CN106937030A - Imaging modules and electronic installation - Google Patents
Imaging modules and electronic installation Download PDFInfo
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- CN106937030A CN106937030A CN201610120713.0A CN201610120713A CN106937030A CN 106937030 A CN106937030 A CN 106937030A CN 201610120713 A CN201610120713 A CN 201610120713A CN 106937030 A CN106937030 A CN 106937030A
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- module
- imaging modules
- installation portion
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- 238000003384 imaging method Methods 0.000 title claims abstract description 63
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
Abstract
The invention discloses a kind of imaging modules and electronic installation.Imaging modules include flexible PCB and at least two camera modules.Flexible PCB includes the connector installation portion of at least two module installation portions of at least two module installation portions and connection.At least two module installation portions are connected with each other.At least two camera modules are separately positioned at least two module installation portions, at least two camera module interval settings.In the imaging modules of embodiment of the present invention, at least two camera module interval settings cause there are enough spaces between at least two camera modules, it is convenient to by the light axial adjustment of at least two camera modules to parallel position, it is ensured that the shooting quality of imaging modules.
Description
Priority information
The application request on December 30th, 2015 submitted to China national Department of Intellectual Property, number of patent application be
201511025532.1st, 201521132821.7,201511024922.7 and 201521131513.2 patent application is excellent
First power and rights and interests, and by referring to being incorporated by herein.
Technical field
The present invention relates to camera technology field, more particularly to a kind of imaging modules and a kind of electronic installation.
Background technology
As people improve to the quality requirement of shooting image, dual camera shooting technology arises at the historic moment.In order to ensure to take pictures
Quality, the optical axis of two camera modules of dual camera module be arranged in parallel and two camera modules shoot towards the same side.Cause
How this, in the production process of dual camera module, facilitate adjustment two optical axises of camera to parallel position to turn into
Problem demanding prompt solution.
The content of the invention
Present invention seek to address that one of technical problem present in prior art.Therefore, the present invention provides a kind of imaging modules
And a kind of electronic installation.
The imaging modules of embodiment of the present invention include flexible PCB and at least two camera modules.Flexible PCB includes
The connector installation portion of at least two module installation portions of at least two module installation portions and connection.At least two module installation portions
It is connected with each other.At least two camera modules are separately positioned on two module installation portions, two camera module interval settings.
In the imaging modules of embodiment of the present invention, at least two camera module interval settings cause at least two camera modules
Between have enough spaces, it is convenient to by the light axial adjustment of at least two camera modules to parallel position, it is ensured that imaging
The shooting quality of module.
In some implementations, the quantity of the module installation portion and the quantity of the camera module are two.
In some embodiments, the flexible PCB includes being connected with each other or spaced two connecting portions, each
The connecting portion connects each described module installation portion and the connector installation portion.
In some embodiments, each described camera module includes printed circuit board (PCB) and sets on the printed circuit board
And the imageing sensor being electrically connected with the printed circuit board (PCB), the printed circuit board (PCB) is arranged on the module installation portion
And be electrically connected with the module installation portion.
In some embodiments, the module installation portion include the first electric connection pad, the printed circuit board (PCB) include with
Corresponding second electric connection pad of first electric connection pad, the printed circuit board (PCB) passes through second electric connection pad
The module installation portion is electrically connected with first electric connection pad.
In some embodiments, the camera module includes setting on the printed circuit board and is passed positioned at described image
Camera lens module above sensor.
In some embodiments, the camera lens module includes camera lens and voice coil motor, and the camera lens is arranged on the voice coil loudspeaker voice coil
In motor, the voice coil motor includes housing, two the two of the camera module housing interval settings.
In some embodiments, the imaging modules include connector assembly, and the connector assembly includes substrate and sets
Put connector on the substrate, the substrate be arranged on the connector installation portion and with the connector installation portion
It is electrically connected with.
In some embodiments, the imaging modules include colloid, and the colloid is bonded two camera modules.
In some embodiments, the camera module includes the connecting side relative with camera module another described, two
The camera module is fixedly connected by welding the connecting side.
In some embodiments, the imaging modules include cover body, and two camera modules are arranged in the cover body
And be fixedly connected with the cover body.
In some embodiments, the cover body include around two camera modules framework and with framework top
The top cover of connection, the framework and the top cover are fixedly connected with two camera modules.
The electronic installation of embodiment of the present invention includes above-mentioned imaging modules.
In above-mentioned electronic installation, at least two camera module interval settings cause there is enough between at least two camera modules
Space, it is convenient to by the light axial adjustment of at least two camera modules to parallel position, it is ensured that the shooting matter of imaging modules
Amount.
