CN108270949B - Split type array camera module and manufacturing method thereof - Google Patents

Abstract

The invention provides an array camera module, which comprises: at least two module units of making a video recording, wherein an at least module unit of making a video recording includes: the photosensitive assembly comprises at least one circuit board, a photosensitive element and a base, the photosensitive element is electrically connected to the circuit board, the base is integrally formed on the circuit board to form an optical window for providing a light path for the photosensitive element, and the lens is positioned in the light path of the photosensitive element; and an assembly body to which the camera module units are respectively fixed to form a single body.

Description

Split type array camera module and manufacturing method thereof

Technical Field

The invention relates to the field of camera modules, in particular to a split type array camera module and a manufacturing method thereof.

Background

Along with the continuous development of smart machine, the requirement to the module of making a video recording is higher and higher. For example, in the last two years, a single camera of a smart phone becomes a dual camera, and the development of a dual camera module also becomes an important trend in the development of a mobile phone camera module.

Briefly, the two cameras can acquire images through the cooperation of the two cameras, so that a richer image acquisition function is realized. The existing double cameras can be mainly divided into two types according to functions: one is that two cameras are used for generating stereoscopic vision to obtain the depth of field of an image, and depth of field information is used for application such as background blurring, 3D scanning, auxiliary focusing and motion recognition, or information of two pictures is used for fusion; the other type is that left and right two different pictures are fused to expect to obtain higher resolution, better color, better dynamic range and other better image quality or realize the function of optical zooming.

On the other hand, the pixel requirement of the camera module is higher and higher, the lens quantity of the lens is continuously increased, from two, three to five, six or even more original lenses, the camera module for high pixel is faced with the problem that the size is small on the one hand, and the optical imaging quality is good on the other hand, and the module for multiple cameras is also faced with the problem that how to make the module wholly fit for high pixel, and two or more camera modules are stably and safely matched with each other to form an integral module, so as to adapt to the requirement of the existing camera module for multiple camera modules in the development, which is a problem to be solved.

The camera is when installing in electronic equipment, for example when smart mobile phone, and the outside needs keep leveling, and two camera outward appearances are guaranteed beautifully, therefore how to make a video recording the equipment of two module external rules and be one of the problem that many camera modules need consider.

Further, the uniformity of optical axis between many cameras is an important aspect of many cameras camera module optical design, how to guarantee that a plurality of camera modules can be assembled in an organic whole, and can guarantee the uniformity of optical axis, and this is a problem that needs to consider in the manufacturing of many cameras camera modules.

Further, two cameras that mutually support gather image information separately, and image acquisition's accuracy and formation of image quality and the incident light of two cameras are closely related, and the optical axis uniformity between two cameras is the basis of guaranteeing the module of making a video recording formation of image quality. That is to say, how to improve the consistency of the optical axes of the two camera modules or make the error within a predetermined range on the basis of stably and compactly fixing the two cameras, so as to improve the mounting accuracy and make the camera modules have better imaging quality is another important problem to be considered in the development of the dual cameras.

Further, the conventional camera module is usually a camera module assembled by a COB method, and its basic structure includes a circuit board, a photosensitive element, a lens holder, a lens and a filter element, wherein the photosensitive element is attached to the circuit board, and is electrically connected to the circuit board through a gold wire, and the lens holder is attached to the circuit board through glue, and the lens is installed on the lens holder, and the filter element is installed on the lens holder, and is usually provided with a convex electronic element on the circuit board. In this structure, on one hand, the lens holder is usually manufactured by injection molding and then bonded to the circuit board, which cannot provide a good smooth mounting condition for the lens, and the bonding and fixing method increases the accumulated tolerance. On the other hand, the electronic component protrudes out of the circuit board, so that an installation space needs to be reserved when the lens base is installed, the whole required area of the circuit board is large, the electronic component is exposed in the space in the camera module, and the imaging effect of the camera module is easily influenced by dust and impurities stained on the surface. In a word, there are many adverse factors in the module of making a video recording of traditional COB dress mode, especially are not suitable for the demand of the module of making a video recording of current high pixel.

Disclosure of Invention

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the split type array camera module includes at least two camera module units that are separately installed, so that the camera module units can be actively calibrated relatively independently, and the optical axes of the camera module units are consistent.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the split type array camera module includes an assembly body, and the assembly body stably assembles and fixes each camera module unit to form a whole.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the assembly has a receiving chamber for receiving each camera module unit therein, so that the split type array camera module has a regular external shape and is convenient to install and use.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the assembly includes at least one partition wall that partitions the receiving chamber, so that the camera module units are separately disposed, and electromagnetic interference between the camera module units is reduced.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the assembly includes at least one supporting edge extending from the receiving chamber, so as to stably support and mount each camera module unit.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the camera module unit includes a photosensitive assembly, the photosensitive assembly includes a base and a circuit board, the base is integrally formed on the circuit board, the base has good flatness and can provide flat mounting conditions for the mounted components, thereby improving the consistency of the optical axes of the camera module unit.

An objective of the present invention is to provide a split-type array camera module and a method for manufacturing the same, wherein the base has an optical window for providing a light path for a photosensitive element, and the inner sidewall of the base is disposed obliquely to reduce the reflection of stray light to the photosensitive element.

An object of the present invention is to provide a split-type array camera module, wherein the photosensitive element has at least a photosensitive region and a non-photosensitive region, and the base integrally encapsulates at least a portion of the non-photosensitive region of the photosensitive element to expand an integrally encapsulated region of the base.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the circuit board includes a circuit board main body and at least one electronic component, the electronic component protrudes from the circuit board main body, and the base is integrally formed on the circuit board main body to cover the electronic component, thereby reducing the space occupation.

An object of the present invention is to provide a split-type array camera module and a method for manufacturing the same, wherein the photosensitive element is electrically connected to the circuit board main body through at least one electrical connection element, and the base covers the electrical connection element.

An object of the present invention is to provide a split-type array camera module and a method for manufacturing the same, wherein the base includes a supporting member, and the supporting member is disposed at an interval between the circuit board and the base body so as to protect the circuit board and the photosensitive member during the manufacturing process.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the camera module unit includes a filter element, and the filter element is mounted on the base body.

An object of the present invention is to provide a split type array camera module and a method of manufacturing the same, in which the camera module unit includes a holder to which the base main body is mounted, and a filter element is mounted to the holder.

An object of the present invention is to provide a split-type array camera module and a method for manufacturing the same, wherein the circuit board body has a sinking region, and the photosensitive element is disposed in the sinking region to reduce the relative height between the photosensitive element and the circuit board body.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the circuit board main body includes a first board and a second board, and the first board is conductively connected to the second board through a conductive adhesive.

An object of the present invention is to provide a split type array camera module and a method for manufacturing the same, wherein the height and size of each camera module unit can be freely matched and assembled, so as to facilitate the matching of different types of camera module units.

To achieve at least one of the above objectives, an aspect of the present invention provides an array camera module, which includes: the camera module comprises at least two camera module units and an assembly body, wherein each camera module unit is fixed on the assembly body respectively so as to form a whole.

According to some embodiments, the assembly body includes an upper cover for fixedly connecting each of the camera module units.

According to some embodiments, the assembly body includes a main body defining a receiving chamber, and each camera module unit is received in the receiving chamber.

According to some embodiments, the assembly body includes an upper cover adapted to cover the accommodating chamber, and the upper cover has at least two lens openings, so that each camera module unit can be received in the accommodating chamber of the assembly body for collecting light through the lens openings.

According to some embodiments, wherein the upper cover is integrally connected to the main body. It is understood that the assembly may be implemented as a body having only the above-described upper cover, or having the above-described body forming the receiving chamber and the upper cover integrally formed with the body, or having only a sidewall without the above-described upper cover, or the like as appropriate.

According to some embodiments, the assembly body includes a partition wall located in the accommodating chamber to divide the accommodating chamber into at least two parts for accommodating the camera module units respectively.

