CN110166654B - Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment - Google Patents

Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment Download PDF

Info

Publication number
CN110166654B
CN110166654B CN201810137613.8A CN201810137613A CN110166654B CN 110166654 B CN110166654 B CN 110166654B CN 201810137613 A CN201810137613 A CN 201810137613A CN 110166654 B CN110166654 B CN 110166654B
Authority
CN
China
Prior art keywords
photosensitive
camera module
circuit board
base
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810137613.8A
Other languages
Chinese (zh)
Other versions
CN110166654A (en
Inventor
赵波杰
方银丽
曾俊杰
袁业辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201810137613.8A priority Critical patent/CN110166654B/en
Publication of CN110166654A publication Critical patent/CN110166654A/en
Application granted granted Critical
Publication of CN110166654B publication Critical patent/CN110166654B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

Integral type array camera module and array sensitization subassembly and manufacturing mould, manufacturing method and electronic equipment thereof, wherein array sensitization subassembly is used for integral type array camera module, and it includes: the integrated circuit board is provided with a first side surface; the two photosensitive elements are electrically connected with the conjoined circuit board; the compensation layer is arranged on the first side face of the conjoined circuit board, and the photosensitive element is arranged on the compensation layer; and the conjoined base is integrally formed on the first side surface of the conjoined circuit board to form two light windows which respectively correspond to the two photosensitive elements and provide light paths for the two photosensitive elements, and the two end parts of the array camera module are consistent in height by the mode.

