摄像模组20及罩体30。The colloid 40 is disposed in the first gap 50 and the second gap 51 , and the colloid 40 connects at least two camera modules 20 and the cover 30 .
因此,本发明实施方式的成像模组100中,第一点胶孔32对应于第一间隙50,第二点胶孔33对应于第二间隔51,使得成像模组100在组装过程中,能够将粘胶点到第一点胶孔32及第二点胶孔33中以使粘胶能填充间隙,进而将至少两个摄像模组20牢固地固定在罩体30上。Therefore, in the imaging module 100 of the embodiment of the present invention, the first dispensing hole 32 corresponds to the first gap 50, and the second dispensing hole 33 corresponds to the second spacing 51, so that the imaging module 100 can be assembled during the assembly process. The adhesive is spotted into the first dispensing hole 32 and the second dispensing opening 33 to enable the adhesive to fill the gap, thereby securing the at least two camera modules 20 to the cover 30 securely.
具体地,本实施方式中,摄像模组20的数量为两个。Specifically, in the present embodiment, the number of the camera modules 20 is two.
在一个例子中,在组装成像模组100的时候,先将两个摄像模组20分别固定至柔性电路板10上,然后可用机械手夹持固定其中一个摄像模组20,之后通过机械手调整另一个摄像模组20的位置以使两个摄像模组20的光轴平行,并且两个摄像模组20朝向同一侧。In one example, when assembling the imaging module 100, the two camera modules 20 are respectively fixed to the flexible circuit board 10, and then one of the camera modules 20 can be clamped by a robot, and then the other is adjusted by the robot. The position of the camera module 20 is such that the optical axes of the two camera modules 20 are parallel, and the two camera modules 20 face the same side.
在本实施方式中,柔性电路板10包括间隔设置的两个模组安装部12及连接两个模组安装部12的连接器安装部14。每个摄像模组20设置在对应的模组安装部12上使得两个摄像模组20间隔设置。In the present embodiment, the flexible circuit board 10 includes two module mounting portions 12 that are spaced apart from each other and a connector mounting portion 14 that connects the two module mounting portions 12. Each camera module 20 is disposed on the corresponding module mounting portion 12 such that the two camera modules 20 are spaced apart.
因此,两个摄像模组20间隔设置使得两个摄像模组20之间有足够的空间,可方便地将两个摄像模组20的光轴调整至平行的位置,保证成像模组100的拍摄质量。Therefore, the two camera modules 20 are spaced apart so that there is sufficient space between the two camera modules 20, and the optical axes of the two camera modules 20 can be conveniently adjusted to parallel positions to ensure the imaging of the imaging module 100. quality.
进一步地,在本实施方式中,柔性电路板10包括间隔设置的两个连接部16,每个连接部16连接对应的模组安装部12及连接器安装部14。Further, in the present embodiment, the flexible circuit board 10 includes two connecting portions 16 that are spaced apart, and each of the connecting portions 16 is connected to the corresponding module mounting portion 12 and the connector mounting portion 14.
如此,两个连接部16间隔设置可进一步有利于柔性电路板10变形,从而有利于调整两个摄像模组20的位置以使两个摄像模组20的光轴平行。 As such, the two connecting portions 16 are spaced apart to further facilitate the deformation of the flexible circuit board 10, thereby facilitating adjustment of the positions of the two camera modules 20 such that the optical axes of the two camera modules 20 are parallel.
在某些实施方式中,请参图11,柔性电路板包括间隔设置的两个模组安装部112及间隔设置的两个连接器安装部114,每个模组安装部112连接对应的连接器安装部114,每个摄像模组设置在对应的模组安装部112上。In some embodiments, referring to FIG. 11, the flexible circuit board includes two module mounting portions 112 spaced apart from each other and two connector mounting portions 114 spaced apart, and each module mounting portion 112 is connected to a corresponding connector. The mounting portion 114 is provided on each of the corresponding module mounting portions 112.
因此,间隔设置的两个模组安装部112及两个连接器安装部114使得在柔性电路板存在故障时,只需维修或更换其中一个模组安装部及/或连接器安装部,降低了成像模组的维护成本。Therefore, the two module mounting portions 112 and the two connector mounting portions 114 are provided at intervals, so that when the flexible circuit board is faulty, only one of the module mounting portions and/or the connector mounting portion needs to be repaired or replaced, which is reduced. Maintenance cost of the imaging module.