According to some embodiments, the material of the partition wall is selected from one or more of plastic, resin, rubber and metal.

According to some embodiments, wherein the partition wall is connected to the main body. According to some embodiments, the assembly includes at least one partition wall dividing the housing chamber into at least two parts for respectively housing the camera module units, the partition wall being connected to the upper cover.

According to some embodiments, the assembly body includes at least one supporting edge extending inward from the main body so as to support each camera module unit.

According to some embodiments, wherein the support edge is a boss structure.

According to some embodiments, each of the camera module units includes a light sensing element and a lens, wherein the lens is located in a light sensing path of the light sensing element, the light sensing element includes a circuit board, a light sensing element and a base, the base is integrally formed on the circuit board, the light sensing element is electrically connected to the circuit board, the lens is located in the light sensing path of the light sensing element, and the base has at least one optical window for providing a light path for the light sensing element.

According to some embodiments, wherein the photosensitive element is located inside the base.

According to some embodiments, the photosensitive assembly includes at least a portion of the non-photosensitive region integrally encapsulating the circuit board and the photosensitive element by the base.

According to some embodiments, the photosensitive element is electrically connected to the circuit board through at least one electrical connection element, and the base covers the electrical connection element.

According to some embodiments, the circuit board includes at least one electronic component, and the integrated base covers the electronic component.

According to some embodiments, the base comprises a supporting element, and the supporting element is arranged on the circuit board main body so as to protect the circuit board main body and the photosensitive element in the manufacturing process.

According to some embodiments, the base includes a support member disposed in the non-photosensitive region of the photosensitive element to protect the photosensitive element during manufacturing.

According to some embodiments, each of the camera units comprises a holder mounted to the base for mounting a filter element.

According to some embodiments, the carrier is at least partially connected to the wiring board.

According to some embodiments, the holders of the camera module units are integrally connected.

According to some embodiments, the circuit board is provided with at least one sinking area, and the photosensitive element is arranged in the sinking area so as to reduce the relative height of the photosensitive element and the circuit board.

According to some embodiments, the circuit board includes a first board body and a second board body, and the second board body is fixedly connected to the first board body through a connecting medium.

According to some embodiments, the first board body is a hard board, the second board body is a soft board, and the connection medium is an anisotropic conductive adhesive.

According to some embodiments, the base includes an extended mounting portion extending at least partially upward from the base body to form a retaining groove to retain a mounted component.

According to some embodiments, the circuit board is provided with a reverse sticking groove, and the photosensitive element is arranged in the reverse sticking groove so as to be mounted on the circuit board in a reverse sticking chip mode.

According to some embodiments, the circuit boards of the camera module units are integrally connected.

According to some embodiments, wherein each camera module unit is provided separately.

According to some embodiments, the bottom of each camera module unit has a height difference.

According to some embodiments, each of the camera module units includes a lens support member, the lens being mounted to the lens support member, the lens support member being mounted to the base.

According to some embodiments, the lens supporting element is a driving element, so that the camera module unit forms a moving-focus camera module.

According to some embodiments, the lens supporting member is a barrel member, so that the camera module unit forms a fixed focus camera module.

According to some embodiments, at least two of the camera module units are fixed focus camera modules.

According to some embodiments, at least two of the camera module units are moving focus camera modules.

According to some embodiments, at least one of the camera module units is a moving focus camera module, and at least one of the camera module units is a fixed focus camera module.

According to some embodiments, each of the array camera modules includes a filter element, and the filter element is mounted on the base.

According to some embodiments, wherein the type of circuit board is selected from the group consisting of a rigid board, a flexible board, a rigid-flex board, and a flexible board.

Drawings

Fig. 1 is a schematic perspective view of a split array camera module according to a first preferred embodiment of the present invention.

Fig. 2 is an exploded schematic view of a split array camera module according to a first preferred embodiment of the present invention.

Fig. 3 is a schematic diagram of an assembly process of the split array camera module according to the first preferred embodiment of the invention.

Fig. 4 is a schematic cross-sectional view of a split array camera module according to a first preferred embodiment of the invention.

Fig. 5 is a schematic cross-sectional view of a split array camera module according to a second preferred embodiment of the invention.

Fig. 6 is a schematic cross-sectional view of a split array camera module according to a third preferred embodiment of the invention.

Fig. 7 is a schematic cross-sectional view of a split array camera module according to a fourth preferred embodiment of the invention.

Fig. 8A and 8B are schematic cross-sectional views of a split array camera module according to a fifth preferred embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of a split array camera module according to a sixth preferred embodiment of the invention.

Fig. 10 is a schematic sectional view of a split array camera module according to a seventh preferred embodiment of the present invention.

Fig. 11 is a schematic sectional view of a split type array camera module according to an eighth preferred embodiment of the present invention.

Fig. 12 is a schematic cross-sectional view of a split array camera module according to a ninth preferred embodiment of the invention.

Fig. 13 is a schematic cross-sectional view of a split array camera module according to a tenth preferred embodiment of the invention.

Fig. 14 is a schematic diagram of a split-type array camera module according to a twelfth preferred embodiment of the invention.

Fig. 15A, 15B and 15C are schematic cross-sectional views of different embodiments of a split-type array camera module according to a tenth preferred embodiment of the invention.

Fig. 16 is a top view of a split type array camera module according to an eleventh preferred embodiment of the present invention.

Fig. 17 is a block diagram of a method for manufacturing a split array camera module according to the above preferred embodiment of the present invention.

Fig. 18 is an application schematic diagram of the split type array camera module according to the above preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships that are based on those shown in the drawings, which are merely for convenience in describing the present disclosure and to simplify the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus the terms above should not be construed as limiting the present disclosure.

The module of making a video recording of many cameras is the important trend of the module of making a video recording recent development, especially when the various performance of the module of making a video recording in order to tend to extremely, the pixel of the module of making a video recording is higher and higher, under the more and more circumstances of lens quantity of camera lens, the module of making a video recording that develops many cameras has become important trend and direction. The cooperation of the plurality of camera modules can realize more functions, such as generating stereoscopic vision by using two cameras, obtaining the depth of field of an image, performing applications such as background blurring, 3D scanning, auxiliary focusing, action recognition and the like by using depth of field information, or fusing information of two pictures; or the left and right different pictures are fused to expect to obtain higher resolution, better color, better dynamic range and other better image quality or realize the function of optical zooming. However, the combination of these different camera modules can be stably installed and applied, and the conventional multi-camera module mostly stays in a theoretical stage, or two camera modules are independently assembled, and the mutual position relationship is determined by the installation position, so that the multi-camera module is not suitable for large-scale production and application. According to an embodiment of the present invention, a split type array camera module is provided, which includes at least two camera module units and an assembly, wherein each camera module unit is assembled separately through the assembly, so that the camera modules are less affected by each other, and the camera modules form a whole in structure, and the camera module is neat in appearance and convenient to install and apply. Furthermore, according to an embodiment of the present invention, each camera module unit includes at least one photosensitive element, and each photosensitive element includes a base and a circuit board, and the base is attached to or formed on the circuit board in an integrated manner, and preferably, the base can provide a flat mounting plane in an integrated manner. The camera module unit can be manufactured into different types of camera modules, so that the specific optimized structure of the camera module unit and the assembly structure of the camera module unit are combined together, and the array camera module with regular structure, good optical performance and optimized volume is provided, so that the same or different camera modules can be stably and safely assembled into a whole to form a whole, and more functions are realized.

The split array camera module of the present invention can be applied to electronic devices, such as, but not limited to, smart phones, laptops, tablets, cameras, monitoring devices, wearable devices,

for convenience of explanation, the split type dual camera array camera module 100 including two camera module units will be described as an example. In other embodiments of the present invention, the split array camera module 100 may include more camera module units, and the present invention is not limited in this respect.