Additional aspect of the invention and advantage will be set forth in part in the description, and will partly become from the following description
Substantially, or by practice of the invention recognize.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to implementation method is combined
Substantially and be readily appreciated that, wherein：
Fig. 1 is the structural representation of the imaging modules of embodiment of the present invention.
Fig. 2 is the schematic perspective view of the imaging modules of embodiment of the present invention.
Fig. 3 be imaging modules in Fig. 2 along III-III to generalized section.
Fig. 4 is the enlarged diagram of the IV parts of the imaging modules in Fig. 3.
Fig. 5 is the decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 6 is another decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 7 is the schematic perspective view of the cover body of the imaging modules of embodiment of the present invention.
Fig. 8 is the structural representation of the flexible PCB of the imaging modules of embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the implementation method is shown in the drawings, wherein ad initio extremely
Same or similar label represents same or similar element or the element with same or like function eventually.Below by ginseng
The implementation method for examining Description of Drawings is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be only
Described with simplified for the ease of the description present invention, must be with specific rather than the device or element for indicating or imply meaning
Orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.Additionally, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply to indicate indicated skill
The quantity of art feature.Thus, define " first ", the feature of " second " can express or implicitly include one or
More described features.In the description of the invention, " multiple " is meant that two or more, unless otherwise clear and definite
It is specific to limit.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integratedly
Connection；Can mechanically connect, or electrically connect or can mutually communicate；Can be joined directly together, it is also possible to logical
Intermediary is crossed to be indirectly connected to, can be two element internals connection or two interaction relationships of element.For this
For the those of ordinary skill in field, above-mentioned term concrete meaning in the present invention can be as the case may be understood.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included, it is also possible to including the first and second features be not directly contact but pass through
Other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above "
Including fisrt feature directly over second feature and oblique upper, or to be merely representative of fisrt feature level height special higher than second
Levy.Fisrt feature second feature " under ", " lower section " and " below " just go up including fisrt feature in second feature
Side and oblique upper, or fisrt feature level height is merely representative of less than second feature.
Following disclosure provides many different implementation methods or example is used for realizing different structure of the invention.For letter
Change disclosure of the invention, hereinafter the part and setting to specific examples are described.Certainly, they are only merely illustrative,
And purpose does not lie in the limitation present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference word
Mother, this repetition is for purposes of simplicity and clarity, discussed various implementation methods itself not to be indicated and/or it is set
Between relation.Additionally, the invention provides various specific technique and material example, but ordinary skill
Personnel can be appreciated that the application of other techniques and/or the use of other materials.
Fig. 1 is the structural representation of the imaging modules of embodiment of the present invention.The cover body of the not shown imaging modules of Fig. 1.
Please join Fig. 1, the imaging modules 100 of embodiment of the present invention include flexible PCB 10 and two camera modules 20.
Flexible PCB 10 includes two module installation portions 11 and connector installation portion 12.Two module installation portions 11 are mutually interconnected
Connect.Connector installation portion 12 connects two module installation portions 11.Two camera modules 20 are separately positioned on two module peaces
In dress portion 11, two interval settings of camera module 20.
In the imaging modules 100 of embodiment of the present invention, two interval settings of camera module 20 cause two camera modules
There are enough spaces between 20, it is convenient to by two light axial adjustment of camera module 20 to parallel position, it is ensured that into
As the shooting quality of module 100.
Specifically, in one example, it is first that two camera modules 20 are solid respectively when imaging modules 100 are assembled
Calmly to module installation portion 11, then robotic arm grips one of camera module 20, afterwards by manipulator
The position of another camera module 20 is adjusted so that the optical axis of two camera modules 20 is parallel, then by two camera modules
20 are bonded or are welded and fixed by colloid.When two camera modules 20 are adjusted, module installation portion 11 can produce small
Deformation is so that the position of camera module 20 can adjust.
It is appreciated that in other embodiments, the quantity of module installation portion and camera module can be more than three, three
Camera module interval setting more than individual.The module installation portion interval setting of more than three.The camera module of more than three point
It is not arranged on the module installation portion of more than three.
For convenience of explanation, the implementation method for being hereafter two with the quantity of the quantity of module installation portion and camera module is made
Further illustrate, but be not considered as limiting the invention.
Incorporated by reference to Fig. 8, in present embodiment, flexible PCB 10 includes spaced two connecting portions 13, each company
Socket part 13 connects each module installation portion 11 and connector installation portion 12.
Two interval settings of connecting portion 13 can further be conducive to flexible PCB 10 to deform, so as to be conducive to adjustment two
The position of camera module 20 is so that the optical axis of two camera modules 20 is parallel.