进一步地,请参图11,在某些实施方式中,柔性电路板包括间隔设置的两个连接部116,每个连接部116连接对应的模组安装部112及对应的连接器安装部114。Further, referring to FIG. 11 , in some embodiments, the flexible circuit board includes two connecting portions 116 spaced apart, and each connecting portion 116 is connected to the corresponding module mounting portion 112 and the corresponding connector mounting portion 114 .
因此,每个摄像模组对应于独立的模组安装部112、连接器安装部114及连接部116,使得两个摄像模组的电路连接部分相互独立,进一步降低了成像模组的维护成本。Therefore, each camera module corresponds to the independent module mounting portion 112, the connector mounting portion 114, and the connecting portion 116, so that the circuit connecting portions of the two camera modules are independent of each other, further reducing the maintenance cost of the imaging module.
在某些实施方式中,请参图12,柔性电路板包括模组安装部212及连接模组安装部212的连接器安装部214。两个摄像模组设置在模组安装部212上。因此,两个摄像模组设置在同一模组安装部212上,模组安装部212无需制造成更小的尺寸,进而降低了模组安装部的制造成本。In some embodiments, referring to FIG. 12 , the flexible circuit board includes a module mounting portion 212 and a connector mounting portion 214 that connects the module mounting portion 212 . Two camera modules are disposed on the module mounting portion 212. Therefore, the two camera modules are disposed on the same module mounting portion 212, and the module mounting portion 212 does not need to be manufactured to a smaller size, thereby reducing the manufacturing cost of the module mounting portion.
进一步地,请参图12,在某些实施方式中,柔性电路板包括连接部216,连接部216连接模组安装部212及连接器安装部214。因此,模组安装部212、连接器安装部214及连接部216形成整体单一结构,降低了柔性电路板的制造成本。Further, referring to FIG. 12 , in some embodiments, the flexible circuit board includes a connecting portion 216 that connects the module mounting portion 212 and the connector mounting portion 214 . Therefore, the module mounting portion 212, the connector mounting portion 214, and the connecting portion 216 form a unitary single structure, which reduces the manufacturing cost of the flexible circuit board.
本实施方式中,请参图9,第一点胶孔32为单个点胶孔,其包括长条状孔34及连接在长条状孔34的两端的两个端孔36,端孔36沿长条状孔34的宽度方向的尺寸大于长条状孔34的宽度。In this embodiment, referring to FIG. 9, the first dispensing hole 32 is a single dispensing hole, which includes an elongated hole 34 and two end holes 36 connected to both ends of the elongated hole 34. The dimension of the elongated hole 34 in the width direction is larger than the width of the elongated hole 34.
请结合图3,长条状孔34对应于两个摄像模组20的两个侧壁。每个端孔36对应于两个摄像模组20的两个角落位置20a、20b。Referring to FIG. 3 , the elongated holes 34 correspond to the two side walls of the two camera modules 20 . Each of the end holes 36 corresponds to two corner positions 20a, 20b of the two camera modules 20.
因此,一方面,胶体40通过长条状孔34进入到两个摄像模组20中间之间的间隙,使胶体40连接两个摄像模组30的中间侧壁及罩体30;另一方面,胶体40通过两个端孔36进入两个摄像模组20的两个角落位置20a、20b与罩体30之间的间隙,使胶体40连接两个摄像模组20的角落侧壁及罩体30。如此,提高了胶体40将两个摄像模组20固定到罩体30上的连接强度。Therefore, on the one hand, the colloid 40 enters the gap between the two camera modules 20 through the elongated holes 34, so that the colloid 40 connects the intermediate side walls of the two camera modules 30 and the cover 30; The colloid 40 enters the gap between the two corner positions 20a, 20b of the two camera modules 20 and the cover 30 through the two end holes 36, so that the colloid 40 connects the corner side walls of the two camera modules 20 and the cover 30. . In this way, the connection strength of the colloid 40 to fix the two camera modules 20 to the cover 30 is improved.
同时,端孔36沿长条状孔34的宽度方向的尺寸大于长条状孔34的宽度,使得两个摄像模组20在角落位置20a、20b与罩体30形成T形的胶体连接部,进一步提高两个摄像模组20与罩体30的连接强度。At the same time, the dimension of the end hole 36 along the width direction of the elongated hole 34 is larger than the width of the elongated hole 34, so that the two camera modules 20 form a T-shaped colloidal connection portion with the cover 30 at the corner positions 20a, 20b. The connection strength between the two camera modules 20 and the cover 30 is further improved.