Referring to fig. 1 to 4, a split type array camera module 100 according to a first preferred embodiment of the present invention. The split type array camera module 100 includes at least two camera module units and an assembly body 30, and each of the camera module units is separately assembled to the assembly body 30 to form a single body.

Specifically, the two camera module units are a first camera module unit 10 and a second camera module unit 20, respectively. The assembly 30 includes a main body 31 and has a receiving chamber 32, and the first camera module unit 10 and the second camera module unit 20 are received in the receiving chamber 32. In other words, the main body 31 forms the accommodation chamber 32, and the first camera module unit 10 and the second camera module unit 20 are limited and fixed therein, so that the first camera module unit 10 and the second camera module unit 20 form a whole body, which is convenient for installation and application. It should be noted that the accommodating chamber 32 is not a closed structure, but a semi-open structure, so that the camera module units can collect light and provide electrically connectable positions.

In other embodiments of the present invention, the assembly may not form the distinct housing chamber, for example, the first camera module unit 10 and the second camera module unit 20 may be fixed by a plate-shaped member with a gap.

Further, the first camera module unit 10 and the second camera module unit 20 are respectively fixed on the side wall of the main body 31 of the assembly 30, for example, by glue, so that the main body 31 provides a fixed position for the first camera module unit 10 and the second camera module unit 20, respectively, so that the relative positions of the first camera module unit 10 and the second camera module unit 20 are determined, and an array structure is formed. It should be noted that the array described in the present invention is used to express that each camera module unit forms a position layout relationship, and is not limited to be arranged in a row manner, and the layout manner may be determined according to the requirement and the number and type of the array camera modules, such as linear arrangement, triangular arrangement, symmetrical arrangement, and the like.

More specifically, in some embodiments, the assembly 30 may be a square frame structure, so that each camera module unit is assembled in a limited manner in a square regular structure, which facilitates installation and application, such as installation in electronic equipment. Of course, in other embodiments of the present invention, the structure of the assembly 30 may be deformed according to the size and structure of each camera module unit, so as to form a regular or irregular structure, so that each camera module unit can be stably assembled.

Further, the assembly 30 includes an upper cover 33, and the upper cover 33 is adapted to cover the main body 31 so as to close the accommodating chamber 32. Further, the upper cover 33 has at least two lens ports 331, and the lens ports 331 correspond to the camera module units, so that the camera module units can collect light through the lens ports 331.

In this embodiment of the present invention, the upper cover 33 is integrally coupled to the main body 31, thereby constructing a unitary receiving structure. For example, in the process of assembling the split-type array camera module,

of course, in other embodiments of the present invention, the upper cover 33 may not be provided, or the upper cover 33 may be separately connected to the main body 31, or only the upper cover 33 may be connected without the main body 31, and it should be understood by those skilled in the art that the arrangement and connection manner of the upper cover 33 are not limited by the present invention.

Further, referring to fig. 3, for example, the assembly process of the split-type array camera module 100 may be that the assembly 30 is inverted, glue is applied to the tops of the camera module units 10 and 20, then the assembly is preassembled in the assembly 30 in an inverted manner, further, the first camera module unit 10 and the second camera module unit 20 are actively calibrated respectively, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are consistent, and then the first camera module unit 10 and the second camera module unit 20 are solidified, so that the first camera module unit 10 and the second camera module unit 20 are fixedly connected to the assembly 30.

It should be noted that the fixing position of the camera module units 10 and 20 and the assembly 30 may be a top or a side wall. For example, the side wall of the main body 31 of the assembly 30 and the camera module unit may be fixed during bonding, and/or the upper cover 33 of the assembly 30 and the camera module unit may be fixed during bonding. The assembly 30 may be provided without the upper cover 33, and the camera module units 10 and 20 are connected to the side wall or the bottom wall of the assembly 30. It should be understood by those skilled in the art that the bonding position of the glue is not a limitation of the present invention.

In another embodiment of the present invention, referring to fig. 15A to 15C, the assembly 30 may include a supporting edge 34 disposed at the bottom of the main body 31 so as to support the first camera module unit 10 and the second camera module unit 20. Specifically, the supporting edge 34 extends from the main body 31 into the accommodating chamber 32 to form a boss, which provides a supporting position for the first camera module unit 10 and the second camera module unit 20. The upper cover 33 is detachably coupled to the main body 31.

The supporting edge 34 limits the first camera module unit 10 and the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are located at predetermined positions. It should be noted that, in this embodiment of the present invention, the heights of the supporting sides 34 corresponding to the first camera module unit 10 and the second camera module unit 20 are the same, and when the heights of the two camera module units are the same, the heights of the end portions of the camera module units can be made to be the same. In other embodiments of the present invention, the positions of the first camera module unit 10 and the second camera module unit 20 corresponding to the supporting edge 34 may have different heights, so that different limiting heights can be provided, and even if the heights of the two camera module units are different, the height difference between the first camera module unit 10 and the second camera module unit 20 can still be compensated by the supporting edge 34, so that the ends of the split array camera module 100 are consistent. Of course, in other embodiments of the present invention, the heights of the tops of the first camera module unit 10 and the second camera module unit 20 may not be uniform, and the present invention is not limited in this respect. That is to say, the supporting edges 34 may be bosses on the same plane, or bosses on different planes, the heights of the camera modules may be the same or different, the tops of the first camera module unit 10 and the second camera module unit 20 may or may not be the same, and the present invention is not limited in these respects.

It should be noted that, in the present invention, the first camera module unit 10 and the second camera module unit 20 are separately arranged, so that the mutual influence between the first camera module unit 10 and the second camera module unit 20 is small, and the consistency of the optical axes of the first camera module unit 10 and the second camera module unit 20 is ensured by the packaging of the assembly 30. In the assembling process, the first camera module unit 10 and the second camera module unit 20 can be pre-assembled to the assembly body 30, and then the first camera module unit 10 and/or the second camera module unit 20 can be automatically calibrated, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are consistent, or the included angle between the optical axes is within a predetermined error range, or the relative positions at a certain distance are maintained. If the first camera module unit 10 and the second camera module unit 20 are integrally and fixedly disposed, and the mutual influence is large, that is, when one camera module unit is adjusted, the other camera module unit is inevitably influenced, and the purpose of independent active calibration in the present invention cannot be achieved.

In this embodiment of the present invention, the basic structures of the first camera module unit 10 and the second camera module unit 20 are the same, that is, the first camera module unit 10 and the second camera module unit 20 may be the same type of camera modules, and of course, in other embodiments of the present invention, the first camera module may be different types, and the present invention is not limited in this respect.

Specifically, the first camera module unit 10 includes a first photosensitive element 11, a first lens 12, a first lens supporting element 13 and a first filter element 14.

The first lens 12 is located in a photosensitive path of the first photosensitive component 11, the first lens 12 is mounted on the first lens supporting element 13, the first lens supporting element 13 is mounted on the first photosensitive component 11, so that the first lens 12 is located in the photosensitive path of the first photosensitive component 11, and the first filter element 14 is mounted on the first photosensitive component 11, so that light passing through the first lens 12 reaches the first photosensitive component 11 through the action of the first filter element 14.

The first photosensitive assembly 11 includes a first circuit board 111, a first photosensitive element 113 and a first base 112.

The first photosensitive element 113 is electrically connected to the first circuit board 111 so as to transmit photosensitive information to the first circuit board 111, and the first lens 12 is located in a photosensitive path of the first photosensitive element 113 so as to receive light rays from the first photosensitive element 113 for photosensitive. In particular, in some embodiments, the first photosensitive element 113 may be disposed on the first circuit board 111 by a surface Mount technology (smt), and electrically connected to the first circuit board 111 by at least one first electrical connection element 1133. The first electrical connection element 1133 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a pad, a pin, and the like.

The first photosensitive element 113 has a first photosensitive region 1131 and a first non-photosensitive region 1132, the first photosensitive region 1131 is used for performing a photosensitive action, and the first non-photosensitive region 1132 is electrically connected to the first circuit board 111. In this embodiment of the present invention, the first non-photosensitive region 1132 is electrically connected to the first circuit board 111 through the electrical connection element.