Description

Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment
Technical Field
The invention relates to the field of camera modules, in particular to an integrated array camera module, an array photosensitive assembly, a manufacturing mold, a manufacturing method and electronic equipment of the array photosensitive assembly.
Background
Along with the module of making a video recording and intelligent electronic equipment's continuous development, the module of two modules or many cameras of making a video recording has become an important trend of development. The camera modules of different types are mutually matched to obtain higher quality or obtain image information with more functions, which is a great advantage brought by the double-camera module.
The conventional dual camera module is basically assembled by two independent camera modules, for example, the two independent camera modules are fixed by an outer frame, so as to obtain an integral dual camera module.
The assembly structure of the existing double camera module has several problems.
From the basic function of the double-camera module, two camera modules in the double-camera module are adjacently arranged, and image information with higher quality or more functions is obtained by matching the two camera modules with the image information acquired by the same acquisition target. In the manufacturing process, two modules of making a video recording all need satisfy respective optical design requirement, are the module of making a video recording of two different grade types usually, consequently have the difference in the aspect of size and height, for example have different optics overall length, and the equipment degree of difficulty of two independent modules of making a video recording has further been improved to this kind of difference. Two different modules of making a video recording of optical design, highly different usually, but it often requires the module top to flush to make a video recording or array module, so often there is the difference in height bottom when the module assembly of making a video recording is together two.
Further, the dual camera module generally needs to be assembled to an electronic device, such as a smart phone or a wearable device, so that the top end of the dual camera module directly corresponds to the outer end face of the electronic device, and the inner end face is connected to the electronic device inside the electronic device. The top end part of the double-camera module relates to the appearance of the whole electronic equipment, and the double-camera top surface is often required to have a relatively flat surface by both a production manufacturer and a user, so that the overall design appearance is not influenced. To the module of making a video recording of two different grade types, especially to the module of making a video recording that two optics overall length are different, the current two requirements in these two aspects of hardly satisfying simultaneously of making a video recording the module structure.
Disclosure of Invention
An object of the present invention is to provide an integrated array camera module, an array photosensitive element, a manufacturing mold thereof, a manufacturing method thereof, and an electronic apparatus, which are integrally connected to each other without the need for an existing outer frame for assembly and fixation.
An object of the present invention is to provide an integrated array camera module and array photosensitive assembly, a mold for manufacturing the same, a method for manufacturing the same, and an electronic apparatus, which compensate for differences in camera module units by means of internal compensation, thereby making respective heights of a plurality of camera module units uniform at top and bottom ends after assembly.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a mold for manufacturing the same, a method for manufacturing the same, and an electronic device, which enable each set of a plurality of camera module units to satisfy optical design by means of internal compensation, and enable respective heights of top end portions and bottom end portions to be consistent after assembly.
An object of the present invention is to provide an integrated type array camera module and array photosensitive assembly, a mold for manufacturing the same, a method for manufacturing the same, and an electronic apparatus, in which a compensation layer is provided on a bottom surface of a photosensitive element of a camera module unit having a short optical length to compensate for a difference between the camera module unit having a long optical total length and the camera module unit having a long optical total length.
An object of the present invention is to provide an integrated camera module and array photosensitive assembly, a mold for manufacturing the same, and a method for manufacturing the same, in which a plurality of camera module units are integrally connected to each other through a connection base, thereby eliminating the need for external frame fixation and providing more degrees of freedom in adjustment.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic device, wherein in some embodiments, the surface design of the connected base is matched to compensate for differences of the camera module units, such as a height difference of the surface design of the connected base.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold, a manufacturing method and an electronic device thereof, in which a bracket is matched with a connection base to compensate for differences of camera module units.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic device, wherein in some embodiments, a steel plate layer is disposed on a bottom surface of the photosensitive element to form the compensation layer.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic device, wherein in some embodiments, the compensation layer is integrally formed when the integrated base is integrally formed.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic device, which compensate for differences of camera module units through a bottom surface compensation of a photosensitive element, and a selective matching manner of multiple aspects of an integrated base and a bracket.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic apparatus, which provide an integrated mounting base surface through a one-piece circuit board, so that the bottom end portions of the camera module units are uniform in height.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic device, which are assembled by an integrated base, thereby providing a flat mounting surface and improving the assembly accuracy.
An object of the present invention is to provide an integrated array camera module, an array photosensitive assembly, a manufacturing mold thereof, a manufacturing method thereof, and an electronic device, in which a compensation layer is disposed on a bottom surface of a photosensitive element to raise a height of the photosensitive element, so that a relative position of the photosensitive element and a lens corresponds to an optical design of the camera module.
In order to achieve at least one of the above objects, an aspect of the present invention provides an array photosensitive assembly for an integrated array camera module, including:
a connected circuit board;
at least two light-sensitive elements electrically connected to the conjoined circuit board;
the compensation layer is arranged between the conjoined circuit board and one photosensitive element in the at least photosensitive elements; and
the conjoined base is integrally formed on the conjoined circuit board and forms at least two light windows which respectively correspond to the photosensitive elements and provide light paths for the photosensitive elements.
According to some embodiments, the conjoined circuit board has a base region and a compensation region, the conjoined base is integrally formed in the base region, a photosensitive element is mounted in the photosensitive element mounting region, and the compensation layer is disposed in the compensation region.
According to some embodiments, the one-piece circuit board includes a photosensitive element mounting area, and one of the photosensitive elements is mounted on the photosensitive element mounting area.
According to some embodiments, the compensation layer is a plate body structure.
According to some embodiments, the compensation layer is integrally formed on the one-piece circuit board.
According to some embodiments, the compensation layer is integrally formed on the connected circuit board in a manner of being integrally connected with the connected base.
According to some embodiments, the connection circuit board has at least one electrical connection area, and the compensation layer has an exposed area corresponding to the electrical connection area of the connection circuit board so that the electrical connection area is exposed, so that the photosensitive element is electrically connected to the connection circuit board.
According to some embodiments, the one-piece base has a mounting surface that provides a mounting location for components of the integrated array camera module, the mounting surface being an extended plane.
According to some embodiments, the one-piece base has a mounting surface that provides a mounting location for components of the integrated array camera module, and the mounting surface is of a stepped structure.
According to some embodiments, the mounting surface comprises a first mounting area and a second mounting area, the second mounting area and the first mounting area having a height difference.
According to some embodiments, the first mounting region and the second mounting region are connected by an inclined surface.
According to some embodiments, the second mounting area is higher than the first mounting area, the second mounting area corresponding to the compensation layer.
According to some embodiments, the one-piece base has at least one mounting groove, and the mounting groove is communicated with the light window.
According to some embodiments, the array photosensitive assembly comprises at least one electronic component, the electronic component is electrically connected with the connected circuit board, and the connected base covers the electronic component.
According to some embodiments, the photosensitive element is electrically connected to the one-piece circuit board through at least one electrical connection element.
According to some embodiments, the one-piece base is located at a periphery of at least one of the photosensitive elements.
According to some embodiments, the conjoined base integrally encapsulates at least a portion of the non-photosensitive region of the at least one photosensitive element.
According to some embodiments, the integral molding is a molded integral molding.
According to some embodiments, the inner side of the connected base has an inclination angle.
Another aspect of the present invention provides an integrated array camera module, comprising:
an array photosensitive assembly, and
and the at least two lenses are positioned on the photosensitive path of the array photosensitive assembly.
According to some embodiments, the integrated array camera module includes at least two lens bearing elements, and each lens is respectively mounted on each lens bearing element and located in the photosensitive path of the corresponding photosensitive element.
According to some embodiments, at least one of the lens bearing elements is a driving element, and forms a moving focus camera module unit.
According to some embodiments, at least one of the lens bearing elements is a fixed element, and forms a focus-fixing camera module unit.
According to some embodiments, the array camera module comprises two filter elements respectively located in the photosensitive paths of the two photosensitive elements, wherein at least one filter element is mounted on the lens carrier.
According to some embodiments, the array camera module comprises at least two filter elements and a bracket, the two filter elements are respectively located in the photosensitive paths of the photosensitive elements, at least one filter element is mounted on the bracket, and the bracket is mounted on the conjoined base.
According to some embodiments, the array camera module comprises at least two filter elements, the two filter elements are located in the photosensitive paths of the two photosensitive elements, and at least one filter element is directly mounted on the conjoined base.
Another aspect of the present invention provides an integrated array camera module, comprising:
at least one first camera module unit including
A first photosensitive assembly including
A first circuit board; a first photosensitive element; the first base is integrally formed on the first circuit board to form a first light window which provides a light path for the first photosensitive element; and
the first lens is positioned on a photosensitive path of the first photosensitive assembly; and at least one second camera module unit, wherein the second camera module unit comprises
A second photosensitive assembly including
A second circuit board, a second photosensitive element; the second base is integrally formed on the second circuit board to form a first light window for providing a light path for the second photosensitive element; and
the second lens is positioned on the photosensitive path of the second photosensitive assembly; and
and the first base is integrally connected with the second base to form a connected base, and the compensation layer is arranged between the second photosensitive element and the second circuit board to compensate the difference between the first camera module unit and the second camera module unit, so that the heights of the top end part and the bottom end part of the first camera module unit and the second camera module unit are consistent and respectively accord with optical design.
According to some embodiments, the first wiring board and the second wiring board are integrally connected to constitute a one-piece wiring board.
According to some embodiments, the one-piece circuit board has a base region and a compensation region, the one-piece base is integrally formed in the base region, a photosensitive element is mounted in the photosensitive element mounting region, and the compensation layer is disposed in the compensation region.
According to some embodiments, the one-piece circuit board includes a photosensitive element mounting area, and one of the photosensitive elements is mounted on the photosensitive element mounting area.
According to some embodiments, the compensation layer is attached to the second circuit board.
According to some embodiments, the compensation layer is a plate body structure.
According to some embodiments, the compensation layer is integrally formed with the second wiring board.
According to some embodiments, the compensation layer is integrally formed on the second circuit board integrally connected with the second base.