It is appreciated that in other embodiments, two connecting portions can be connected with each other.Because the rigidity of connecting portion is relatively low,
The connecting portion of interconnection can also be deformed to adjust two positions of camera module.
Fig. 2-Fig. 4 is referred to, in present embodiment, each 20 bag printed circuit board (PCB) of camera module 21 (Printed Circuit
Board, PCB) and imageing sensor 22.The sensing face of two imageing sensors 22 is parallel or coplanar and towards together
Side.Printed circuit board (PCB) 21 is arranged on module installation portion 11 and is electrically connected with module installation portion 11.Image sensing
Device 22 is arranged on printed circuit board (PCB) 21 and is electrically connected with printed circuit board (PCB) 21.
In this way, imageing sensor 22 can obtain the image of object, and image is passed through into printed circuit board (PCB) 21 and flexible circuit
Plate 10 reaches external device (ED).
Specifically, imageing sensor 22 can use complementary metal oxide semiconductors (CMOS) (Complementary Metal Oxide
Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device, CCD) shadow
As sensor.
In present embodiment, module installation portion 11 includes the first electric connection pad 111, and printed circuit board (PCB) 21 includes and the
Second electric connection pad 211 of the correspondence connection of one electric connection pad 111, printed circuit board (PCB) 21 passes through the second electric connection pad
211 and the first electric connection pad 111 be electrically connected with module installation portion 11.
In this way, the first electric connection pad 111 and the second electric connection pad 211 realize flexible PCB 10 and camera module
It is electrically connected between 20 and is communicated.For example, the first electric connection pad 111 and the second electric connection pad 211 are using conduction
Glue.
In present embodiment, the shape of printed circuit board (PCB) 21 and shape with corresponding module installation portion 11 is dimensioned slightly smaller than
And size.
Can so make the structure of imaging modules 100 compacter, be conducive to reducing the volume of imaging modules 100.Imaging mould
When group 100 is applied to electronic installation, can further reduce the volume of electronic installation.
In present embodiment, as an example, each printed circuit board (PCB) 21 and the shape with corresponding module installation portion 11
Shape is in tabular.And in other embodiments, each printed circuit board (PCB) and can root with the shape of corresponding module installation portion
Specifically set according to actual demand.
Incorporated by reference to Fig. 5 and Fig. 6, in present embodiment, camera module 20 includes being arranged on printed circuit board (PCB) 21 and position
In the camera lens module 23 of the top of imageing sensor 22.
In this way, camera lens module 23 can make imageing sensor 22 obtain quality preferably image, so as to imaging modules can be improved
100 shooting quality.
In present embodiment, camera lens module 23 includes camera lens 231 and voice coil motor 232, and camera lens 231 is arranged on voice coil loudspeaker voice coil horse
Up in 232, voice coil motor 232 includes housing 2321, two the two of camera module 20 interval settings of housing 2321.
Voice coil motor 232 can drive camera lens 231 along the optical axis direction movement of camera lens 231 to adjust camera lens 231 and image
The distance between sensor 22, and then the auto-focusing of imaging modules 100 is realized, imaging modules 100 is obtained quality
Preferably image.
Further, optical filter 24 is provided between camera lens 231 and imageing sensor 22.Optical filter 24 can filter pre-
If the light of frequency so that imageing sensor 22 forms preferably image according to the light after filtering.
It is preferred that optical filter 24 is cutoff filter.In this way, cutoff filter 24 can filter infrared ray,
Avoid the image fault of imageing sensor 22.
Specifically, camera lens module 23 also includes pedestal 233, and pedestal 233 opens up fluted 2331, the bottom of groove 2331
Face offers through hole 2332.Optical filter 24 is arranged in groove 2331 and is supported on the bottom surface of groove 2331, passes through
The light of the filtering of optical filter 24 can reach imageing sensor 22 by through hole 2332.
Take for convenience optical filter 24, link slot 2333, the communication groove 2331 of link slot 2333 are offered on pedestal 233.
In present embodiment, imaging modules 100 include connector assembly 30, and connector assembly 30 includes substrate 31 and sets
Put connector 32 on the substrate 31.Substrate 31 be arranged on connector installation portion 12 and with connector installation portion 12
It is electrically connected with.
In this way, can be quickly installed imaging modules 100 on electronic equipment by connector 32.
It is preferred that substrate 31 is corresponding with the shape and size of connector installation portion 12.Can so make connector 32 with it is soft
The structure of property circuit board 10 is compacter.
In present embodiment, imaging modules 100 include colloid 40, and colloid 40 is bonded two camera modules 20.