In this embodiment of the invention, the first photosensitive element 113 is located inside the first base 112, that is, is not enclosed by the base. In this embodiment of the present invention, the first photosensitive element 113 needs to be attached to the first circuit board 111, for example, by glue bonding, so that the first photosensitive element 113 is stably fixed, and then the first photosensitive element 113 is electrically connected to the first circuit board 111 through the first electrical connection element 1133, for example, electrically connected to the first circuit board 111 through a gold wire bonding method.

Further, the first base 112 is integrally connected to the first circuit board 111. The first base 112 includes a first base body 1121 and has a first optical window 1122. The first light window 1122 provides a light path for the first photosensitive element 113. In other words, the first photosensitive element 113 is located in the first light window 1122, and a photosensitive path of the first photosensitive element 113 is aligned with the first light window 1122.

More specifically, the first base body 1121 forms the first optical window 1122 to provide a light path for the first photosensitive element 113. In some embodiments, the first base body 1121 is a closed ring-shaped structure that is adapted to the shape of the first photosensitive element 113.

In this embodiment of the present invention, the first base body 1121 has a first inner sidewall, and the first inner sidewall has an inclined angle, so as to facilitate the mold manufacturing and reduce the reflection of stray light to the light sensing element. For example, when the side wall is perpendicular, the incident angle of the light reaching the first base body 1121 is large, so the reflection angle of the light is large, and the light is easily reflected inward, that is, reflected toward the position of the light sensing element. When the first inner side wall is inclined, the incident angle of the light is smaller, and the reflected light is deviated to a position far away from the photosensitive element in the same direction, so that the inclined arrangement mode is favorable for reducing the interference of stray light. The size of the inclined angle can be set according to requirements. Of course, in some embodiments, the first inner sidewall of the first base body 1121 may be vertically disposed, that is, the tilt angle is not present.

Further, according to the embodiment of the present invention, the first base 112 is integrally formed on the first circuit board 111, for example, by molding, so as to stably fix the first base 112 and the first circuit board 111, and reduce additional mounting and fixing processes. For example, the process of glue bonding is reduced, the connection is more stable, the height of glue connection is saved, and the height of the camera module unit is reduced.

For example, the first base 112 may be integrally formed On the first circuit board 111 by molding, for example, by molding, which is different from a conventional cob (chip On board) method. By integrally molding the mold, the molding shape and the surface flatness can be controlled well, for example, the first base main body 1121 has good flatness, so as to provide a flat mounting condition for the mounted components, such as the lens supporting element and the first filter element 14, thereby contributing to improving the optical axis uniformity of the first camera module unit 10.

Further, according to the embodiment of the present invention, the first circuit board 111 includes a first circuit board main body 1111 and at least one first electronic component 1112, and the first electronic component 1112 protrudes from the first circuit board main body 1111 for cooperating with the first circuit board main body 1111. The first base 112 is integrally formed on the first circuit board main body 1111 and covers the first electronic component 1112, so as to reduce the occupied space of the first electronic component 1112. The first electronic element 1112 is exemplified by, but not limited to, a resistor, a capacitor, a driver, and the like. Of course, in other embodiments of the invention, the first electronic component 1112 may not be disposed or the first electronic component 1112 may protrude from the first circuit board body 1111, for example, be embedded in the first circuit board body 1111, which is not limited in this respect.

Each of the first electronic components 1112 may be mounted on an edge area of the first circuit board 111, such as an outer side of the first photosensitive component 113, at a distance from each other by, for example, an SMT process. It should be noted that each of the first electronic components 1112 may be respectively located on the same side or opposite sides of the first circuit board 111, for example, in a specific example, the first photosensitive element 113 and each of the first electronic components 1112 may be respectively located on the same side of the first circuit board 111, and the first photosensitive element 113 is mounted on a chip mounting area of the first circuit board 111, and each of the first electronic components 1112 is mounted on an edge area of the first circuit board 111 at an interval. The first base 112 covers each of the first electronic elements 1112 after molding, so that the first base 112 isolates the adjacent first electronic elements 1112 and isolates the first electronic elements 1112 from the first photosensitive element 113.

In the camera module of the present invention, the first base 112 covers each first electronic component 1112 after being molded, so that the first base 112 covers each first electronic component 1112, and a bad phenomenon of mutual interference between adjacent first electronic components 1112 is avoided, and even when the distance between adjacent first electronic components 1112 is short, the imaging quality of the camera module unit can be ensured, so that a larger number of first electronic components 1112 can be mounted on the first circuit board 111 with a small area, and the structure of the camera module unit is more compact, thereby being beneficial to improving the imaging quality of the camera module unit on the basis of controlling the size of the camera module unit; next, the first base 112 covers each of the first electronic components 1112, so that no safety distance needs to be reserved between the first base 112 and each of the first electronic components 1112, whether in the horizontal direction or in the height direction, so as to reduce the size of the camera module unit. Third, the first base 112 covers each of the first electronic components 1112, so that no glue is needed to connect and level between the first base 112 and the first circuit board 111, which is beneficial to reducing the height dimension of the camera module unit. Fourthly, the first base 112 covers each of the first electronic elements 1112, and in the process of subsequently transporting and assembling the camera module unit to form the split-type array camera module 100, the first base 112 can prevent the first electronic elements 1112 from shaking and falling off, thereby being beneficial to ensuring the structural stability of the split-type array camera module 100. Fifth, the first base 112 covers each of the first electronic components 1112, so that in the subsequent transportation and assembly of the camera module unit to form the split-type array camera module 100, contamination of each of the first electronic components 1112 by contaminants can be prevented, or contamination of photosensitive elements by contaminants falling off from the surfaces of the electronic components can be prevented, thereby ensuring the imaging quality of the first camera module unit 10. Sixth, the first base 112 can isolate the first electronic component 1112 from air after covering the electronic component, which can slow down the oxidation speed of the metal portion of the first electronic component 1112, and is beneficial to improving the environmental stability of the first electronic component 1112 and the split-type array camera module 100.

It should be noted that the first base 112 is integrally formed on the first circuit board main body 1111 and covers the first electronic component 1112 of the first circuit board 111, so that the first base 112 and the first circuit board main body 1111 have a larger connection area, are more stably connected, and have better structural strength through an integral forming manner, and therefore the first base 112 can firmly and reliably support and fix the components of the first camera module unit 10, thereby ensuring the yield of products.

It is also worth mentioning that for the high pixel camera module unit, the number of lenses of the lens is increasing, for example, to 5p, 6p and 6p or more, when the number of lenses of the camera module lens is increased, the requirement of optical performance, such as providing a smaller back focal length, so as to prevent the filter element from influencing the imaging quality of the camera module unit, for example, providing cleaner and smoother installation conditions, so that no black spots, no edge image blur and the like occur in imaging, in an embodiment of the present invention, the filter element is mounted to the base formed integrally, therefore, a flat mounting condition can be provided for the filter element, and the height position of the filter element can be effectively controlled through the height of the base, so that the structure of the invention is more suitable for a high-pixel camera module.

The first base 112 has a first mounting groove 1123 connected to the first optical window 1122. The first filter element 14 is located between the first lens 12 and the first photosensitive element 113, so as to filter the light reaching the first photosensitive element 113 through the first lens 12. The first filter element 14 is mounted to the first mounting groove 1123. For example, the first filter element 14 can be implemented as an infrared cut filter, a full transmission spectrum filter, a blue glass filter, or the like.

The second camera module unit 20 includes a second photosensitive element 21, a second lens 22, a second lens supporting element 23 and a second filter element 24.