According to some embodiments, the second circuit board has at least one electrical connection region, and the compensation layer has an exposed region corresponding to the electrical connection region of the second circuit board so that the electrical connection region is exposed, so that the photosensitive element is electrically connected to the second circuit board.
According to some embodiments, the one-piece base has a mounting surface that provides a mounting location for components of the integrated array camera module, the mounting surface being an extended plane.
According to some embodiments, the one-piece base has a mounting surface that provides a mounting location for components of the integrated array camera module, the mounting surface being a stepped structure.
According to some embodiments, the mounting surface comprises a first mounting area and a second mounting area, the second mounting area and the first mounting area having a height difference.
Another aspect of the present invention provides an integrated array camera module, comprising:
at least two camera module units, each of which is arranged in an array; and
a compensation layer, wherein the two camera modules are a first camera module unit and a second camera module unit, the first camera module unit comprises a first photosensitive component and a first lens component, the first lens component is located in the photosensitive path of the first photosensitive component, the second camera module unit comprises a second photosensitive component and a second lens component, the second lens component is located in the photosensitive path of the second photosensitive component, the first photosensitive component and the second photosensitive component are integrally connected, the first photosensitive component comprises a first circuit board, a first photosensitive element and a first base, the first photosensitive element is electrically connected to the first circuit board, the first base is integrally formed on the first circuit board, the second photosensitive component comprises a second circuit board, a second photosensitive component and a second base, the second photosensitive element is electrically connected to the second circuit board, the second base is integrally formed on the second circuit board, and the compensation layer is arranged between the second photosensitive element and the second circuit board, so that the top end and the bottom end of the first camera module unit and the second camera module unit are consistent.
According to some embodiments, the integrated array camera module, wherein the first base and the second base are integrally connected to form a connected base,
according to some embodiments, the first wiring board and the second wiring board are integrally connected to constitute a one-piece wiring board.
According to some embodiments, the integrated circuit board has a base region and a compensation region, the integrated base is integrally formed in the base region, the photosensitive element is mounted in the photosensitive element mounting region, and the compensation layer is disposed in the compensation region and located between the integrated circuit board and the second photosensitive element.
According to some embodiments, the one-piece array camera module, wherein the one-piece base has a mounting surface that provides a mounting location for a component of the one-piece array camera module, and the mounting surface is a stepped structure.
According to some embodiments, the integrated array camera module, wherein the mounting surface comprises a first mounting area and a second mounting area, and the second mounting area and the first mounting area have a height difference.
According to some embodiments, the integrated array camera module, wherein the first mounting area and the second mounting area are connected by an inclined surface.
According to some embodiments, the integrated array camera module comprises a first mounting area and a second mounting area, wherein the first mounting area is higher than the second mounting area, and the second mounting area corresponds to the compensation layer.
An integral type array module of making a video recording, its characterized in that includes:
at least two camera module units, wherein each array camera module unit is arranged in an array;
the at least two camera modules comprise a first camera module unit and a second camera module unit, the first camera module unit comprises a first photosensitive component and a first lens component, the first lens component is positioned on a photosensitive path of the first photosensitive component, the second camera module unit comprises a second photosensitive component and a second lens component, the second lens component is positioned on a photosensitive path of the second photosensitive component, the first photosensitive component and the second photosensitive component are integrally connected, the first photosensitive component comprises a first circuit board, a first photosensitive element and a first base, the first photosensitive element is electrically connected with the first circuit board, the first base is integrally formed on the first circuit board, the second photosensitive component comprises a second circuit board, a second photosensitive component and a second base, the second photosensitive element is electrically connected to the second circuit board, the second base is integrally formed on the second circuit board, the first base and the second base are integrally connected to form a connected base, the connected base is provided with a mounting surface and provides a mounting position for components of the integrated array camera module, and the mounting surface is of a step-shaped structure, so that the top end portion and the bottom end portion of the first camera module unit and the second camera module unit are consistent.
In accordance with some embodiments, the mounting surface includes a first mounting area and a second mounting area, the second mounting area and the first mounting area having a height differential.
According to some embodiments, the first mounting region and the second mounting region are connected by an inclined surface.
In some embodiments, the second mounting area is higher than the first mounting area.
According to some embodiments, the array camera module comprises a compensation layer, and the compensation layer is arranged between the second photosensitive element and the second circuit board.
According to some embodiments, the first circuit board and the second circuit board are integrally connected to form a unitary circuit board.
According to some embodiments, the integrated circuit board has a top surface, the top surface of the integrated circuit board has a base area and a compensation area, the integrated base is integrally formed in the base area, the photosensitive element is mounted in the photosensitive element mounting area, and the compensation layer is disposed in the compensation area and located between the integrated circuit board and the second photosensitive element.
A manufacturing mold for manufacturing the array photosensitive assembly, comprising:
the upper die comprises a die main body and a group of array optical window forming bodies, wherein the array optical window forming bodies protrude and extend from the die main body and are matched with the die main body to form a connecting body base forming channel; and
The lower die is provided with a positioning cavity and used for positioning a connected circuit board; the upper die and the lower die are provided with an open die state and a closed die state, the connected circuit board is positioned in the lower die in the open die state, and an integrated forming material enters the connected base forming channel in the closed die state, is attached to the connected circuit board to be integrally formed to form a connected base main body and form at least two optical windows.
According to some embodiments, the integral forming is a molded integral forming.
Another aspect of the present invention provides a method for manufacturing an array of photosensitive elements, comprising the steps of:
(A) setting a compensation layer at a preset position by taking a connected circuit board as a base surface;
(B) integrally forming a connected base main body in a base area of the connected circuit board to form a first optical window and a first second optical window; and
(C) and at least two photosensitive elements are arranged by taking the conjoined circuit board and the compensation layer as base planes respectively.
According to some embodiments, the compensation layer is a plate structure and is attached to the one-piece circuit board.
According to some embodiments, the compensation layer is integrally formed with the one-piece wiring board.
According to some embodiments, steps (a) and (B) are performed simultaneously, and the compensation layer is integrally formed when the unitary susceptor body is formed.
Another aspect of the present invention provides an electronic device, including:
an array camera module, and
the array camera module is arranged on the electronic equipment body.
According to some embodiments, the electronic device is selected from the group consisting of: smart phones, tablet computers, notebook computers, electronic books, personal digital assistants, cameras, wearable devices.
Drawings
Fig. 1 is a perspective view of an integral array camera module according to a first embodiment of the invention.
Fig. 2 is a schematic sectional view of an integral array camera module according to a first embodiment of the present invention.
Fig. 3 is an exploded view of the integral array camera module according to the first embodiment of the present invention.
Fig. 4 is a schematic view of a connected circuit board according to a first embodiment of the present invention.
Fig. 5 is a schematic diagram of a process for forming an integral array camera module according to a first embodiment of the present invention.
Fig. 6A, 6B are schematic views of a manufacturing mold according to a first embodiment of the present invention.
FIGS. 7A, 7B, and 7C are schematic views illustrating a manufacturing process of the connected base according to the first embodiment of the invention.
Fig. 8A and 8B are different types of modified embodiments of the integral array camera module according to the first embodiment of the present invention.
Fig. 9 is a schematic cross-sectional view of an integral array camera module according to a second embodiment of the present invention.
Fig. 10 is a schematic sectional view of an integral array camera module according to a third embodiment of the present invention.
Fig. 11 is a schematic cross-sectional view of an integrated array camera module according to a fourth embodiment of the present invention.
Fig. 12 is a schematic sectional view of an integrated array camera module according to a fifth embodiment of the present invention.
Fig. 13 is an exploded schematic view of an integral array camera module according to a fifth embodiment of the present invention.
Fig. 14 is a schematic view of an array photosensitive element of an integrated array camera module according to a fifth embodiment of the invention.
Fig. 15 is a schematic view of a one-piece wiring board of an integrated array camera module according to a fifth embodiment of the invention.
Fig. 16 is a schematic diagram of a process of forming an integral array camera module according to a fifth embodiment of the present invention.
FIG. 17 is a block diagram of a method for manufacturing an array photosensitive assembly according to the above embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Multiple camera modules or arrays of camera modules have become an important trend in the field of camera modules. The existing dual-camera module is generally assembled by two mutually independent camera modules, and as mentioned above, there are two major problems, one is how to assemble the mutually independent camera modules into a whole, and the other is how to better match the installed electronic equipment with two different types of camera modules, such as two camera modules with different optical designs and different heights, for example, how to make the camera modules have the consistency of the top end and the bottom end. The problems of the two aspects can not be solved well in the traditional double-camera module formed by mutually independent camera modules, and the two aspects can not be well coordinated, but according to the invention, the integrated array camera module is provided, a plurality of camera modules are stably connected with each other in an integrated connection mode, an outer frame body is not required to be assembled, further, a compensation layer or an adjusting base is arranged in at least one camera module in the invention in an internal compensation mode, so that the consistency of two end parts can be realized while the two cameras are integrally assembled, the requirement of the installed electronic equipment is met, the consistency of the appearance is kept, and the convenient installation position is provided.
As shown in fig. 1 to 5, an integral type array camera module 1 according to a first embodiment of the present invention is provided. The integrated array camera module 1 includes at least two camera module units, and the two camera module units are integrally connected, so that the two camera module units are stably assembled without requiring an outer frame for assembly.
Further, the top end portions of the camera module units are uniform, so that the uniformity of the external surfaces of the integrated array camera module 1 and the electronic apparatus when the array camera module is assembled to the electronic apparatus is improved. That is, the external inconsistency due to the height difference existing at the top of the integrated array camera module 1 is reduced. On the other hand, the bottoms of the camera module units are consistent, so that the integrated array camera module provides a flat mounting position, and inconvenience in mounting and other adverse factors caused by the height difference of the bottom end surface are reduced.
It should be noted that for convenience of description, the array camera module formed by two camera module units is mainly used as an example in the present invention, and it should be understood by those skilled in the art that the array camera module may also be formed by more camera module units without departing from the basic inventive concept of the present invention, and the number of the camera module units is not limited by the present invention.
According to this embodiment of the present invention, the integrated array camera module 1 includes two camera module units, a first camera module unit 10 and a second camera module unit 20, respectively, and the first camera module unit 10 and the second camera module unit 20 are integrally connected so as to be stably connected to each other. That is, the first camera module unit 10 and the second camera module unit 20 are assembled and fixed to each other by means of an integral connection without providing an additional outer frame for assembly and fixation. Of course, in some embodiments, the present invention may be implemented by adding an external frame on the basis of an integrated assembly.