After being adjusted to be parallel to each other by the optical axis of two camera modules 20, colloid 40 is clicked and entered between two camera modules.Glue
Body 40 can ensure that two camera modules 20 are relatively fixed.Colloid 40 can increase by two bonding strengths of camera module 20,
Two probability of the light shaft offset of camera module 20 can be reduced.
It should be noted that in present embodiment, as shown in the orientation in Fig. 3, colloid 40 is located at two camera modules
The bottom in the gap between 20.And in other embodiments, the gap that colloid can be filled up between two camera modules.
Colloid 40 for example can be the colloids with stickiness such as UV glue (Ultraviolet Glue).
In some embodiments, camera module includes the connecting side relative with another camera module, two camera modules
It is fixedly connected by being welded to connect side.
In this way, two camera modules will can be rigidly secured together by welding.For example, the connection of each camera module
Side can be welded by laser spot welding or tin cream or solder and is fixedly connected with another camera module.
In present embodiment, imaging modules 100 include cover body 50, two camera modules 20 be arranged in cover body 50 and with
Cover body 50 is fixedly connected.
For example, cover body 50 can be fixedly connected with two camera modules 20 by welding or colloid.
In this way, cover body 50 can further fix two positions of camera module 20, reduce camera module 20 falling or
Suffered impulsive force during concussion, increases the stability of the structure of imaging modules 100, improves imaging modules 100
Quality.
Incorporated by reference to Fig. 7, in present embodiment, cover body 50 is included around two frameworks of camera module 20 51 and and framework
The top cover 52 of 51 top connections, framework 51 and top cover 52 are fixedly connected with two camera modules 20.
In this way, the framework 51 and top cover 52 of cover body 50 are connected with two camera modules 20, cover body 50 and two can be increased
Connection area between individual camera module 20 so that cover body 50 is connected more firm with two camera modules 20.
Specifically, top cover 52 offers two light holes 251, and two camera modules 20 pass through two light holes 251 respectively
Exposure.Light reaches imageing sensor 22 after sequentially passing through light hole 251, camera lens 231 and optical filter 24, and image is passed
Sensor 22 is so as to collect external image.
It should be noted that in present embodiment, two equal cylindrical forms of light hole 251.In other embodiments,
Depending on two shapes of light hole can be distinguished specifically.Therefore, the shape of the light hole of present embodiment is it is not intended that to this
The limitation of invention.
In present embodiment, it is preferred that light hole 251 is set with the light shaft coaxle of camera lens 231.
Further, imaging modules 100 also include reinforcing plate 60, and two module installation portions 11 are fixed in reinforcing plate 60.
In this way, reinforcing plate 60 can further fix two positions of camera module 20, the anti-impact of imaging modules 100 is improved
The ability hit, and then improve shooting quality.
In present embodiment, imaging modules 100 also include anti electromagnetic wave disruption member 70, and reinforcing plate 60 is arranged on anti-electromagnetism
On wave interference part 70.
Anti electromagnetic wave disruption member 70 can prevent imaging modules 100 from being disturbed by electromagnetic wave, it is ensured that imaging modules 100 are obtained
Quality preferably image.Anti electromagnetic wave disruption member 70 can be for example made of metal material.
The electronic installation of embodiment of the present invention includes above-mentioned imaging modules 100.
Therefore, electronic installation can easily by the light axial adjustment of at least two camera modules 20 to parallel position, it is ensured that
The shooting quality of electronic installation.
In the description of this specification, reference term " implementation method ", " some implementation methods ", " schematic embodiment party
The description of formula ", " example ", " specific example " or " some examples " etc. means to combine the implementation method or example describes
Specific features, structure, material or feature are contained at least one implementation method of the invention or example.In this explanation
In book, the schematic representation to above-mentioned term is not necessarily referring to identical implementation method or example.And, the tool of description
Body characteristicses, structure, material or feature can be in one or more any implementation methods or example in an appropriate manner
With reference to.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：Not
These implementation methods can be carried out with various changes, modification, replacement in the case of departing from principle of the invention and objective and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (13)
1. a kind of imaging modules, it is characterised in that including：
Flexible PCB, the flexible PCB includes at least two module installation portions and connects at least two modules peace
The connector installation portion in dress portion, at least two modules installation portion is connected with each other；And
At least two camera modules, at least two camera module is separately positioned at least two modules installation portion
On, at least two camera modules interval setting.
2. imaging modules as claimed in claim 1, it is characterised in that the quantity of the module installation portion and the shooting
The quantity of module is two.
3. imaging modules as claimed in claim 2, it is characterised in that the flexible PCB include being connected with each other or
Every two connecting portions for setting, each described connecting portion connects each described module installation portion and the connector installation portion.