The second lens 22 is located in a photosensitive path of the second photosensitive assembly 21, the second lens 22 is mounted on the second lens supporting element 23, the second lens supporting element 23 is mounted on the second photosensitive assembly 21, so that the second lens 22 is located in the photosensitive path of the second photosensitive assembly 21, and the second filter element 24 is mounted on the second photosensitive assembly 21, so that light passing through the second lens 22 reaches the second photosensitive assembly 21 through the second filter element 24.

The second photosensitive assembly 21 includes a second circuit board 211, a second photosensitive element 213 and a second base 212.

The second photosensitive element 213 is electrically connected to the second circuit board 211 so as to transmit photosensitive information to the second circuit board 211, and the second lens 22 is located in a photosensitive path of the second photosensitive element 213 so that the second photosensitive element 213 receives light rays for photosensitive. In particular, in some embodiments, the second photosensitive element 213 can be disposed on the second circuit board 211 through a surface Mount technology (smt), and electrically connected to the second circuit board 211 through at least one second electrical connection element 2133. The second electrical connection element 2133 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a pad, a pin, etc.

The second photosensitive element 213 has a second photosensitive area 2131 and a second non-photosensitive area 2132, the second photosensitive area 2131 is used for performing a photosensitive function, and the second non-photosensitive area 2132 is used for electrically connecting to the second circuit board 211. In this embodiment of the present invention, the second non-photosensitive region 2132 is electrically connected to the second circuit board 211 through the electrical connection element.

In this embodiment of the invention, the second photosensitive element 213 is located inside the second base 212, that is, is not enclosed by the base. In this embodiment of the present invention, the second photosensitive element 213 needs to be attached to the second circuit board 211, for example, by glue bonding, so that the second photosensitive element 213 is stably fixed, and then the second photosensitive element 213 is electrically connected to the second circuit board 211 through the second electrical connection element 2133, for example, electrically connected to the second circuit board 211 through a gold wire bonding method.

Further, the second base 212 is integrally connected to the second circuit board 211. The second base 212 includes a second base body 2121 and has a second light window 2122. The second light window 2122 provides a light path for the second photosensitive element 213. In other words, the second photosensitive element 213 is located in the second light window 2122, and the photosensitive path of the second photosensitive element 213 is aligned with the second light window 2122.

More specifically, the second base body 2121 forms the second light window 2122 providing a light path for the second light sensing element 21313. In some embodiments, the second base body 2121 is a closed loop structure that conforms to the shape of the second photosensitive element 213.

In this embodiment of the present invention, the second base body 2121 has a second inner sidewall, and the second inner sidewall has an inclined angle α, so as to facilitate the mold manufacturing and reduce the reflection of stray light to the photosensitive element. For example, when the side wall is at a vertical angle, the incident angle of the light beam reaching the second base body 2121 is large, and therefore the reflection angle of the light beam is large, and the light beam is relatively easily reflected inward, that is, reflected toward the position of the photosensitive element. When the second inner side wall is inclined, the incident angle of the light is smaller, and the position of the reflected light far away from the photosensitive element deviates in the same direction of the incident light, so that the inclined arrangement mode is favorable for reducing the interference of stray light. The size of the inclination angle alpha can be set according to requirements. Of course, in some embodiments, the second inner sidewall of the second base body 2121 may be vertically disposed, that is, the inclination angle α is not present.

Further, according to the embodiment of the present invention, the second base 212 is integrally formed on the second circuit board 211, for example, by molding, so that the second base 212 and the second circuit board 211 are stably fixed, and additional mounting and fixing processes are reduced. For example, the process of glue bonding is reduced, the connection is more stable, the height of glue connection is saved, and the height of the camera module unit is reduced.

For example, the second base 212 may be integrally formed On the second circuit board 211 by molding, for example, in a manner different from a conventional cob (chip On board) manner. By integrally molding the mold, the molding shape and the surface flatness can be controlled well, for example, the second base body 2121 has good flatness, so as to provide a flat mounting condition for the mounted components, such as the second lens supporting element 23 and the second filter element 24, thereby contributing to improving the optical axis consistency of the second camera module unit 20.

Further, according to this embodiment of the present invention, the second circuit board 211 includes a second circuit board main body 2111 and at least one second electronic component 2112, and the second electronic component 2112 protrudes from the second circuit board main body 2111 for cooperating with the second circuit board main body 2111. The second base 212 is integrally formed on the second circuit board body 2111, and covers at least a portion of the second electronic component 2112, so as to reduce the space occupied by the second electronic component 2112. The second electronic component 2112 is exemplified by, but not limited to, a resistor, a capacitor, a driver, and the like. Of course, in other embodiments of the invention, the second electronic component 2112 may not be provided or the second electronic component 2112 may not protrude from the second board body 2111, for example, may be embedded in the second board body 2111, and the invention is not limited in this respect. For example, the types of the first circuit board body 1111 and the second circuit board body 2111 are selected from a soft board, a hard board, and a soft and hard combined board.

Each of the second electronic components 2112 may be mounted to an edge region of the second circuit board 211, such as an outer side of the second photosensitive component 213, at a distance from each other by, for example, an SMT process. It should be noted that each of the second electronic components 2112 may be respectively located on the same side or opposite sides of the second circuit board 211, for example, in a specific example, the second photosensitive element 213 and each of the second electronic components 2112 may be respectively located on the same side of the second circuit board 211, and the second photosensitive element 213 is mounted on the chip mounting area of the second circuit board 211, and each of the second electronic components 2112 is mounted on the edge area of the second circuit board 211 at intervals. The second base 212 covers each of the second electronic components 2112 after molding, so that the second base 212 isolates the adjacent second electronic components 2112 and isolates the second electronic components 2112 from the second photosensitive element 213.

The advantages of the second base 212 integrally formed on the second circuit board 211 are the same as those of the first camera module unit 10, and are not repeated herein. It is understood that the first and second bases may be disposed on the first and second circuit boards, respectively, by glue attachment. Preferably, at least one of the first and second bases is integrally formed on the corresponding circuit board. For example, two of the bases are integrally formed on the corresponding circuit boards, or one of the bases is integrally formed on the corresponding circuit board, and the other base is a conventional bracket and is mounted on the corresponding circuit board.

Further, the first lens holding member 13 and the second lens holding member 23 may be implemented as a driving member or a barrel member, thereby forming a moving focus camera module or a fixed focus camera module. The driving element is exemplified by, but not limited to, a voice coil motor, a piezoelectric motor, etc. For example, when the first lens holding member 13 and the second lens holding member 23 are both implemented as a driving member, the first camera module unit 10 and the second camera module unit 20 are both moving focus camera modules, that is, the split type array camera module 100 is composed of two moving focus camera modules. When the first lens 12 supporting unit is implemented as a driving element and the second lens supporting element 23 is implemented as a lens barrel element, the first camera module unit 10 is a moving focus camera module and the second camera module unit 20 is a fixed focus camera module, that is, the split array camera module 100 is composed of a moving focus camera module and a fixed focus camera module. When the first lens supporting member 13 is implemented as a lens barrel member and the second lens 22 is implemented as a driving member, the first camera module unit 1010 is a fixed focus camera module and the second camera module unit 20 is a moving focus camera module. When the first lens holding member 13 and the second lens holding member 23 are both implemented as the lens barrel member, the first camera module unit 10 and the second camera module unit 20 are both fixed-focus camera modules.

It should be noted that, in some embodiments, when the first lens supporting element 13 or the second lens supporting element 23 is implemented as a driving element, the first lens supporting element 13 and the second lens supporting element 23 are electrically connected to the first circuit board 111 or the second circuit board 211 so as to drive the first lens 12 or the second lens 22 to operate. For example, the first lens holding element 13 and the second lens holding element 23 may be electrically connected to the first circuit board 111 or the second circuit board 211 by providing pins, pads, or wires.

The types of the first camera module unit 10 and the second camera module unit 20 may be configured as required, so as to cooperate with each other to achieve a better image capturing effect, and the invention is not limited in this respect.