本实施方式中,请参图9,长条状孔34的宽度W为0.5±0.1mm,较佳为0.5mm。 In the present embodiment, referring to Fig. 9, the width W of the elongated hole 34 is 0.5 ± 0.1 mm, preferably 0.5 mm.
当长条状孔34的宽度小于以上范围时,这不容易点胶且容易溢胶;当长条状孔34的宽度大于以上范围时,这会导致罩体30的强度较低;当长条状孔34的宽度为0.5mm时,胶体40很容易进入到第一点胶孔32中。When the width of the elongated hole 34 is smaller than the above range, this is not easy to dispense and is easy to overflow; when the width of the elongated hole 34 is larger than the above range, this causes the strength of the cover 30 to be low; When the width of the hole 34 is 0.5 mm, the colloid 40 easily enters the first dispensing hole 32.
长条状孔34的长度L为8.4±0.1mm,较佳为8.4mm。The length L of the elongated hole 34 is 8.4 ± 0.1 mm, preferably 8.4 mm.
当长条状孔34的长度小于以上范围时,这不容易点胶且容易溢胶;当长条状孔34的长度大于以上范围时,这会导致罩体30的强度较低;当长条状孔34的长度为8.4mm时,胶体40不容易溢出第一点胶孔32外。When the length of the elongated hole 34 is less than the above range, this is not easy to dispense and is easy to overflow; when the length of the elongated hole 34 is larger than the above range, this causes the strength of the cover 30 to be low; When the length of the hole 34 is 8.4 mm, the colloid 40 does not easily overflow outside the first dispensing hole 32.
在某些实施方式中,长条状孔34的宽度W为0.5±0.1mm,长条状孔34的长度L大于或等于1.5mm。In some embodiments, the elongated hole 34 has a width W of 0.5 ± 0.1 mm and the elongated hole 34 has a length L greater than or equal to 1.5 mm.
在本实施方式中,请参图9,长条状孔34到罩体30的长边侧壁的距离H大于0.45mm。In the present embodiment, referring to FIG. 9, the distance H between the elongated holes 34 and the long side walls of the cover 30 is greater than 0.45 mm.
本实施方式中,端孔36呈三角形状。呈三角形状的端孔36有利于形成相应形状的胶体40,使得两个摄像模组20与罩体30的连接更牢固。In the present embodiment, the end hole 36 has a triangular shape. The triangular shaped end holes 36 facilitate the formation of the correspondingly shaped colloids 40 such that the connection of the two camera modules 20 to the cover 30 is stronger.
在某些实施方式中,请参图13,第一点胶孔130呈长条状。进一步地,第一点胶孔130的宽度W1为0.5±0.1mm,较佳为0.5mm,第一点胶孔130的长度L1为8.4±0.1mm,较佳为8.4mm。In some embodiments, referring to FIG. 13, the first dispensing holes 130 are elongated. Further, the width W1 of the first dispensing hole 130 is 0.5±0.1 mm, preferably 0.5 mm, and the length L1 of the first dispensing hole 130 is 8.4±0.1 mm, preferably 8.4 mm.
在某些实施方式中,第一点胶孔130的宽度W1为0.5±0.1mm,第一点胶孔的长度L1大于或等于1.5mm。In some embodiments, the first dispensing aperture 130 has a width W1 of 0.5 ± 0.1 mm and the first dispensing aperture has a length L1 greater than or equal to 1.5 mm.
在某些实施方式中,请参图13,第一点胶孔130到罩体的长边侧壁的距离H1大于0.45mm。In some embodiments, referring to FIG. 13, the distance H1 of the first dispensing hole 130 to the long side wall of the cover is greater than 0.45 mm.
在本实施方式中,第二点胶孔33包括多个圆柱状孔37,多个圆柱状孔37间隔分布在罩体30的不同设定位置。In the present embodiment, the second dispensing hole 33 includes a plurality of cylindrical holes 37, and the plurality of cylindrical holes 37 are spaced apart at different set positions of the cover 30.
具体地,请结合图5及图10,在本实施方式中,罩体30大致呈长方体状。罩体30包括围绕两个摄像模组20的框体38及与框体38连接的顶盖39,顶盖39通过胶体40与两个摄像模组20固定连接。Specifically, referring to FIG. 5 and FIG. 10, in the present embodiment, the cover 30 has a substantially rectangular parallelepiped shape. The cover 30 includes a frame 38 surrounding the two camera modules 20 and a top cover 39 connected to the frame 38. The cover 39 is fixedly connected to the two camera modules 20 via the glue 40.