4. imaging modules as claimed in claim 2, it is characterised in that each described camera module includes printed circuit board (PCB)
And the imageing sensor being electrically connected with the printed circuit board and with the printed circuit board (PCB), the printed circuit are set
Plate is arranged on the module installation portion and is electrically connected with the module installation portion.
5. imaging modules as claimed in claim 4, it is characterised in that the module installation portion includes that first is electrically connected with
Pad, the printed circuit board (PCB) includes the second electric connection pad corresponding with first electric connection pad, the printed circuit
Plate is electrically connected with the module installation portion by second electric connection pad with first electric connection pad.
6. imaging modules as claimed in claim 4, it is characterised in that the camera module includes being arranged on the printing
Camera lens module on circuit board and above described image sensor.
7. imaging modules as claimed in claim 6, it is characterised in that the camera lens module includes camera lens and voice coil motor,
The camera lens is arranged in the voice coil motor, and the voice coil motor includes housing, two the two of the camera module institutes
State housing interval setting.
8. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include connector assembly, institute
Connector assembly connector including substrate and setting on the substrate is stated, the substrate is arranged on the connector and installs
It is electrically connected with portion and with the connector installation portion.
9. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include colloid, the colloid
Two camera modules of bonding.
10. imaging modules as claimed in claim 2, it is characterised in that the camera module include with described in another
The relative connecting side of camera module, two camera modules are fixedly connected by welding the connecting side.
11. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include cover body, two institutes
Camera module is stated to be arranged in the cover body and be fixedly connected with the cover body.
12. imaging modules as claimed in claim 11, it is characterised in that the cover body is included around two shootings
The framework of module and the top cover being connected with framework top, the framework and the top cover and two camera modules are consolidated
Fixed connection.
13. a kind of electronic installations, it is characterised in that including the imaging modules as described in claim any one of 1-12.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/090057 WO2017113747A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
| PCT/CN2016/090056 WO2017113746A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090064 WO2017113752A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090059 WO2017113748A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090061 WO2017113750A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090062 WO2017113751A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
| PCT/CN2016/090060 WO2017113749A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132821 | 2015-12-30 | ||
| CN2015211328217 | 2015-12-30 | ||
| CN2015211315132 | 2015-12-30 | ||
| CN2015110249227 | 2015-12-30 | ||
| CN201511025532 | 2015-12-30 | ||
| CN201521131513 | 2015-12-30 | ||
| CN2015110255321 | 2015-12-30 | ||
| CN201511024922 | 2015-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937030A true CN106937030A (en) | 2017-07-07 |
Family
ID=56779601
Family Applications (14)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620163035.1U Expired - Fee Related CN205545565U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201620163154.7U Ceased CN205545575U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201620162941.XU Active CN205545558U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201610120781.7A Pending CN106937035A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201620163152.8U Expired - Fee Related CN205545574U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201610120713.0A Pending CN106937030A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
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| CN201610120778.5A Pending CN106937034A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
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| CN201620162943.9U Expired - Fee Related CN205545559U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201610120775.1A Pending CN106937033A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
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| CN106791330B (en) * | 2017-01-11 | 2019-08-13 | Oppo广东移动通信有限公司 | Camera module and terminal |
| CN108462816B (en) * | 2017-02-20 | 2021-01-01 | 北京小米移动软件有限公司 | Camera module and electronic equipment |
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- 2016-03-03 CN CN201620162941.XU patent/CN205545558U/en active Active
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- 2016-03-03 CN CN201620163163.6U patent/CN205647690U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120780.2A patent/CN106937058A/en active Pending
- 2016-03-03 CN CN201620162943.9U patent/CN205545559U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120775.1A patent/CN106937033A/en active Pending
- 2016-03-03 CN CN201610120772.8A patent/CN106937032A/en active Pending
- 2016-03-03 CN CN201620163180.XU patent/CN205545576U/en not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| CN205545559U (en) | 2016-08-31 |
| CN106937058A (en) | 2017-07-07 |
| CN205545574U (en) | 2016-08-31 |
| CN205545558U (en) | 2016-08-31 |
| CN205545565U (en) | 2016-08-31 |
| CN205545575U (en) | 2016-08-31 |
| CN106937032A (en) | 2017-07-07 |
| CN106937031A (en) | 2017-07-07 |
| CN106937034A (en) | 2017-07-07 |
| CN106937033A (en) | 2017-07-07 |
| CN205545576U (en) | 2016-08-31 |
| CN106937035A (en) | 2017-07-07 |
| CN205647690U (en) | 2016-10-12 |
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