It should be noted that in this embodiment of the present invention, the types of the first photosensitive element 113 and the second photosensitive element 213 of the first camera module unit 10 and the second camera module unit 20 may be the same or different, so as to form camera module units with different functions.

As shown in fig. 5, a sectional view of a split array camera module 100 according to a second preferred embodiment of the present invention is schematically shown. Unlike the above embodiments, the second base 212 of the second photosensitive element 21 of the second camera module unit 20 integrally encapsulates at least a portion of the second non-photosensitive area 2132 of the second photosensitive element 213. In other words, the second base 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213, so that the second photosensitive element 213 is stably fixed and the moldable region of the second base 212 is increased. The second base 212 covers the second electrical connecting element 2133.

It should be noted that, compared to the manner in which the first base 112 is formed on the first circuit board 111 only in the first embodiment, the manner in which the second base 212 is molded on the photosensitive element extends the range in which the second base 212 can be integrally formed to the second non-photosensitive area 2132 of the second photosensitive element 213, so that the connection area of the bottom of the second base 212 is increased without affecting the normal photosensitive operation of the second photosensitive element 213, and thus the second base 212, the second circuit board 211 and the second photosensitive element 213 can be connected more stably, and the top can be used as other components, such as the second lens 22 and the second lens support element 23, to provide a larger mountable area. The second electrical connecting element 2133 is covered by the second base 212, so as to avoid external interference with the second electrical connecting element 2133, and prevent the second electrical connecting element 2133 from being oxidized or contaminated by dust to affect the imaging quality of the camera module unit.

As shown in fig. 6, it is a schematic cross-sectional view of a split array camera module 100 according to a third preferred embodiment of the present invention. In this embodiment of the present invention, the assembly 30 includes a partition wall 35 disposed in the housing chamber 32 to partition the housing chamber 32 and respectively house the camera module units. The partition wall 35 may be made of plastic, resin, rubber, metal, or the like so as to reduce electromagnetic interference of the first and second camera module units 10 and 20.

Further, in an embodiment of the present invention, the partition wall 35 is fixedly connected to the upper cover 33, so that when the upper cover 33 closes the accommodating chamber 32, the partition wall 35 separates the first camera module unit 10 from the second camera module unit 20.

In another embodiment of the present invention, the partition wall 35 is fixedly connected to a sidewall of the main body 31 to divide the accommodating chamber 32 into two parts for accommodating the first camera module unit 10 and the second camera module unit 20, respectively. That is, when the first camera module unit 10 and the second camera module unit 20 are mounted to the assembly 30, the first camera module unit 10 and the second camera module unit 20 are separated by the partition wall 35. Of course, in other embodiments of the present invention, the partition wall 35 may have other structures and materials, and the present invention is not limited in this respect.

Fig. 7 is a schematic cross-sectional view of a split array camera module 100 according to a fourth preferred embodiment of the present invention. In this embodiment, the first base 112 includes a first supporting member 1124 for supporting a mold during the manufacturing process to prevent damage to the first circuit board 111 or the first photosensitive element 113. That is, during the manufacturing process, the manufacturing mold may be abutted against the first supporting member 1124 so that the mold does not directly contact the first circuit board 111 or the first photosensitive element 113 and the molding material is prevented from overflowing to the inside.

Further, the first supporting element 1124 may be a ring-shaped structure, which is shaped to conform to the edge of the first base body 1121. The first support element 1124 is resilient, for example but not limited to a glue coating or pad.

The second base 212 includes a second supporting member 2124 for supporting a mold during a manufacturing process to prevent damage to the second circuit board 211 or the second photosensitive element 213. That is, during the manufacturing process, the manufacturing mold may be abutted against the second supporting member 2124 so that the mold does not directly contact the first wiring board 111 or the second photosensitive member 213 and the molding material is prevented from overflowing to the inside.

Further, the second support element 2124 may be a ring-shaped structure that conforms to the shape of the edge of the second base body 2121. The second support element 2124 is resilient, for example but not limited to a glue coating or a glue pad.

Fig. 8A and 8B are schematic cross-sectional views of a split array camera module 100 according to a fifth preferred embodiment of the present invention. Referring to fig. 8A, in this embodiment of the present invention, the first camera module unit 10 includes a first holder 15 for mounting other components, such as the first filter element 14, the first lens 12 or the first lens holding element 13.

In the drawings of this embodiment of the present invention, the first holder 15 is mounted to the first base body 1121, and the first filter element 14 is mounted to the first holder 15. In particular, the first support 15 is sunk in the first optical window 1122 of the first base 112, so that the position of the first filter element 14 is sunk to be close to the first photosensitive element 113, thereby reducing the back focal length occupation of the first camera module unit 10 and reducing the required area of the first filter element 14.

The second holder 25 is attached to the second base body 2121, and the second filter element 24 is attached to the second holder 25. In particular, the second support 25 is sunk in the second light window 2122 of the second base 212, so that the second filter element 24 is sunk to be close to the second photosensitive element 213, thereby reducing the back focal length occupation of the second camera module unit 20 and reducing the required area of the second filter element 24. Of course, in other embodiments of the present invention, the array camera module may only include one support, such as the first support 15 or the second support 25, and it should be understood by those skilled in the art that the number of the supports is not limited by the present invention.

In this embodiment, the first holder 15 is mounted to the first mounting groove 1123 of the first base 112, and the second holder 25 is mounted to the second mounting groove 2123 of the second base 212. In other embodiments of the present invention, the first base body 1121 and the second base body 2121 may be platform structures, and the first support 15 and the second support 25 may not be sunk downward and are directly mounted on the platform structures of the first support 15 and the second support 25, and it should be understood by those skilled in the art that the mounting position and specific structure of the supports are not limited to the present invention.

It should be noted that in other embodiments of the present invention, the support may cooperate with the base to form the optical window, that is, the base may have an opening communicating with the outside, and the support may complement the opening to form a closed optical window. For example, the support may be extendedly connected to the circuit board body to form a closed optical window.

Referring to fig. 8B, in this embodiment, the first holder 15 and the second holder 25 are integrally connected. That is, adjacent portions of the first and second holders 15 and 25 are connected to each other, thereby enabling one-time mounting to the first and second bases 112 and 212 and providing relatively uniform mounting conditions.

Fig. 9 is a schematic cross-sectional view of a split array camera module 100 according to a sixth preferred embodiment of the present invention. In this embodiment, unlike the first embodiment, the second circuit board main body 2111 has a second sunken region 21111, and the second photosensitive element 213 is sunken in the second sunken region 21111 so as to reduce the relative height of the second photosensitive element 213 and the second circuit board main body 2111.

The second dip zone 21111 may be implemented as a groove or a through hole. That is, both sides of the second wiring board main body 2111 may be made not to communicate or to communicate. When the second sinking portion 21111 is a recess, the second photosensitive element 213 is disposed at the bottom of the groove and is electrically connected to the second circuit board main body 2111 through the second electrical connecting element 2133. The outer end of the second electrical connecting element 2133 may be electrically connected to the bottom of the groove, or may be electrically connected to the outside of the second sinking region 21111, which is not a limitation of the present invention in this respect. Further, the top surface of the second photosensitive element 213 may be coincident with the top surface of the second board main body 2111, or higher than the top surface of the second board main body 2111, or lower than the top surface of the second board main body 2111, that is, the present invention is not limited to the sinking depth.

Further, in the drawings of this embodiment of the present invention, the second sinking region 21111 is a through hole, that is, both sides of the second circuit board 211 communicate through the through hole. The second circuit board 211 of the second camera module unit 20 includes a second bottom plate 1113, which is stacked on the bottom of the second circuit board main body 2111 to support the photosensitive element and enhance the structural strength of the second circuit board main body 2111. That is, the second photosensitive element 213 is sunk in the second sinking region 21111 and supported by the bottom plate 1113. The second photosensitive element 213 is electrically connected to the second circuit board main body 2111 via the second electrical connection element 2133.