圆柱状孔37的数量为四个,四个圆柱状孔37分别分布在顶盖39的四个角落位置。如此可以使胶体40的分布更合理,提高了胶体40连接摄像模组20与罩体30的连接强度。The number of the cylindrical holes 37 is four, and the four cylindrical holes 37 are respectively distributed at the four corner positions of the top cover 39. In this way, the distribution of the colloid 40 can be made more reasonable, and the connection strength of the colloid 40 to the camera module 20 and the cover 30 can be improved.
另外,顶盖39开设有两个通光孔391,两个摄像模组20分别通过两个通光孔391暴露。In addition, the top cover 39 is provided with two light-passing holes 391, and the two camera modules 20 are respectively exposed through the two light-passing holes 391.
需要说明的是,本实施方式中,两个通光孔391均呈圆柱形状。在其他实施方式中, 两个通光孔的形状可分别具体而定。因此,本实施方式的通光孔的形状不能理解为对本发明的限制。It should be noted that in the present embodiment, both of the light-passing holes 391 have a cylindrical shape. In other embodiments, The shape of the two light-passing holes can be determined specifically. Therefore, the shape of the light-passing hole of the present embodiment is not to be construed as limiting the invention.
本实施方式中,圆柱状孔37的孔径为1±0.1mm,较佳地为,圆柱状孔37的孔径为1mm。In the present embodiment, the cylindrical hole 37 has a hole diameter of 1 ± 0.1 mm, and preferably, the cylindrical hole 37 has a hole diameter of 1 mm.
当圆柱状孔37的孔径小于以上范围时,这不容易点胶且容易溢胶;当圆柱状孔37的孔径大于以上范围时,这会导致罩体30的强度较低;当圆柱状孔37的孔径为1mm时,胶体40不容易溢出圆柱状孔37外且容易进入圆柱状孔37中。When the diameter of the cylindrical hole 37 is smaller than the above range, this is not easy to dispense and is easy to overflow; when the diameter of the cylindrical hole 37 is larger than the above range, this causes the strength of the cover 30 to be low; when the cylindrical hole 37 When the aperture is 1 mm, the colloid 40 does not easily overflow outside the cylindrical hole 37 and easily enters the cylindrical hole 37.
请参图8,本实施方式中,第二间隙51包括侧间隙53及顶间隙55,侧间隙53由框体38的内表面与摄像模组20的外侧面之间所形成,顶间隙55由顶盖39的内表面与摄像模组20的外顶面之间所形成。侧间隙53连接顶间隙55并共同连通第二点胶孔33,例如是直接连通第二点胶孔33。Referring to FIG. 8 , in the embodiment, the second gap 51 includes a side gap 53 and a top gap 55 formed by an inner surface of the frame 38 and an outer side surface of the camera module 20 , and the top gap 55 is formed by The inner surface of the top cover 39 is formed between the inner surface of the top cover 39 and the outer top surface of the camera module 20. The side gap 53 connects the top gap 55 and communicates with the second glue hole 33 in common, for example, directly communicating with the second glue hole 33.
因此,当胶体40从第二点胶孔33进入第二间隔51时,一部分胶体40流进侧间隙53,另一部分胶体40流进顶间隙55,使得胶体40从不同方位将摄像模组20粘接在罩体30内。当胶体40固化后,胶体40将摄像模组20牢固地固定在罩体30内。Therefore, when the colloid 40 enters the second interval 51 from the second dispensing hole 33, a part of the colloid 40 flows into the side gap 53, and another part of the colloid 40 flows into the top gap 55, so that the colloid 40 sticks the camera module 20 from different directions. Connected within the cover 30. After the colloid 40 is cured, the colloid 40 securely fixes the camera module 20 within the cover 30.
请参阅图5、图6及图7,在本实施方式中,每个摄像模组20包括印刷电路板21(Printed Circuit Board,PCB)及图像传感器22。两个图像传感器22的感测面朝向同一侧。印刷电路板21设置在柔性电路板10上且与柔性电路板10电性连接。图像传感器22设置在印刷电路板21上且与印刷电路板21电性连接。Referring to FIG. 5 , FIG. 6 and FIG. 7 , in the embodiment, each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 . The sensing faces of the two image sensors 22 are oriented on the same side. The printed circuit board 21 is disposed on the flexible circuit board 10 and electrically connected to the flexible circuit board 10. The image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.
如此,图像传感器22可获取物体的图像,并将图像通过印刷电路板21及柔性电路板10传至外部装置。As such, the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10.