The top end parts of the first camera module unit 10 and the second camera module unit 20 are consistent, so that the appearance consistency of the top of the integrated array camera module 1 is ensured. That is to say, the heights of the top surfaces of the first camera module unit 10 and the second camera module unit 20 are substantially the same, so that the difference between the heights of the surfaces of the first camera module unit 10 and the second camera module unit 20 is reduced, and even the heights of the surfaces of the first camera module unit 10 and the second camera module unit 20 are the same, and no difference exists.
It is worth mentioning that when the integrated array camera module 1 is assembled in an electronic device, such as a smart phone, the top end of the integrated array camera module 1 faces the outside of the electronic device and corresponds to the outer surface of the electronic device, such as the screen surface or the back surface, so that the uniformity of the top end of the array camera module directly affects the aesthetic degree of the appearance of the electronic device, and in the case of high development of the smart electronic device, any one of the influencing factors may become a factor influencing the product competitiveness, such as the smoothness of the surface of the smart phone. Compared with a product with a double-camera module protruding from the surface of the electronic equipment, the flat-surface array camera module and the electronic equipment obviously have higher competitiveness.
Further, when the integrated type array camera module 1 is assembled in the electronic device, the bottom end portion of the integrated type array camera module 1 needs to be electrically connected to the electronic device on the one hand and fixed to the electronic device on the other hand, corresponding to the interior of the electronic device, so the shape characteristics of the bottom end portion of the integrated type array camera module 1 affect the convenience and stability of the connection, which may affect the long-term use performance of the integrated type array camera module 1 to some extent, such as the stability of the imaging quality. In the present invention, the bottom ends of the first camera module unit 10 and the second camera module unit 20 are the same, so that the bottom of the integrated array camera module 1 has better flatness, and better connection convenience and connection stability are provided.
Specifically, the first camera module unit 10 includes a first lens 11 and a first photosensitive component 12, and the first lens 11 is located in a photosensitive path of the first photosensitive component 12. The second camera module unit 20 includes a second lens 21 and a second camera module unit 20, and the second lens 21 is located in a photosensitive path of the second camera module unit 20. The first photosensitive component 12 of the first camera module unit 10 is integrally connected with the second photosensitive component 22 of the second camera module unit 20 to form an array photosensitive component 100, so that the first camera module unit 10 and the second camera module unit 20 are stably assembled with each other. That is, the array photosensitive assembly 100 includes the first photosensitive assembly 12 and the second photosensitive assembly 12.
According to this embodiment of the present invention, the first lens 11 is mounted to the first photosensitive member 12, and the second lens 21 is mounted to the second photosensitive member 22, that is, the first photosensitive member 12 and the second photosensitive member 22 integrally connected provide mounting positions for the first lens 11 and the second lens 21 at the same time. In other words, the first lens 11 and the second lens 21 have a relatively positionally stable mount position. In the traditional double-camera module, the two camera module units are independent from each other, the mutual positions of the two camera module units are determined through a third part such as an outer frame, namely, the two camera module units respectively determine the relative position relation with the outer frame, and then the relation of the two camera module units is determined through the outer frame.
Further, the first photosensitive assembly 12 includes a first circuit board 121, a first base 122 and a first photosensitive element 123. The first photosensitive element 123 is electrically connected to the first circuit board 121, and the first base 122 is integrally formed on the first circuit board 121. The first base 122 has a first light window 1222 and includes a first base body 1221, the first base body 1221 forms the first light window 1222, and the first light window 1222 corresponds to the first light sensing element 123 so as to provide a light path for the first light sensing element 123. More specifically, the first optical window 1222 provides a light path for the first lens 11 and the first photosensitive element 123, so that light passing through the first lens 11 smoothly reaches the first photosensitive element 123 for sensitization, and image information acquisition is further achieved.
The second photosensitive assembly 22 includes a second circuit board 221, a second base 222 and a second photosensitive element 223. The second photosensitive element 223 is electrically connected to the second circuit board 221, and the second base 222 is integrally formed on the second circuit board 221. The second base 222 has a second light window 2222 and includes a second base body 2221, the second base body 2221 forms the second light window 2222, and the second light window 2222 corresponds to the second photosensitive element 223, so as to provide a light path for the second photosensitive element 223. More specifically, the second optical window 2222 provides a light path for the second lens 21 and the second photosensitive element 223, so that light passing through the second lens 21 smoothly reaches the second photosensitive element 223 for sensitization, thereby achieving image information collection. More specifically, the first base body 1221 and the second base body 2221 form a closed ring-shaped structure to form the first light window 1222 and the second light window 2222 that are enclosed.
According to this embodiment of the present invention, the first base 122 and the second base 222 are integrally connected to form a one-piece base 102. That is, the first photosensitive assembly 12 and the second photosensitive assembly 22 are integrally connected and fixed to each other by integrally connecting the first base 122 and the second base 222. The conjoined base 102 provides mounting positions for the first lens 11 and the second lens 21, respectively, so as to integrally connect and fix the first camera module unit 10 and the second camera module unit 20.
More specifically, the conjoined base 102 has the first light window 1222 and the second light window 2222, which provide light paths for the first photosensitive element 123 and the second photosensitive element 223, respectively. The first base body 1221 and the second base body 2221 are integrally connected to form a unitary base body 1021 integrally formed with the first circuit board 121 and the second circuit board 221.
Further, according to the present invention, the integrated array camera module 1 includes a compensation layer 30 for compensating the difference between the first camera module unit 10 and the second camera module unit 20. Specifically, the compensation layer 30 is used to compensate and coordinate the height uniformity of the top end portion and the bottom end portion of the first camera module unit 10 and the second camera module unit 20 under the condition that each of the first camera module unit and the second camera module unit satisfies the optical design.
Specifically, the first camera module unit 10 and the second camera module unit are different types of camera modules, and the first camera module unit 10 and the second camera module unit 20 are selectively provided with the compensation layer 30 so as to compensate for a height difference between the first camera module unit 10 and the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 respectively conform to an optical design, and the heights of the top end and the bottom end are consistent. Namely, the requirements of both end conformity and optical design are achieved by arranging the compensation layer 30 inside the camera module unit.
In particular, according to this embodiment of the present invention, the compensation layer 30 is provided to the second camera module unit 20, that is, the second camera module unit 20 includes the compensation layer 30. The compensation layer 30 is disposed between the second photosensitive element 223 and the second circuit board 221 to raise the position of the second photosensitive element 223, so that when the top ends of the second camera module unit 20 and the first camera module unit 10 are inconsistent and have no height difference, the relative positions of the second photosensitive element 223 and the second lens 21 can meet the optical design requirement. Further, in this embodiment of the present invention, the optical design height of the second camera module unit 20 is lower than the height of the first camera module unit 10, and each of the two camera module units satisfies the optical design requirement when the heights of both ends of the second camera module unit 20 and the first camera module unit 10 are made to be identical by the compensation layer 30.
Further, according to this embodiment of the present invention, the first wiring board 121 and the second wiring board 221 are integrally connected to constitute a one-piece wiring board 101, that is, the first wiring board 121 and the second wiring board 221 may be manufactured at one time by an integral wiring board, rather than being manufactured separately. In other words, the integrated circuit board 101 is provided with the photosensitive circuits of the first camera module unit 10 and the second camera module unit 20 at the same time. The conjoined base main body 1021 is integrally formed on the conjoined wiring board 101, and forms the first light window 1222 and the second light window 2222 at the same time.
Further, the conjoined circuit board 101 has a first side surface 1011 and a second side surface 1012, and the first side surface 1011 faces the incident direction of light rays and is used for providing mounting and supporting positions for other components of the integrated array camera module 1. The second side surface 1012 is opposite to the light incident direction and corresponds to the bottom end of the integrated array camera module 1. That is, the second side 1012 of the integrated circuit board 101 forms the bottom end surface of the integrated array camera module 1, thereby providing a flat and uniform surface.
It should be noted that the circuit boards of the camera module unit of the conventional split dual camera module are independent from each other, so that the two independent circuit boards provide mounting bases for the camera module unit, respectively, whereas in the present invention, the first circuit board 121 and the second circuit board 221 are integrally connected, so that a consistent mounting base is provided for the two camera module units.
Further, the first side surface of the conjoined circuit board 101 has a base region 10111, a photosensitive element mounting region 10112 and a compensation region 10113. The base region 10111 is used to integrally form the connected base 102, the photosensitive element mounting region 10112 is used to mount the first photosensitive element 123, and the compensation region 10113 is used to dispose the compensation layer 30 and mount the second photosensitive element 223. The compensation region 10113 is a region corresponding to the second photosensitive element 223.
According to this embodiment of the present invention, the compensation layer 30 is mounted on the compensation region 10113, the second photosensitive element 223 is supported on the compensation layer 30, and the first photosensitive element 123 and the second photosensitive element 223 are electrically connected to the connected circuit board 101. That is to say, in this way, the first photosensitive element 123 and the second photosensitive element 223 have mounting base surfaces with different heights, for example, the mounting base surface of the first photosensitive element 123 is the first side surface 1011 of the conjoined circuit board 101, and the mounting base surface of the second photosensitive element 223 is the surface of the compensation layer 30 disposed on the first side surface 1011, so that the compensation layer 30 provides a height difference of the photosensitive elements, so that the height difference of the photosensitive elements meets the optical design requirements of the respective corresponding camera module units.
It should be noted that, for different types of camera modules, there is a difference in optical design parameters, such as the total optical length and the back focal length, so that there is a difference in the height of the lens and the distance from the lens to the photosensitive surface, but in the present invention, for two different types of camera module units, under the condition that both ends, i.e. the top end and the bottom end, of the camera module units are consistent, the compensation layer 30 is provided, so that the different types of camera module units can respectively meet the optical design requirements, such as the requirement of the distance from the respective lens to the photosensitive element or the requirement of the respective optical imaging quality. And for the camera modules with different optical design parameters, the thickness of the compensation layer 30 can be correspondingly adjusted.
Further, the first photosensitive element 123 is electrically connected to the connected circuit board 101 through at least one first electrical connection element 125. The second photosensitive element 223 is electrically connected to the integrated circuit board 101 through at least one second electrical connection element 225. The electrical connection elements are exemplified by, but not limited to, gold wires, silver wires, aluminum wires, copper wires, pads, pins.