In some embodiments, the bottom plate 1113 may be a metal plate, and is attached to the bottom of the second circuit board main body 2111.

Fig. 10 is a schematic sectional view of a split array camera module 100 according to a seventh preferred embodiment of the present invention. Unlike the first embodiment, in this embodiment, the first base 112 of the first photosensitive element 11 of the first camera module unit 10 integrally encapsulates at least a portion of the first non-photosensitive region 1132 of the first photosensitive element 113. In other words, the first base 112 integrally encapsulates the first circuit board 111 and the first photosensitive element 113, so that the first photosensitive element 113 is stably fixed and the moldable region of the first base 112 is increased. The first base 112 covers the first electrical connection element 1133.

It should be noted that, compared to the manner in which the first base 112 is formed on the first circuit board 111 only in the first embodiment, the manner in which the first base 112 is molded on the photosensitive element extends the range in which the first base 112 can be integrally formed to the first non-photosensitive area 1132 of the first photosensitive element 113, so that the connection area of the bottom of the first base 112 is increased without affecting the normal photosensitive operation of the first photosensitive element 113, so that the first base 112, the first circuit board 111 and the first photosensitive element 113 can be connected more stably, and the top can be other components, such as the first lens 12, the first lens supporting element 13, and the like, to provide a larger mountable area. And the electrical connection element is covered by the first base 112, thereby preventing the electrical connection element from being interfered by the outside, and preventing the electrical connection element from being oxidized or contaminated by dust to affect the imaging quality of the camera module unit.

The second base 212 of the second photosensitive element 21 of the second camera module unit 20 integrally encapsulates at least a portion of the second non-photosensitive area 2132 of the second photosensitive element 213. In other words, the second base 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213, so that the second photosensitive element 213 is stably fixed and a moldable region of the second base 212 is increased. The second base 212 covers the second electrical connecting element 2133.

Further, in this embodiment, the second circuit board main body 2111 has a second sunken region 21111, and the second photosensitive element 213 is sunken in the second sunken region 21111, so as to reduce the relative height between the second photosensitive element 213 and the second circuit board main body 2111.

Second dip zone 21111 may be implemented as a recess or via. That is, both sides of the second wiring board main body 2111 may be made not to communicate or to communicate. When the second sinking region 21111 is a groove, the second photosensitive element 213 is disposed at the bottom of the groove and is electrically connected to the second circuit board main body 2111 through the second electrical connecting element 2133. The outer end of the second electrical connection element 2133 may be electrically connected to the bottom of the groove, or may be electrically connected to the outside of the second sinking region 21111, although the invention is not limited in this respect. Further, the top surface of the second photosensitive element 213 may be coincident with the top surface of the second board main body 2111, or higher than the top surface of the second board main body 2111, or lower than the top surface of the second board main body 2111, that is, the present invention is not limited to the sinking depth.

Further, in the drawings of this embodiment of the present invention, the second sinking region 21111 is a through hole, that is, both sides of the second circuit board 211 communicate through the through hole.

In this embodiment, the second photosensitive element 213 and the second electrical connection element 2133 are integrally encapsulated by the second base 212, so that the second photosensitive element 213 can be fixed by the second base 212. A second bottom plate may be disposed at the bottom of the second circuit board 211, or the second bottom plate may not be disposed.

Fig. 11 is a schematic cross-sectional view of a split array camera module 100 according to an eighth preferred embodiment of the present invention. Unlike the first embodiment, in this embodiment, the first base 212 of the first photosensitive element 21 of the first camera module unit 20 integrally encapsulates at least a part of the first non-photosensitive area 2132 of the first photosensitive element 213. In other words, the first substrate 212 integrally encapsulates the first circuit board 211 and the first photosensitive element 213, so that the first photosensitive element 213 is stably fixed and the moldable region of the first substrate 212 is increased. The first base 212 covers the first electrical connection element 2133.

Further, the first circuit board main body 1111 includes a first board 11112 and a second board 11113, and the first board 11112 and the second board 11113 are fixedly connected by a connecting medium 11114. The first board 11112 may be a hard board, the second board 11113 may be a soft board, and the connecting medium 11114 may be anisotropic conductive adhesive. The first board 11113 may also include an interface end, such as a connector, configured to facilitate electrical connection to an electronic device.

In some embodiments, the first base body 1121 is integrally formed with the first board 11112, and the second board 11113 is overlapped with an end portion of the first board 11112. In the manufacturing process, the first circuit board main body 1111 may be formed by the first board 11112 and the second board 11113 and then integrally formed, or the first board 11112 may be integrally formed and then the second board 11113 may be electrically connected to the first board 11112, for example, fixed to the first board 11112 by the anisotropic conductive adhesive.

In some embodiments, the second circuit board body 2111 may also be constructed in the manner described above, as the invention is not limited in this respect.

Fig. 12 is a schematic cross-sectional view of a split array camera module 100 according to a ninth preferred embodiment of the invention. Unlike the first preferred embodiment, in this embodiment, the second board main body 2111 is provided with a second reverse attaching groove 21115, and the photosensitive element is mounted in the second reverse attaching groove 21115 in a reverse attaching manner. That is, the second photosensitive element 213 is mounted to the second circuit board main body 2111 by an FC (Flip Chip) method. The second reverse attaching groove 21115 is opposite to the second lens 22.

That is, in the mounting process, the second photosensitive element 213 is mounted to the second circuit board main body 2111 from below the second circuit board main body 2111, and the second photosensitive area 2131 of the second photosensitive element 213 performs a photosensitive action through the second optical window 2122 and the upper opening of the second inverted groove 21115.

Of course, in other embodiments of the present invention, the first image pickup module unit 10 may also be configured as described above.

Fig. 13 is a schematic cross-sectional view of a split-type array camera module 100 according to a tenth preferred embodiment of the present invention. Unlike the above preferred embodiment, in this embodiment, the second base 212 of the second photosensitive element 21 of the second camera module unit 20 integrally encapsulates at least a part of the second non-photosensitive area 2132 of the second photosensitive element 213. In other words, the second base 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213, so that the second photosensitive element 213 is stably fixed and the moldable region of the second base 212 is increased. The second base 212 covers the second electrical connecting element 2133.

The second base 212 includes a second extension mounting part 2125 extending at least partially upward from the second base body 2121 and forming a second limiting groove 21251 for limiting and mounting the second lens 2224 or the second lens supporting member 2325. In this embodiment of the present invention, the second lens 22 is mounted to the second extension mount 2125, and the second extension mount 2125 replaces the second lens holding member 23, thereby forming a focus camera module.

In another embodiment of the present invention, the first image pickup module unit 10 may be configured as described above.

Fig. 14 is a schematic diagram of a split-type array camera module 100 according to an eleventh preferred embodiment of the present invention. Unlike the first preferred embodiment, in this embodiment of the present invention, the first wiring board body 1111 and the second wiring board body 2111 are integrally connected to form an integral structure, and the first base 112 and the second base 212 are respectively formed at different regions of the integral structure, that is, the regions corresponding to the first wiring board body 1111 and the second wiring board 211.

Fig. 15A, 15B, and 15C are schematic cross-sectional views of different embodiments of the split array camera module 100 according to the twelfth preferred embodiment of the invention. In this embodiment of the present invention, the split array camera module 100 is composed of two camera module units with different heights, and the relative positions of the first camera module unit 10 and the second camera module unit 20 can be arranged according to requirements. For example, referring to fig. 15A, the top ends of the first camera module unit 10 and the second camera module unit 20 are made to be consistent, and the bottom portions have a height difference, for example, referring to fig. 15B, the bottom portions of the first camera module unit 10 and the second camera module unit 20 are made to be consistent, and the top portions have a height difference, for example, referring to fig. 15C, both ends of the first camera module unit 10 and the second camera module unit 20 are made to be inconsistent, and both ends have a height difference. It should be understood by those skilled in the art that the type and height of the camera module unit are not limitations of the present invention.