具体地,图像传感器22可以采用互补金属氧化物半导体(Complementary Metal Oxide Semiconductor,CMOS)影像感测器或者电荷耦合元件(Charge-coupled Device,CCD)影像感测器。印刷电路板21设置在模组安装部12上且与模组安装部12电性连接。Specifically, the image sensor 22 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor. The printed circuit board 21 is disposed on the module mounting portion 12 and electrically connected to the module mounting portion 12.
本实施方式中,请参图7,成像模组100包括电性连接垫52,电性连接垫52设置在柔性电路板10与印刷电路板21之间且电性连接柔性电路板10与印刷电路板21。In this embodiment, referring to FIG. 7, the imaging module 100 includes an electrical connection pad 52. The electrical connection pad 52 is disposed between the flexible circuit board 10 and the printed circuit board 21 and electrically connected to the flexible circuit board 10 and the printed circuit. Board 21.
如此,电性连接垫52实现柔性电路板10与摄像模组20之间电性连接及通信。例如,电性连接垫52可采用导电胶。As such, the electrical connection pads 52 electrically connect and communicate between the flexible circuit board 10 and the camera module 20. For example, the electrical connection pad 52 can be made of a conductive paste.
请结合图5,本实施方式中,摄像模组20包括设置在印刷电路板21上并位于图像传感器22上方的镜头模组23。Referring to FIG. 5 , in the embodiment, the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .
如此,镜头模组23可使图像传感器22获得品质较佳的图像,从而可提高成像模组100的拍摄品质。 In this way, the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.
本实施方式中,镜头模组23包括镜头231及音圈马达232,音圈马达232包括壳体2321,镜头231设置在壳体2321内,第一间隙50形成在两个摄像模组的两个壳体2321之间,第二间隙形成在两个壳体与罩体之间。In this embodiment, the lens module 23 includes a lens 231 and a voice coil motor 232. The voice coil motor 232 includes a housing 2321. The lens 231 is disposed in the housing 2321. The first gap 50 is formed in two of the two camera modules. Between the housings 2321, a second gap is formed between the two housings and the cover.
音圈马达232可以驱动镜头231沿镜头231的光轴方向移动以调整镜头231与图像传感器22之间的距离,进而实现成像模组100的自动对焦,使成像模组100获取品质较佳的图像。进一步地,镜头231与图像传感器22之间设置有滤光片24。滤光片24可以过滤预设频率的光线,使得图像传感器22根据过滤后的光线形成较佳的图像。The voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image. . Further, a filter 24 is disposed between the lens 231 and the image sensor 22. The filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.
较佳地,滤光片24为红外截止滤光片。如此,红外截止滤光片24可以过滤红外线,避免图像传感器22的图像失真。光线依次经过通光孔391、镜头231及滤光片24后到达图像传感器22,图像传感器22从而可采集到外界图像。Preferably, the filter 24 is an infrared cut filter. As such, the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22. The light passes through the light-passing hole 391, the lens 231 and the filter 24 in sequence, and then reaches the image sensor 22, so that the image sensor 22 can collect an external image.
具体地,镜头模组23还包括基座233,基座233开设有凹槽2331,凹槽2331的底面开设有通孔2332。滤光片24设置在凹槽2331内且支撑在凹槽2331的底面上,经过滤光片24过滤的光线可以通过通孔2332到达图像传感器22。Specifically, the lens module 23 further includes a base 233. The base 233 defines a recess 2331. The bottom surface of the recess 2331 defines a through hole 2332. The filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.
壳体2321可通过第一胶圈54连接在基座233上。基座233可通过第二胶圈56连接在印刷电路板21上。The housing 2321 can be coupled to the base 233 by a first rubber ring 54. The pedestal 233 can be attached to the printed circuit board 21 via a second rubber ring 56.
为了方便拿取滤光片24,基座233上开设有连接槽2333,连接槽2333连通凹槽2331。In order to facilitate the take-up of the filter 24, the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.
本实施方式中,请参图4,成像模组100包括连接器58,连接器58设置在连接器安装部14上并与连接器安装部14电性连接。In this embodiment, referring to FIG. 4 , the imaging module 100 includes a connector 58 . The connector 58 is disposed on the connector mounting portion 14 and electrically connected to the connector mounting portion 14 .
如此,连接器58可将成像模组100快速地安装到电子设备上。As such, the connector 58 can quickly mount the imaging module 100 to the electronic device.
本实施方式中,较佳地,通光孔391与镜头231的光轴同轴设置。In the present embodiment, preferably, the light passing hole 391 is disposed coaxially with the optical axis of the lens 231.