More specifically, the first photosensitive element 123 has a first front surface 1231 and a first back surface 1232, the first front surface 1231 includes a first photosensitive region 12311 and a first non-photosensitive region 12312, the first photosensitive region 12311 is used for performing a photosensitive action, and the first non-photosensitive region 12312 is used for electrically connecting to the one-piece circuit board 101, for example, the non-photosensitive region is electrically connected to the one-piece circuit board 101 through the first electrical connection element 125. In this embodiment of the present invention, the front surface of the first photosensitive element 123 is opposite to the first light window 1222, and the back surface of the first photosensitive element 123 is attached to the photosensitive element mounting area 10112 on the first side surface 1011 of the one-piece circuit board 101. Further, the second photosensitive element 223 has a second front surface 2231 and a second back surface 2232, the second front surface 2231 includes a second photosensitive region 22311 and a second non-photosensitive region 22312, the second photosensitive region 22311 is configured to perform a photosensitive function, and the second non-photosensitive region 22312 is configured to be electrically connected to the interconnection board 101. In this embodiment of the present invention, the front surface of the second photosensitive element 223 is opposite to the second optical window 2222, the back surface of the second photosensitive element 223 is attached to the top surface of the compensation layer 30, and the bottom surface of the compensation layer 30 is attached to the compensation region 10113 on the first side surface 1011 of the integrated circuit board 101.
In this embodiment of the present invention, the first base 122 is located at the periphery of the first photosensitive element 123 and the first electrical connecting element 125, and provides a closed light path for the first photosensitive element 123, and the second base 222 is located at the periphery of the second photosensitive element 223 and the second electrical connecting element 225, and provides a closed light path for the second photosensitive element 223. Of course, in other embodiments of the present invention, the integrally formed region of the one-piece base 102 may also be formed in other manners, such as integrally formed to at least a portion of the non-photosensitive region of the photosensitive element.
According to this embodiment of the invention, the compensation layer 30 may be a steel plate, a rubber coated layer, a plastic plate.
The first photosensitive assembly 12 includes a first electronic component 124, and is configured to cooperate with a photosensitive function of the first photosensitive element 123, specifically, the first electronic component 124 is disposed in the base region 10111 of the first side surface 1011 of the conjoined circuit board 101, and the conjoined base 102 integrally wraps the first electronic component 124. The second photosensitive assembly 22 includes two second electronic components 224, and is configured to cooperate with a photosensitive function of the second photosensitive element 223, specifically, the second electronic components 224 are disposed in the base region 10111 of the first side surface 1011 of the conjoined circuit board 101, and the conjoined base 102 integrally covers the second electronic components 224. The electronic components are exemplified by, but not limited to, resistors, capacitors, diodes, transistors, and drivers.
It should be noted that, in the present invention, the first electronic component 124 and the second electronic component 224 are both disposed on the integrated circuit board 101 integrally connected, so that the positions of the first electronic component 124 and the second electronic component 224 can be more flexibly disposed on the first integrated circuit board 101, and are not limited to the positions corresponding to a single camera module unit. The photosensitive element and each of the electronic components may be respectively located on the same side or opposite sides of the connected circuit board 101, for example, in a specific example, the photosensitive element and the electronic component may be respectively located on the same side of the connected circuit board 101, the photosensitive element is attached to the photosensitive element mounting area 10112 of the connected circuit board 101, and the plurality of electronic components are respectively attached to the connected base 102 area 10111 of the connected circuit board 101 at intervals. The conjoined base 102 covers each electronic component after molding, so that the conjoined base 102 isolates the adjacent electronic components and isolates the electronic components from the photosensitive element.
The conjoined base 102 has a mounting surface 10211 for providing mounting locations for other components of the unitary array camera module 1, such as the lens, filtering elements, and brackets.
According to this embodiment of the present invention, the mounting surface 10211 of the conjoined base 102 is an extended plane, that is, the mounting plane provides a highly uniform mounting surface for other components.
The connected base 102 is integrally formed on the connected circuit board 101 in one piece, preferably, integrally formed on the connected circuit board 101 by molding. That is to say, the connected base 102 does not need a connecting medium to be fixed to the connected circuit board 101, but is fixed to the connected circuit board 101 in a molding process by using the connected circuit board 101 as an attachment molding, and provides better flatness by an integral molding manner, so as to coat the electronic component and reduce the size of the product.
Further, in this embodiment of the present invention, the first camera module unit 10 includes a first filter element 14 and a first bracket 15, and the first filter element 14 is mounted to the first bracket 15. The bracket is mounted to the mounting surface 10211 of the conjoined base 102. The first filter element 14 is located below the first lens 11 and between the first lens 11 and the first photosensitive element 123. The first camera module unit 10 includes a first lens carrier 13, the first lens 11 is mounted on the first lens carrier 13, and the first lens carrier 13 is mounted on the top surface of the first bracket 15. Further, in this embodiment of the present invention, the first lens bearing element 13 is a driving element electrically connected to the one-piece circuit board 101, so that the first camera module unit 10 forms a moving focus camera module.
The second camera module unit 20 includes a second filter element 24 and a second lens carrying element 23, and the first lens 11 and the second filter element 24 are mounted on the first lens carrying element 13. The second filter element 24 is located below the first lens 11 and between the first lens 11 and the second photosensitive element 223. In this embodiment of the present invention, the second lens bearing element 23 is a lens fixing element, and supports and fixes the second lens 21, so that the second camera module unit 20 forms a fixed focus camera module.
That is, in this embodiment of the present invention, the mounting surface 10211 of the conjoined base 102 provides a mounting plane with a uniform height for the first support 15 of the first camera module unit 10 and the second lens 21 of the second camera module unit 20, and when the first lens 11 is mounted on the first lens carrier 13, the first lens carrier 13 is mounted on the first support 15, and the second lens 21 is mounted on the second lens carrier 23, the top end and the bottom end of the first camera module unit 10 and the second camera module unit 20 are uniform.
It should be noted that, if the position of the compensation layer 30 is set in the first camera module unit 10 or the second camera module unit 20, the height of the compensation layer 30, the structural shape and height setting of the conjoined base 102, and the support, the first lens bearing element 13, the first lens 11, the second lens bearing element 23, and the second lens 21 are matched with each other, so that the top end and the bottom end of the first camera module unit 10 and the second camera module unit 20 are consistent in height and meet the optical design requirements respectively.
That is, the arrangement position and height of the compensation layer 30 may be adjusted according to the types and optical design requirements of the first and second camera module units 10 and 20. The height of the conjoined base 102 may be adjusted in shape according to the type and optical design requirements of the first camera module unit 10 and the second camera module unit 20. The holder and the lens carrier can be adjusted according to the type and optical design requirements of the first camera module unit 10 and the second camera module unit 20.
Referring to fig. 5, according to this embodiment of the present invention, a forming process of the integrated array camera module 1 may be: the first electronic component 124 and the second electronic component 224 are firstly disposed on the surface of the connected circuit board 101, for example, the first electronic component 124 and the second electronic component 224 are disposed in an SMT (surface mount technology) manner, then, the first photosensitive element 123 and the second photosensitive element 223 are electrically connected to the connected circuit board 101, the connected base 102 is further integrally formed on the base region 10111 of the first side surface 1011 of the connected circuit board 101, the first optical window 1222 and the second optical window 2222 are formed, and the first electronic element and the second electronic element are covered by the integrated base, further, the first bracket 15, the first lens 11, the first lens bearing element 13, the filtering element, the second lens 21, and the second lens bearing element 23 are mounted on the mounting surface 10211 of the connected base 102.
Of course, in other embodiments of the present invention, in the process of forming the array photosensitive assembly 100, after the connection base 102 is formed on the connection circuit board 101, the first photosensitive element 123 and the second photosensitive element 223 may be electrically connected to the connection circuit board 101, and the present invention is not limited in this respect on the basis of not departing from the basic concept of the present invention.
Referring to fig. 6A, 6B and 7A to 7C, the present invention provides a manufacturing mold 200, wherein the manufacturing mold 200 is used for molding the connecting body base 102. Specifically, the manufacturing mold 200 is used for integrally forming the one-piece base 102 on the first side surface 1011 of the one-piece circuit board 101.
The manufacturing mold 200 includes an upper mold 201 and a lower mold 202, and the upper mold 201 and the lower mold 202 have an open state and a closed state. And when the mold is opened, the mold is used for accommodating the integrally molded target object. In the clamped state, the upper mold 201 and the lower mold 202 form an integral molding chamber 203, and the object to be molded is enclosed in the integral molding chamber 203. During molding, the upper mold 201 and the lower mold 202 are in the mold clamping state, and the integrally molded material 300 enters the integrally molding chamber 203, and is integrally molded with the molding space formed by the molding chamber and the object to be molded, thereby forming a molded body having a predetermined shape.
Specifically, the upper mold 201 includes a mold body 2011 and at least one array light window molding 2012, wherein the array light window molding 2012 inwardly protrudes and extends to cooperate with the mold body 2011 to form a connection base molding channel 2013. The array light window forming body 2012 corresponds to the first photosensitive element 123 region and the second photosensitive region 22311 of the connected circuit board 101, so as to form the first light window 1222 and the second light window 2222 in the first photosensitive region 12311 and the second photosensitive region 22311, and provide a light path for the first photosensitive element 123 and the second photosensitive element 223. The base molding passage corresponds to the base region 10111 of the conjoined printed circuit board 101, so that the conjoined printed circuit board 101 is attached to the base molding passage by molding material 300 to form the conjoined base main body 1021. The lower mold 202 has a positioning cavity 2021 for positioning the connecting circuit board 101. That is, when the manufacturing mold 200 is closed, the first side 1011 of the conjoined circuit board 101 and the upper mold 201 cooperate to form the conjoined base molding passageway 1023.
It should be noted that the shapes of the array light window forming bodies 2012 and the mold main body 2011 may be set according to the shape of the connected base 102 to be formed, for example, the distance between two adjacent array light window forming bodies 2012 is set to correspond to the connected bases 102 with different widths, for example, an edge step structure is set, so as to form the connected base 102 with the installation groove 102114, for example, the mold main bodies 2011 with different heights are set, so as to form the connected base 102 with a step shape (which will be provided later). It should be understood by those skilled in the art that the structural variations of the optical window and the mold body 2011 of the manufacturing mold 200 are not limitations of the present invention based on the inventive concept.
The inner side surfaces of the first base body 1221 and the second base body 2221 have an inclined angle, so that the first base body 1221 and the second base body 2221 can be integrally formed and manufactured by the manufacturing mold 200, and the mold can be easily removed. That is, the inner side of the conjoined base 102 has an inclined angle.
Referring to fig. 7A through 7C, the formation of the connected base 102 may be: when the manufacturing mold 200 is in the mold opening state, the connected circuit board 101 is arranged in the positioning cavity 2021, the connected circuit board 101 may have the electronic component or the photosensitive element, further, the manufacturing mold 200 is closed, the connected circuit board 101 is sealed in the integral molding chamber 203 formed by the upper mold 201 and the lower mold 202, further, an integrally molding material 300 is conveyed into the integral molding chamber 203 through auxiliary equipment, so that the array molding channel is filled with the molding material 300 to form the connected base 102, and after the connected base 102 is molded, the manufacturing mold 200 is in the mold opening state, thereby completing the molding process of the connected base 102.
The integral molding may be a process of molding integral molding. The molding material may be selected from nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.
In the first embodiment of the present invention, the first camera module unit 10 is a moving focus camera module, and the second camera module unit 20 is a fixed focus camera module, but in other embodiments of the present invention, the first camera module unit 10 and the second camera module unit 20 may be of other types.
Referring to fig. 8A, the second camera module unit 20 includes a second bracket 25, the second filter element 24 is mounted on the second bracket 25, the second bracket 25 is mounted on the mounting surface 10211 of the connected base 102, the second lens 21 is mounted on the second lens bearing element 23, and the second lens bearing element 23 is a driving element, so that the second camera module unit 20 forms a moving focus camera module. That is, the integrated array camera module 1 includes two moving-focus camera modules. The driving element is exemplified but not limited to a voice coil motor, a piezoelectric motor.