Fig. 16 is a top view of the split type array camera module 100 according to the eleventh preferred embodiment of the present invention. In this embodiment of the present invention, the split array camera module 100 is composed of two camera module units with different sizes, and the relative positions of the first camera module unit 10 and the second camera module unit 20 can be arranged according to requirements. The structure of the assembly 30 can be changed with the size of the camera module, for example, at the position with a larger cross section of the camera module, the opening area of the assembly 30 is larger, and at the position with a smaller cross section of the camera module unit, the opening area of the assembly 30 is smaller, so as to adapt to the size of each camera module unit.

It should be noted that the above embodiments and the drawings are only for illustrative purposes to show some ways in which the present invention may be implemented, and various features of the above embodiments may be freely combined to form different camera module units, which constitute other embodiments of the present invention, and also belong to the scope of the present invention. In the above embodiments and other embodiments of the present invention, the types and structures of the camera module units can be freely combined, and the assembly body 30 is used for assembling, so as to form the split array camera module 100 with different structures, which is not limited in this respect.

Fig. 17 is a block diagram of a method for manufacturing the split array camera module 100 according to the above preferred embodiment of the present invention. The invention provides a manufacturing method 1000 of a split type array camera module, which comprises the following steps:

1001: forming at least two camera module units; and

1002: the camera module units are assembled by an assembly body 30.

Wherein in the step 1001, the method comprises the steps of:

10011: mounting a photosensitive element on a circuit board;

10012: a base is integrally formed on a circuit board.

10013: arranging a lens on a photosensitive path of the photosensitive element;

10014: and actively calibrating the camera module unit.

Wherein, the step 10012 may be before the step 10011 or after the step 10011.

Wherein in the step 10012, the method may include the steps of: the base is integrally formed on the circuit board and the photosensitive element, for example, a base is integrally formed on a circuit board and at least a part of a non-photosensitive area of a photosensitive element, and the circuit board and the photosensitive element are integrally packaged.

The step 1002 includes the steps of:

10021: pre-fixing each camera module unit to the assembly 30;

10022: actively calibrating the camera module units respectively to enable the optical axes of the camera module units to be consistent; and

10023: and fixing each camera module unit.

Fig. 18 is a schematic application diagram of the split-type array camera module 100 according to the above preferred embodiment of the present invention. The present invention further provides an electronic device 300, wherein the electronic device comprises an electronic device body 200 and at least one split array camera module 100, wherein the split array camera module 100 is respectively disposed on the electronic device body 200 for obtaining images. It should be noted that the type of the electronic device body 200 is not limited, for example, the electronic device body 200 may be any electronic device capable of being configured with the camera module, such as a smart phone, a wearable device, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, a monitoring device, and the like. It will be understood by those skilled in the art that although fig. 18 illustrates the electronic device body 200 as a smart phone, it does not limit the content and scope of the present invention.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (34)

1. An array camera module, a serial communication port, include:

at least two camera module units; and

at least one assembly body, wherein each camera module unit is respectively fixed on the assembly body so as to form a whole;

the assembly comprises a main body, at least one upper cover and at least one supporting edge, and is provided with an accommodating chamber, wherein the accommodating chamber is formed in the main body, each camera module unit is accommodated in the accommodating chamber, the upper cover is provided with at least one lens opening and is suitable for shielding the main body to seal the accommodating chamber, each camera module unit is used for lighting through the lens opening of the upper cover, and the supporting edge extends inwards from the main body so as to support each camera module unit.

2. The array camera module of claim 1, wherein the upper cover is integrally connected to the main body.

3. The array camera module of claim 1, wherein the body has at least one sidewall, each of the camera module units being attached to the sidewall.

4. The array camera module of claim 1, wherein the assembly comprises at least one partition wall, the partition wall is located in the housing chamber and divides the housing chamber into at least two parts for respectively accommodating the camera module units.

5. The array camera module of claim 4, wherein the material of the partition wall is selected from one or more of plastic, resin, rubber and metal.

6. The camera module array of claim 4, wherein the partition wall is connected to the body.

7. The array camera module of claim 1, wherein the assembly comprises at least one partition wall dividing the housing chamber into at least two sections for respectively housing each camera module unit, the partition wall being connected to the top cover.

8. The array camera module of claim 1, wherein the support edge is a boss structure.

9. The array camera module of any of claims 1-8, wherein each camera module unit includes at least one photosensitive element and at least one lens, wherein the lens is located in a photosensitive path of the photosensitive element, the photosensitive element includes at least one circuit board, at least one photosensitive element and at least one base, the base is integrally formed on the circuit board, the photosensitive element is electrically connected to the circuit board, the lens is located in a photosensitive path of the photosensitive element, and the base has at least one optical window for providing a light path for the photosensitive element.

10. The array camera module of claim 9, wherein the photosensitive element is located inside the base.

11. The array camera module of claim 9, wherein the base integrally encapsulates the circuit board and at least a portion of the non-photosensitive area of the photosensitive element.

12. The array camera module of claim 11, wherein the photosensitive element is electrically connected to the circuit board through at least one electrical connection element, and the base covers the electrical connection element.

13. The array camera module of claim 9, wherein the circuit board comprises at least one electronic component, and the integral base covers the electronic component.

14. The array camera module of claim 9, wherein the base includes a support member, the support member being disposed on the circuit board body to protect the circuit board body and the photosensitive element during manufacturing.

15. The array camera module of claim 9, wherein the base includes a support member, the support member being disposed in a non-photosensitive region of the photosensitive element to protect the photosensitive element during manufacturing.

16. The camera module array of claim 9, wherein each of the camera module units includes a holder, the holder being at least partially mounted to the base to facilitate mounting of a filter element.

17. The array camera module of claim 16, wherein the mount is at least partially attached to the wiring board.

18. The arrayed camera module of claim 16, wherein the respective mounts of the respective camera module cells are integrally connected.

19. The array camera module of claim 9, wherein the circuit board is provided with at least one depressed area, and the photosensitive element is disposed in the depressed area so as to reduce the relative height of the photosensitive element and the circuit board.

20. The array camera module of claim 9, wherein the circuit board comprises a first board and a second board, and the second board is fixedly connected to the first board through a connecting medium.

21. The array camera module of claim 20, wherein the first board is a hard board, the second board is a soft board, and the connection medium is an anisotropic conductive adhesive.

22. The array camera module of claim 9, wherein the base includes an extended mounting portion extending at least partially upward from the base body to form a retaining groove to retain a mounted component.

23. The array camera module according to claim 9, wherein the circuit board is provided with a reverse attaching groove, and the photosensitive element is provided in the reverse attaching groove so as to be mounted on the circuit board in a reverse chip manner.

24. The arrayed camera module of claim 9, wherein the circuit boards of the respective camera module cells are integrally connected.

25. The arrayed camera module of claim 9, wherein each camera module unit is provided separately.

26. The arrayed camera module of claim 9, wherein a bottom of each of the camera module cells has a height difference.

27. The camera module array of claim 9, wherein each of the camera module units includes at least one lens support member, the lens being mounted to the lens support member, the lens support member being mounted to the base.

28. The camera module array of claim 27, wherein the lens support member is a driving member so that the camera module unit constitutes a moving focus camera module.

29. The camera module array of claim 27, wherein the lens holder is a barrel so that the camera module unit forms a fixed focus camera module.

30. The array camera module of claim 9, wherein at least two of the camera module units are fixed focus camera modules.

31. The array camera module of claim 9, wherein at least two of the camera module units are dynamic focus camera modules.

32. The array camera module of claim 9, wherein at least one of the camera module units is a moving focus camera module and at least one is a fixed focus camera module.

33. The array camera module of claim 9, wherein each of the array camera modules includes a filter element, the filter element being mounted to the base.

34. The array camera module of claim 9, wherein each of the circuit board types is selected from the group consisting of rigid board, flexible board, rigid-flex board, and ceramic substrate.

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