进一步地,成像模组100还包括加强板60,两个模组安装部12固定在加强板60上。Further, the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 12 are fixed on the reinforcing plate 60.
如此,加强板60可进一步固定两个摄像模组20的位置,提高成像模组100的抗冲撞的能力,进而提高拍摄品质。In this way, the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.
本实施方式中,成像模组100还包括防电磁波干扰件70,加强板60设置在防电磁波干扰件70上。防电磁波干扰件70可防止成像模组100受到电磁波的干扰,保证成像模组100获取品质较佳的图像。防电磁波干扰件70例如可采用金属材料制成。In the embodiment, the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70. The anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image. The electromagnetic wave preventing member 70 can be made of, for example, a metal material.
需要说明的是,上述图3、图5及图6没有显示胶体40以能够清楚显示其它元件之间的关系。但是,本领域技术人员可通过图1及图2及相应的文字描述,清楚地了解胶体40在图3、图5及图6中的位置。另外,图2也省略了部分胶体40,例如,省略了位于第二点胶孔33中的胶体40。It should be noted that the above-described FIG. 3, FIG. 5 and FIG. 6 do not show the colloid 40 so as to clearly show the relationship between other elements. However, those skilled in the art can clearly understand the positions of the colloid 40 in FIGS. 3, 5 and 6 by means of FIGS. 1 and 2 and corresponding textual descriptions. In addition, part of the colloid 40 is also omitted in FIG. 2, for example, the colloid 40 located in the second dispensing hole 33 is omitted.
本发明实施方式的电子装置包括上述任一实施方式的成像模组。电子装置例如是手 机、平板电脑等。An electronic device according to an embodiment of the present invention includes the imaging module of any of the above embodiments. Electronic device such as hand Machine, tablet, etc.
因此,在电子装置中,第一点胶孔对应于第一间隙,第二点胶孔对应于第二间隔,使得成像模组在组装过程中,能够将粘胶点到第一点胶孔及第二点胶孔中以使粘胶能填充间隙,进而将至少两个摄像模组牢固地固定在罩体上。Therefore, in the electronic device, the first dispensing hole corresponds to the first gap, and the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first dispensing hole during the assembly process. The second point is in the glue hole so that the glue can fill the gap, and then at least two camera modules are firmly fixed on the cover body.
在本说明书的描述中,参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本发明的实施方式,本领域的普通技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。 While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims (26)

  1. 一种成像模组,其特征在于,包括:An imaging module, comprising:
    柔性电路板;Flexible circuit board
    至少两个摄像模组,所述至少两个摄像模组设置在所述柔性电路板上,所述至少两个摄像模组之间形成有第一间隙;At least two camera modules, the at least two camera modules are disposed on the flexible circuit board, and a first gap is formed between the at least two camera modules;
    罩体,所述罩体罩设在所述至少两个摄像模组上,所述罩体与所述摄像模组之间形成有第二间隙,所述罩体开设有间隔设置的第一点胶孔及第二点胶孔,所述第一点胶孔对应于所述第一间隙,所述第二点胶孔对应所述第二间隙;a cover body, the cover body is disposed on the at least two camera modules, a second gap is formed between the cover body and the camera module, and the cover body is provided with a first point spaced apart a glue hole and a second glue hole, the first glue hole corresponds to the first gap, and the second glue hole corresponds to the second gap;
    设置在所述第一间隙及所述第二间隙中的胶体,所述胶体连接所述至少两个摄像模组及所述罩体。a colloid disposed in the first gap and the second gap, the colloid connecting the at least two camera modules and the cover.
  2. 如权利要求1所述的成像模组,其特征在于,所述摄像模组的数量为两个。The imaging module of claim 1 , wherein the number of the camera modules is two.
  3. 如权利要求2所述的成像模组,其特征在于,所述柔性电路板包括间隔设置的两个模组安装部及连接所述两个模组安装部的连接器安装部;The imaging module according to claim 2, wherein the flexible circuit board comprises two module mounting portions spaced apart from each other and a connector mounting portion connecting the two module mounting portions;
    每个所述摄像模组设置在对应的所述模组安装部上。Each of the camera modules is disposed on a corresponding module mounting portion.
  4. 如权利要求3所述的成像模组,其特征在于,所述柔性电路板包括间隔设置的两个连接部,每个所述连接部连接对应的所述模组安装部及所述连接器安装部。The imaging module according to claim 3, wherein the flexible circuit board comprises two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the connector mounting unit.