Referring to fig. 8B, the first filter element 14 is mounted on the first lens bearing element 13, the first lens bearing element 13 is mounted on the mounting surface 10211 of the conjoined base 102, and the first lens bearing element 13 is a fixed element, so that the first camera module unit 10 constitutes a fixed-focus camera module unit. That is, the integrated array camera module 1 unit includes two fixed-focus camera modules.
In other embodiments of the present invention, the first camera module unit 10 and the second camera module unit 20 may have no lens bearing element, and a lens is directly mounted on the bracket or the conjoined base 102 to form a fixed focus camera module.
Of course, in other embodiments of the present invention, the first filter element 14 and the second filter element 24 may be directly mounted on the one-piece base 102, for example, by providing a mounting groove 102114 on the one-piece base 102 instead of being mounted on the bracket or the lens carrying element, and it will be understood by those skilled in the art that the mounting positions of the first filter element 14 and the second filter element 24 are not a limitation of the present invention without departing from the basic inventive concept of the present invention.
As shown in fig. 9, an integrated array camera module 1 according to a second embodiment of the present invention is shown. Unlike the first embodiment, the mounting surface 10211 of the conjoined base 102 is a step-like structure so as to further compensate the height difference of the first camera module unit 10 and the second camera module unit 20, so that the top end and the bottom end of the first camera module unit 10 and the second camera module unit 20 are respectively consistent.
The mounting surface 10211 includes a first mounting region 102111 and a second mounting region 102112, the first mounting region 102111 being used to mount components of the first camera module unit 10, and the second mounting region 102112 being used to mount components of the second camera module unit 20. According to this embodiment of the present invention, the second mounting region 102112 and the first mounting region 102111 have a height difference, that is, the first mounting region 102111 and the second mounting region 102112 respectively provide mounting bases of different heights, thereby meeting the optical design requirements of the first camera module unit 10 and the second camera module unit 20. Specifically, the distance between the first lens 11 and the first photosensitive element 123 and the distance between the second lens 21 and the second photosensitive element 223 satisfy the optical design requirement. More specifically, the second mounting region 102112 is higher than the first mounting region 102111.
Further, in this embodiment of the present invention, the first mount 15 is mounted to the first mounting region 102111, the first filter element 14 is mounted to the first mount 15, and the first lens bearing element 13 is mounted to the first mount 15 such that the first lens 11 is positioned above the first filter element 14. The second lens bearing element 23 is mounted to the second mounting region 102112.
Further, the first mounting area 102111 and the second mounting area are connected by an inclined surface 102113, so that the connected base 102 can be easily subjected to die drawing during one-step molding.
That is to say, in this embodiment, on one hand, the compensation layer 30 is disposed on the back surface of the photosensitive element to raise the photosensitive element, and on the other hand, the mounting base surfaces with different heights are disposed through the height difference of the mounting surface 10211 of the conjoined base 102, so that compensation and coordination are performed in multiple aspects, so that the conjoined first camera module unit 10 and the conjoined second camera module unit 20 respectively meet the optical design requirement under the condition that two end portions are consistent, and the integral array camera module 1 has better imaging quality.
As shown in fig. 10, is a schematic cross-sectional view of an integrated array camera module 1 according to a third embodiment of the present invention. In this embodiment of the present invention, the mounting surface 10211 of the one-piece base 102 is provided with a mounting groove 102114, the mounting groove 102114 is communicated with the first light window 1222, and the first mounting groove 102114 is used for mounting the first filter element 14. That is, in this embodiment, the first camera module unit 10 does not need to be provided with the first bracket 15, and the first lens bearing member 13 is directly mounted on the mounting surface 10211 of the conjoined base 102, thereby reducing the height of the first camera module unit.
In this embodiment of the present invention, the distance between the first lens 11 and the first photosensitive element 123 can be shorter, so that the present embodiment is more suitable for an image pickup module having a shorter back focal length, requiring a smaller distance from the first lens 11 to the first photosensitive element 123, or having a smaller height difference between the first lens 11 and the second lens 21.
As shown in fig. 11, is a schematic cross-sectional view of an integrated array camera module 1 according to a fourth embodiment of the present invention. In this embodiment of the present invention, the conjoined base 102 is integrally formed to extend to the first non-photosensitive region 12312 of the first photosensitive element 123 and the second non-photosensitive region 22312 of the second photosensitive element 223.
Specifically, the conjoined base main body 1021 is integrally formed in the base region 10111 of the conjoined circuit board 101, the first non-photosensitive region 12312 of at least part of the first photosensitive element 123, and the second non-photosensitive region 22312 of at least part of the second photosensitive element 223, and forms the first light window 1222 and the second light window 2222, which correspond to the first photosensitive region 12311 and the second photosensitive region 22311, respectively. The connecting body base 102 covers the first electrical connecting element 125 and the second electrical connecting element 225. That is, the first photosensitive element 123 and the second photosensitive element 223 are stably fixed to the connection substrate 101 by integral molding.
It should be noted that, by extending inward, the integrally formed range of the conjoined base 102 is expanded inward, so as to further provide a possibility of reducing the volume of the integrated array camera module 1, and when the second photosensitive element 223 is integrally formed and encapsulated, the compensation layer 30 is fixedly fixed on the back surface of the second photosensitive element 223, so as to provide a supporting function for the second photosensitive element 223 more stably.
As shown in fig. 12, is a schematic sectional view of an integrated array camera module 1 according to a fifth embodiment of the present invention. Fig. 13 is an exploded view of the integrated array camera module 1 according to the fifth embodiment of the present invention. As shown in fig. 14, there is a schematic view of a connected circuit board 101 of the integrated array camera module 1 according to the fifth embodiment of the present invention. Fig. 15 is a schematic diagram of a process for forming the components of the integrated circuit board 101 of the integrated array camera module 1 according to the fifth embodiment of the present invention.
The conjoined circuit board 101 has a base region 10111, a first photosensitive element 123 region, a compensation region 10113 and an electrical connection region 10114, the base region 10111 is used for integrally forming the conjoined base 102, the first photosensitive element 123 region is used for arranging the first photosensitive element 123, the compensation region 10113 is used for arranging the compensation layer 30 to provide a mounting position for the second photosensitive element 223, and the electrical connection region 10114 is used for electrically connecting the second photosensitive element 223 to the conjoined circuit board 101.
The compensation layer 30 is integrally formed on the connected circuit board 101, and specifically, the compensation body 30 is integrally formed in a compensation area 10113 of the connected circuit board 101. The compensation layer 30 has at least one exposed region 31, so that the position of the electrical connection region 10114 of the integrated circuit board 101 is exposed, thereby facilitating the electrical connection of the photosensitive element to the integrated circuit board 101. The compensation layer 30 is integrally connected to the conjoined base 102. In this embodiment of the present invention, the compensation layer 30 is integrally formed on the second camera module unit 20. Specifically, the compensation layer 30 is formed when the conjoined base 102 is integrally formed. The compensation layer 30 covers the surface of the connected circuit board 101 corresponding to the second photosensitive element 223.
Specifically, as shown in fig. 16, a schematic diagram of a forming process of the integrated array camera module 1 according to the fifth embodiment of the present invention is shown. One process of forming the array photosensitive assembly 100 may be: the first electronic component 124 and the second electronic component 224 are firstly disposed on the first side surface 1011 of the conjoined wiring board 101, for example, the first electronic component 124 and the second electronic component 224 are disposed by SMT (surface mount technology), then, the first photosensitive element 123 is electrically connected to the integrated circuit board 101, the integrated base 102 is further integrally formed on the base area 10111 of the first side surface 1011 of the integrated circuit board 101, and the compensation layer 30 is integrally formed in the compensation region 10113, the exposed region 31 is formed, the first light window 1222 and the second light window 2222 are formed, and the first electronic component and the second electronic component are covered by the exposed region 31, the second photosensitive element 223 is disposed on the surface of the compensation layer 30 and is electrically connected to the connecting circuit board 101 through the exposed region 31.
Of course, in other embodiments of the present invention, in the process of forming the array photosensitive assembly 100, after the connection base 102 and the compensation layer 30 are formed on the connection circuit board 101, the first photosensitive element 123 and the second photosensitive element 223 may be electrically connected to the connection circuit board 101, and the present invention is not limited in this respect without departing from the basic concept of the present invention.
It should be noted that, in this embodiment of the present invention, the compensation layer 30 is formed on the first side 1011 of the one-piece circuit board 101 in an integrated manner, so that a separate process is not required to fix the compensation layer 30 on the one-piece circuit board 101, and the compensation layer 30 formed in the integrated manner can provide the second photosensitive element 223 with a mounting surface 10211 with better flatness.
The positions and the number of the electrical connection regions 10114 are set according to the positions and the number of the electrical connection lines provided by the second photosensitive element 223.
It should be noted that the shape of the manufacturing mold 200 may be adjusted according to the shape of the connected base 102 to be molded. For example, the mold bodies with different heights of the inner bottom surfaces are arranged so as to correspond to the connected base installation areas with different heights, which corresponds to the second embodiment. In some embodiments, an extension block may be disposed inside the upper mold 201, and when the upper mold 201 and the lower mold 202 are closed, the extension block extends to the electrical connection region 10114 of the one-piece circuit board 101, so that the exposed region 31 of the compensation layer 30 is formed at a position corresponding to the electrical connection region 10114 of the one-piece circuit board 101, so that the electrical connection region 10114 is exposed, and the second photosensitive element 223 is electrically connected to the electrical connection region 10114.
Fig. 17 is a block diagram of a method of manufacturing the array photosensitive assembly 100 according to the above-described embodiment of the present invention. According to the above embodiment of the present invention, the present invention provides a method 1000 for manufacturing a connected circuit board 101 assembly, the method comprising the steps of:
1001: a compensation layer 30 is arranged at a preset position by taking a connected circuit board 101 as a base surface;
1002: a connected base main body 1021 is integrally formed in a base area of the connected circuit board 101 to form a first optical window 1222 and a second optical window 2222; and
1003: and at least two photosensitive elements are arranged by taking the conjoined circuit board 101 and the compensation layer 30 as base planes respectively.
The compensation layer 30 may be a plate-like structural member or may be an integrally formed layer. When the compensation layer 30 is a plate structure component, in the step 1001, the compensation layer 30 may be fixed to the compensation region 10113 on the first side surface 1011 of the one-piece circuit board 101 in a mounting manner, and when the compensation layer 30 is an integrally formed layer, the step 1001 and the step 1002 may be performed simultaneously, that is, the compensation layer 30 is integrally formed on the first side surface 1011 of the one-piece circuit board 101 while the one-piece base 102 is formed.
In the step 1002, the connected circuit board 101 may or may not have the electronic component and/or the photosensitive element. In some implementations, the one-piece base body 1021 may encapsulate the electronic components. In some embodiments, the unitary base body 1021 may integrally encapsulate at least a portion of the non-photosensitive region of the photosensitive element.
The step 1003 may be before the step 1002 or after the step 1002.
According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device includes an electronic device body and at least one integrated array camera module 1, wherein the integrated array camera module is disposed on the electronic device body for obtaining an image. It should be noted that the type of the electronic device is not limited, for example, the electronic device may be any electronic device capable of being configured with the camera module, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, a wearable device, and the like.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (35)