  5. 如权利要求2所述的成像模组,其特征在于,所述柔性电路板包括间隔设置的两个模组安装部及间隔设置的两个连接器安装部,每个所述模组安装部连接对应的所述连接器安装部;The imaging module according to claim 2, wherein the flexible circuit board comprises two module mounting portions spaced apart from each other and two connector mounting portions spaced apart, each of the module mounting portions being connected Corresponding connector mounting portion;
    每个所述摄像模组设置在对应的所述模组安装部上。Each of the camera modules is disposed on a corresponding module mounting portion.
  6. 如权利要求5所述的成像模组,其特征在于,所述柔性电路板包括间隔设置的两个连接部,每个所述连接部连接对应的所述模组安装部及对应的所述连接器安装部。The imaging module according to claim 5, wherein the flexible circuit board comprises two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connection Installation unit.
  7. 如权利要求2所述的成像模组,其特征在于,所述柔性电路板包括模组安装部及连接所述模组安装部的连接器安装部;The imaging module according to claim 2, wherein the flexible circuit board comprises a module mounting portion and a connector mounting portion that connects the module mounting portion;
    两个所述摄像模组设置在所述模组安装部上。 Two camera modules are disposed on the module mounting portion.
  8. 如权利要求7所述的成像模组,其特征在于,所述柔性电路板包括连接部,所述连接部连接所述模组安装部及所述连接器安装部。The imaging module according to claim 7, wherein the flexible circuit board includes a connection portion, and the connection portion connects the module mounting portion and the connector mounting portion.
  9. 如权利要求1所述的成像模组,其特征在于,所述第一点胶孔呈长条状。The imaging module according to claim 1, wherein the first dispensing hole is elongated.
  10. 如权利要求9所述的成像模组,其特征在于,所述第一点胶孔的宽度为0.5±0.1mm,所述第一点胶孔的长度大于或等于1.5mm。The imaging module according to claim 9, wherein the first dispensing hole has a width of 0.5 ± 0.1 mm, and the first dispensing hole has a length greater than or equal to 1.5 mm.
  11. 如权利要求9所述的成像模组,其特征在于,所述第一点胶孔的宽度为0.5±0.1mm,所述第一点胶孔的长度为8.4±0.1mm。The imaging module according to claim 9, wherein the first dispensing hole has a width of 0.5 ± 0.1 mm, and the first dispensing hole has a length of 8.4 ± 0.1 mm.
  12. 如权利要求9所述的成像模组,其特征在于,所述第一点胶孔的宽度为0.5mm,所述第一点胶孔的长度为8.4mm。The imaging module according to claim 9, wherein the first dispensing hole has a width of 0.5 mm and the first dispensing hole has a length of 8.4 mm.
  13. 如权利要求1所述的成像模组,其特征在于,所述第一点胶孔到所述罩体的长边侧壁的距离大于0.45mm。The imaging module according to claim 1, wherein the distance between the first dispensing hole and the long side wall of the cover is greater than 0.45 mm.
  14. 如权利要求2所述的成像模组,其特征在于,所述第一点胶孔包括长条状孔及连接在所述长条状孔的两端的两个端孔,所述端孔沿所述长条状孔的宽度方向的尺寸大于所述长条状孔的宽度;The imaging module according to claim 2, wherein the first dispensing hole comprises an elongated hole and two end holes connected at two ends of the elongated hole, the end hole The dimension of the elongated hole in the width direction is larger than the width of the elongated hole;
    所述长条状孔对应于两个所述摄像模组的两个侧壁;The elongated holes correspond to two side walls of the two camera modules;
    每个所述端孔对应于两个所述摄像模组的两个角落位置。Each of the end holes corresponds to two corner positions of the two camera modules.
  15. 如权利要求14所述的成像模组,其特征在于,所述长条状孔的宽度为0.5±0.1mm,所述长条状孔的长度大于或等于1.5mm。The imaging module according to claim 14, wherein the elongated hole has a width of 0.5 ± 0.1 mm, and the elongated hole has a length greater than or equal to 1.5 mm.
  16. 如权利要求14所述的成像模组,其特征在于,所述长条状孔的宽度为0.5±0.1mm,所述长条状孔的长度为8.4±0.1mm。The imaging module according to claim 14, wherein the elongated hole has a width of 0.5 ± 0.1 mm, and the elongated hole has a length of 8.4 ± 0.1 mm.
  17. 如权利要求14所述的成像模组,其特征在于,所述长条状孔的宽度为0.5mm,所述长条状孔的长度为8.4mm。 The imaging module according to claim 14, wherein the elongated hole has a width of 0.5 mm and the elongated hole has a length of 8.4 mm.
  18. 如权利要求14所述的成像模组,其特征在于,所述长条状孔到所述罩体的长边侧壁的距离大于0.45mm。The imaging module according to claim 14, wherein the distance from the elongated hole to the long side wall of the cover is greater than 0.45 mm.
  19. 如权利要求14所述的成像模组,其特征在于,所述端孔呈三角形状。The imaging module of claim 14 wherein said end apertures are triangular in shape.
  20. 如权利要求1所述的成像模组,其特征在于,所述第二点胶孔包括多个圆柱状孔,所述多个圆柱状孔间隔分布在所述罩体的不同设定位置。The imaging module according to claim 1, wherein the second dispensing hole comprises a plurality of cylindrical holes, and the plurality of cylindrical holes are spaced apart at different set positions of the cover.
  21. 如权利要求20所述的成像模组,其特征在于,所述圆柱状孔的孔径为1±0.1mm。The imaging module according to claim 20, wherein the cylindrical hole has a hole diameter of 1 ± 0.1 mm.
  22. 如权利要求20所述的成像模组,其特征在于,所述圆柱状孔的孔径为1mm。The imaging module according to claim 20, wherein said cylindrical hole has a hole diameter of 1 mm.
  23. 如权利要求1所述的成像模组,其特征在于,所述罩体包括围绕所述至少两个摄像模组的框体及与所述框体连接的顶盖,所述顶盖通过所述胶体与所述至少两个摄像模组固定连接。The imaging module of claim 1 , wherein the cover comprises a frame surrounding the at least two camera modules and a top cover connected to the frame, the top cover The colloid is fixedly connected to the at least two camera modules.
  24. 如权利要求23所述的成像模组,其特征在于,所述第一点胶孔为单个点胶孔,所述第二点胶孔包括四个圆柱状孔,所述四个圆柱状孔分别分布在所述顶盖的四个角落位置。The imaging module according to claim 23, wherein the first dispensing hole is a single dispensing hole, and the second dispensing hole comprises four cylindrical holes, the four cylindrical holes respectively Distributed in four corner positions of the top cover.
  25. 如权利要求1所述的成像模组,其特征在于,每个所述摄像模组包括印刷电路板及设置在所述印刷电路板上且与所述印刷电路板电性连接的图像传感器,所述印刷电路板设置在所述柔性电路板上且与所述柔性电路板电性连接,所述成像模组包括电性连接垫,所述电性连接垫设置在所述柔性电路板与所述印刷电路板之间且电性连接所述柔性电路板与所述印刷电路板。The imaging module of claim 1 , wherein each of the camera modules comprises a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board. The printed circuit board is disposed on the flexible circuit board and electrically connected to the flexible circuit board, the imaging module includes an electrical connection pad, and the electrical connection pad is disposed on the flexible circuit board and the The flexible circuit board and the printed circuit board are electrically connected between the printed circuit boards.
  26. 一种电子装置,其特征在于,包括如权利要求1-25任一项所述的成像模组。 An electronic device comprising the imaging module of any of claims 1-25.
PCT/CN2016/090053 2016-03-03 2016-07-14 Imaging module and electronic device WO2017148072A1 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
CN201610120752.0 2016-03-03
CN201620163056.3U CN205545568U (en) 2016-03-03 2016-03-03 Imaging module and electron device
CN201610120830.7A CN107155039A (en) 2016-03-03 2016-03-03 Imaging modules and electronic installation
CN201610120830.7 2016-03-03
CN201610120911.7 2016-03-03
CN201610120911.7A CN107155046A (en) 2016-03-03 2016-03-03 Imaging modules and electronic installation
CN201610120752.0A CN107155027A (en) 2016-03-03 2016-03-03 Imaging modules and electronic installation
CN201620163058.2 2016-03-03
CN201620163056.3 2016-03-03
CN201620162763.0U CN205545552U (en) 2016-03-03 2016-03-03 Imaging module and electron device
CN201620162763.0 2016-03-03
CN201620163058.2U CN205545569U (en) 2016-03-03 2016-03-03 Imaging module and electron device

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JP2001305535A (en) * 2000-04-18 2001-10-31 Miyota Kk Vertical backlight
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001305535A (en) * 2000-04-18 2001-10-31 Miyota Kk Vertical backlight
CN104333687A (en) * 2014-11-28 2015-02-04 广东欧珀移动通信有限公司 Dual-camera device and terminal equipment thereof
CN104580857A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module
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