1. An array photosensitive assembly for an integral array camera module, its characterized in that includes:
a connected circuit board;
at least two photosensitive elements electrically connected to the conjoined circuit board;
the compensation layer is arranged between the conjoined circuit board and one photosensitive element in the at least one photosensitive element so as to enable the at least one photosensitive element and the other photosensitive elements to have a height difference, and therefore the compensation layer is used for compensating and coordinating the height consistency of the top end part and the bottom end part of each camera module unit of the integrated array camera module under the condition that the camera module units respectively meet optical design; and
the conjoined base is integrally formed on the conjoined circuit board and forms at least two light windows which respectively correspond to the photosensitive elements and provide light paths for the photosensitive elements;
the conjoined circuit board is provided with a base area and a compensation area, the conjoined base is integrally formed in the base area, the photosensitive element is installed in the photosensitive element installation area, and the compensation layer is arranged in the compensation area.
2. The arrayed photosensitive assemblies of claim 1 wherein said conjoined circuit board has a photosensitive element mounting area, one of said photosensitive elements being mounted to said photosensitive element mounting area.
3. The arrayed photosensitive assemblies of claim 2, wherein the compensation layer is a plate structure.
4. The arrayed photosensitive assemblies of claim 1, wherein the compensation layer is integrally formed with the interposer.
5. The arrayed photosensitive assemblies of claim 1, wherein the compensation layer is integrally connected to the connection base and integrally formed on the connection circuit board.
6. The array photosensitive assembly of claim 5, wherein the integrated circuit board has at least one electrical connection area, and the compensation layer has an exposed area corresponding to the electrical connection area of the integrated circuit board so that the electrical connection area is exposed, so that the photosensitive element is electrically connected to the integrated circuit board.
7. The arrayed photosensitive assemblies of any of claims 1 to 6, wherein the conjoined base has a mounting surface to provide a mounting location for a component of the unitary array camera module, the mounting surface being an extended plane.
8. The array photosensitive assembly of any of claims 1 to 6, wherein the conjoined base has a mounting surface to provide a mounting location for a component of the unitary array camera module, the mounting surface being a stepped structure.
9. The array photosensitive assembly of claim 8 wherein said mounting surface includes a first mounting area and a second mounting area, said second mounting area and said first mounting area having a height difference.
10. The array photosensitive assembly of claim 9, wherein the first mounting area and the second mounting area are connected by an inclined surface.
11. The array photosensitive assembly of claim 9, wherein the second mounting area is higher than the first mounting area, the second mounting area corresponding to the compensation layer.
12. The array photosensitive assembly of any one of claims 1 to 6, wherein the conjoined base has at least one mounting groove, and the mounting groove is communicated with the optical window.
13. The array photosensitive assembly according to any one of claims 1 to 6, wherein the array photosensitive assembly comprises at least one electronic component, the electronic component is electrically connected with the conjoined circuit board, and the conjoined base covers the electronic component.
14. The array photosensitive assembly of any one of claims 1 to 6, wherein the photosensitive element is electrically connected to the connection circuit board through at least one electrical connection element.
15. The array photosensitive assembly of any one of claims 1 to 6, wherein said conjoined substrate is located at the periphery of at least one of said photosensitive elements.
16. The arrayed photosensitive assemblies of any one of claims 1 to 6, wherein the conjoined base integrally encapsulates at least a portion of the non-photosensitive region of at least one of the photosensitive elements.
17. The array photosensitive assembly of any one of claims 1 to 6, wherein the integral molding is a molding integral molding.
18. The array photosensitive assembly of any of claims 1 to 6, wherein the inner side of the conjoined substrate has an inclined angle.
19. An integrated array camera module, its characterized in that includes:
an arrayed photosensitive element according to any one of claims 1 to 18, and
and the at least two lenses are positioned on the photosensitive path of the array photosensitive assembly.
20. The camera module array of claim 19, wherein the integrated camera module array comprises at least two lens carriers, each lens being mounted on each lens carrier in a light sensing path of the corresponding light sensing element.
21. The array camera module of claim 20, wherein at least one of the lens carrying elements is a driving element, forming a moving focus camera module unit.
22. The camera module array of claim 20, wherein at least one of the lens-holding elements is a fixed element, forming a fixed focus camera module unit.
23. The camera module of claim 20, wherein the camera module comprises two filter elements respectively located in the photosensitive paths of the photosensitive elements, wherein at least one of the filter elements is mounted on the lens carrier.
24. The array camera module of claim 20, wherein the array camera module comprises at least two filter elements and a bracket, the two filter elements are respectively located in the photosensitive paths of the two photosensitive elements, wherein at least one filter element is mounted on the bracket, and the bracket is mounted on the conjoined base.
25. The array camera module of claim 19, wherein the array camera module comprises at least two filter elements, wherein the two filter elements are located in the photosensitive paths of the two photosensitive elements, and wherein at least one filter element is directly mounted on the conjoined base.
26. An integrated array camera module, its characterized in that includes:
at least one first module unit of making a video recording, first module unit of making a video recording includes:
the first photosensitive assembly comprises a first circuit board; a first photosensitive element; the first base is integrally formed on the first circuit board to form a first light window which provides a light path for the first photosensitive element; and
The first lens is positioned on a photosensitive path of the first photosensitive assembly; and
at least one second camera module unit, the second camera module unit includes:
the second photosensitive assembly comprises a second circuit board and a second photosensitive element; the second base is integrally formed on the second circuit board to form a first light window for providing a light path for the second photosensitive element; and
the second lens is positioned on the photosensitive path of the second photosensitive assembly; and
and the first base is integrally connected with the second base to form a connected base, and the compensation layer is arranged between the second photosensitive element and the second circuit board to compensate the difference between the first camera module unit and the second camera module unit, so that the heights of the top end part and the bottom end part of the first camera module unit and the second camera module unit are consistent and respectively accord with optical design.
27. An integrated array camera module, its characterized in that includes:
At least two camera module units, wherein each array camera module unit is arranged in an array; and
a compensation layer is arranged on the surface of the substrate,
wherein the two camera modules are respectively a first camera module unit and a second camera module unit, the first camera module unit comprises a first photosensitive component and a first lens component, the first lens component is positioned in the photosensitive path of the first photosensitive component, the second camera module unit comprises a second photosensitive component and a second lens component, the second lens component is positioned in the photosensitive path of the second photosensitive component, the first photosensitive component and the second photosensitive component are integrally connected, the first photosensitive component comprises a first circuit board, a first photosensitive element and a first base, the first photosensitive element is electrically connected with the first circuit board, the first base is integrally formed on the first circuit board, the second photosensitive component comprises a second circuit board, a second photosensitive component and a second base, the second photosensitive element is electrically connected to the second circuit board, the second base is integrally formed on the second circuit board, and the compensation layer is arranged between the second photosensitive element and the second circuit board, so that the top end part and the bottom end part of the first camera module unit and the second camera module unit are consistent.
28. An integral type array module of making a video recording, its characterized in that includes:
at least two camera module units, wherein each array camera module unit is arranged in an array;
the at least two camera modules comprise a first camera module unit and a second camera module unit, the first camera module unit comprises a first photosensitive component and a first lens component, the first lens component is positioned on the photosensitive path of the first photosensitive component, the second camera module unit comprises a second photosensitive component and a second lens component, the second lens component is positioned on the photosensitive path of the second photosensitive component, the first photosensitive component and the second photosensitive component are integrally connected, the first photosensitive component comprises a first circuit board, a first photosensitive element and a first base, the first photosensitive element is electrically connected with the first circuit board, the first base is integrally formed on the first circuit board, the second photosensitive component comprises a second circuit board, a second photosensitive component and a second base, the second photosensitive element is electrically connected to the second circuit board, the second base is integrally formed on the second circuit board, the first base and the second base are integrally connected to form a connected base, the connected base is provided with a mounting surface and provides a mounting position for components of the integrated array camera module, and the mounting surface is of a step-shaped structure, so that the top end part and the bottom end part of the first camera module unit and the second camera module unit are consistent.
29. A manufacturing mold for manufacturing the array photosensitive assembly of any of claims 1 to 18, comprising:
the upper die comprises a die main body and a group of array optical window forming bodies, wherein the array optical window forming bodies protrude and extend from the die main body and are matched with the die main body to form a connecting body base forming channel; and
the lower die is provided with a positioning cavity and used for positioning a connected circuit board; the upper die and the lower die are provided with an open die state and a closed die state, the connected circuit board is positioned in the lower die in the open die state, and an integrated forming material enters the connected base forming channel in the closed die state, is attached to the connected circuit board to be integrally formed to form a connected base main body and form at least two optical windows.
30. A method of fabricating an array photosensitive assembly, comprising the steps of:
(A) setting a compensation layer at a preset position by taking a connected circuit board as a base surface;
(B) integrally forming a connected base main body in a base area of the connected circuit board to form a first optical window and a second optical window; and
(C) At least two photosensitive elements are arranged by taking the conjoined circuit board and the compensation layer as base planes respectively;
the conjoined circuit board is provided with a base area and a compensation area, the conjoined base is integrally formed in the base area, the photosensitive elements are installed in the photosensitive element installation area, and the compensation layer is arranged in the compensation area, so that at least one photosensitive element and other photosensitive elements have height difference, and the compensation layer is used for compensating and coordinating the height consistency of the top end part and the bottom end part of each camera module unit of the integral array camera module under the condition that each camera module unit meets the optical design.
31. The method of manufacturing according to claim 30, wherein the compensation layer is a board structure attached to the one-piece circuit board.
32. The method of manufacturing of claim 30, wherein the compensation layer is integrally formed with the one-piece wiring board.
33. The method of manufacturing of claim 30, wherein steps (a) and (B) are performed simultaneously, the compensating layer being integrally formed when forming the unitary base body.
34. An electronic device, comprising:
An array camera module according to any one of claims 19 to 28; and
the array camera module is arranged on the electronic equipment body.
35. The electronic device of claim 34, wherein the electronic device is selected from the group consisting of: smart phones, tablet computers, notebook computers, electronic books, personal digital assistants, cameras, wearable devices.
CN201810137613.8A 2018-02-10 2018-02-10 Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment Active CN110166654B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810137613.8A CN110166654B (en) 2018-02-10 2018-02-10 Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810137613.8A CN110166654B (en) 2018-02-10 2018-02-10 Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment

Publications (2)

Publication Number Publication Date
CN110166654A CN110166654A (en) 2019-08-23
CN110166654B true CN110166654B (en) 2022-06-28

Family

ID=67641501

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810137613.8A Active CN110166654B (en) 2018-02-10 2018-02-10 Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment

Country Status (1)

Country Link
CN (1) CN110166654B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205545516U (en) * 2015-12-18 2016-08-31 安徽昌硕光电子科技有限公司 Two camera module's structure
CN206547144U (en) * 2017-03-09 2017-10-10 昆山丘钛微电子科技有限公司 Multi-cam modular structure
CN206725921U (en) * 2016-10-14 2017-12-08 宁波舜宇光电信息有限公司 Array camera module based on integral packaging technique
CN107483802A (en) * 2017-09-29 2017-12-15 信利光电股份有限公司 A kind of camera module
CN206807579U (en) * 2016-12-31 2017-12-26 宁波舜宇光电信息有限公司 Split type array camera module
CN207382418U (en) * 2017-09-29 2018-05-18 信利光电股份有限公司 A kind of camera module
CN208353435U (en) * 2018-02-10 2019-01-08 宁波舜宇光电信息有限公司 Integral type array camera module and array photosensory assembly and its manufacture mold and electronic equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532865B2 (en) * 2003-09-09 2010-08-25 キヤノン株式会社 Imaging device and focus control method of imaging device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205545516U (en) * 2015-12-18 2016-08-31 安徽昌硕光电子科技有限公司 Two camera module's structure
CN206725921U (en) * 2016-10-14 2017-12-08 宁波舜宇光电信息有限公司 Array camera module based on integral packaging technique
CN206807579U (en) * 2016-12-31 2017-12-26 宁波舜宇光电信息有限公司 Split type array camera module
CN206547144U (en) * 2017-03-09 2017-10-10 昆山丘钛微电子科技有限公司 Multi-cam modular structure
CN107483802A (en) * 2017-09-29 2017-12-15 信利光电股份有限公司 A kind of camera module
CN207382418U (en) * 2017-09-29 2018-05-18 信利光电股份有限公司 A kind of camera module
CN208353435U (en) * 2018-02-10 2019-01-08 宁波舜宇光电信息有限公司 Integral type array camera module and array photosensory assembly and its manufacture mold and electronic equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
《电磁驱动大尺寸MEMS扫描镜的研究》;何嘉辉 等;《光子学报》;20170131;第1-8页 *

Also Published As

Publication number Publication date
CN110166654A (en) 2019-08-23

Similar Documents

Publication Publication Date Title
CN110089105B (en) Array camera module with height difference, circuit board assembly, manufacturing method of array camera module and circuit board assembly and electronic equipment
CN109688303B (en) Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method
CN109510932B (en) Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module
CN110832835B (en) Fixed-focus camera module and electronic equipment
US11165941B2 (en) Array camera module and application thereof
KR20170099764A (en) Camera module with compression-molded circuit board and manufacturing method thereof
CN112217969A (en) Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof
CN108124082B (en) Sinking type camera module, sinking type photosensitive assembly and manufacturing method thereof
CN114845014A (en) Photosensitive assembly, camera module and manufacturing method thereof
TW201741752A (en) Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
CN106303169B (en) Ultrathin camera module and manufacturing method thereof
CN108270949B (en) Split type array camera module and manufacturing method thereof
CN110493502A (en) Camera module, mobile terminal and camera module manufacturing method
CN110166654B (en) Integrated array camera module, array photosensitive assembly, manufacturing mold and manufacturing method of array photosensitive assembly and electronic equipment
JP3495008B2 (en) Solid-state imaging device and manufacturing method thereof
CN111726483A (en) Lens module and electronic device
CN208353435U (en) Integral type array camera module and array photosensory assembly and its manufacture mold and electronic equipment
WO2018121793A1 (en) Separable photographic array module and manufacturing method thereof
TWI685255B (en) Split array camera module and manufacturing method thereof
CN109819142B (en) Split double-camera module, photosensitive assembly, manufacturing method and electronic equipment
CN115508973A (en) Multi-group lens, camera module and electronic equipment thereof
CN210075310U (en) Camera module and mobile terminal
CN112714239A (en) Photosensitive assembly, camera module, method thereof and electronic equipment
CN211860268U (en) Lens assembly and electronic equipment
CN209982575U (en) Camera shooting module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant